Gluing device for manufacturing power electronic components

Abstract

The utility model belongs to the field of electronic component manufacturing, and particularly relates to a gluing device for power electronic component manufacturing, which comprises a base, a glue dipping device is arranged on the left side of the top of the base, a drying device is arranged on the right side of the top of the base and below the glue dipping device, and the glue dipping device comprises a glue containing box. The glue containing box is fixedly mounted at the top of the base, an L-shaped mounting frame is fixedly mounted on the left side of the base, a guide groove is formed in the L-shaped mounting frame, and a mounting seat is slidably connected into the guide groove; the base is used for installing the glue dipping device and the drying device, the glue dipping device is used for carrying out glue dipping and coating on a large component, and the drying device is used for fixing the component subjected to glue dipping and coating, so that excessive glue on the surface of the component drips; and meanwhile, the component subjected to gum dipping can be dried.

Description

Technical Field

[0001] The utility model relates to the field of electronic component manufacturing, and particularly relates to a glue coating device for manufacturing power electronic components. Background Art

[0002] Electronic components are components of electronic elements and small machines and instruments. They are often composed of several parts and can be used interchangeably in similar products. They usually refer to certain parts in industries such as electrical appliances, radio, and instruments. They are the general term for electronic devices such as capacitors, transistors, hairsprings, and clockwork, and common ones include diodes, etc.

[0003] When manufacturing components, to prevent the intrusion of external impurities and moisture and ensure that the components are not affected by corrosion and changes in resistance values, a protective glue is often coated on the outside of the components. The glue coating methods for components are divided into three types: immersion glue coating, dispensing glue coating, and quantitative glue coating. The prior art discloses a glue coating device for manufacturing power electronic components (authorized announcement number CN220126699U). This patented technology can control the up and down movement of the extrusion rod in the glue injection tube by controlling the electric telescopic rod, so that the glue in the glue injection tube can be extruded onto the electronic components or sucked back into the glue injection tube to control the glue injection amount. At the same time, the glue injection tube can be received by the horizontal plate to slow down the solidification speed of the glue exposed to the air.

[0004] Although this solution can achieve the advantage of dispensing glue on components to avoid glue leakage, it cannot meet the usage requirements when a large circuit board needs to be fully coated during actual use. Therefore, those skilled in the art have provided a glue coating device for manufacturing power electronic components to solve the problems raised in the above background art. Summary of the Utility Model

[0005] In order to make up for the deficiencies of the prior art and solve the problem that it cannot meet the usage requirements when a large circuit board needs to be fully coated during actual use, the utility model provides a glue coating device for manufacturing power electronic components.

[0006] The technical solution adopted by the utility model to solve its technical problems is: a glue coating device for manufacturing power electronic components, including a base, an immersion glue coating device is arranged on the left side of the top of the base, and a drying device is arranged on the right side of the top of the base and below the immersion glue coating device;

[0007] The dipping device includes a glue storage box, which is fixedly installed on the top of the base. An L-shaped mounting frame is fixedly installed on the left side of the base. A guiding groove is formed inside the L-shaped mounting frame. A mounting seat is slidably connected inside the guiding groove. An installation rod is arranged at the bottom of the mounting seat. Two first sliding grooves are formed at the bottom of the installation rod. A first sliding block is slidably connected inside the first sliding groove. A first clamping rod is fixedly installed at the bottom of the first sliding block.

[0008] Preferably, a first spring is fixedly installed on one side of the first sliding block, and one side of the first spring is fixedly connected to one side of the inner cavity of the first sliding groove.

[0009] Preferably, two second cylinders are fixedly installed at the bottom of the mounting seat, and the bottom of the second cylinder is fixedly connected to the top of the installation rod.

[0010] Preferably, a fixing plate is fixedly installed on the right side of the top of the L-shaped mounting frame. A first cylinder is fixedly installed on the top of the mounting seat, and the output end of the first cylinder is fixedly connected to the left side of the fixing plate.

