Semiconductor chip photoresist masking quality inspection device

Abstract

The utility model relates to a photoresist masking quality inspection device for a semiconductor chip, which aims to solve the problems that in the prior art, missing inspection is easy to cause, defects are caused in the production and manufacturing process, the product quality is seriously influenced, the yield is low, and a simple magnifying glass inspection device is low in production efficiency. A horizontal positioning device and a video device are arranged on the bracket; a horizontal positioning device is arranged on the operating platform, an automatic rotating device is arranged above the horizontal positioning device, a slide glass platform is arranged above the automatic rotating device, a video device is arranged above the slide glass platform, and an adjusting controller is arranged on the operating platform. And then defect points are repaired, so that the junction terminal shaping area table board is intact before being corroded by acid and alkali liquor, and therefore, the device not only improves the working efficiency, but also improves the product quality, and achieves remarkable economic and social benefits.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip design and manufacturing, and particularly relates to a semiconductor chip photoresist masking quality inspection device. Background Art

[0002] When looking at a thyristor semiconductor chip from the front, it has a gate region, a cathode region, and a junction termination shaping region respectively; when looking at it from the back, it has an anode region and a junction termination shaping region respectively. The anode and cathode regions are in the central area and are circular; the junction termination shaping region is distributed at the outer ends of the anode and cathode regions and is annular; the gate region is distributed inside the cathode region. The voltage blocking capacity within the thyristor semiconductor chip body is a planar PN junction; due to a sudden interruption from the outside, the PN junction in the junction termination region is bent and distorted, causing electric field concentration and a decrease in the voltage blocking capacity. Therefore, a special shaping must be carried out in a certain area of the junction termination to enable it to withstand the blocking voltage. The anode and cathode regions and the junction termination shaping region need to use photoresist as a masking demarcation line. The anode and cathode regions need photoresist as a masking protection layer, while the junction termination shaping region needs to be exposed, and the junction termination shaping region is etched into a special shape with an acid-base etching solution. Therefore, the photoresist protection boundary between the anode and cathode regions and the junction termination shaping region must be well protected, regular, without burrs and defects; otherwise, it will cause shaping distortion in the junction termination region, resulting in electric field concentration and further affecting the voltage blocking capacity.

[0003] In the past, the quality inspection of the photoresist masking protection of thyristor semiconductor chips was to use a simple magnifying glass to check the quality of the photoresist protection layer in the anode and cathode regions, the photolithography lines, and the exposure situation in the junction termination region. Due to the low magnification, small field of view, or unsystematic and irregular inspection of the simple magnifying glass, there are often missed defect points, resulting in production and manufacturing defects, seriously affecting product quality, resulting in a low yield, and the production efficiency of the simple magnifying glass inspection device is also low. Summary of the Utility Model

[0004] To overcome the problems that in the above-mentioned prior art, when using a simple magnifying glass to check the quality of the photoresist protection layer in the anode and cathode regions, the photolithography lines, and the exposure situation in the junction termination region, there are often missed defect points in the inspection, resulting in defects in the production and manufacturing process, seriously affecting product quality, resulting in a low yield, and the production efficiency of the simple magnifying glass inspection device is low, the utility model proposes a semiconductor chip photoresist masking quality fine inspection device, which can quickly, efficiently, and accurately inspect the semiconductor chip photoresist masking layer quality inspection device.

