Cooling platform for cooling sintering carrier

Abstract

The utility model discloses a cooling platform for cooling a sintering carrier, which comprises a shell, a support plate and a cooling assembly, and an accommodating cavity is formed in the shell; the supporting plate is supported at the opening of the accommodating cavity, and the surface, deviating from the accommodating cavity, of the supporting plate is used for supporting a sintering carrier to be cooled; the cooling assembly comprises a liquid cooling plate which is attached to the supporting plate and faces the surface of the containing cavity, and a cavity used for storing cooling liquid is formed in the liquid cooling plate. According to the cooling platform, a liquid cooling mode is adopted, the structure is simple, and the cooling effect on the sintering carrier is excellent.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging equipment, and particularly relates to a cooling platform for cooling a sintering carrier. Background Art

[0002] Nano silver is a green and pollution-free material, which has a low sintering temperature and a high melting point, and has many excellent properties such as good electrical conductivity and thermal conductivity. It is an ideal connecting material in the field of high-power electronic packaging. Different from soft soldering and adhesives, nano silver is generally based on a silver powder sintering technology below 300°C. After sintering, it forms densified silver with a melting point of 960°C, which is much higher than the welding temperature and can be sintered repeatedly. It is especially suitable for electronic packaging with high temperature, high density and high power. After sintering, it is necessary to cool the material and the sintering carrier. Usually, air cooling or a semiconductor-assisted cooling device is used. The former has a slow cooling speed, while the latter has high power consumption and high cost, and a small operating temperature range.

[0003] The information disclosed in this background art section is only intended to enhance the overall understanding of the utility model and should not be regarded as an admission or any form of suggestion that this information constitutes prior art already known to those of ordinary skill in the art. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a cooling platform to solve the cooling problem of the sintering carrier.

[0005] To achieve the above purpose, a specific embodiment of the utility model provides a cooling platform for cooling a sintering carrier, which includes a housing, a support plate and a cooling component. The housing forms a receiving cavity; the support plate is arranged at the opening of the receiving cavity to close the receiving cavity, and the surface of the support plate facing away from the receiving cavity is used to support the sintering carrier to be cooled; the cooling component includes a liquid cooling plate attached to the surface of the support plate facing the receiving cavity, which forms a cavity for storing a coolant.

[0006] In one or more embodiments of the utility model, multiple liquid cooling plates are attached to the liquid cooling plate.

[0007] In one or more embodiments of the utility model, each liquid cooling plate is respectively provided with a liquid inlet and a liquid outlet communicating with the cavity. Two water inlet connectors are fixed on the housing, and one of the water inlet connectors communicates with all the liquid inlets, and the other water inlet connector communicates with all the liquid outlets.

[0008] In one or more embodiments of the utility model, the liquid inlet and the liquid outlet are arranged at both ends of the liquid cooling plate along the length direction of the liquid cooling plate.

[0009] In one or more embodiments of the present utility model, the two water diversion joints are arranged on two side walls of the housing along the length direction of the liquid cooling plate.

[0010] In one or more embodiments of the present utility model, the two water diversion joints are arranged on the same side wall of the housing.

[0011] In one or more embodiments of the present utility model, the cooling assembly further includes a pressure strip for fixing the liquid cooling plate to the support plate, and the pressure strip is detachably fixed to the support plate.

[0012] In one or more embodiments of the present utility model, it further includes a temperature control module fixed to the housing, and the temperature control module is connected to and displays the temperature of the support plate.

[0013] In one or more embodiments of the present utility model, handles for grasping are arranged on the housing, and the handles are arranged on two opposite side walls of the housing.

[0014] In one or more embodiments of the present utility model, rubber feet are fixed to the bottom of the housing.

