Cooling patch rolling bearing platform for chip-on-film packaging body
By designing a rolling bearing platform for the crystal-covered thin film packaging, the accommodating groove and vacuum hole technology is used to solve the problem that the heat dissipation stick cannot be fully fit during the rolling process, achieving better fit and appearance quality.
Patent Information
- Application Number
- CN202422192411.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-09-06
AI Technical Summary
In the prior art, the heat dissipation patch of the crystal-covered thin film package cannot be fully fit during the rolling process, resulting in the pleat of the heat dissipation patch and the problem of poor appearance.
A heat dissipation stick rolling bearing platform for a crystal-covered thin film package is designed. The platform body is equipped with an accommodating groove, the cross-section of the top wall of the accommodating groove is greater than the cross-section of the bottom wall, and the depth is not less than the thickness of the package. The side wall of the accommodating groove is an inclined surface, which is used to accommodate the chip and adsorb the substrate through the vacuum hole to ensure that the substrate and the heat dissipation stick are fully fitted.
Improve the wrinkle degree of the heat dissipation patch, improve the yield of the packaged products, and reduce poor appearance.
Smart Images
Figure CN223079085U_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present disclosure belong to the technical field of semiconductor integrated circuit packaging, and particularly relate to a heat dissipation sticker rolling and carrying platform for a flip chip on film package body. Background Art
[0002] A COF (Chip on film) product is a packaging structure that fixes a slender chip on a thin, light, and bendable substrate, and is mostly used as a driving chip for a display screen. Due to its special structure, when a COF product needs to enhance its heat dissipation performance, a thin and sticky heat dissipation sticker is usually attached to the substrate side of its back; however, since the main body generating heat is the chip, attaching the heat dissipation sticker on the substrate side has limited effect. Therefore, in order to enhance the heat dissipation effect, it is now necessary to directly attach the heat dissipation sticker on the chip on the front side.
[0003] The current heat dissipation sticker attaching process mainly includes three steps: the label picking head sucks the heat dissipation sticker, the label picking head carries the heat dissipation sticker and presses it onto the front side of the COF product, and the roller rolls the heat dissipation sticker. Since the chip has a certain height relative to the substrate, and the heat dissipation sticker has insufficient ductility, the heat dissipation sticker cannot be fully attached. After rolling the heat dissipation sticker, the heat dissipation sticker cannot be rolled to be completely flat, and there will be a circle of wrinkles, resulting in a problem of poor appearance.
[0004] In view of the above problems, it is necessary to propose a heat dissipation sticker rolling and carrying platform for a flip chip on film package body that is reasonably designed and can effectively improve the above problems. Utility Model Content
[0005] Embodiments of the present disclosure aim to at least solve one of the technical problems existing in the prior art, and provide a heat dissipation sticker rolling and carrying platform for a flip chip on film package body.
[0006] Embodiments of the present disclosure provide a heat dissipation sticker rolling and carrying platform for a flip chip on film package body. The flip chip on film package body includes a substrate, a chip disposed on the substrate, and a heat dissipation sticker mounted on the front side of the chip. The carrying platform is characterized in that it includes a platform body for carrying the flip chip on film package body;
[0007] The platform body is provided with a receiving groove for receiving the chip when rolling the heat dissipation sticker; wherein,
[0008] The cross-sectional dimension of the top wall of the receiving groove is larger than the cross-sectional dimension of the bottom wall of the receiving groove, and the depth of the receiving groove is not less than the total thickness of the flip chip on film package body.
[0009] Optionally, the cross-sectional dimension of the receiving groove gradually decreases from its top wall to its bottom wall.
[0010] Optionally, the side wall of the receiving groove is planar.
[0011] Optionally, the longitudinal section of the receiving groove is trapezoidal or triangular.
[0012] Optionally, the side wall of the receiving groove is curved.
[0013] Optionally, the platform body is provided with a plurality of ventilation holes; among them,
[0014] Some of the ventilation holes penetrate through the platform body along the width direction of the platform body.
[0015] Optionally, the remaining ventilation holes penetrate through the platform body along the length direction of the platform body.
[0016] Optionally, the platform body is provided with a plurality of vacuum holes;
[0017] The plurality of vacuum holes are arranged at intervals along the circumferential side of the receiving groove; among them,
[0018] The first end of the vacuum hole is communicated with the ventilation hole, and the second end of the vacuum hole is used to adsorb the substrate.