[0005] The technical solution of the present utility model is: a semiconductor chip photoresist masking quality inspection device, including a bracket and an operating table. A bracket is provided on the operating table. It further includes a wafer stage, an automatic rotation device, a horizontal positioning device, an adjustment controller, a video device, and a large-screen projection device. The horizontal positioning device and the video device are provided on the bracket; the automatic rotation device is provided above the horizontal positioning device, the wafer stage is provided above the automatic rotation device, the video device is provided above the wafer stage, and the adjustment controller is provided on the operating table;

[0006] The bracket includes a base, a cross beam, and a vertical beam. One end of the base is connected to one end of the cross beam through the vertical beam. A video device through hole is provided at the other end of the cross beam, and a video device is provided in the video device through hole. The automatic rotation device is provided on the base;

[0007] The automatic rotation device is a rectangular parallelepiped metal box. A transmission convex shaft is provided at the center of the automatic rotation device. A rotation motor is provided inside the automatic rotation device. The transmission convex shaft is connected to the rotation motor. The rotation motor is provided with a power supply jack a and a data line jack a;

[0008] A shallow hole is provided at the center of the bottom of the wafer stage. The upper surface of the wafer stage is a cylinder with a flat bottom and a convex rib provided around the edge. The shallow hole is connected to the transmission convex shaft;

[0009] The video device includes an outer diameter of the video device. The outer diameter of the video device is a cylindrical structure. A power supply terminal and a data connection jack are provided at the top of the outer diameter of the video device. Multiple magnifying convex lenses are provided inside the outer diameter of the video device. A focal length adjustment knob is provided on the outside of the outer diameter of the video device. A lighting power supply is provided on the outside of the bottom of the outer diameter of the video device. The data connection jack is connected to the large-screen projection device;

[0010] A clamping device a is provided at the inner top of the horizontal positioning device. A transverse lead screw is provided on the side wall of the upper middle part inside the horizontal positioning device through the clamping device a. A clamping device b is provided at the center of the inner bottom of the horizontal positioning device. A longitudinal lead screw is provided on the side wall of the middle and lower part inside the horizontal positioning device through the clamping device b. A horizontal track is provided between the top plate of the horizontal positioning device and the horizontal positioning device. A vertical track is provided between the bottom plate of the horizontal positioning device and the horizontal positioning device. The longitudinal lead screw and the transverse lead screw are both provided with drive motors. The drive motors are provided with a power supply jack b and a data line jack b;

[0011] The adjustment controller is a cuboid metal box, which is internally provided with a single-chip microcomputer circuit board PLC-MOED1 and PLC-MOED2. The data line interface port1 of the single-chip microcomputer circuit board PLC-MOED1 is connected to the data line jack a; the data line interfaces port2 and port3 of the single-chip microcomputer circuit board PLC-MOED2 are connected to the data line jack b; externally, there are terminal posts a and terminal posts b, and the terminal posts a and terminal posts b are respectively connected to the single-chip microcomputer circuit boards PLC-MOED1 and PLC-MOED2 for power supply;

[0012] The depth of the shallow hole is 1-1.5 cm.

[0013] The convex rib is arc-shaped. When placing the semiconductor chip, it is not easy to damage the semiconductor chip. The width of the convex rib is 1-2 cm, the height of the convex rib is 0.3-0.5 cm, and the inner diameter of the convex rib is 0.1-0.2 cm larger than the outer diameter of the semiconductor chip.

[0014] The height of the transmission convex shaft is 5-6 cm greater than the depth of the shallow hole.

[0015] The cross beam is connected to the vertical beam and the video device through hole in a vertically movable manner.

[0016] The magnification of the video device is 15-25 times, the indication accuracy is 0.001 mm, and the resolution is 2K.

[0017] The large-screen projection device is an 80-inch high-definition digital TV with a resolution of 2K. The large-screen projection device is fixed on the wall at a height of 0.5-1 meter from the ground; it is 5-6 meters away from the test operation table.

