Wax-pasted sheet taking device

Abstract

The embodiment of the utility model provides a wafer taking device after waxing, and relates to the technical field of silicon carbide wafer taking. The wafer taking device comprises a bearing platform, a guide rail assembly and a wafer taking structure. The guide rails comprise two conveying guide rails, the two conveying guide rails are arranged on the two sides of the bearing platform in the width direction of the bearing platform and extend in the length direction of the bearing platform, the two ends of the piece taking structure are detachably connected with the two conveying guide rails correspondingly, and the piece taking structure can be driven by the conveying guide rails to move in the length direction of the bearing platform. The conveying guide rail is used for driving the silicon carbide wafer to move to be separated from the bearing platform, that is, the silicon carbide wafer is driven to be separated from the bearing platform in the process that the conveying guide rail drives the wafer taking structure to move relative to the bearing platform in the length direction of the bearing platform. The silicon carbide wafer can be directly driven to be separated from the bearing platform under the action of the conveying guide rail and the wafer taking structure, so that the wafer taking efficiency of the silicon carbide wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon carbide slice taking, in particular to a slice taking device after waxing. Background Art

[0002] Silicon carbide (SiC), as an emerging third-generation semiconductor core material, has excellent properties such as wide bandgap, high critical breakdown electric field strength, high electron mobility, good radiation resistance and chemical stability. This makes it an important substrate wafer material with wide applications, showing good application prospects in the fields of aviation devices, new energy vehicles, rail transportation and household appliances.

[0003] The inventors have found that in the existing process of removing the silicon carbide wafer after waxing, it is necessary to heat it first, wait for it to cool to a certain temperature, and then remove it manually, which is inefficient. Utility Model Content

[0004] The utility model aims to provide a wafer taking device after waxing, which can improve the wafer taking efficiency of silicon carbide wafers.

[0005] The embodiment of the utility model is achieved as follows:

[0006] In a first aspect, the utility model provides a device for removing a film after waxing, comprising:

[0007] A support platform, the support platform is used to place the silicon carbide wafer with a wax layer, and the wax layer is located between the support platform and the silicon carbide wafer;

[0008] A guide rail assembly, the guide rail assembly includes two conveying guide rails, the two conveying guide rails are arranged on both sides of the base along the width direction of the base, and the conveying guide rails extend along the length direction of the base;

[0009] The wafer taking structure has two ends which are detachably connected to the two conveying guide rails. The wafer taking structure can move in the length direction of the support platform driven by the conveying guide rails to drive the silicon carbide wafer to leave the support platform.

[0010] In an optional embodiment, the support platform has a mounting surface, the mounting surface is used to place the silicon carbide wafer, and the mounting surface is arranged to be inclined downward.

[0011] In an optional embodiment, the angle between the mounting surface and the horizontal plane is 15-30°.

[0012] In an optional embodiment, the support platform has an inlet end and an outlet end opposite to each other, and a receiving pad for receiving the silicon carbide wafer is arranged at the lower side of the outlet end, and the receiving pad is made of a flexible material.

[0013] In an optional embodiment, the sheet-taking structure is used to abut against the wax layer, and / or the sheet-taking structure is made of a flexible material.

[0014] In an optional embodiment, a heating element is further provided on a side of the platform away from the silicon carbide wafer, and the heating element is used to heat the platform.

[0015] In an optional embodiment, the platform is provided with two side panels along its width direction, and the two conveying guide rails are respectively provided on the two side panels.

[0016] In an optional embodiment, the conveying guide rail includes a driving member, a guide rail and a moving member, the moving member is disposed on the guide rail and is detachably connected to the film picking structure, and the driving member is used to drive the moving member to move on the guide rail.

[0017] In an optional embodiment, the support platform has a relative inlet end and an outlet end, and a first limiter is provided at the outlet end, and the first limiter is used to limit the movement of the film picking structure in a direction from the inlet end to the outlet end; and / or a second limiter is provided at the inlet end, and the second limiter is used to limit the movement of the film picking structure in a direction from the outlet end to the inlet end.

