Spraying bed electroplating machine

Abstract

The utility model discloses a spray bed electroplating machine, which belongs to the technical field of electroplating and comprises a tank body, fluid directors (including a main fluid director and an auxiliary fluid director), a liquid outlet mesh window, a cathode conducting ring, an anode basket and the like. The fluid director optimizes the flow direction of the plating solution, and waste and environmental pollution are reduced. The device is characterized in that a main fluid director is located above a liquid outlet screen window, and an auxiliary fluid director is located below the liquid outlet screen window; a cathode conducting ring is arranged at the lower end of the liquid outlet net window; the anode basket is electrically matched and connected with the cathode conducting ring; the workpiece feeding port is located between the main flow guide device and the liquid outlet net window. A liquid inlet is formed in the bottom of the liquid outlet screen window, a liquid spraying socket is arranged at the bottom of the tank body, and the liquid inlet is communicated with the liquid spraying socket. According to the utility model, the electroplating uniformity and efficiency are improved, the production cost is reduced, and the device has wide application prospect and market value.

Description

Technical Field

[0001] The utility model belongs to the technical field of electroplating, and particularly relates to a spray bed electroplating machine. Background Art

[0002] With the trend of miniaturization and microminiaturization of electronic products, traditional electroplating methods are facing major challenges. In the past, barrel plating and rack plating processes were usually adopted in the electroplating industry. During the electroplating process, the position and orientation of the workpieces change rapidly, and their plating conditions are very favorable. For extremely small electronic components and connectors, the electroplating effect is poor. Especially for small workpieces with dimensions less than 1 cm in all directions, there are problems such as low efficiency, poor coating uniformity, and slow metal deposition rate, which are difficult to meet the high-precision and high-quality requirements of modern manufacturing. Content of the Utility Model

[0003] In order to overcome the defects of the prior art, the purpose of the utility model is to provide a spray bed electroplating machine, which is used to solve the problem of inconvenient use in the prior art.

[0004] In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

[0005] A spray bed electroplating machine includes a tank body, a flow guide device is arranged in the tank body, and the flow guide device includes a main flow guide device and a sub-flow guide device; an outlet liquid mesh window is arranged outside the flow guide device, the main flow guide device is located above the outlet liquid mesh window and is used to guide the flow direction of the plating solution, and the sub-flow guide device is located below the outlet liquid mesh window and is used to guide the workpiece to re-enter the annular space; a cathode conductive ring is arranged at the lower end of the outlet liquid mesh window, an anode basket is arranged in the tank body, and the anode basket is electrically connected with the cathode conductive ring in a matching manner. A workpiece feeding port is arranged at the opening between the main flow guide device and the outlet liquid mesh window, a liquid inlet is arranged at the bottom of the outlet liquid mesh window, and a spray liquid socket is arranged at the bottom of the tank body. The spray liquid socket is used to connect to a high-speed plating solution pipe; the liquid inlet is connected to the spray liquid socket in a through manner.

[0006] Further preferably according to the above technical scheme, guide surfaces are respectively arranged on both sides of the lower edge of the bottom of the main flow guide device, the direction of the guide surfaces is parallel to the side surface of the sub-flow guide device, and the guide surfaces are used to control the flow direction of the plating solution.

[0007] Preferably, the included angle between the guide surface and the vertical direction is 40-50 degrees, which is used to optimize the flow track of the plating solution.

[0008] Preferably, a spray liquid pipe network is arranged in the connecting pipe between the liquid inlet and the spray liquid socket, and the spray liquid pipe network is used to maintain the purity of the plating solution.

[0009] Preferably, the outlet liquid mesh window has a porous mesh structure, which is used to evenly distribute the plating solution.

[0010] Preferably, the porous network structure is uniformly distributed round holes with a hole diameter of 2 mm ± 0.5 mm.

[0011] Preferably, the bottom end of the liquid outlet mesh window is a conical structure, the cathode conductive ring is arranged on the conical surface of the conical structure, and a channel is left between the auxiliary flow deflector and the inner side of the conical surface of the conical structure for storing workpieces.

[0012] Preferably, the tank body is made of stainless steel material and has good corrosion resistance.

[0013] Preferably, the auxiliary flow deflector is a shuttle shape, a flow through hole is arranged at the center of the auxiliary flow deflector, the lower end of the flow through hole is flush with the liquid inlet, and the upper end of the flow through hole is flush with the main flow deflector.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] The present utility model provides a spray bed electroplating machine. A flow deflector is arranged in the device of the present utility model, which optimizes the flow direction of the plating solution, reduces the waste of the plating solution, reduces environmental pollution, improves the uniformity and efficiency of electroplating, reduces production costs, and has broad application prospects and market value. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic structural diagram of the device of the present utility model.