[0019] Optionally, the plurality of vacuum holes are arranged in a matrix.
[0020] Optionally, the platform body is further provided with a plurality of fixing holes penetrating through its thickness.
[0021] The heat dissipation sticker rolling and bearing platform for a flip-chip thin film package body according to an embodiment of the present disclosure includes a platform body for bearing the flip-chip thin film package body. The platform body is provided with a receiving groove for receiving the chip when rolling the heat dissipation sticker. Among them, the cross-sectional dimension of the top wall of the receiving groove is larger than the cross-sectional dimension of the bottom wall of the receiving groove, and the depth of the receiving groove is not less than the total thickness of the flip-chip thin film package body. Since the side wall of the receiving groove is an inclined surface, the groove wall of the receiving groove can support the substrate when rolling the heat dissipation sticker, thereby improving the wrinkling degree of the heat dissipation sticker, reducing the appearance defects of the packaged product, and improving the yield. Description of the Drawings
[0022] Figure 1 Schematic diagram of the structure of taking a header sticker to mount a heat dissipation sticker in the prior art;
[0023] Figure 2 Schematic diagram of the structure of the bearing platform in the prior art;
[0024] Figure 3 Schematic diagram of the heat dissipation sticker attached to the front after rolling in the prior art;
[0025] Figure 4Schematic diagram of the structure of a heat dissipation sticker rolling and bearing platform for a flip-chip thin film package in an embodiment of the present disclosure;
[0026] Figure 5 is Figure 4 the top view of the bearing platform in;
[0027] Figure 6 Cross-sectional view of a heat dissipation sticker rolling and bearing platform for a flip-chip thin film package in another embodiment of the present disclosure;
[0028] Figure 7 Cross-sectional view of a heat dissipation sticker rolling and bearing platform for a flip-chip thin film package in another embodiment of the present disclosure;
[0029] Figure 8 Cross-sectional view of a heat dissipation sticker rolling and bearing platform for a flip-chip thin film package in another embodiment of the present disclosure. Detailed implementation manners
[0030] To enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, the following further describes the embodiments of the present disclosure in detail with reference to the accompanying drawings and specific implementation manners.
[0031] As Figure 1 shown, in the prior art, a label picking head 6 for frontally attaching a heat dissipation sticker will open a groove 61 at a corresponding position of a chip 4. When the label picking head adsorbs the heat dissipation sticker and presses it onto a substrate 5, the label picking head groove 61 will reshape the originally flat heat dissipation sticker 3 into a shape with a convex top on the chip 4 and gradually flattening outward, and the edge is initially attached to the substrate 5; from the cross-sectional view, the heat dissipation sticker presents a trapezoid.
[0032] Since the pressing of the label picking head 6 cannot attach the heat dissipation sticker flatly, a roller is needed to roll it again to flatten the outer shape of the heat dissipation sticker 3 and discharge the bubbles between the heat dissipation sticker 3 and the substrate 5.
[0033] As Figure 2As shown in the figure, when rolling the heat dissipation sticker 6, the existing bearing platform 7 has a square groove 71 at the position corresponding to the chip 4, which is used to accommodate the chip 4 when the roller 2 rolls the surface of the heat dissipation sticker 3, so as to avoid the chip 4 being broken due to excessive pressure. Considering the deviation caused by the operation and recognition of the machine, the specification of the bearing platform groove 71 is larger than that of the sticker picking head groove 61. Therefore, when rolling, at the position supported by the upper surface of the bearing platform 7, the heat dissipation sticker 3 and the substrate 5 can be closely attached; while in the groove 71, the originally trapezoidal heat dissipation sticker 3 will be pressed down as a whole by the roller 2 with certain elasticity, and the overall height of the COF product in the groove is slightly lower than the upper surface of the bearing platform 7. Due to the large height difference at the edge of the square groove, under the pressure of the roller 2, the heat dissipation sticker is squeezed, and wrinkles are generated between the boundary of the sticker picking head groove 61 and the boundary of the support platform groove 71, forming the rolling boundary 33 in the following figure.