[0018] In an optional embodiment, the support platform has an opposite inlet end and an outlet end, and the support platform is provided with a first position sensor and a second position sensor located between the inlet end and the outlet end, the first position sensor is close to the inlet end, and the second position sensor is close to the outlet end.

[0019] The beneficial effect of the embodiment of the utility model is as follows: the embodiment of the utility model provides a wafer picking device after waxing, which includes a support platform, a guide rail assembly and a wafer picking structure. The guide rail includes two conveying rails, which are arranged on both sides of the support platform along the width direction of the support platform, and the conveying rails extend along the length direction of the support platform. The two ends of the wafer picking structure are detachably connected to the two conveying rails respectively. The wafer picking structure can move in the length direction of the support platform under the drive of the conveying rails, so as to drive the silicon carbide wafer to move and detach from the support platform, that is, in the process of driving the wafer picking structure to move relative to the support platform in the length direction of the support platform through the conveying rails, the silicon carbide wafer can be driven to detach from the support platform. The silicon carbide wafer can be directly driven to detach from the support platform under the action of the conveying rails and the wafer picking structure, thereby improving the wafer picking efficiency of the silicon carbide wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic structural diagram of the sheet taking device provided by an embodiment of the present utility model.

[0022] Icon: 1 - Sheet taking device; 100 - Base; 110 - Mounting surface; 101 - Inlet end; 102 - Outlet end; 200 - Guide rail assembly; 210 - Guide rail; 220 - Moving part; 300 - Side plate; 400 - Sheet taking structure. Detailed implementation manners

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings herein can be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the protection scope of the present utility model.

[0025] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0026] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this utility model is usually placed when in use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0027] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0028] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "arranged", "installed", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0029] The following will introduce in detail the specific structure of a wafer picking device after waxing provided by an embodiment of the present utility model and the corresponding technical effects brought thereby with reference to the patent drawings.

[0030] A wafer picking device 1 after waxing provided by an embodiment of the present utility model includes a base 100, a guide rail assembly 200 and a wafer picking structure 400.

[0031] Please refer to Figure 1 , the base 100 is used to place the silicon carbide wafer with a wax layer, that is to say, the wax layer is located between the base 100 and the silicon carbide wafer.

[0032] It should be noted that the silicon carbide will go through processes such as waxing. During waxing, the wax will be heated to an appropriate temperature to melt it, and the melted wax will be evenly applied on the support carrier. It should be noted that the support carrier can be understood as the base 100 in this embodiment. Then, the silicon carbide wafer is placed on the wax layer to ensure that the silicon carbide wafer is in close contact with the base 100. During the waxing process, a pressure tool can be used to help the silicon carbide wafer better adhere to the wax layer. Until the wax layer cools and solidifies, the silicon carbide wafer can be firmly adhered to the base 100. After the silicon carbide wafer is fixed on the support carrier, the next step of processing can be carried out, such as cutting or etching, etc. After the processing is completed, the wafer needs to be removed from the support carrier.

[0033] In some existing wafer picking processes, it is mostly necessary to heat and soften the wax layer, and only after the softened wax layer cools to a certain temperature can the silicon carbide wafer be manually removed, with low efficiency. It should be noted that the removed silicon carbide wafer needs to be cleaned to remove the residual wax on the silicon carbide wafer.

[0034] In this embodiment, the guide rail 210 includes two conveying guide rails 210. The two conveying guide rails 210 are arranged on both sides of the base 100 along the width direction of the base 100. The conveying guide rails 210 extend along the length direction of the base 100. Both ends of the wafer picking structure 400 are detachably connected to the two conveying guide rails 210. The wafer picking structure 400 can move along the length direction of the base 100 driven by the conveying guide rails 210, so as to drive the silicon carbide wafer to move away from the base 100. That is to say, when the conveying guide rails 210 drive the wafer picking structure 400 to move relative to the base 100 along the length direction of the base 100, the silicon carbide wafer is driven to move away from the base 100.