[0015] Compared with the prior art, the cooling platform of the present utility model adopts a liquid cooling method, has a simple structure, and has an excellent cooling effect on the sintering carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a schematic diagram of the cooling platform in an embodiment of the present utility model;

[0018] Figure 2 It is an exploded view of the cooling platform in an embodiment of the present utility model;

[0019] Figure 3 It is an exploded view of the cooling platform from another perspective in an embodiment of the present utility model.

[0020] Main reference numerals description:

[0021] 100 - Cooling platform, 10 - Housing, 11 - Accommodating cavity, 12 - Water diversion joint, 13 - Handle, 14 - Foot pad, 20 - Cooling assembly, 21 - Support plate, 22 - Liquid cooling plate, 221 - Liquid inlet, 222 - Liquid outlet, 23 - Pressure strip, 24 - Temperature control module. Specific embodiments

[0022] In order to enable those skilled in the art to better understand the technical solutions in the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0023] As Figures 1-3 shown, the cooling platform 100 in an embodiment of the present utility model includes a housing 10 and a cooling assembly 20. An accommodation cavity 11 is formed inside the housing 10. The cooling assembly 20 includes a support plate 21 and a liquid cooling plate 22. The support plate 21 is supported at the opening of the accommodation cavity 11 to close the accommodation cavity 11, and the surface thereof facing away from the accommodation cavity 11 is used to support the sintering carrier to be cooled. The liquid cooling plate 22 is attached to the surface of the support plate 21 facing the accommodation cavity 11. The liquid cooling plate 22 is a hollow plate body, and a cavity for storing a coolant is formed inside it.

[0024] The cooling platform 100 in this embodiment is used in cooperation with a sintering carrier of nano silver (or other semiconductor materials). The sintering carrier to be cooled is placed on the support plate 21, and the liquid cooling plate 22 on the back of the support plate 21 quickly takes away the heat of the sintering carrier through heat transfer. The cooling platform 100 has a simple structure, low manufacturing and use costs, and the liquid cooling (with a large heat capacity) method also has a better cooling effect.

[0025] It can be imagined that in order to improve the heat conduction efficiency, the support plate 21 and the liquid cooling plate 22 are made of high thermal conductivity materials, such as alloy materials such as aluminum and copper.

[0026] In one embodiment, the opening of the accommodation cavity 11 is a square, and the liquid cooling plate 22 is a rectangular plate-like structure. Its length is equivalent to the length of the accommodation cavity 11, while the width is smaller than the length of the accommodation cavity 11. Therefore, multiple liquid cooling plates 22 can be attached to the bottom surface of the support plate 21. The small area design of the liquid cooling plate 22 can ensure the contact area. When a failure or leakage occurs, only the faulty liquid cooling plate 22 needs to be replaced, rather than the whole, reducing the maintenance cost and having high flexibility.

[0027] As Figure 2 and 3As shown, the liquid cooling plate 22 is fixed to the support plate 21 by the pressure strip 23. After removing the pressure strip 23, the liquid cooling plate 22 can be removed. Specifically, a plurality of holes are respectively formed in the pressure strip 23 and the cooling plate 21, and a locking member (such as a bolt) is inserted between the corresponding holes to achieve fixation. The pressure strip 23 covers all the liquid cooling plates 22. The bolt structure is simple and the operation is convenient.

[0028] Preferably, each liquid cooling plate 22 is respectively provided with a liquid inlet 221 and a liquid outlet 222 communicating with its internal cavity. Two water diversion joints 12 are formed on the housing 10. One water diversion joint 12 communicates with all the liquid inlets 221 at the same time, and the other water diversion joint 12 is connected to all the liquid outlets 222 at the same time. Therefore, the cooling platform 100 adopts a circulating liquid cooling form. By connecting an external coolant, the coolant is circulated throughout the sintering carrier cooling process, discharging the coolant with a higher temperature and introducing the coolant with a lower temperature, so as to ensure the cooling effect.

