Bonding tool for packaging CFP flat ceramic tube shell

Abstract

The utility model discloses a bonding tool for packaging a CFP flat ceramic tube shell, which comprises a bonding base and a carrier boat, the carrier boat is stacked on the bonding base, the bonding base is provided with a plurality of vertically upward bosses, the center of each boss is provided with an adsorption hole, the carrier boat is provided with a plurality of sinking platforms, the number of the sinking platforms is consistent with that of the bosses, and the adsorption hole is communicated with the adsorption hole. The sinking table comprises a containing hole for the boss to be inserted and a containing groove for the pins to be placed, the boss is inserted into the containing hole, and the top of the boss is lower than the edge of the containing hole to form a cavity for placing the ceramic tube shell. According to the utility model, the bonding pedestal and the carrier boat are assembled together, the bosses of the bonding pedestal are inserted into the accommodating holes of the carrier boat to form a plurality of cavities in a rectangular array, so that a plurality of ceramic tube shells can be placed at the same time, exposed part main bodies of the pins are placed on the accommodating grooves, and the ceramic tube shells are adsorbed and positioned by using the adsorption holes, so that subsequent operation is facilitated; by means of the bonding, a batch feeding and discharging bonding mode can be achieved, and the production efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip packaging equipment, and more particularly to a bonding tooling for CFP flat ceramic package. Background Art

[0002] In semiconductor integrated circuit packaging, the mainly used packages include ceramic packages such as CDIP, CFP, CQFP, and CBGA. With the development of the whole machine products towards high density, miniaturization and high performance. Among them, the CFP flat ceramic package has the advantages of small size, good airtightness, high mechanical strength, stable chemical properties, high thermal conductivity, high insulation impedance and thermal expansion coefficient close to that of the chip, and is mainly used in the packaging of memories, controllers, drivers and optoelectronic devices.

[0003] CFP (Ceramic Flat Package) flat ceramic package is one of the surface mount packages. The packaging substrate can use single-layer or multi-layer ceramic substrates. The pin center pitch is usually 1.27 mm, the number of pins ranges from about 3 to 32, and the pin length is usually more than 3.2 mm.

[0004] The existing bonding and packaging devices for CFP flat ceramic packages can mostly only bond in the way of off-line manual single mechanical clamping or single vacuum adsorption, and cannot realize the bonding method of batch loading and unloading, so the production efficiency is relatively low. Summary of the Utility Model

[0005] In order to solve the above problems, the utility model provides a bonding tooling for CFP flat ceramic package, which can realize the bonding method of batch loading and unloading and improve the production efficiency.

[0006] According to one aspect of the utility model, a bonding tooling for CFP flat ceramic package is provided, which includes a bonding base and a carrier. The carrier is stacked on the bonding base.

[0007] The bonding base is provided with a plurality of vertically upward convex platforms. The bonding base has a horizontal upper surface. The convex platforms are higher than the upper surface of the bonding base. The center of the convex platform is provided with an adsorption hole, and the bonding base is provided with an air flow hole communicated with the adsorption hole.

[0008] The carrier is provided with a plurality of sunk platforms. The number of the sunk platforms is the same as that of the convex platforms. The sunk platform includes a receiving hole for inserting the convex platform and a receiving groove for placing pins.

[0009] The convex platform is inserted into the receiving hole, and the top of the convex platform is lower than the edge of the receiving hole to form a cavity for placing the ceramic package.

[0010] Thus, the bonding tooling adopts a modular structure. When stacking the carrier on the bonding base, the bosses are inserted into the receiving holes, forming a plurality of cavities for placing ceramic packages. The edges of the receiving holes that are higher than the bosses play a role in limiting the ceramic packages. A plurality of ceramic packages are placed in these cavities, and the exposed parts of the pins are placed on the receiving grooves. The air flow holes are externally connected to a negative pressure device, and the ceramic packages are adsorbed and positioned through the adsorption holes for subsequent operations. This bonding tooling can place multiple ceramic packages simultaneously at one time, enabling batch loading and unloading bonding methods, greatly improving production efficiency. In this design, the cavities for placing ceramic packages are not formed by slotting a single part, but are assembled by two parts, which can reduce the processing difficulty of the tooling and avoid the situation where the corners at the bottom of the slots are not processed properly.