[0035] It can be understood that during the wafer picking process, since there is no need for an operator to pick up the wafer manually, nor to heat and soften the wax layer and wait for the wax layer to cool to a certain temperature, the silicon carbide wafer can be directly driven to move away from the base 100 under the action of the conveying guide rails 210 and the wafer picking structure 400, thereby improving the wafer picking efficiency of the silicon carbide wafer.

[0036] Specifically, in this embodiment, the wafer picking structure 400 is used to abut against the wax layer. That is to say, when driving the silicon carbide wafer to move away from the base 100, under the action of the conveying guide rails 210, the wafer picking structure 400 contacts the wax layer under the silicon carbide wafer, that is, the wafer picking structure 400 contacts the outer peripheral wall of the wax layer, and under the action of the conveying guide rails 210, drives the wax layer and the silicon carbide wafer above the wax layer to move away from the base 100 together.

[0037] Optionally, the above-mentioned wafer picking structure 400 being used to abut against the wax layer can be understood as that part of the wafer picking structure 400 abuts against the peripheral wall of the wax layer, and the other part abuts against the peripheral wall of the silicon carbide wafer. It can also be understood as only abutting against the peripheral wall of the wax layer.

[0038] It can be understood that the wafer picking structure 400 not only abuts against the silicon carbide wafer to pull the silicon carbide wafer, but abuts against the outer peripheral wall of the wax layer to pull the wax layer and drive the silicon carbide wafer on the wax layer, which can avoid scratching the silicon carbide wafer by the wafer picking structure 400.

[0039] In this embodiment, since the wafer picking structure 400 can be detachably connected to the conveying guide rails 210, it is convenient for the operator to disassemble and assemble.

[0040] Optionally, the conveying guide rail 210 includes a driving member (not shown), the guide rail 210 and a moving member 220, wherein the moving member 220 is disposed on the guide rail 210 and is detachably connected to the film-taking structure 400, and the film-taking member is used to drive the moving member 220 to move on the guide rail 210. In other words, the driving member drives the moving member 220 and then drives the film-taking structure 400 connected to the moving member 220 to move, and when the driving members on the conveying guide rails 210 on both sides move synchronously, the film-taking structure 400 can be driven to move along the extension direction of the guide rail 210, and then the wax layer can be pulled to separate the wax layer from the support platform 100, and then the silicon carbide wafer disposed on the wax layer is driven to separate from the support platform 100.

[0041] It should be noted that the structure of the conveying guide rail 210 can be the conveying guide rail 210 structure in the prior art. The guide rail 210 structure is a conventional and mature structure. It only needs to be able to drive the film picking structure 400 to move in the length direction of the platform 100. The specific structure of the conveying guide rail 210 and its connection relationship will not be described in detail here.

[0042] In detail, the support platform 100 has an inlet end 101 and an outlet end 102 relative to each other, and a receiving pad for receiving the silicon carbide wafer is arranged on the lower side of the outlet end 102, and the receiving pad is made of a flexible material. It can be understood that the wafer taking structure 400 can move from the outlet end 102 to the inlet end 101 under the action of the conveying guide rail 210, and in the process of moving, it can pull the wax layer on the support platform 100 to separate from the support platform 100, and drive the silicon carbide wafer to detach from the support platform 100 from the outlet end 102 of the support platform 100. After detaching from the support platform 100 from the outlet end 102 of the support platform 100, the silicon carbide wafer and the wax layer on the silicon carbide wafer will fall on the receiving pad together. Since the receiving pad is made of a flexible material, it can prevent the silicon carbide wafer from being damaged after falling.

[0043] Optionally, the support platform 100 has a mounting surface 110, and the mounting surface 110 is used to prevent the silicon carbide wafer. The mounting surface 110 is tilted downward. It can be understood that since the mounting surface 110 is tilted downward, it can facilitate the downward movement of the silicon carbide crystal and the wax layer under the silicon carbide crystal to detach from the support platform 100 and complete the silicon carbide crystal wafer removal.