[0029] Preferably, the liquid inlet 221 and the liquid outlet 222 are formed at both ends of the liquid cooling plate 22 along the length direction, so that the coolant flows from one end of the support plate 21 to the other end in the liquid cooling plate 22 to cover the entire surface of the support plate 21, so that most of the area of the support plate 21 (except the contact area with the side wall of the housing 10) is a cooling area. The operator can place the sintering carrier on the support plate 21 without identifying the area.

[0030] To cooperate with the above settings, the two water diversion joints 12 are arranged on the two side walls of the housing 10 along the length direction of the liquid cooling plate 22, so that the connection distance between the water diversion joints 12 and the liquid inlets 221 and the liquid outlets 222 is the shortest.

[0031] Of course, the two water diversion joints 12 can also be arranged on the side walls on the same side of the housing 10 for the convenience of the operator to connect. This embodiment does not limit.

[0032] Preferably, a temperature control module 24 is installed on the housing 10, which is connected to and displays the temperature of the support plate 21. For example, when the displayed temperature is too high, the flow rate of the coolant can be appropriately increased to expand the temperature difference and improve the heat transfer rate, so as to quickly reduce the temperature of the support plate 21. When the temperature is displayed as the preset temperature, the sintering carrier can be removed.

[0033] Such as Figure 2 and 3 As shown, the cooling platform 100 is a portable platform and can be moved to the target position according to needs. Therefore, for convenient handling, handles 13 are arranged on the opposite side walls of the housing 10 for the operator to grasp.

[0034] Such as Figure 3As shown, a plurality of rubber feet 14 are installed at the bottom of the housing 10, which are used to provide shock absorption, reduce the vibration generated during operation from being transmitted to the sintering carrier, avoid the collision between the cooling platform 100 and the sintering carrier, and reduce noise.

[0035] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed claim.

[0036] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A cooling platform for cooling a sintering carrier, characterized in that, Comprising: A housing, with a receiving cavity formed inside; A support plate, disposed at the opening of the receiving cavity to close the receiving cavity, and the surface of the support plate facing away from the receiving cavity is used to support the sintering carrier to be cooled; A cooling assembly, including a liquid cooling plate attached to the surface of the support plate facing the receiving cavity, which forms a cavity for storing coolant.

2. The cooling platform for cooling the sintering carrier according to claim 1, wherein, Multiple of the above-mentioned liquid cooling plates are attached to the liquid cooling plate.

3. The cooling platform for cooling the sintering carrier according to claim 2, wherein, Each liquid cooling plate is respectively provided with a liquid inlet and a liquid outlet communicating with the cavity, and two water inlet connectors are fixed on the housing, one of the water inlet connectors communicates with all the liquid inlets, and the other water inlet connector communicates with all the liquid outlets.

4. The cooling platform for cooling a sintering carrier according to claim 3, wherein, The liquid inlet and the liquid outlet are arranged at both ends of the liquid cooling plate along the length direction of the liquid cooling plate.

5. The cooling platform for cooling the sintering carrier according to claim 3, characterized in that, The two water inlet connectors are arranged on both side walls of the housing along the length direction of the liquid cooling plate.

6. The temperature reduction platform for cooling the sintering carrier according to claim 3, characterized in that The two water inlet connectors are arranged on the same side wall of the housing.

7. The cooling platform for cooling a sintering carrier according to claim 1, wherein The cooling assembly further includes a pressure strip for fixing the liquid cooling plate to the support plate, and the pressure strip is detachably fixed to the support plate.

8. The cooling platform for cooling the sintering carrier according to claim 1, characterized in that, It further includes a temperature control module fixed to the housing, and the temperature control module connects to and displays the temperature of the support plate.

9. The cooling platform for cooling a sintering carrier according to claim 1, wherein, A handle for grasping is provided on the housing, and the handle is provided on opposite side walls of the housing.

10. The cooling platform for cooling a sintering carrier according to claim 1, characterized in that, Rubber feet are fixed to the bottom of the housing.

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