[0011] In some embodiments, several bosses and counterbores are arranged in a rectangular array. An avoidance hole penetrating the carrier is provided at one end of the receiving groove away from the receiving hole, and the receiving grooves in the same column share one avoidance hole. Thus, the other ends of the pins can be placed on the avoidance hole, and the receiving grooves in the same column share a long avoidance hole, which increases the working space and facilitates operation.

[0012] In some embodiments, the receiving hole is a rectangular hole with four corners. The left and right sides of the receiving hole are vertical inner walls, and stepped avoidance parts are formed at the front, rear sides and four corners of the receiving hole. The bottom of the avoidance part is lower than the top position of the boss when the boss is inserted into the receiving hole. Thus, the four corners of the ceramic package may not necessarily be rounded but may be right-angled. The provision of the avoidance part can ensure that the ceramic package is placed in place.

[0013] In some embodiments, the air flow holes extend to the side wall of the bonding base. Thus, when the air flow holes are provided on the side wall, it does not affect the stable installation and fixation of the bonding base when externally connecting equipment.

[0014] In some embodiments, a positioning blind hole is provided at the center of the bottom of the bonding base, and a limiting counterbore is provided at the orifice of the positioning blind hole. The limiting counterbore is eccentrically arranged relative to the positioning blind hole. Thus, positioning can be performed with the workbench surface that can be installed with the positioning blind hole, and the provision of the eccentric limiting counterbore can play an anti-misassembly role.

[0015] In some embodiments, the bonding base is provided with locking holes for locking and fixing, and the locking holes are counterbored holes. Thus, after installing bolts, the upper surface of the bonding base fits with the carrier.

[0016] In some embodiments, a receiving cavity for accommodating the upper part of the bonding base is provided inside the lower part of the carrier, and a blocking platform is provided inside the carrier to abut against the upper surface of the bonding base. Thus, after the bonding base is installed and fixed, the carrier is stacked on the bonding base, the bosses are inserted into the receiving holes of the carrier, and the blocking platform abuts against the upper surface of the bonding base.

[0017] Compared with the prior art, the beneficial effects of the present utility model are as follows: The present utility model provides a bonding tooling for CFP flat ceramic package, which is assembled by a bonding base and a carrier. The processing difficulty of the tooling is reduced. The convex platform of the bonding base is inserted into the accommodating hole of the carrier to form a plurality of cavities in a rectangular array, so as to be able to place a plurality of ceramic packages simultaneously. The exposed part of the pin body is placed on the accommodating groove, and the ceramic package is adsorbed and positioned by the adsorption holes for subsequent operations. By using this bonding, a batch feeding and bonding method can be realized, greatly improving the production efficiency and increasing the production profit and competitiveness of the enterprise. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 FIG. is a schematic structural diagram of an embodiment of a bonding tooling for CFP flat ceramic package of the present utility model, wherein, Figure 1 A is a top view, Figure 1 B is a front view, Figure 1 C is a side view;

[0019] Figure 2 is a ceramic package with pins;

[0020] Figure 3 is a perspective view of an embodiment of the bonding base;

[0021] Figure 4 is a schematic structural diagram of the bonding base, wherein, Figure 4 A is a top view, Figure 4 B is a bottom view, Figure 4 C is Figure 4 a cross-sectional view taken along line A-A in B, Figure 4 D is a side view;

[0022] Figure 5 is a perspective view of an embodiment of the carrier;

[0023] Figure 6 is a schematic structural diagram of the carrier, wherein, Figure 6 A is a top view, Figure 6 B is a bottom view, Figure 6 C is Figure 6 a cross-sectional view taken along line B-B in A, Figure 6 D is Figure 6 a cross-sectional view taken along line C-C in A, Figure 6 E is Figure 6 an enlarged view of I in A. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The present utility model will be further described below in conjunction with the detailed embodiments.

[0025] As Figure 2As shown in the figure, this embodiment is designed based on a CFP3 package form. The center distance A of the pin 101 is 1.27 mm, the exposed length B of the pin 101 is 9.8 mm, the overall height H of the package 100 is 1.5 mm, and the external dimension is 4.5 mm X 17.8 mm. A bonding tooling for batch loading and unloading bonding method is provided to solve the problem of low bonding production efficiency in the prior art.