[0044] It should be noted that the installation surface 110 being tilted downward can be understood as the base 100 being tilted as a whole so that the installation surface 110 is also tilted downward.

[0045] Optionally, the film taking device 1 also includes a support member, which is connected to the support platform 100 and is used to support the support platform 100. The support platform 100 is detachably connected to the support member. When the support platform 100 is set on the support member, the support platform 100 is tilted downward, that is, the mounting surface 110 is also tilted downward.

[0046] Optionally, the included angle between the installation surface 110 and the horizontal plane is 15 to 30°. When the included angle between the installation surface 110 and the horizontal plane is between 15 and 30°, it is convenient for the wax layer and the silicon carbide wafer separated from the surface of the bearing platform 100 to move along the length direction of the bearing platform 100, and then be discharged from the outlet end 102.

[0047] Optionally, in some embodiments, a heating element (not shown in the figure) is provided on the side of the bearing platform 100 away from the silicon carbide wafer. It can be understood that in order to facilitate the wafer taking structure 400 to separate the wax layer from the bearing platform 100, the wax layer can be preheated through the heating element to at least partially melt the bonding surface between the wax layer and the bearing platform 100, so as to facilitate the curved surface structure to separate the wax layer from the bearing platform 100.

[0048] Optionally, two side plates 300 are provided on the bearing platform 100 along its own width direction, and two conveying guide rails 210 are respectively arranged on the two side plates 300. The side plates 300 can limit the movement of the wax layer in the width direction.

[0049] Optionally, in some embodiments, the conveying guide rail 210 is detachably connected to the side plate 300 for easy disassembly and assembly of the conveying guide rail 210. Of course, in some other embodiments, the conveying guide rail 210 can also be directly detachably arranged on both sides in the width direction of the bearing platform 100.

[0050] Optionally, in some embodiments, the wafer taking structure 400 is made of a flexible material, for example, a rope made of hemp, cotton, linen, polypropylene, nylon, polyester, or polyethylene.

[0051] Of course, in some other embodiments, the wafer taking structure 400 can also be made of other materials, not limited to flexible materials.

[0052] Optionally, in some embodiments, a first limiting member (not shown in the figure) is provided at the outlet end 102, and the first limiting member is used to limit the movement of the wafer taking structure 400 in the direction from the inlet end 101 to the outlet end 102. A second limiting member is provided at the inlet end 101, and the second limiting member (not shown in the figure) is used to limit the movement of the wafer taking structure 400 in the direction from the outlet end 102 to the inlet end 101.

[0053] First limiting members can be provided at the outlet ends 102 of the two side plates 300, and the first limiting members are used to limit the movement of the moving member 220 structure in the direction from the inlet end 101 to the outlet end 102. Second limiting members are provided at the inlet ends 101 of the two side plates 300, and the second limiting members are used to limit the movement of the moving member 220 in the direction from the outlet end 102 to the inlet end 101.

[0054] Optionally, the bearing platform 100 is further provided with a first position sensor (not shown in the figure) and a second position sensor (not shown in the figure) located between the inlet section and the outlet end 102. The first position sensor is close to the inlet section, and the second position sensor is close to the outlet end 102. Specifically, the first position sensor is arranged at the side plate 300 close to the inlet end 101, and the second position sensor is arranged at the side plate 300 close to the outlet end 102. Wherein, the first position sensor and the second position sensor are communicatively connected to the driving member. When the first position sensor detects that the moving member 220 has passed, the driving member stops to prevent the moving member 220 from continuing to move. When the second position sensor detects that the moving member 220 has passed, the driving member stops to prevent the moving member 220 from continuing to move.