[0034] After the rolling is completed, the structure of the heat dissipation sticker attached to the front is as Figure 3 shown. In the top view, the heat dissipation sticker will present three obvious boundaries, namely the chip boundary 31 corresponding to the chip position; the plastic deformation boundary 32 generated by the groove 61 when the sticker picking head 6 presses the heat dissipation sticker 3; and the rolling boundary 33 generated by the bearing platform groove 71 when the roller 2 presses the heat dissipation sticker 3. The chip boundary 31 is a normal phenomenon. The boundary of the plastic deformation boundary 32 should be made as blurred as possible. The rolling boundary 33, as a defective appearance item, is not allowed to be detected.
[0035] Among them, the chip boundary 31 corresponds to the edge of the chip, and the heat dissipation sticker within its boundary is attached to the surface of the chip; the heat dissipation sticker 3 between the plastic deformation boundary 32 and the chip boundary 31 corresponds to the side of the chip 4 and is usually attached to the underfill around the chip; the heat dissipation sticker 3 between the rolling boundary 33 and the plastic deformation boundary 32 is attached to the substrate 5. The formation of the rolling boundary 33 is mainly because when the roller rolls the surface of the heat dissipation sticker 3, the chip 4 is pressed down into the groove 71, and the heat dissipation sticker within the rolling boundary 33 is squeezed by the groove edge and the roller, causing it to bend downward. In the groove 71, the substrate 5 and the heat dissipation sticker 3 also squeeze each other, so its boundary is clear and can be clearly distinguished visually, which can be judged as a defective appearance.
[0036] In view of the above problems existing in the prior art, as Figures 4 to 8 shown, on the one hand, an embodiment of the present disclosure provides a heat dissipation sticker rolling bearing platform 100 for a flip-chip thin film package. The flip-chip thin film package 200 includes a substrate 210, a chip 220 disposed on the substrate 210, and a heat dissipation sticker 230 mounted on the front of the chip 220.
[0037] The bearing platform 100 includes a platform body 110, and the platform body 100 is used to carry the flip-chip thin film package 200. Specifically, the substrate 210 of the flip-chip thin film package 200 is placed on the bearing platform.
[0038] The platform body 110 is provided with a receiving groove 120 for receiving the chip 220 when rolling the heat dissipation sticker 230. Specifically, the length and width dimensions of the receiving groove 120 are both larger than the length and width dimensions of the chip 220, and it is necessary to ensure that within the range of machine operation and recognition error, the receiving groove 120 will not squeeze the chip 220.
[0039] The cross-sectional dimension of the top wall of the receiving groove 120 is larger than the cross-sectional dimension of the bottom wall of the receiving groove 120.
[0040] Specifically, as Figures 4 to 7 shown, in this embodiment, the receiving groove 120 is wider at the top and narrower at the bottom. That is to say, the side wall of the receiving groove 120 is an inclined surface, which is different from the vertical side wall of the receiving groove in the prior art. The side wall of the receiving groove 120 is an inclined surface, and the side wall of the receiving groove 120 can support the substrate 210 when rolling the heat dissipation sticker, thereby improving the wrinkling degree of the heat dissipation sticker 230.
[0041] The depth of the receiving groove 120 is not less than the total thickness of the flip-chip thin film package 200. When rolling the heat dissipation sticker, the receiving groove 120 can at least receive the entire flip-chip thin film package 200.
[0042] After the heat dissipation sticker 230 is mounted on the front surface of the chip 220 by taking the header to obtain the flip-chip thin film package 200, the flip-chip thin film package 200 is transported to the roller, and the flip-chip thin film package 200 is placed on the platform body 110 of the carrying platform 110, where the heat dissipation sticker 230 is placed upward. The elastic roller presses down to the surface of the heat dissipation sticker 230. At the position supported by the platform body 110, the substrate 210 is completely attached to the heat dissipation sticker 230; in the receiving groove 120, the inclined side wall of the receiving groove 120 can support the substrate 210.
[0043] At the same time, due to the design of the receiving groove 120 being wider at the top and narrower at the bottom, the size of the top wall of the receiving groove 120 can be set larger, larger than the groove size of the existing support platform. On the heat dissipation sticker, the range pressed by the header groove is farther from the top wall of the receiving groove 120, which can relieve the bending of the heat dissipation sticker 230, making the rolling boundary of the roller 310 indistinguishable visually. And because there is an inclined side wall of the receiving groove 120 as a support under the substrate 210, the bending of the substrate 210 at the shaping boundary is not so obvious.
