Semiconductor chip COL interconnection structure
By adopting a semiconductor chip COL interconnect structure in MiniLED display, using column and row line interleaved arrays to arrange the LED flip chip, and soldering electrodes through solder paste layer, the problem of PCB hard board not being flexible and transparent display is solved, achieving a low-cost flexible and transparent display effect.
Patent Information
- Application Number
- CN202420804237.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-18
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-04-18
AI Technical Summary
In existing MiniLED displays, PCB hard boards cannot achieve flexible and transparent display, which is costly.
Using a semiconductor chip COL interconnect structure, an array of interwoven column lines and row lines is used to arrange the LED flip chip, and the electrodes are soldered through the solder paste layer to achieve flexible and transparent display.
A flexible and transparent display is achieved and costs are reduced.
Smart Images
Figure CN223080445U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor chips, and particularly relates to a semiconductor chip COL interconnection structure. Background Technique
[0002] LEDs are widely used in the fields of lighting and display due to their advantages of energy saving, rich colors, small size, long life, etc. The emission wavelength of LEDs can cover the entire visible light band, and has important application value, especially in the application of large display screens, where it has an irreplaceable position.
[0003] In MiniLED displays, commonly used R, G, and B three-color flip chips are fixed on a PCB board through die bonding and reflow soldering processes (Chip On Board, COB process). The IC driver chip has been integrated on the PCB board, and then a protective glue is applied to form a display unit board. The disadvantages of this method are: the substrate is a rigid PCB board, which cannot be bent or curled, and cannot achieve flexible display and transparent display, and the cost is relatively high; in view of this, we propose a semiconductor chip COL interconnection structure. Content of the Utility Model
[0004] Aiming at the deficiencies of the prior art, the utility model provides a semiconductor chip COL interconnection structure, which solves the problems mentioned in the above background technique.
[0005] To achieve the above purposes, the utility model is realized through the following technical solutions: A semiconductor chip COL interconnection structure, including a chip group and an interconnection mechanism, the interconnection mechanism is electrically connected to the chip group, the chip group includes a red light LED flip chip, a blue light LED flip chip, and a green light LED flip chip, and the interconnection mechanism includes:
[0006] Column enameled wires, and three groups of column enameled wires are arranged in an array;
[0007] Row enameled wires.
[0008] Optionally, the LED chips in the chip group are respectively provided with an LED chip P electrode and an LED chip N electrode.
[0009] Optionally, the LED chip P electrode and the LED chip N electrode are respectively electrically connected to the row enameled wire and the column enameled wire.
[0010] The utility model provides a semiconductor chip COL interconnection structure. It has the following beneficial effects:
[0011] The COL interconnection structure of the semiconductor chip arranges enameled wires with an insulating layer into an array of interwoven rows and columns. An LED flip chip is placed at the node where the row wire and the column wire intersect. The LED flip chip can be rectangular or triangular. The LED flip chip is lapped on the intersecting row and column wires at an angle of 45 degrees. The part of the enameled wire in contact with the P and N electrodes of the LED flip chip is a metal wire without an insulating layer but coated with a solder paste layer. The solder paste layer is welded to the P and N electrodes of the LED flip chip. Three LED flip chips of red, green, and blue form a pixel of the display screen. By applying current to the row and column wires of the enameled wire, the LED flip chip can be lit to achieve full-color display. Coating the array with silicone or other organic colloids can achieve flexible transparent display. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 FIG. 1 is a schematic structural diagram of the interconnection according to Embodiment 1 of the present invention;
[0013] Figure 2 FIG. 2 is a schematic structural diagram of the interconnection according to Embodiment 2 of the present invention.
[0014] In the figure: 1, red light LED flip chip; 2, blue light LED flip chip; 3, green light LED flip chip; 4, column wire enameled wire; 5, row wire enameled wire; 6, LED chip P electrode; 7, LED chip N electrode. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0015] Hereinafter, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0016] Embodiment 1
[0017] Please refer to Figure 1 , the present invention provides a technical solution: a COL interconnection structure of a semiconductor chip, including a chip group and an interconnection mechanism. The interconnection mechanism is electrically connected to the chip group. The chip group includes a red light LED flip chip 1, a blue light LED flip chip 2, and a green light LED flip chip 3. The interconnection mechanism includes: column wire enameled wire 4 and row wire enameled wire 5. Among them, three groups of column wire enameled wires 4 are arranged in an array.
[0018] In this embodiment, the LED chips in the chip group are respectively provided with an LED chip P electrode 6 and an LED chip N electrode 7. The LED chip P electrode 6 and the LED chip N electrode 7 are respectively electrically connected to the row wire enameled wire 5 and the column wire enameled wire 4.
[0019] In this embodiment, the red LED flip chip 1, the blue LED flip chip 2, and the green LED flip chip 3 are all rectangular flip LED chips.
[0020] As an application of this embodiment: The enameled wire with an insulating layer is arranged in an array of rows and columns intertwined. An LED flip chip is placed at the node where the row wire and the column wire intersect. The LED flip chip is lapped at a 45-degree angle on the intersecting row and column wires. The part of the enameled wire in contact with the P and N electrodes of the LED flip chip is a metal wire without an insulating layer but coated with a solder paste layer. The solder paste layer is welded to the P and N electrodes of the LED flip chip. The three LED flip chips of red, green, and blue form a pixel of the display screen. By applying current to the row and column wires of the enameled wire, the LED flip chip can be lit to achieve full-color display. Coating the array with silicone or other organic colloids can achieve flexible transparent display.
[0021] Embodiment Two
[0022] Please refer to Figure 2 , the present utility model provides a technical solution: a semiconductor chip COL interconnection structure, including a chip group and an interconnection mechanism. The interconnection mechanism is electrically connected to the chip group. The chip group includes a red LED flip chip 1, a blue LED flip chip 2, and a green LED flip chip 3. The interconnection mechanism includes: column wire enameled wire 4 and row wire enameled wire 5. Among them, three groups of column wire enameled wires 4 are arranged in an array.
[0023] In this embodiment, the LED chips in the chip group are respectively provided with an LED chip P electrode 6 and an LED chip N electrode 7. The LED chip P electrode 6 and the LED chip N electrode 7 are respectively electrically connected to the row wire enameled wire 5 and the column wire enameled wire 4.
[0024] In this embodiment, the red LED flip chip 1, the blue LED flip chip 2, and the green LED flip chip 3 are all triangular flip LED chips.
[0025] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. A semiconductor chip COL interconnection structure, characterized in that: It includes a chipset and an interconnection mechanism. The interconnection mechanism is electrically connected to the chipset. The chipset includes a red LED flip chip (1), a blue LED flip chip (2), and a green LED flip chip (3). The interconnection mechanism includes: Column wire enameled wires (4), and three groups of the column wire enameled wires (4) are arranged in an array; Row wire enameled wires (5).
2. The COL interconnection structure of a semiconductor chip according to claim 1, wherein: The LED chips in the chipset are respectively provided with an LED chip P electrode (6) and an LED chip N electrode (7).
3. The semiconductor chip COL interconnection structure according to claim 2, wherein: The LED chip P electrode (6) and the LED chip N electrode (7) are respectively electrically connected to the row wire enameled wire (5) and the column wire enameled wire (4).