[0017] In the figure: 1. Tank body, 2. Flow deflector, 21. Main flow deflector, 22. Auxiliary flow deflector, 23. Guide surface, 24. Flow through hole, 3. Liquid outlet mesh window, 4. Cathode conductive ring, 5. Anode basket, 6. Workpiece feeding port, 7. Liquid inlet, 8. Spray liquid socket, 9. Spray liquid pipe network. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0019] Embodiment 1

[0020] As Figure 1As shown in the figure, the present utility model provides an embodiment of a spray bed electroplating machine, which includes a tank body 1. A flow guide device 2 is arranged inside the tank body 1. The flow guide device 2 includes a main flow guide device 21 and a sub-flow guide device 22. An out-liquid mesh window 3 is arranged outside the flow guide device 2. The main flow guide device 21 is located above the out-liquid mesh window 3 and is used to guide the flow direction of the plating solution. The sub-flow guide device 22 is located below the out-liquid mesh window 3 and is used to guide the workpiece to re-enter the annular space. A cathode conductive ring 4 is arranged at the lower end of the out-liquid mesh window 3. An anode basket 5 is arranged inside the tank body 1. The anode basket 5 is electrically connected to the cathode conductive ring 4 in a cooperative manner. A workpiece feeding port 6 is arranged at the opening between the main flow guide device 21 and the out-liquid mesh window 3. A liquid inlet 7 is arranged at the bottom of the out-liquid mesh window 3. A spray liquid socket 8 is arranged at the bottom of the tank body 1. The spray liquid socket 8 is used to connect to a high-speed plating solution pipe. The liquid inlet 7 is connected to the spray liquid socket 8 in a through manner. In the embodiment of the present utility model, both the main flow guide device 21 and the sub-flow guide device 22 are plug-in combined structures. During use, the inner flow guide device 2 including the main flow guide device 21 and the sub-flow guide device 22 is inserted into the liquid inlet at the spray liquid socket 8. Small workpieces are added to the plating bath from the workpiece feeding port 6. Then, the prepared conical out-liquid mesh window 3 is inserted onto the spray liquid socket 8 under the liquid level of the electroplating tank. And check whether the gaps of the anode basket positions around the plating bath are consistent. Start the filtration circulation pump and the DC power supply, and enter the electroplating working state. When electroplating the workpiece, the loading amount of the workpiece is based on filling the annular space between the inner wall of the conical part of the out-liquid mesh window 3 and the sub-flow guide device 22. After starting the machine, the plating solution is sprayed out at high speed from the bottom spray liquid socket. The negative pressure generated by the plating solution flow drives the surrounding workpieces to rise into the air. The plating solution flow encounters the upper main flow guide device 21 and turns into an umbrella shape and folds back downward along the upper side of the sub-flow guide device 22, driving the workpiece to re-enter the annular space again. The plating solution flow drives the workpiece to circulate and float in this way repeatedly. A cathode conductive ring 4 is installed around the liquid inlet 7 at the bottom of the annular space. There are mesh windows for solution circulation and conduction around the upper cylindrical part of the annular space of the out-liquid mesh window 3. The annular anode basket 5 is directly opposite to the outside of the mesh window. The workpiece entering the annular space forms an electroplating circuit and deposits a plating layer. The workpiece is repeatedly electroplated at high speed driven by the high-speed liquid flow. The plating layer is uniform, without adhesion and non-plating phenomena. The device of the present utility model optimizes the flow direction of the plating solution, reduces the waste of the plating solution, reduces environmental pollution, improves the uniformity and efficiency of electroplating, reduces production costs, and has broad application prospects and market value.

[0021] On both sides of the lower edge of the bottom of the main flow guide device 21, there are respectively provided guiding surfaces 23. The direction of the guiding surfaces 23 is parallel to the side surface of the sub-flow guide device 22. The guiding surfaces 23 are used to control the flow direction of the plating solution.

[0022] The included angle between the guiding surface 23 and the vertical direction is 40 to 50 degrees, which is used to optimize the flow track of the plating solution. In the embodiment of the present utility model, the included angle between the guiding surface 23 and the vertical direction is set to 45 degrees downward. In this way, the plating solution enters from the liquid inlet 7 and rushes out upward at a high speed. After the plating solution encounters the main flow guide 21 at the top, the flow direction of the plating solution is changed. After rotating 135 degrees, it flows obliquely downward along the side surface of the auxiliary flow guide 22. At this time, the workpiece at the liquid inlet 7 is brought into the annular workpiece at the conical bottom of the liquid outlet mesh window 3.

[0023] A liquid spraying pipe network 9 is arranged on the connecting pipe between the liquid inlet 7 and the liquid spraying socket 8, and the liquid spraying pipe network 9 is used to maintain the purity of the plating solution.

[0024] The liquid outlet mesh window 3 has a porous mesh structure, which is used to evenly distribute the plating solution.

[0025] The porous mesh structure is uniformly distributed round holes, and the aperture of the round holes is 2mm ± 0.5mm.