[0044] In addition, under the structure of the receiving groove 120 being wider at the top and narrower at the bottom, the bottom wall of the receiving groove 120 is slightly lower than the thickness of the flip-chip thin film package 200. Therefore, when considering the same chip size and machine offset, the size of the bottom wall of the receiving groove 120 can be reduced, and to a certain extent, the attachment effect between the chip boundary and the shaping boundary can be optimized.
[0045] The heat dissipation sticker rolling and bearing platform for a flip chip thin film package according to an embodiment of the present disclosure includes a platform body for bearing the flip chip thin film package. The platform body is provided with a receiving groove for receiving the chip when rolling the heat dissipation sticker. Wherein, the cross-sectional dimension of the top wall of the receiving groove is larger than that of the bottom wall of the receiving groove, and the depth of the receiving groove is not less than the total thickness of the flip chip thin film package. Since the groove wall of the receiving groove is an inclined surface, the groove wall of the receiving groove can support the substrate when rolling the heat dissipation sticker, thereby improving the wrinkle degree of the heat dissipation sticker, reducing the appearance defect of the packaged product, and improving the yield.
[0046] Exemplarily, as Figures 6 to 8 shown, the cross-sectional dimension of the receiving groove 120 gradually decreases from its top wall to its bottom wall. Specifically, in this embodiment, the cross-sectional dimension of the receiving groove 120 gradually decreases linearly from its top wall to its bottom wall.
[0047] Exemplarily, the side wall of the receiving groove 120 can be planar. For example, as Figure 6 shown, in one embodiment, the longitudinal section of the receiving groove 120 is a trapezoid with a wider top and a narrower bottom, and the side wall of the receiving groove 120 is a smooth planar shape. As Figure 7 shown, in another embodiment, the longitudinal section of the receiving groove 120 can be a triangle with a wider top and a narrower bottom, and the side wall of the receiving groove 120 is also a smooth planar shape. It should be noted that the shape of the longitudinal section of the receiving groove 120 is not specifically limited in this embodiment and can be selected according to actual needs.
[0048] Exemplarily, the side wall of the receiving groove 120 can be curved. As Figure 8 shown, in another embodiment, the side wall of the receiving groove 120 is a curved surface that arches inward. It should be noted that the specific shape of the receiving groove 120 can be selected according to actual needs, which can be planar or curved, and is not specifically limited in this embodiment.
[0049] Exemplarily, as Figure 4 and Figure 5 shown, the platform body 110 is provided with a plurality of ventilation holes 130. Among them, some ventilation holes 130 penetrate through the platform body 110 along the width direction of the platform body 110, and the remaining ventilation holes 130 penetrate through the platform body 110 along the length direction of the platform body 110. Among them, the ventilation holes 130 are connected to the vacuum pumping tube of the machine table.
[0050] Specifically, as Figure 4 shown, in this embodiment, two ventilation holes 130 penetrate through the width direction of the platform body 110, and two ventilation holes 130 penetrate through the length direction of the platform body 110. The number of the ventilation holes 130 is not specifically limited and can be selected according to actual needs.
[0051] Exemplarily, as Figure 4 shown, the platform body 110 is provided with a plurality of vacuum holes 140. The plurality of vacuum holes 140 are arranged at intervals along the circumferential side of the receiving groove 120. Among them, the first end of the vacuum hole 140 is communicated with the ventilation hole 130, and the second end of the vacuum hole 140 is used to adsorb the substrate 210.
[0052] Specifically, several small and dense vacuum holes 140 can evacuate the air inside the platform body 110 when the machine rolls the flip-chip thin film package 200, adsorb the flip-chip thin film package 200 on the surface of the platform body 110, flatten the substrate 210 at the same time, prevent the flip-chip thin film package 200 from sliding, and ensure that the bottom substrate 210 is flat when rolling the heat dissipation patch 230, avoiding wrinkles.
[0053] Exemplarily, the plurality of vacuum holes 140 are arranged in a matrix. Specifically, as Figure 4 and Figure 5 shown, in this embodiment, two rows of vacuum holes are arranged on both sides of the receiving groove 120 along its width, and each row of vacuum holes is provided with a plurality of vacuum holes 140.
[0054] It should be noted that the number and specific arrangement of the vacuum holes 140 are not specifically limited in this embodiment and can be selected according to actual needs.
