Wafer chemical mechanical grinding device

Abstract

The utility model discloses a wafer chemical mechanical grinding device which comprises a base, a groove is formed in the base, a working table is installed on the top of the base, a rotating hole is formed in the middle of the working table, a bearing seat is installed on the rotating hole, and a first servo motor is installed at the bottom of the working table through a bolt. A grinding pad is installed on an output shaft of the first servo motor and rotationally installed on a bearing seat of the workbench, a water tank is arranged at the top of the workbench, a drainage hole is formed in the bottom of the water tank, and a water pipe is arranged at the bottom of the drainage hole. According to the wafer polishing device, a wafer is polished on the polishing pad, a chemical reagent is sprayed on the polishing pad in the polishing process to assist in polishing, chippings and the chemical reagent generated in the polishing process flow into the water tank and are discharged into the filter through the water pipe, and the chemical reagent can be repeatedly utilized after being filtered in the filter; and the production cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, in particular to a wafer chemical mechanical polishing device. Background Art

[0002] Wafer Chemical Mechanical Planarization (CMP for short) is a very crucial step in semiconductor manufacturing. It involves a surface planarization technology that combines chemical etching and mechanical polishing. Currently, the existing polishing devices cannot filter and reuse chemical reagents. Therefore, a wafer chemical mechanical polishing device is proposed, which can reuse chemical reagents and reduce production costs.

[0003] After retrieval, the patent with the Chinese patent application number 202022436959 discloses a wafer polishing device and a polishing pad. This polishing device does not have a protective structure, and the chemical reagents sprayed during polishing are prone to break away from the polishing pad and damage the polishing device. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the deficiencies existing in the prior art, and a wafer chemical mechanical polishing device is proposed.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A wafer chemical mechanical polishing device includes a base. A groove is arranged inside the base. A workbench is installed on the top of the base. A rotation hole is arranged in the middle of the workbench. A bearing seat is installed on the rotation hole. A first servo motor is installed at the bottom of the workbench through bolts. A polishing pad is installed on the output shaft of the first servo motor. The polishing pad is rotatably installed on the bearing seat of the workbench. A water tank is arranged on the top of the workbench. A drain hole is arranged at the bottom of the water tank. A water pipe is arranged at the bottom of the drain hole.

[0007] As a further scheme of the utility model: The polishing device further includes a filter. The filter is installed at the bottom of the workbench. A plurality of filter elements are arranged inside the filter. The filter is connected to the water pipe through a pipeline. A window is arranged on one side of the filter. The polishing device further includes a control module. The filter is electrically connected to the control module.

[0008] As a further scheme of the utility model: The polishing device further includes a protection component. The protection component includes a first pneumatic telescopic cylinder. The first pneumatic telescopic cylinder is installed at the bottom of both sides of the workbench through bolts. A baffle is installed at the output end of the first pneumatic telescopic cylinder through bolts. A rubber ring is installed at the bottom of the baffle. The first pneumatic telescopic cylinder is electrically connected to the control module.

[0009] As a further solution of the present utility model: The grinding device further includes a fixing frame, which is installed on one side of the workbench. A second servo motor is installed at the bottom of the fixing frame, and the second servo motor is electrically connected to the control module. A second pneumatic telescopic cylinder is installed at the output end of the second servo motor, and the second pneumatic telescopic cylinder is electrically connected to the control module. A connecting plate is installed at the output end of the second pneumatic telescopic cylinder, and a support frame is installed at the connection between the connecting plate and the output end of the second pneumatic telescopic cylinder.

[0010] As a further solution of the present utility model: The grinding device further includes an air pump, which is installed on the top of the connecting plate. The air pump is electrically connected to the control module. A fixing seat is installed below the air pump. A plurality of suction holes are provided at the bottom of the fixing seat, and the suction holes are connected to the air pump. A plurality of air nozzles are installed inside the annular circle of the fixing seat, and the air nozzles are connected to the air pump.

[0011] As a further solution of the present utility model: The grinding device further includes a water pump, which is installed on the workbench. A water tank is installed on one side of the workbench. The water tank and the filter are connected to the water pump through pipelines. The water tank is electrically connected to the control module. A spray pipe is installed on the top of the baffle, and the spray pipe is connected to the water pump through a pipeline.

[0012] As a further solution of the present utility model: The grinding device further includes an electrical box, which is installed on the workbench. A control panel is installed on the top of the electrical box, and the control panel is electrically connected to the control module.

[0013] The beneficial effects of the present utility model are as follows:

[0014] 1. By grinding the wafer on the grinding pad, spraying chemical reagents on the grinding pad during the grinding process to assist grinding. The debris generated during the grinding process and the chemical reagents flow into the water tank and are discharged into the filter through a water pipe. The chemical reagents can be reused after being filtered in the filter, reducing the production cost.