[0011] Preferably, the drying device includes a U-shaped mounting seat, which is fixedly installed on the right side of the top of the base. A collection trough is inserted inside the U-shaped mounting seat. Two second sliding grooves are formed on both sides of the top of the U-shaped mounting seat. A second sliding block is slidably connected inside the second sliding groove. A cross bar is fixedly installed on the top of the second sliding block. A second clamping rod is fixedly installed at the center of the top of the cross bar.

[0012] Preferably, a second spring is fixedly installed on one side of the second sliding block, and one side of the second spring is fixedly connected to the inner cavity of the second sliding groove.

[0013] Preferably, limiting grooves are formed on both sides of the inner cavity of the U-shaped mounting seat. Limiting blocks are fixedly installed on both sides of the collection trough and are matched with the limiting grooves for use. The limiting blocks are located inside the limiting grooves.

[0014] Preferably, mounting plates are fixedly installed on both sides of the top of the base and on both sides of the U-shaped mounting seat. Uniformly distributed baking lamps are fixedly installed on one side of the mounting plate close to the U-shaped mounting seat.

[0015] The beneficial effects of the present utility model are as follows:

[0016] The present utility model is provided with a base for installing the dipping device and the drying device. Through the setting of the dipping device, dipping and coating of larger components can be realized. Through the setting of the drying device, the dipped components can be fixed to make the excess glue drops on the surface of the components fall off, and at the same time, the dipped components can be dried. Brief Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a structural schematic diagram of the present invention;

[0019] Figure 2 It is a structural schematic diagram of the dipping device of the present invention;

[0020] Figure 3 It is a schematic bottom view of the mounting rod of the present invention;

[0021] Figure 4 It is a structural schematic diagram of the first clamping rod and the driving device of the present invention;

[0022] Figure 5 It is a structural schematic diagram of the drying device of the present invention;

[0023] Figure 6 It is a structural schematic diagram of the cross bar and the driving device of the present invention;

[0024] Figure 7 It is a structural schematic diagram of the baking device of the present invention.

[0025] In the figure: 1, base; 2, dipping device; 201, glue storage tank; 202, L-shaped mounting bracket; 203, first cylinder; 204, fixing plate; 205, mounting rod; 206, first clamping rod; 207, second cylinder; 208, guide groove; 209, first chute; 210, mounting seat; 211, first spring; 212, first slider; 3, drying device; 301, mounting plate; 302, collection tank; 303, U-shaped mounting seat; 304, baking lamp; 305, second chute; 306, cross bar; 307, limiting block; 308, limiting groove; 309, second clamping rod; 310, second slider; 311, second spring. Detailed Embodiments

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0027] The following will further elaborate on this application in conjunction with the attached Figure 1-7 drawings to provide a more detailed description of the present application.

[0028] An embodiment of the present application discloses a glue coating device for manufacturing power electronic components. Referring to Figure 1 and Figure 2 , a glue coating device for manufacturing power electronic components includes a base 1. On the left side of the top of the base 1, a glue dipping device 2 is provided. On the right side of the top of the base 1 and below the glue dipping device 2, a drying device 3 is provided;

[0029] The glue dipping device 2 includes a glue storage box 201. The glue storage box 201 is fixedly installed on the top of the base 1. On the left side of the base 1, an L-shaped mounting bracket 202 is fixedly installed. A guide groove 208 is formed inside the L-shaped mounting bracket 202. A mounting seat 210 is slidably connected inside the guide groove 208. An installation rod 205 is provided at the bottom of the mounting seat 210. Two first sliding grooves 209 are formed at the bottom of the installation rod 205. A first sliding block 212 is slidably connected inside the first sliding groove 209. A first clamping rod 206 is fixedly installed at the bottom of the first sliding block 212.

[0030] Referring to Figure 3 and Figure 4 , a first spring 211 is fixedly installed on one side of the first sliding block 212. One side of the first spring 211 is fixedly connected to one side of the inner cavity of the first sliding groove 209. By setting the first spring 211, the first sliding block 212 is pulled, and then the first clamping rod 206 is pulled to move towards the relatively close side, so as to clamp and fix the components to be dipped in glue, facilitating subsequent dipping and coating of the components with glue.