[0026] As Figure 1 shown, a bonding tooling for CFP flat ceramic package in an embodiment of the present utility model includes a bonding base 1 and a carrier 2, and the carrier 2 is stacked on the bonding base 1.

[0027] As Figure 3 and 4 shown, the main body of the bonding base 1 is a cuboid structure. The bonding base 1 has a horizontal upper surface 11, and several vertically upward convex platforms 12 are processed on the upper surface 11. The convex platforms 12 are higher than the upper surface 11 of the bonding base 1, and the convex platforms 12 are arranged in a rectangular array. In this embodiment, the convex platforms 12 have two columns, and each column has multiple. An adsorption hole 13 is opened at the center of the convex platform 12. The adsorption hole 13 penetrates through the convex platform 12 and extends into the bonding base 1. An air flow hole 14 communicated with the adsorption hole 13 is opened in the bonding base 1, and the air flow hole 14 is used for connecting an external negative pressure device (not shown in the figure).

[0028] As Figure 5 and 6 shown, several sinking platforms 20 are processed on the carrier 2. The sinking platforms 20 are also arranged in a rectangular array. The number of the sinking platforms 20 is the same as that of the convex platforms 12, and the positions of the sinking platforms 20 correspond to those of the convex platforms 12 one by one. Each sinking platform 20 includes a receiving hole 21 for inserting the convex platform 12 and a receiving groove 22 for placing the pin 101. The depth of the receiving groove 22 does not penetrate through the carrier 2.

[0029] A relief hole 24 penetrating through the carrier 2 is provided at one end of the receiving groove 22 away from the receiving hole 21. The receiving grooves 22 in the same column share one relief hole 24, and both ends of the receiving groove 22 are open.

[0030] When the carrier 2 is stacked on the bonding base 1, the convex platform 12 is inserted into the receiving hole 21, and the top of the convex platform 12 is lower than the edge of the receiving hole 21, forming a plurality of cavities 23 for placing the ceramic package 100 ( Figure 1As shown in the figure, the edge of the accommodation hole 21 that is higher than the boss 12 positions the ceramic package 100. The exposed part of each pin 101 is placed on the corresponding accommodation groove 22, and the other end of the pin 101 can be placed on the avoidance hole 24. The accommodation grooves 22 in the same column share a long avoidance hole 24, which increases the working space and facilitates operation. The air flow hole 14 is externally connected to a negative pressure device, and the ceramic package 100 is adsorbed and positioned through the adsorption hole 13 for subsequent operations.

[0031] In this embodiment, the cavity 23 for placing the ceramic package 100 is not formed by opening slots in one part, but is assembled by two parts, which can reduce the processing difficulty of the tooling and avoid the situation where the corners at the bottom of the slot are not processed properly.

[0032] As Figure 6 shown in Figure 6 Figure E, the accommodation hole 21 is a rectangular hole, so four corners are formed. The left and right sides of the accommodation hole 21 are vertical inner walls, and stepped avoidance parts 25 are formed at the front and rear sides and the four corners of the accommodation hole 21. As Figure 1 shown in Figure 1 Figure C, the bottom of the avoidance part 25 is lower than the top position of the boss 12 when the boss 12 is inserted into the accommodation hole 21. Since the four corners of the ceramic package 100 may not be rounded but may be right angles, the avoidance part 25 is provided to ensure that the ceramic package 100 is placed in place.

[0033] In this embodiment, as Figure 3 shown in the figure, the opening of the air flow hole 14 is not at the bottom of the bonding base 1, but extends to the side wall of the bonding base 1. In this way, when externally connecting the device, it does not affect the stable installation and fixation of the bonding base 1.

[0034] As Figure 4 shown in the figure, a positioning blind hole 15 is opened at the center of the bottom of the bonding base 1. A limiting countersunk head 16 is machined at the orifice of the positioning blind hole 15, and the limiting countersunk head 16 is eccentrically arranged relative to the positioning blind hole 15. A positioning pin (not shown in the figure) can be provided on the workbench surface, and the positioning pin is correspondingly provided with an eccentric step. According to the positioning blind hole 15, it can be positioned with the workbench surface where it is installed. The eccentric limiting countersunk head 16 can play an anti-fooling role in the installation direction. The bonding base 1 is provided with a locking hole 17 for locking and fixing. The type of the locking hole 17 is a countersunk hole. In this way, after installing the bolt in the countersunk hole locking hole 17, the upper surface 11 of the bonding base 1 fits with the carrier 2.