[0055] In summary, a wafer picking device 1 after waxing provided by an embodiment of the present invention includes a bearing platform 100, a guide rail assembly 200, and a wafer picking structure 400. The guide rail 210 includes two conveying guide rails 210. The two conveying guide rails 210 are arranged on both sides of the bearing platform 100 along the width direction of the bearing platform 100. The conveying guide rail 210 extends along the length direction of the bearing platform 100. The two ends of the wafer picking structure 400 are detachably connected to the two conveying guide rails 210 respectively. The wafer picking structure 400 can move along the length direction of the bearing platform 100 driven by the conveying guide rail 210 to drive the silicon carbide wafer to move away from the bearing platform 100. That is to say, in the process of driving the wafer picking structure 400 to move relative to the bearing platform 100 along the length direction of the bearing platform 100 by the conveying guide rail 210, the silicon carbide wafer is driven to move away from the bearing platform 100. The silicon carbide wafer can be directly driven to move away from the bearing platform 100 under the action of the conveying guide rail 210 and the wafer picking structure 400, thereby improving the wafer picking efficiency of the silicon carbide wafer.

[0056] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A film-taking device after waxing, characterized in that, Comprising: A bearing platform (100) for placing a silicon carbide wafer with a wax layer, the wax layer being located between the bearing platform (100) and the silicon carbide wafer; A guide rail assembly (200) including two conveying guide rails (210), the two conveying guide rails (210) being arranged on both sides of the bearing platform (100) along the width direction of the bearing platform (100), and the conveying guide rails (210) extending along the length direction of the bearing platform (100); A wafer taking structure (400) with its two ends detachably connected to the two conveying guide rails (210) respectively, and the wafer taking structure (400) can move in the length direction of the bearing platform (100) driven by the conveying guide rails (210) to drive the silicon carbide wafer away from the bearing platform (100).

2. The wafer taking device after wax sticking according to claim 1, characterized in that: The bearing platform (100) has an installation surface (110) for placing the silicon carbide wafer, and the installation surface (110) is inclined downward.

3. The wafer taking device after wax sticking according to claim 2, characterized in that: The included angle between the installation surface (110) and the horizontal plane is 15 - 30°.

4. The wafer taking device after wax sticking according to claim 2, characterized in that: The bearing platform (100) has an opposite inlet end (101) and outlet end (102), and a receiving pad for receiving the silicon carbide wafer is arranged on the lower side of the outlet end (102), and the receiving pad is made of a flexible material.

5. The wafer taking device after wax sticking according to claim 1, characterized in that: The wafer taking structure (400) is used to abut against the wax layer, and / or the wafer taking structure (400) is made of a flexible material.

6. The wafer taking device after wax sticking according to claim 1, characterized in that: A heating element is arranged on one side of the bearing platform (100) away from the silicon carbide wafer, and the heating element is used to heat the bearing platform (100).

7. The wafer taking device after wax sticking according to claim 1, characterized in that: Two side plates (300) are arranged on the bearing platform (100) along its own width direction, and the two conveying guide rails (210) are respectively arranged on the two side plates (300).

8. The wafer taking device after wax sticking according to claim 1, characterized in that: The conveying guide rail (210) includes a driving member, a guide rail (210) and a moving member (220), the moving member (220) is arranged on the guide rail (210) and is detachably connected to the wafer taking structure (400), and the driving member is used to drive the moving member (220) to move on the guide rail (210).

9. The wafer taking device after wax sticking according to claim 1, characterized in that: The bearing platform (100) has opposite inlet end (101) and outlet end (102), a first limiting member is provided at the outlet end (102), and the first limiting member is used to limit the movement of the chip taking structure (400) in the direction from the inlet end (101) to the outlet end (102); and / or a second limiting member is provided at the inlet end (101), and the second limiting member is used to limit the movement of the chip taking structure (400) in the direction from the outlet end (102) to the inlet end (101).

10. The chip taking device after waxing according to claim 1, wherein: The bearing platform (100) has opposite inlet end (101) and outlet end (102), a first position sensor and a second position sensor are provided on the bearing platform (100) between the inlet end (101) and the outlet end (102), the first position sensor is close to the inlet end (101), and the second position sensor is close to the outlet end (102).

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