[0055] It should be further noted that in this embodiment, the size of the vacuum hole 140 is much smaller than the size of the ventilation hole 130.
[0056] Exemplarily, as Figure 4 and Figure 5 shown, the platform body 110 is further provided with a plurality of fixing holes 150 penetrating through its thickness. The fixing holes 150 are used to fix the platform body 110 to the machine. Specifically, in this embodiment, the fixing holes 150 can be bolt holes or threaded holes, which can be selected according to actual needs, and the type of the fixing holes 150 is not specifically limited. Taking the fixing hole 150 as a bolt hole as an example, align the fixing hole 150 of the platform body 110 with the mounting hole at the corresponding position on the machine base, and sequentially pass the bolts through the fixing hole 150 and the mounting hole to fix the platform body 110 to the machine base.
[0057] As Figures 4 to 8 shown, the working principle of the heat dissipation patch rolling and bearing platform 100 for the flip-chip thin film package can be as follows:
[0058] After the operator aligns the fixing holes 150 of the carrying platform 100 with the mounting holes of the machine base, bolts are passed through the fixing holes 150 and the mounting holes to fix the carrying platform 100 to the machine. Place the flip-chip thin film package 200 on the carrying platform 100. Connect the vent hole 130 to the machine's evacuation tube and ensure airtightness, and then adjust the machine base until the chip is located at the center of the receiving groove 120 of the carrying platform 100, thus completing the installation of the carrying platform 100.
[0059] When the machine is operating and the roller 310 rolls over the heat dissipation sticker 230, the machine evacuates the inside of the carrying platform 100. Under the action of the air pressure difference, the vacuum hole 140 adsorbs the substrate 210 of the flip-chip thin film package 200 on the surface of the carrying platform 100, and the roller 310 starts to roll over the heat dissipation sticker 230 from the edge of the carrying platform 100. When the roller 310 moves to the other side of the carrying platform 100, the roller 310 lifts, the air pressure returns to normal, and the machine completes the rolling action. When the machine is running automatically, the operator does not need to manually operate the machine, and only needs to regularly check the attachment and rolling effect of the heat dissipation sticker.
[0060] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principles of the embodiments of the present disclosure. However, the embodiments of the present disclosure are not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of the present disclosure, and these modifications and improvements are also regarded as the protection scope of the embodiments of the present disclosure.
Claims
1. A heat dissipation sticker rolling and bearing platform for a flip chip thin film package, the flip chip thin film package comprising a substrate, a chip disposed on the substrate, and a heat dissipation sticker mounted on the front surface of the chip, characterized in that, The carrier platform includes a platform body for carrying the flip-chip thin film package; The platform body is provided with a receiving groove for receiving the chip when rolling the heat sink sticker; wherein, The cross-sectional dimension of the top wall of the receiving groove is larger than that of the bottom wall of the receiving groove, and the depth of the receiving groove is not less than the total thickness of the flip-chip thin film package.
2. The bearing platform according to claim 1, characterized in that, The cross-sectional dimension of the receiving groove decreases sequentially from its top wall to its bottom wall.
3. The carrying platform according to claim 2, wherein, The side wall of the receiving groove is planar.
4. The bearing platform according to claim 3, characterized in that The longitudinal section of the receiving groove is trapezoidal or triangular.
5. The bearing platform according to claim 2, wherein, The side wall of the receiving groove is curved.
6. The bearing platform according to any one of claims 1 to 5, characterized in that, The platform body is provided with a plurality of ventilation holes; wherein, Some of the ventilation holes penetrate through the platform body along the width direction of the platform body.
7. The bearing platform according to claim 6, characterized in that, The remaining ventilation holes penetrate through the platform body along the length direction of the platform body.
8. The bearing platform according to claim 7, characterized in that, The platform body is provided with a plurality of vacuum holes; The plurality of vacuum holes are arranged at intervals along the circumferential side of the receiving groove; wherein, The first end of the vacuum hole is communicated with the ventilation hole, and the second end of the vacuum hole is used for adsorbing the substrate.
9. The bearing platform according to claim 8, wherein The plurality of vacuum holes are arranged in a matrix.
10. The bearing platform according to any one of claims 1 to 5, characterized in that The platform body is further provided with a plurality of fixing holes penetrating through its thickness.