Heat dissipation shell of auxiliary driving control box

Abstract

The utility model relates to the technical field of automobile auxiliary driving, in particular to an auxiliary driving control box heat dissipation shell which comprises a base, a plurality of fixing plates are arranged on the base, fixing threaded holes are formed in the fixing plates, a containing groove is formed in one side of the base, and a plurality of heat conduction columns are arranged on the inner wall of one side of the containing groove. The heat conduction column is provided with heat conduction glue, one side, far away from the heat conduction glue, of the heat conduction column is fixedly provided with a vapor chamber, the base and the vapor chamber are provided with a plurality of heat dissipation fins, the length of the heat conduction column can be correspondingly adjusted according to the thickness of a chip so as to adapt to chips with different thicknesses, and the application range is widened.

Description

Technical Field

[0001] The utility model relates to the technical field of automotive assisted driving, and more specifically, to a heat dissipation housing for an assisted driving control box. Background Art

[0002] The assisted driving control box is a key component in the assisted driving system. It usually includes the core components of sensors, communication, decision-making, and execution devices for real-time monitoring of the driver, vehicle, and its driving environment. The assisted driving system uses sensors, communication, decision-making, and execution devices installed on the vehicle to monitor the driver, vehicle, and its driving environment in real time, and assists the driver in performing driving tasks or avoiding and reducing collision hazards through information, motion control, etc. As the core component of this system, the assisted driving control box is responsible for processing data from various sensors, making decision analysis, and controlling the actuator to achieve corresponding driving assistance functions.

[0003] As disclosed in a Chinese patent: A heat dissipation housing for assisted driving, application number: CN202121889095.9, includes: a housing, the housing includes a housing bottom and a housing wall portion, the housing wall portion is disposed on the housing bottom, the inner side of the housing wall portion is a housing space for accommodating a driving assistance device, the housing bottom is provided with an upward protruding portion for mounting a control main board, a heat dissipation space is provided below the protruding portion, the lower surface of the protruding portion is provided with a plurality of first heat dissipation fins, one end of the first heat dissipation fin extends to the outside of the housing wall portion, and the other end of the first heat dissipation fin extends to the side wall of the heat dissipation space. The utility model has a better heat dissipation function and is convenient for realizing the heat dissipation of the assisted driving device during operation. More specifically, the first heat dissipation fin of the utility model contacts the airflow during high-speed driving of the vehicle, which can further improve the heat dissipation effect.

[0004] However, in the actual use process of the above technical solution, a large amount of heat will be generated on the control board and chips of the assisted driving control box. Therefore, it is necessary to use the heat dissipation housing of the assisted driving control box to dissipate heat from the control board and chips in a timely manner. The chips used in the assisted driving control boxes of different manufacturers are also different, resulting in different chip thicknesses. The above technical solution can only dissipate heat from chips with a fixed thickness, and the applicable range is small. Summary of the Utility Model

[0005] The main purpose of the present utility model is to provide a heat dissipation housing for an assisted driving control box, which can effectively solve the problem in the background technology that during the actual use of the assisted driving control box, a large amount of heat is generated by the control board and chips on the assisted driving control box. Therefore, it is necessary to use the heat dissipation housing of the assisted driving control box to dissipate heat from the control board and chips in a timely manner. However, the chips used in the assisted driving control boxes of different manufacturers are also different, resulting in different chip thicknesses. The above technical solution can only dissipate heat from chips with a fixed thickness, and the applicable range is relatively small.

[0006] To achieve the above purpose, the technical solution adopted by the present utility model is as follows:

[0007] A heat dissipation housing for an assisted driving control box includes a base, on which several fixing plates are provided. Fixing threaded holes are provided on the fixing plates. A receiving groove is provided on one side of the base. Several heat conducting columns are provided on the inner wall of one side of the receiving groove. Heat conducting glue is provided on the heat conducting columns. A heat sink plate is fixedly provided on the side of the heat conducting column away from the heat conducting glue. Several heat dissipation fins are provided on the base and the heat sink plate.

[0008] Preferably, the heat sink plate is fixedly installed on the base.

[0009] Preferably, the heat conducting column includes a heat conducting column base, on which a filling groove is provided, and heat conducting silicone grease is provided in the filling groove.