[0015] 2. By setting the protection component, it can be raised when grinding the wafer to prevent the sprayed chemical reagents from flowing out and affecting the normal use of the grinding device. By using rubber rings, water can be prevented from flowing out of the water tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of a wafer chemical mechanical grinding device proposed by the present utility model;

[0017] Figure 2 is a schematic structural diagram of the installation of the first servo motor proposed by the present utility model;

[0018] Figure 3Structural schematic diagram of the protection component proposed by the present utility model;

[0019] Figure 4 Structural schematic diagram of the installation of the fixed seat proposed by the present utility model.

[0020] In the figure: 1 - base, 2 - workbench, 3 - protection component, 4 - grinding pad, 5 - fixing frame, 6 - first servo motor, 7 - filter, 8 - electrical box, 9 - first pneumatic telescopic cylinder, 10 - baffle, 11 - rubber ring, 12 - water pipe, 13 - second servo motor, 14 - second pneumatic telescopic cylinder, 15 - connecting plate, 16 - support frame, 17 - air pump, 18 - fixed seat, 19 - air nozzle, 20 - water pump, 21 - spray pipe, 22 - water tank, 23 - control panel. Specific embodiments

[0021] The technical solution of the present utility model will be further described in detail below in conjunction with specific embodiments.

[0022] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.

[0023] Embodiment 1

[0024] A wafer chemical mechanical polishing device, as Figures 1-4 shown, includes a base 1. A groove is provided inside the base 1. A workbench 2 is installed on the top of the base 1. A rotating hole is provided in the middle of the workbench 2. A bearing seat is installed on the rotating hole. A first servo motor 6 is installed at the bottom of the workbench 2 through bolts. A grinding pad 4 is installed on the output shaft of the first servo motor 6. The grinding pad 4 is rotatably installed on the bearing seat of the workbench 2. A water tank is provided on the top of the workbench 2. A drain hole is provided at the bottom of the water tank. A water pipe 12 is provided at the bottom of the drain hole.

[0025] This device is further configured as; as Figure 2 shown, the grinding device further includes a filter 7. The filter 7 is installed at the bottom of the workbench 2. A plurality of filter elements are provided inside the filter 7. The filter 7 is connected to the water pipe 12 through a pipeline. A window is provided on one side of the filter 7. The grinding device further includes a control module. The filter 7 is electrically connected to the control module. By providing a window, it is convenient to replace the filter elements inside the filter 7. The structure and working principle of the filter elements are prior art and will not be elaborated here.

[0026] By grinding the wafer on the grinding pad 4 and spraying chemical reagents on the grinding pad 4 during the grinding process to assist in grinding, the debris generated during the grinding process and the chemical reagents flow into the water tank and are discharged into the filter 7 through the water pipe 12. The chemical reagents can be reused after being filtered in the filter 7, reducing the production cost.

[0027] This device is further configured as; as Figures 1-3 shown, the grinding device further includes a protection component 3. The protection component 3 includes a first pneumatic telescopic cylinder 9. The first pneumatic telescopic cylinder 9 is installed at the bottom of both sides of the workbench 2 through bolts. A baffle 10 is installed at the output end of the first pneumatic telescopic cylinder 9 through bolts. A rubber ring 11 is installed at the bottom of the baffle 10. The first pneumatic telescopic cylinder 9 is electrically connected to the control module.

[0028] By setting the protection component 3, it can be raised when grinding the wafer to prevent the sprayed chemical reagents from flowing out and affecting the normal use of the grinding device. By using the rubber ring 11, water can be prevented from flowing out of the water tank.

[0029] This device is further configured as; as Figure 1 、 Figure 4 shown, the grinding device further includes a fixing frame 5. The fixing frame 5 is installed on one side of the workbench 2. A second servo motor 13 is installed at the bottom of the fixing frame 5. The second servo motor 13 is electrically connected to the control module. A second pneumatic telescopic cylinder 14 is installed at the output end of the second servo motor 13. The second pneumatic telescopic cylinder 14 is electrically connected to the control module. A connecting plate 15 is installed at the output end of the second pneumatic telescopic cylinder 14. A support frame 16 is installed at the connection between the connecting plate 15 and the output end of the second pneumatic telescopic cylinder 14.

[0030] This device is further configured as; as Figure 4 shown, the grinding device further includes an air pump 17. The air pump 17 is installed on the top of the connecting plate 15. The air pump 17 is electrically connected to the control module. A fixing seat 18 is installed below the air pump 17. A number of suction holes are provided at the bottom of the fixing seat 18. The suction holes are connected to the air pump 17. A number of air nozzles 19 are installed in the annular circle of the fixing seat 18. The air nozzles 19 are connected to the air pump 17.

[0031] The control module drives the air pump 17 to fix the wafer at the bottom of the fixing seat 18. The position of the wafer can be adjusted by the second servo motor 13 and the second pneumatic telescopic cylinder 14 so that the wafer is attached to the surface of the grinding pad 4 to grind the wafer.