[0026] The bottom end of the liquid outlet mesh window 3 is a conical structure. The cathode conductive ring 4 is arranged on the conical surface of the conical structure. A channel is left between the auxiliary flow guide 22 and the inner side of the conical surface of the conical structure for storing workpieces. In the embodiment of the present utility model, an insertion pipe is arranged at the lower end of the liquid outlet mesh window 3, and is connected with the liquid spraying socket 8 in an insertion and matching manner. Mesh holes are arranged on the side surface of the insertion pipe, and the mesh holes are used for the plating solution to flow through. In the embodiment of the present utility model, the main flow guide 21 and the auxiliary flow guide 22 are fixedly connected to the liquid outlet mesh window 3 through a bracket, and can also be set to be connected in an insertion and matching manner. For example, a retaining frame is arranged on the liquid outlet mesh window 3, and the edge of the main flow guide 21 is lapped and connected with the retaining platform. The space between the retaining frames is in a hollow shape. The workpiece feeding port 6 is arranged at the hollow part of the retaining frames for adding workpieces. The hollow shape between the retaining frames is also used for the workpieces to pass through. Driven by the high-speed plating solution, the workpieces pass through the main flow guide 21 and turn, and then fall through the auxiliary flow guides 22 on both sides. The high-speed plating solution can drive the workpieces to freely pass through the retaining frames.

[0027] The tank body 1 is made of stainless steel and has good corrosion resistance.

[0028] The auxiliary flow guide 22 is a spindle body. A through-flow hole 24 is arranged at the center of the auxiliary flow guide 22. The lower end of the through-flow hole 24 is flush with the liquid inlet 7, and the upper end of the through-flow hole 24 is flush with the main flow guide 21.

[0029] Certainly, the above embodiments are not limitations to the present utility model, and the present utility model is not limited to the above examples. Changes, modifications, additions or substitutions made by those skilled in the art within the essence of the present utility model should also belong to the protection scope of the present utility model.

Claims

1. A spray bed electroplating machine, comprising a tank body (1), characterized in that: A flow guide (2) is arranged inside the tank body (1), and the flow guide (2) includes a main flow guide (21) and a sub-flow guide (22); a liquid outlet mesh window (3) is arranged outside the flow guide (2), the main flow guide (21) is located above the liquid outlet mesh window (3) and is used to guide the flow direction of the plating solution, and the sub-flow guide (22) is located below the liquid outlet mesh window (3) and is used to guide the workpiece to re-enter the annular space; a cathode conductive ring (4) is arranged at the lower end of the liquid outlet mesh window (3), an anode basket (5) is arranged inside the tank body (1), the anode basket (5) is electrically connected to the cathode conductive ring (4) in a cooperative manner, a workpiece feeding port (6) is arranged at the opening between the main flow guide (21) and the liquid outlet mesh window (3), a liquid inlet (7) is arranged at the bottom of the liquid outlet mesh window (3), a spray liquid socket (8) is arranged at the bottom of the tank body (1), and the spray liquid socket (8) is used to connect to a high-speed plating solution pipe; the liquid inlet (7) is connected to the spray liquid socket (8) in a through manner.

2. The spray bed electroplating machine according to claim 1, characterized in that: On both sides of the lower edge of the bottom of the main flow guide (21), guiding surfaces (23) are respectively arranged, the direction of the guiding surfaces (23) is parallel to the side surface of the sub-flow guide (22), and the guiding surfaces (23) are used to control the flow direction of the plating solution.

3. The spray bed electroplating machine according to claim 2, characterized in that: The included angle between the guiding surface (23) and the vertical direction is 40 to 50 degrees, which is used to optimize the flow trajectory of the plating solution.

4. The spray bed electroplating machine according to claim 1, characterized in that: A spray liquid pipe network (9) is arranged in the connecting pipe between the liquid inlet (7) and the spray liquid socket (8), and the spray liquid pipe network (9) is used to maintain the purity of the plating solution.

5. The spray bed electroplating machine according to claim 1, characterized in that: The liquid outlet mesh window (3) has a porous mesh structure and is used to evenly distribute the plating solution.

6. The spray bed electroplating machine according to claim 5, characterized in that: The porous mesh structure is uniformly distributed round holes, and the aperture of the round holes is 2mm ± 0.5mm.

7. The spray bed electroplating machine according to claim 1, characterized in that: The bottom end of the liquid outlet mesh window (3) is a conical structure, the cathode conductive ring (4) is arranged on the conical surface of the conical structure, and a channel is left between the sub-flow guide (22) and the inner side of the conical surface of the conical structure for storing workpieces.

8. The spray bed electroplating machine according to claim 1, characterized in that: The tank body (1) is made of stainless steel and has good corrosion resistance.

9. The spray bed electroplating machine according to claim 1, characterized in that: The sub-flow guide (22) is a spindle body, a through-flow hole (24) is arranged at the center of the sub-flow guide (22), the lower end of the through-flow hole (24) is flush with the liquid inlet (7), and the upper end of the through-flow hole (24) is flush with the main flow guide (21).

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