[0018] The present utility model has the following advantages compared with the prior art: 1. Since high-magnification high-definition video devices, large-screen projection devices, and automatic uniform rotation and other devices are used, it is possible to quickly, efficiently, and accurately detect lithography process quality problems; 2. Since high-magnification high-definition video devices, large-screen projection devices, and automatic uniform rotation and other devices are used, the labor intensity is reduced, the labor cost is saved, and the work efficiency is improved; 3. Since high-magnification high-definition video devices, large-screen projection devices, and automatic uniform rotation and other devices are used, defects can be discovered in time, and the defective points can be repaired immediately, making the product perfect, improving the yield rate, and improving the product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic top view of the structure of the carrier platform of the present utility model

[0020] Figure 2 It is a cross-sectional view of the structure of the carrier platform of the present utility model

[0021] Figure 3Top view schematic diagram of the automatic rotation device of the present utility model

[0022] Figure 4 Cross-sectional view of the automatic rotation device of the present utility model

[0023] Figure 5 Perspective structure schematic diagram of the horizontal positioning device of the present utility model

[0024] Figure 6 Cross-sectional structure schematic diagram of the horizontal positioning device of the present utility model

[0025] Figure 7 Top view schematic diagram of the adjustment controller of the present utility model

[0026] Figure 8 Front view schematic diagram of the adjustment controller of the present utility model

[0027] Figure 9 Top view structure schematic diagram of the bracket of the present utility model

[0028] Figure 10 Cross-sectional view of the bracket of the present utility model

[0029] Figure 11 Top view structure schematic diagram of the video device of the present utility model

[0030] Figure 12 Cross-sectional structure schematic diagram of the video device of the present utility model

[0031] Figure 13 Overall structure schematic diagram of the present utility model

[0032] Figure 14 Structure schematic diagram of the large-screen projection device and inspection pattern of the present utility model Specific implementation manners

[0033] For a clearer understanding of the technical features, objectives, and effects of the present utility model, the specific implementation manners of the present utility model will now be described in detail with reference to the accompanying drawings.

[0034] As Figures 1 to 14 A semiconductor chip photoresist masking quality inspection device of the present utility model includes a bracket 5 and an operating table. The operating table is provided with a bracket 5, and further includes a wafer stage 1, an automatic rotation device 2, a horizontal positioning device 3, an adjustment controller 4, a video device 6, and a large-screen projection device 7. The horizontal positioning device 3 is provided on the bracket 5, and the video device 6 is provided above the horizontal positioning device 3. The automatic rotation device 2 is provided above the horizontal positioning device 3, the wafer stage 1 is provided above the automatic rotation device 2, the video device 6 is provided above the wafer stage 1, and the adjustment controller 4 is provided on the operating table.

[0035] The bracket 5 includes a base 51, a cross beam 54, and a vertical beam 56. One end of the base 51 is connected to one end of the cross beam 54 through the vertical beam 56. The other end of the cross beam 54 is provided with a video device through hole 55, and a video device 6 is arranged in the video device through hole 55. An automatic rotation device 2 is arranged on the base 51;

[0036] The automatic rotation device 2 is a cuboid metal box. A transmission convex shaft 21 is arranged at the center of the automatic rotation device 2. A rotation motor 22 is arranged inside the automatic rotation device 2. The transmission convex shaft 21 is connected to the rotation motor 22. The rotation motor 22 is provided with a power supply jack a23 and a data line jack a24;

[0037] A shallow hole 12 is arranged at the center of the bottom of the slide platform 1. The upper surface of the slide platform 1 is a cylinder with a flat bottom and a convex rib 13 arranged around the edge. The shallow hole 12 is connected to the transmission convex shaft 21;

[0038] The video device 6 includes a video device outer diameter 64. The video device outer diameter 64 is a cylindrical structure. A power supply terminal 66 and a data connection jack 65 are arranged at the top of the video device outer diameter 64. A multiple magnification convex lens 62 is arranged inside the video device outer diameter 64. A focal length adjustment knob 63 is arranged outside the video device outer diameter 64. A lighting power supply 61 is arranged outside the bottom of the video device outer diameter 64. The data connection jack 65 is connected to a large screen projection device 7;