[0010] Preferably, a first guiding sliding groove is provided on the heat conducting column base, and a first guiding sliding plate is slidably provided in the first guiding sliding groove. A baffle is fixedly provided on the first guiding sliding plate. Two second guiding sliding grooves are provided on the side of the baffle away from the first guiding sliding plate. Second guiding sliding plates are provided in the second guiding sliding grooves, and a sliding cover is fixedly provided on the second guiding sliding plates.

[0011] Preferably, the heat conducting column base is fixedly installed on the base.

[0012] Preferably, the second guiding sliding groove penetrates through the baffle.

[0013] Compared with the prior art, the present utility model has the following beneficial effects:

[0014] (1) When the present utility model is in use, first, the length of the heat conducting column is adjusted correspondingly according to the thickness of the chip. Subsequently, the thermal grease in the filling groove is increased or decreased according to the adjustment of the heat conducting column. Then, the sliding cover is returned to its original position, and the filling groove is closed again. Then, thermal glue is applied to the sliding cover. Subsequently, the base is installed at the designated position. At this time, the applied thermal glue contacts the chip. Then, the heat generated by the auxiliary driving control box will be dissipated through the base and the heat dissipation fins, while the heat generated by the chip is transferred to the heat conducting column through the applied thermal glue, and then the heat is transferred to the heat dissipation plate through the heat conducting column. The heat is evenly distributed to several heat dissipation fins through the heat dissipation plate for uniform heat dissipation, thereby improving the heat dissipation efficiency. The length of the heat conducting column can be adjusted correspondingly according to the thickness of the chip to adapt to chips of different thicknesses and improve the scope of application. Brief Description of the Drawings

[0015] Figure 1 is an overall structural schematic diagram of a heat dissipation housing of an auxiliary driving control box of the present utility model;

[0016] Figure 2 is a bottom view structural schematic diagram of a heat dissipation housing of an auxiliary driving control box of the present utility model;

[0017] Figure 3 is a structural schematic diagram of a heat conducting column in a heat dissipation housing of an auxiliary driving control box of the present utility model;

[0018] Figure 4 is an internal structural schematic diagram of a heat conducting column in a heat dissipation housing of an auxiliary driving control box of the present utility model.

[0019] In the figure: 1. Base; 2. Fixed plate; 3. Fixed threaded hole; 4. Accommodating groove; 5. Heat conducting column; 501. Heat conducting column base; 502. Filling groove; 503. Thermal grease; 504. First guiding chute; 505. First guiding slide plate; 506. Baffle; 507. Second guiding chute; 508. Second guiding slide plate; 509. Sliding cover; 6. Thermal glue; 7. Heat dissipation plate; 8. Heat dissipation fin. Detailed Embodiment

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] Such as Figure 1 and Figure 2As shown in the figure, a heat dissipation housing for an assisted driving control box includes a base 1, on which a number of fixing plates 2 are provided. Fixing threaded holes 3 are provided on the fixing plates 2. On one side of the base 1, there is a receiving groove 4. On the inner wall of one side of the receiving groove 4, a number of heat conducting columns 5 are provided. A heat conducting adhesive 6 is provided on the heat conducting columns 5. A heat sink plate 7 is fixedly provided on the side of the heat conducting column 5 away from the heat conducting adhesive 6. A number of heat dissipation fins 8 are provided on the base 1 and the heat sink plate 7.

[0022] As Figure 3 and Figure 4 shown, in another embodiment of the present utility model, the heat conducting column 5 includes a heat conducting column base 501. A filling groove 502 is provided on the heat conducting column base 501. Heat conducting silicone grease 503 is provided in the filling groove 502;

[0023] A first guiding sliding groove 504 is provided on the heat conducting column base 501. A first guiding sliding plate 505 is slidably provided in the first guiding sliding groove 504. A baffle 506 is fixedly provided on the first guiding sliding plate 505. Two second guiding sliding grooves 507 are provided on the side of the baffle 506 away from the first guiding sliding plate 505. A second guiding sliding plate 508 is provided in the second guiding sliding groove 507. A sliding cover 509 is fixedly provided on the second guiding sliding plate 508. When it is necessary to adjust the length of the heat conducting column 5 correspondingly according to the thickness of the chip, first move the sliding cover 509 along the track of the second guiding sliding groove 507 to one side to release the sealing of the filling groove 502 by the sliding cover 509. Then move the baffle 506 in a direction away from or close to the heat conducting column base 501, and perform movement guiding through the first guiding sliding groove 504 and the first guiding sliding plate 505, so as to adjust the overall length of the heat conducting column 5, so that the heat conducting adhesive 6 on the sliding cover 509 can contact the chip, so that the length of the heat conducting column 5 can be adjusted correspondingly according to the thickness of the chip. Subsequently, the heat conducting silicone grease 503 in the filling groove 502 is increased or decreased according to the adjustment condition of the heat conducting column 5 to prevent extra space from appearing in the filling groove 502, which is convenient for subsequent heat conduction work. Then make the sliding cover 509 return to its original position and re-seal the filling groove 502.