[0031] Referring to Figure 1 and Figure 2 , two second cylinders 207 are fixedly installed at the bottom of the mounting seat 210. The bottom of the second cylinder 207 is fixedly connected to the top of the installation rod 205. By setting the second cylinder 207, the installation rod 205, the first clamping rod 206, and the components installed between the first clamping rods 206 are pushed into the glue inside the glue storage box 201 to realize dipping and coating of the components with glue.

[0032] Referring to Figure 2 and Figure 3 , a fixed plate 204 is fixedly installed on the right side of the top of the L-shaped mounting bracket 202. A first cylinder 203 is fixedly installed on the top of the mounting seat 210. The output end of the first cylinder 203 is fixedly connected to the left side of the fixed plate 204. By setting the first cylinder 203 and the fixed plate 204, the movement of the mounting seat 210 is realized, and then the installation rod 205, the first clamping rod 206, and the components after dipping and coating are driven to move to the top of the drying device 3 for fixed drying.

[0033] Refer to Figure 1 and Figure 5 Figure 5 , the drying device 3 includes a U-shaped mounting base 303, the U-shaped mounting base 303 is fixedly installed on the right side of the top of the base 1, a collection tank 302 is inserted inside the U-shaped mounting base 303, and two second sliding grooves 305 are opened on both sides of the top of the U-shaped mounting base 303. A second slider 310 is slidably connected inside the second sliding groove 305. A cross bar 306 is fixedly installed on the top of the second slider 310, and a second clamping rod 309 is fixedly installed at the center of the top of the cross bar 306. Through the settings of the cross bar 306 and the second clamping rod 309, the components after dipping and coating are squeezed and fixed. Through the setting of the collection tank 302, the excess glue on the surface of the components after dipping and coating is contained, facilitating subsequent centralized cleaning.

[0034] Refer to Figure 5 and Figure 6 Figure 6 , a second spring 311 is fixedly installed on one side of the second slider 310, and one side of the second spring 311 is fixedly connected to the inner cavity of the second sliding groove 305. Through the setting of the second spring 311, it is used to pull the second slider 310 to drive the cross bar 306 and the second clamping rod 309 to move towards the relatively close side to achieve...

[0035] Refer to Figure 5 Figure 5 , limiting grooves 308 are opened on both sides of the inner cavity of the U-shaped mounting base 303, and limiting blocks 307 that cooperate with the limiting grooves 308 are fixedly installed on both sides of the collection tank 302. The limiting blocks 307 are located inside the limiting grooves 308. Through the settings of the limiting blocks 307 and the limiting grooves 308, the collection tank 302 is limited, increasing the stability of the collection tank 302 inside the U-shaped mounting base 303.

[0036] Refer to Figure 1 and Figure 7 Figure 7 , mounting plates 301 are fixedly installed on both sides of the top of the base 1 and located on both sides of the U-shaped mounting base 303. Uniformly distributed baking lamps 304 are fixedly installed on the side of the mounting plate 301 close to the U-shaped mounting base 303. Through the setting of the mounting plate 301, the baking lamps 304 are installed. Through the setting of the baking lamps 304, the components after dipping and coating are irradiated and dried.

[0037] Working principle: Pull the first clamping rod 206 to both sides, place the component to be dipped and coated between the first clamping rods 206, and release the first clamping rod 206. Under the pulling of the first spring 211, the first slider 212 and the first clamping rod 206 move towards the relatively close side, thereby realizing the clamping and fixing of the component. The elongation of the second cylinder 207 causes the mounting rod 205, the first clamping rod 206, and the component to descend and the component to be immersed in the interior of the glue storage tank 201. After the dipping and coating is completed, the second cylinder 207 pulls the mounting rod 205, the first clamping rod 206, and the component to rise. After waiting for a while, when there is no continuous dripping of glue at the bottom of the component, the first cylinder 203 contracts to drive the mounting base 210, the mounting rod 205, and the component to move to the right, causing the component to move to the top between the second clamping rods 309. Pull the cross bar 306 to the relatively far side, and the second cylinder 207 pushes the mounting rod 205 and the component to descend, causing the component to move between the second clamping rods 309. Release the second clamping rod 309, and under the action of the second spring 311 and the second slider 310, pull the cross bar 306 to drive the second clamping rod 309 to fix the component. After the fixing is completed, turn on the baking lamp 304 to irradiate and dry the dipped and coated component. After drying, the component can be removed.