[0039] A clamping device a31 is arranged at the inner top of the horizontal positioning device 3. A horizontal lead screw 32 is arranged on the side wall of the upper middle part inside the horizontal positioning device 3 through the clamping device a31. A clamping device b38 is arranged at the center of the inner bottom of the horizontal positioning device 3. A vertical lead screw 36 is arranged on the side wall of the middle and lower part inside the horizontal positioning device 3 through the clamping device b38. A horizontal track 34 is arranged between the top plate of the horizontal positioning device 3 and the horizontal positioning device 3. A vertical track 34 is arranged between the bottom plate of the horizontal positioning device 3 and the horizontal positioning device 3. The vertical lead screw 36 and the horizontal lead screw 32 are both provided with a transmission motor 33. The transmission motor 33 is provided with a power supply jack b331 and a data line jack b332;

[0040] The adjustment controller 4 is a cuboid metal box, and a single-chip microcomputer circuit board PLC-MOED1 and PLC-MOED2 are arranged inside. The data line interface port1 of the single-chip microcomputer circuit board PLC-MOED1 is connected to the data line jack a24; The data line interfaces port2 and port3 of the single-chip microcomputer circuit board PLC-MOED2 are connected to the data line jack b332; External connection terminals a41 and b42 are arranged, and the connection terminals a41 and b42 are respectively connected to the single-chip microcomputer circuit board PLC-MOED1 and PLC-MOED2 for power on;

[0041] The depth of the shallow hole 12 is 1 - 1.5 cm.

[0042] The convex rib 13 is arc-shaped. When placing the semiconductor chip, it is not easy to damage the semiconductor chip. The width of the convex rib 13 is 1 - 2 cm, the height of the convex rib 13 is 0.3 - 0.5 cm, and the inner diameter of the convex rib 13 is 0.1 - 0.2 cm larger than the outer diameter of the semiconductor chip.

[0043] The height of the driving camshaft 21 is 5 - 6 cm greater than the depth of the shallow hole 12.

[0044] The cross beam 54 is connected to the vertical beam 56 and the video device through hole 55 in a vertically movable manner.

[0045] The magnification of the video device 6 is 15 - 25 times, the indication accuracy is 0.001 mm, and the resolution is 2K.

[0046] The large screen projection device 7 is an 80-inch high-definition digital TV with a resolution of 2K. The large screen projection device 7 is fixed on the wall at a height of 0.5 - 1 meter from the ground; and it is 5 - 6 meters away from the test operation table.

[0047] During installation: Install the wafer stage 1 on the automatic rotating device 2, power on the automatic rotating device 2, the horizontal positioning device 3, the adjustment controller 4, the video device 6, and the large screen projection device 7. Place the semiconductor chip test sample on the wafer stage 1, turn on the power switch of the large screen projection device 7, turn on the data cable switch of the video device 6 and the large screen projection device 7, project the field of view observed by the video device 6 onto the large screen projection device 7, adjust the up, down, left, and right buttons of the motor of the adjustment controller 4 to make a certain area of the semiconductor chip test sample on the wafer stage 1 in the terminal shaping area directly below the video device 6, adjust the height of the high-magnification high-definition video device 6 to make the magnification reach 20 times; adjust the focal length of the video device 6 up and down to make the clarity optimal. Place the semiconductor chip to be inspected on the wafer stage 1, start the constant-speed rotation through the human-machine interface, carefully check the image on the large screen projection device 7, and repair the defect points in time to ensure that the chip has no defects before being corroded by the acid-base solution and guarantee the perfection of the semiconductor chip terminal shaping area.

[0048] Such as Figure 1 、 Figure 2As shown in the figure, it is a schematic structural diagram of the carrier platform of the utility model technology. The upper surface of the carrier platform 1 is designed to be flat at the bottom and is a cylinder with a convex rib 13 around it. The width of the convex rib 13 is 1 - 2 cm, the height of the convex rib 13 is 0.3 - 0.5 cm, and the inner diameter of the convex rib 13 is 0.1 - 0.2 cm larger than the outer diameter of the chip, which is convenient for taking and placing the chip and fixing the chip; the lower surface is also designed to be flat at the bottom, and a shallow hole 12 is designed at the center of the lower surface, with a depth of 1 - 1.5 cm. The thickness of the carrier platform is 2 - 3 cm, and the material is polytetrafluoroethylene.