[0024] The working principle of the heat dissipation housing for the assisted driving control box:

[0025] In use, first move the sliding cover 509 along the track of the second guiding chute 507 to one side to release the enclosure of the filling groove 502 by the sliding cover 509. Then move the baffle 506 away from or towards the heat conducting column base 501, and conduct the movement guiding through the first guiding chute 504 and the first guiding slide plate 505, so as to adjust the overall length of the heat conducting column 5, enabling the heat conducting adhesive 6 on the sliding cover 509 to contact the chip, thereby enabling the corresponding adjustment of the length of the heat conducting column 5 according to the thickness of the chip. Subsequently, increase or decrease the thermal grease 503 in the filling groove 502 according to the adjustment condition of the heat conducting column 5. Then return the sliding cover 509 to its original position to re-close the filling groove 502. Then apply the heat conducting adhesive 6 on the sliding cover 509. Subsequently, install the base 1 at the designated position. At this time, the applied heat conducting adhesive 6 contacts the chip, and the base 1 is fixed by using the fixing plate 2 and the fixing threaded holes 3. Then the heat generated by the auxiliary driving control box will be dissipated through the base 1 and the heat dissipating fins 8, while the heat generated by the chip is transferred to the heat conducting column 5 through the applied heat conducting adhesive 6, and then the heat is transferred to the heat spreader 7 through the heat conducting column base 501, the sliding cover 509 and the thermal grease 503 made of heat conducting materials. The heat spreader 7 distributes the heat evenly to a plurality of heat dissipating fins 8 for uniform heat dissipation, thereby improving the heat dissipation efficiency. The length of the heat conducting column 5 can be adjusted correspondingly according to the thickness of the chip to adapt to chips of different thicknesses and improve the scope of application.

[0026] Obviously, the above embodiments of the present utility model are merely examples for clearly explaining the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation manners here. Any obvious changes or modifications derived from the technical solutions of the present invention still fall within the protection scope of the present invention.

Claims

1. An auxiliary driving control box heat dissipation housing, comprising a base (1), characterized in that: A plurality of fixing plates (2) are provided on the base (1), fixing threaded holes (3) are provided on the fixing plates (2), a receiving groove (4) is provided on one side of the base (1), a plurality of heat conducting columns (5) are provided on the inner wall of one side of the receiving groove (4), a heat conducting adhesive (6) is provided on the heat conducting columns (5), a heat sink plate (7) is fixedly provided on the side of the heat conducting column (5) away from the heat conducting adhesive (6), and a plurality of heat dissipating fins (8) are provided on the base (1) and the heat sink plate (7).

2. The heat dissipation housing of an assisted driving control box according to claim 1, characterized in that: The heat sink plate (7) is fixedly installed on the base (1).

3. The heat dissipation housing of an assisted driving control box according to claim 2, wherein: The heat conducting column (5) includes a heat conducting column base (501), a filling groove (502) is provided on the heat conducting column base (501), and a heat conducting silicone grease (503) is provided in the filling groove (502).

4. The heat dissipation housing of an assisted driving control box according to claim 3, characterized in that: A first guiding sliding groove (504) is provided on the heat conducting column base (501), a first guiding sliding plate (505) is slidably provided in the first guiding sliding groove (504), a baffle (506) is fixedly provided on the first guiding sliding plate (505), two second guiding sliding grooves (507) are provided on the side of the baffle (506) away from the first guiding sliding plate (505), a second guiding sliding plate (508) is provided in the second guiding sliding grooves (507), and a sliding cover (509) is fixedly provided on the second guiding sliding plate (508).

5. The heat dissipation housing of an assisted driving control box according to claim 4, wherein: The heat conducting column base (501) is fixedly installed on the base (1).

6. The heat dissipation housing of an assisted driving control box according to claim 5, characterized in that: The second guiding sliding groove (507) penetrates through the baffle (506).

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