[0038] The above shows and describes the basic principle, main features, and advantages of the present utility model. Those skilled in the art of this industry should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed.

Claims

1. A glue coating device for manufacturing power electronic components, characterized in that: It includes a base (1), on the left side of the top of the base (1), there is a dipping device (2) arranged, and on the right side of the top of the base (1) and below the dipping device (2), there is a drying device (3) arranged; The dipping device (2) includes a glue storage box (201), the glue storage box (201) is fixedly installed on the top of the base (1), on the left side of the base (1), there is an L-shaped mounting bracket (202) fixedly installed, inside the L-shaped mounting bracket (202), there is a guiding groove (208) opened, inside the guiding groove (208), there is a mounting seat (210) slidably connected, at the bottom of the mounting seat (210), there is a mounting rod (205) arranged, at the bottom of the mounting rod (205), there are two first sliding grooves (209) opened, inside the first sliding grooves (209), there are first sliding blocks (212) slidably connected, and at the bottom of the first sliding blocks (212), there are first clamping rods (206) fixedly installed.

2. The glue - applying device for manufacturing power electronic components according to claim 1, wherein: On one side of the first sliding block (212), there is a first spring (211) fixedly installed, and one side of the first spring (211) is fixedly connected with one side of the inner cavity of the first sliding groove (209).

3. The glue coating device for manufacturing power electronic components according to claim 1, wherein: At the bottom of the mounting seat (210), there are two second cylinders (207) fixedly installed, and the bottom of the second cylinders (207) is fixedly connected with the top of the mounting rod (205).

4. The glue coating device for manufacturing power electronic components according to claim 1, wherein: On the right side of the top of the L-shaped mounting bracket (202), there is a fixing plate (204) fixedly installed, on the top of the mounting seat (210), there is a first cylinder (203) fixedly installed, and the output end of the first cylinder (203) is fixedly connected with the left side of the fixing plate (204).

5. The glue coating device for manufacturing power electronic components according to claim 1, characterized in that: The drying device (3) includes a U-shaped mounting seat (303), the U-shaped mounting seat (303) is fixedly installed on the right side of the top of the base (1), inside the U-shaped mounting seat (303), there is a collection tank (302) inserted, on both sides of the top of the U-shaped mounting seat (303), there are two second sliding grooves (305) opened, inside the second sliding grooves (305), there are second sliding blocks (310) slidably connected, on the top of the second sliding blocks (310), there are cross bars (306) fixedly installed, and at the center of the top of the cross bar (306), there is a second clamping rod (309) fixedly installed.

6. The glue coating device for manufacturing power electronic components according to claim 5, characterized in that: On one side of the second sliding block (310), there is a second spring (311) fixedly installed, and one side of the second spring (311) is fixedly connected with the inner cavity of the second sliding groove (305).

7. A glue coating device for manufacturing power electronic components according to claim 5, characterized in that: On both sides of the inner cavity of the U-shaped mounting seat (303), there are limiting grooves (308) opened, on both sides of the collection tank (302), there are limiting blocks (307) fixedly installed which are used in cooperation with the limiting grooves (308), and the limiting blocks (307) are located inside the limiting grooves (308).

8. The glue coating device for manufacturing power electronic components according to claim 5, characterized in that: On the top of the base (1) and on both sides of the U-shaped mounting seat (303), there are mounting plates (301) fixedly installed, on the side of the mounting plate (301) close to the U-shaped mounting seat (303), there are baking lamps (304) fixedly installed in a uniformly distributed manner.

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