[0032] This device is further configured as; as Figure 1As shown, the grinding device further includes a water pump 20. The water pump 20 is installed on the workbench 2. A water tank 22 is installed on one side of the workbench 2. The water tank 22 and the filter 7 are connected to the water pump 20 through pipelines. The water tank 22 is electrically connected to the control module. A spray pipe 21 is installed on the top of the baffle 10. The spray pipe 21 is connected to the water pump 20 through a pipeline. Chemical reagents are sprayed onto the surface of the grinding pad 4 through the spray pipe 21 to improve the grinding efficiency and quality.

[0033] This device is further configured as; as Figure 1 shown, the grinding device further includes an electrical box 8. The electrical box 8 is installed on the workbench 2. A control panel 23 is installed on the top of the electrical box 8. The control panel 23 is electrically connected to the control module.

[0034] Working principle: The control module drives the air pump 17 to fix the wafer at the bottom of the fixing seat 18. The position of the wafer can be adjusted by the second servo motor 13 and the second pneumatic telescopic cylinder 14 so that the wafer is attached to the surface of the grinding pad 4. Subsequently, the control module drives the protection component 3 to rise. The control module drives the water pump 20 to spray chemical reagents onto the surface of the grinding pad 4. The grinding pad 4 is driven by the first servo motor 6 to rotate to grind the wafer. During the grinding process, the chemical reagents flowing out are mixed with debris and filtered in the filter 7 and then pumped into the spray pipe 21 by the water pump 20 for reuse.

[0035] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present invention.

Claims

1. A wafer chemical mechanical polishing device, characterized in that, It includes a base (1), inside which there is a groove. A workbench (2) is installed on the top of the base (1). A rotation hole is provided at the middle position of the workbench (2), and a bearing seat is installed on the rotation hole. A first servo motor (6) is installed at the bottom of the workbench (2) by bolts. A grinding pad (4) is installed on the output shaft of the first servo motor (6). The grinding pad (4) is rotatably installed on the bearing seat of the workbench (2). A water tank is provided on the top of the workbench (2), and a drain hole is provided at the bottom of the water tank. A water pipe (12) is provided at the bottom of the drain hole.

2. The chemical mechanical polishing apparatus for a wafer according to claim 1, wherein The grinding device further includes a filter (7), which is installed at the bottom of the workbench (2). A number of filter elements are provided inside the filter (7). The filter (7) is connected to the water pipe (12) through a pipeline. A window is provided on one side of the filter (7). The grinding device further includes a control module, and the filter (7) is electrically connected to the control module.

3. The chemical mechanical polishing apparatus for a wafer according to claim 2, wherein, The grinding device further includes a protection component (3), which includes a first pneumatic telescopic cylinder (9). The first pneumatic telescopic cylinder (9) is installed at the bottom of both sides of the workbench (2) by bolts. A baffle (10) is installed at the output end of the first pneumatic telescopic cylinder (9) by bolts. A rubber ring (11) is installed at the bottom of the baffle (10). The first pneumatic telescopic cylinder (9) is electrically connected to the control module.

4. A wafer chemical mechanical polishing device according to claim 3, characterized in that, The grinding device further includes a fixing frame (5), which is installed on one side of the workbench (2). A second servo motor (13) is installed at the bottom of the fixing frame (5). The second servo motor (13) is electrically connected to the control module. A second pneumatic telescopic cylinder (14) is installed at the output end of the second servo motor (13). The second pneumatic telescopic cylinder (14) is electrically connected to the control module. A connecting plate (15) is installed at the output end of the second pneumatic telescopic cylinder (14). A support frame (16) is installed at the connection between the connecting plate (15) and the output end of the second pneumatic telescopic cylinder (14).

5. A wafer chemical mechanical polishing device according to claim 4, characterized in that, The grinding device further includes an air pump (17), which is installed on the top of the connecting plate (15). The air pump (17) is electrically connected to the control module. A fixing seat (18) is installed below the air pump (17). A number of suction holes are provided at the bottom of the fixing seat (18), and the suction holes are connected to the air pump (17). A number of air nozzles (19) are installed inside the annular ring of the fixing seat (18), and the air nozzles (19) are connected to the air pump (17).

6. The chemical mechanical polishing apparatus for a wafer according to claim 5, wherein The grinding device further includes a water pump (20), which is installed on the workbench (2). A water tank (22) is installed on one side of the workbench (2). The water tank (22) and the filter (7) are connected to the water pump (20) through pipelines. The water tank (22) is electrically connected to the control module. A spray pipe (21) is installed on the top of the baffle (10), and the spray pipe (21) is connected to the water pump (20) through a pipeline.

7. A wafer chemical mechanical polishing device according to claim 6, characterized in that The grinding device further includes an electrical box (8), the electrical box (8) is installed on the workbench (2), and a control panel (23) is installed on the top of the electrical box (8), and the control panel (23) is electrically connected to the control module.

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