[0049] Preferably, the edge of the convex rib 13 is designed to be arc-shaped, which is convenient for placing the semiconductor chip and is not easy to damage the edge of the semiconductor chip.

[0050] As Figure 3 、 Figure 4 shown in the figure, it is a schematic structural diagram of the automatic rotation device of the utility model technology. The automatic rotation device 2 is a rectangular metal box with a rotating motor 22 installed inside. It is fixed by 4 screws T around it, and the motor is also fixed at the center of the lower surface of the top plate by 4 screws T. The driving convex shaft 21 of the motor extends out of the metal surface box. The outer diameter of the driving convex shaft 21 matches the inner diameter of the shallow hole 12 of the carrier platform 1 to prevent slipping when moving relative to the carrier platform 1. The height of the driving convex shaft 21 should be 5 - 6 cm greater than the depth of the shallow hole 12 of the carrier platform 1, so that the carrier platform 1 is suspended above the upper surface of the automatic rotation device 2, preventing the lower bottom surface of the carrier platform 1 from rubbing against the upper surface of the automatic rotation device 2 when the carrier platform 1 rotates. The power jack a23 of the rotating motor 22 and the data line jack a 24 of the rotating motor 22.

[0051] As Figure 5 、 Figure 6As shown in the figure, it is a schematic structural diagram of the horizontal positioning device 3. When looking at the horizontal positioning device 3 from top to bottom, a clamping device 31 is installed at the center of the lower surface of the top plate of the horizontal positioning device 3 through a screw T and is connected to the transverse lead screw 32. The transverse lead screw 32 is fixed on the side walls at the upper middle part on the left and right of the horizontal positioning device 3. A drive motor 33 is installed on the outer side of the right side of the horizontal positioning device 3 through a screw T. There is a power jack b331 and a data line jack b332 of the drive motor 33. The drive motor 33 is connected to the right side of the transverse lead screw 32. Tracks 34 are installed at the positions of the upper side edges of the front and rear of the box body of the horizontal positioning device 3 and the lower side edges of the front and rear of the top plate. It can be seen that the transverse movement of the top plate can be realized through the lead screw 32, the clamping device 31, and the tracks 34; the longitudinal lead screw 36 is fixed on the side walls at the middle and lower parts of the front and rear of the horizontal positioning device 3. A drive motor 33 is also installed on the outer side of the rear side of the positioning device 3 through a screw T and is connected to the longitudinal lead screw 36. A clamping device 38 is installed at the center of the upper surface of the bottom plate of the horizontal positioning device 3 through a screw T and is connected to the longitudinal lead screw 36. Tracks 34 are installed at the positions of the lower side edges of the left and right of the box body of the horizontal positioning device 3 and the upper side edges of the left and right of the bottom plate. It can be seen that the front and rear movement of the box body of the horizontal positioning device 3 can be realized through the lead screw 36, the clamping device 38, and 34. In summary, the horizontal movement of the horizontal positioning device 3 can be realized.

[0052] The rotating device 2 is fixed on the horizontal positioning device 3 through screws, and the horizontal movement of the automatic rotating device 2 can be realized.

[0053] As Figure 7 、 Figure 8 shown in the figure, it is a schematic structural diagram of the adjustment controller 4. The adjustment controller 4 is a rectangular metal box with a circuit board inside and button buttons outside. Specifically, there are two single-chip microcomputer circuit boards PLC-MOED1 and PLC-MOED2 inside. The data line interface port1 of the single-chip microcomputer circuit board PLC-MOED1 is connected to the data line 24 of the automatic rotating device 2, and the rotation speed is adjusted through the human-machine interaction interface; the data line interfaces port2 and port3 of the single-chip microcomputer circuit board PLC-MOED2 are connected to the data line 332 of the horizontal positioning 3, and the position of the horizontal positioning device 3 is controlled through the up, down, left, and right buttons. The terminal blocks 41 and 42 are the terminal blocks for energizing the single-chip microcomputer circuit boards PLC-MOED1 and PLC-MOED2 respectively.