[0035] As Figure 6As shown, inside the carrier 2, a receiving cavity 26 is machined from the bottom upwards. This receiving cavity 26 is used to accommodate the upper part of the bonding base 1. A blocking platform 27 is provided inside the carrier 2 to abut against the upper surface 11 of the bonding base 1. After the bonding base 1 is installed and fixed, the carrier 2 is stacked on the bonding base 1. The convex platform 12 is inserted into the receiving hole 21 of the carrier 2, and the blocking platform 27 abuts against the upper surface 11 of the bonding base 1.

[0036] The utility model provides a bonding tooling for CFP flat ceramic package with a simple structure, which is assembled by a bonding base 1 and a carrier 2, reducing the processing difficulty of the tooling. The convex platform 12 of the bonding base 1 is inserted into the receiving hole 21 of the carrier 2, forming a plurality of cavities 23 in a rectangular array, so as to be able to place a plurality of ceramic packages 100 at the same time. The exposed part of the main body of the pin 101 is placed on the receiving groove 22, and the ceramic package 100 is adsorbed and positioned by the adsorption hole 13 for subsequent operations. Using this bonding method, batch loading and unloading bonding can be realized, greatly improving the production efficiency and increasing the production profit and competitiveness of the enterprise.

[0037] The above are only some embodiments of the utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the creative concept of the utility model, other deformations and improvements can also be made, and these all belong to the protection scope of the utility model.

Claims

1. A bonding tool for CFP flat ceramic package, characterized in that It includes a bonding base (1) and a carrier (2), and the carrier (2) is stacked on the bonding base (1); The bonding base (1) is provided with a number of vertically upward convex platforms (12). The bonding base (1) has a horizontal upper surface (11). The convex platforms (12) are higher than the upper surface (11) of the bonding base (1). An adsorption hole (13) is provided at the center of the convex platform (12). The bonding base (1) is provided with an air flow hole (14) communicated with the adsorption hole (13); The carrier (2) is provided with a number of sunk platforms (20). The number of the sunk platforms (20) is the same as that of the convex platforms (12). The sunk platform (20) includes a receiving hole (21) for the convex platform (12) to insert and a receiving groove (22) for placing pins; The convex platform (12) is inserted into the receiving hole (21), and the top of the convex platform (12) is lower than the edge of the receiving hole (21) to form a cavity (23) for placing a ceramic package.

2. The bonding tooling for CFP flat ceramic package according to claim 1, characterized in that A number of the convex platforms (12) and the sunk platforms (20) are both in a rectangular array. An avoidance hole (24) penetrating through the carrier (2) is provided at one end of the receiving groove (22) far away from the receiving hole (21). The receiving grooves (22) in the same column share one avoidance hole (24).

3. The bonding tooling for CFP flat ceramic package according to claim 2, characterized in that The receiving hole (21) is a rectangular hole with four corners. The left and right sides of the receiving hole (21) are vertical inner walls. Step-shaped avoidance parts (25) are formed at the front and rear sides and the four corners of the receiving hole (21). The bottom of the avoidance part (25) is lower than the top position of the convex platform (12) when the convex platform (12) is inserted into the receiving hole.

4. The bonding tooling for CFP flat ceramic package according to claim 1 or 3, characterized in that, The air flow hole (14) extends to the side wall of the bonding base (1).

5. The bonding tooling for CFP flat ceramic package according to claim 4, characterized in that, A positioning blind hole (15) is provided at the center of the bottom of the bonding base (1). A limiting counterbore (16) is provided at the orifice of the positioning blind hole (15). The limiting counterbore (16) is eccentrically arranged relative to the positioning blind hole (15).

6. The bonding tooling for CFP flat ceramic package according to claim 5, characterized in that, The bonding base (1) is provided with a locking hole (17) for locking and fixing. The locking hole (17) is a counterbore.

7. The bonding tooling for CFP flat ceramic package according to claim 1, characterized in that, A receiving cavity (26) for accommodating the upper part of the bonding base (1) is provided inside the lower part of the carrier (2). A blocking platform (27) is provided inside the carrier (2) to abut against the upper surface (11) of the bonding base (1).

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