[0054] As Figure 9 、 Figure 10 shown in the figure, it is a schematic structural diagram of the bracket 5. The base of the bracket 5 is a rectangular flat plate 51, and the horizontal positioning device 3 is fixed on the base flat plate 51; a cross beam 54 is provided at the upper end of the bracket. A fastening screw 52 is provided at the left end of the cross beam 54 to fasten the cross beam 54; a video device through hole 55 and a fastening screw b53 are provided at the right end of the cross beam 54 to fasten the video device through hole 55.

[0055] As shown in Figure 11 , Figure 12 shown in the figure, it is a schematic structural diagram of the video device 6. The lighting power supply 61 increases the light in the field of view; the multiple magnifying convex lens 62 makes the magnification reach 20 times; the focal length adjustment knob 63 clarifies the image; the outer diameter 64 of the video device matches the through hole 55 of the video device, and the fastening screw b53 is installed to fix the video device 6; the power terminal 66 accesses the power supply; the data connection jack 65 accesses the data cable to transmit the image to the large-screen projection device.

[0056] As shown in Figure 13 shown in the figure, it is a schematic diagram of the overall structure of the fine inspection device for the masking quality of semiconductor chip photoresist. The wafer stage 1 is installed on the driving camshaft of the automatic rotating device 2; the automatic rotating device 2 is fixed at the center position on the upper surface of the horizontal positioning device 3, the horizontal positioning device 3 is placed on the bottom plate, the regulator 4 is placed on the right side of the horizontal positioning device 3, and the large-screen projection device 7 is fixed on the opposite wall. The automatic rotating device 2, the horizontal positioning device 3, the adjustment controller 4, the video device 6 and the large-screen projection device 7 all need to be powered on. The motor data cables of the automatic rotating device 2 and the horizontal positioning device 3 are connected to the single-chip microcomputer circuit board of the adjustment controller 4, and the data cable of the video device 6 is connected to the large-screen projection device 7.

[0057] Preferably, the large-screen projection device 7 is 0.5 - 1 meter above the ground; and 5 - 6 meters away from the test operation table, otherwise it will cause dizziness and blurred vision for the tester.

[0058] As shown in Figure 14 shown in the figure, it is an example diagram of the present utility model for inspecting semiconductor chips. The large-screen projection device 7; S is the photoresist protection layer; T is the junction termination shaping region; magnifying the local image by 20 times, the defects in the junction termination shaping region T can be clearly inspected and repaired to ensure that the junction termination shaping region T is perfect before being corroded by the acid-base etching solution.

Claims

1. A semiconductor chip photoresist masking quality inspection device, including a bracket (5) and an operating table. The bracket (5) is provided on the operating table, and it is characterized in that: It also includes a slide platform (1), an automatic rotation device (2), a horizontal positioning device (3), an adjustment controller (4), a video device (6), and a large-screen projection device (7). The bracket (5) is provided with a horizontal positioning device (3) and a video device (6); above the horizontal positioning device (3) is provided an automatic rotation device (2), above the automatic rotation device (2) is provided a slide platform (1), above the slide platform (1) is provided a video device (6), and on the operating table is provided an adjustment controller (4); The bracket (5) includes a base (51), a cross beam (54), and a vertical beam (56). One end of the base (51) is connected to one end of the cross beam (54) through the vertical beam (56). The other end of the cross beam (54) is provided with a video device through hole (55), and a video device (6) is arranged in the video device through hole (55). The automatic rotation device (2) is arranged on the base (51); The automatic rotation device (2) is a cuboid metal box. A transmission convex shaft (21) is arranged at the center of the automatic rotation device (2). A rotation motor (22) is arranged inside the automatic rotation device (2). The transmission convex shaft (21) is connected to the rotation motor (22). The rotation motor (22) is provided with a power supply jack a (23) and a data line jack a (24); At the center of the bottom of the slide platform (1) is provided a shallow hole (12). The upper surface of the slide platform (1) is a cylinder with a flat bottom and a convex rib (13) arranged around the edge. The shallow hole (12) is connected to the transmission convex shaft (21); The video device (6) includes a video device outer diameter (64). The video device outer diameter (64) is a cylindrical structure. At the top of the video device outer diameter (64) are provided a power supply terminal (66) and a data connection jack (65). Inside the video device outer diameter (64) is provided a multi-magnification convex lens (62). On the outer side of the video device outer diameter (64) is provided a focal length adjustment knob (63). On the outer side of the bottom of the video device outer diameter (64) is provided a lighting power supply (61). The data connection jack (65) is connected to the large-screen projection device (7); At the inner top of the horizontal positioning device (3) is provided a positioning device a (31). A transverse lead screw (32) is arranged on the side wall of the upper middle part inside the horizontal positioning device (3) through the positioning device a (31). At the center of the inner bottom of the horizontal positioning device (3) is provided a positioning device b (38). A longitudinal lead screw (36) is arranged on the side wall of the middle and lower part inside the horizontal positioning device (3) through the positioning device b (38). Between the top plate of the horizontal positioning device (3) and the horizontal positioning device (3) is provided a horizontal track (34). Between the bottom plate of the horizontal positioning device (3) and the horizontal positioning device (3) is provided a vertical track (34). Both the longitudinal lead screw (36) and the transverse lead screw (32) are provided with drive motors (33). The drive motors (33) are provided with a power supply jack b (331) and a data line jack b (332); The adjustment controller (4) is a cuboid metal box, which is internally provided with a single-chip microcomputer circuit board PLC-MOED1 and PLC-MOED2. The data line interface port1 of the single-chip microcomputer circuit board PLC-MOED1 is connected to the data line jack a (24); the data line interfaces port2 and port3 of the single-chip microcomputer circuit board PLC-MOED2 are connected to the data line jack b (332); externally, there are terminal posts a (41) and terminal posts b (42), and the terminal posts a (41) and terminal posts b (42) are respectively connected to the single-chip microcomputer circuit boards PLC-MOED1 and PLC-MOED2 for power-on.

2. The semiconductor chip photoresist masking quality inspection device according to claim 1, wherein: The depth of the shallow hole (12) is 1 - 1.5 cm.

3. The semiconductor chip photoresist masking quality inspection device according to claim 1, wherein: The convex rib (13) is arc-shaped, and it is not easy to damage the semiconductor chip when placing the semiconductor chip. The width of the convex rib (13) is 1 - 2 cm, the height of the convex rib (13) is 0.3 - 0.5 cm, and the inner diameter of the convex rib (13) is 0.1 - 0.2 cm larger than the outer diameter of the semiconductor chip.

4. A semiconductor chip photoresist masking quality inspection device according to claim 1, characterized in that: The height of the transmission convex shaft (21) is 5 - 6 cm greater than the depth of the shallow hole (12).

5. A semiconductor chip photoresist masking quality inspection device according to claim 1, characterized in that: The cross beam (54) is movably connected to the vertical beam (56) and the video device through hole (55) up and down.

6. The semiconductor chip photoresist masking quality inspection device according to claim 1, characterized in that: The magnification of the video device (6) is 15 - 25 times, the indication accuracy is 0.001 mm, and the resolution is 2K.

7. The semiconductor chip photoresist masking quality inspection device according to claim 1, characterized in that: The large-screen projection device (7) is an 80-inch high-definition digital TV with a resolution of 2K. The large-screen projection device (7) is fixed on the wall at a height of 0.5 - 1 meter from the ground; and it is 5 - 6 meters away from the test operation table.

Images