Robot gripper for semiconductor equipment

Abstract

The utility model relates to the technical field of semiconductor production, and discloses a robot gripper for semiconductor equipment, which comprises a flange supporting piece, a first material taking assembly, a second material taking assembly and a first connecting plate, one end of the first connecting plate is provided with a suction cup mounting plate, and the first connecting plate is fixedly connected with the flange supporting piece. A material shaking air cylinder is arranged at the bottom of the first connecting plate, a suction cup fixing base is arranged at one end of a piston rod of the material shaking air cylinder, a suction cup fixing base is also arranged at one end of the suction cup mounting plate, and suction cups are arranged at the two ends of the suction cup fixing base. According to the semi-finished semiconductor material taking device, multi-process material taking of semi-finished semiconductor products is achieved, flexibility and applicability are high, the semi-finished semiconductor material taking device is matched with a robot arm and a sensor, manual semiconductor product carrying can be replaced, and carrying accuracy is improved while efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a robot gripper for semiconductor equipment. Background Technique

[0002] The material picking and placing is a relatively important link in the industrial production process. At present, the traditional manual picking and placing method is no longer feasible on the automated production line due to its disadvantages such as high labor intensity, high cost, and lack of precision.

[0003] In the semiconductor production process, the material picking is a key step, and its efficiency and accuracy directly affect the production quality and cost. The traditional manual picking and placing method requires a large amount of human input. Workers need to perform long-term repetitive work on the production line, which not only affects the physical health of workers but also increases the labor cost of enterprises. With the continuous increase of labor costs, the cost of manual picking and placing is also increasing. In addition, due to the instability of manual operation, it may lead to low production efficiency and further increase the production cost. The semiconductor production has extremely high requirements for precision, and manual operation is often difficult to achieve this precision. Once an error occurs, it may lead to product quality problems or even the scrapping of the entire batch of products. And now semiconductors have been widely used in various electronic products, and there are also various intelligent robots for handling semi-finished materials in the production process. However, most of the current handling intelligent robots are dedicated to specific machines, which means they can only be used for specific tasks and environments and cannot adapt to the changing production needs. This not only limits the production flexibility but also increases the equipment investment cost. Therefore, a robot gripper for semiconductor equipment is provided. Content of the Utility Model

[0004] The purpose of the utility model is to provide a robot gripper for semiconductor equipment to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A robot gripper for semiconductor equipment, comprising: a flange support member, a No. 1 material picking component, and a No. 2 material picking component. One side of the bottom of the flange support member is provided with the No. 1 material picking component, and the center of the bottom of the flange support member is provided with the No. 2 material picking component; the No. 1 material picking component further comprises: a first connecting plate, one end of the first connecting plate is provided with a suction cup mounting plate, the first connecting plate is fixedly connected with the flange support member, a vibrating cylinder is arranged at the bottom of the first connecting plate, one end of the piston rod of the vibrating cylinder is provided with a suction cup fixing seat, and a suction cup fixing seat is also arranged at one end of the suction cup mounting plate, and suction cups are arranged at both ends of the suction cup fixing seat.

[0006] Further, the No. 2 material picking component further includes: a second connecting plate, which is fixedly connected to the flange support member. One side of the second connecting plate is provided with a rotary cylinder, one end of the rotary cylinder is provided with a nozzle mounting plate, nozzles are provided at the four corners of the nozzle mounting plate, one side of the top of the nozzle mounting plate is provided with a side bracket, one side of the bottom of the side bracket is provided with a connecting block, and a nozzle is also provided at the bottom end of the connecting block.

[0007] Further, on the side of the bottom of the flange support member away from the No. 1 material picking component, there is a film tearing component, and the film tearing component further includes: a third connecting plate, which is L-shaped. One side of the third connecting plate is provided with a film pressing cylinder, one end of the film pressing cylinder is provided with a pressing block, a roller bracket is provided at the bottom end of the pressing block, rollers are provided between the bottoms of the roller brackets, one side of the outer wall of the middle part of the pressing block is provided with a film sensor bracket, and a film sensor is provided at one end of the film sensor bracket.

[0008] Further, a light source is provided on the side of the suction cup mounting plate close to the suction cup.

[0009] Further, a sensor bracket is provided at one end of the suction cup mounting plate, and a displacement sensor is provided on one side of the sensor bracket.

[0010] Further, the flange support member is used to be connected to a six-axis robotic arm.

[0011] Compared with the prior art, the beneficial effects of the present utility model are:

[0012] By setting the flange support member, the No. 1 material picking component, the No. 2 material picking component and the film tearing component, the present utility model realizes that when the robotic hand claw for semiconductor equipment is used, it is connected to the robotic arm through the flange support member. By setting multiple groups of hand claw fixtures on the flange support member, among which, the No. 1 material picking component can adsorb and pick up and place semiconductor semi-finished products through the suction cup and the vibrating cylinder, and can vibrate the materials at the same time. The No. 2 material picking component can rotate and pick up and place the semiconductor semi-finished products after adsorption through the nozzle and the rotary cylinder. The film tearing component performs the film tearing process on the semiconductor semi-finished products through the rollers and the film sensor. The robotic hand claw set by the present utility model can realize one hand claw to pick up materials for multiple processes of semiconductor semi-finished products, with high flexibility and applicability. Cooperating with the robotic arm and the sensor, it can replace manual handling of semiconductor products, improving the efficiency and the accuracy of handling at the same time. Description of the Drawings

[0013] Figure 1 is a three-dimensional view of a robotic hand claw for a semiconductor device of the present utility model;

[0014] Figure 2 is a schematic structural diagram of the No. 1 material picking component of a robotic hand claw for a semiconductor device of the present utility model;

[0015] Figure 3 This is a schematic structural diagram of the No. 2 material taking component of a robot gripper for a semiconductor device of the present utility model;

[0016] Figure 4 This is a schematic structural diagram of the film tearing component of a robot gripper for a semiconductor device of the present utility model.

[0017] In the figure: 1. Flange support; 2. No. 1 material taking component; 201. First connecting plate; 202. Suction cup mounting plate; 203. Vibrating cylinder; 204. Displacement sensor; 205. Light source; 206. Suction cup; 207. Suction cup fixing seat; 208. Sensor bracket; 3. No. 2 material taking component; 301. Second connecting plate; 302. Rotary cylinder; 303. Nozzle mounting plate; 304. Nozzle; 305. Side bracket; 306. Connecting block; 4. Film tearing component; 401. Third connecting plate; 402. Film pressing cylinder; 403. Pressing block; 404. Film sensor; 405. Roller; 406. Film sensor bracket; 407. Roller bracket. Detailed implementation manners

[0018] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0019] Please refer to Figures 1-4 , the present utility model provides a technical solution: A robot gripper for a semiconductor device includes: a flange support 1, a No. 1 material taking component 2, and a No. 2 material taking component 3. One side of the bottom of the flange support 1 is provided with the No. 1 material taking component 2, and the center of the bottom of the flange support 1 is provided with the No. 2 material taking component 3; The No. 1 material taking component 2 further includes: a first connecting plate 201, one end of the first connecting plate 201 is provided with a suction cup mounting plate 202, the first connecting plate 201 is fixedly connected to the flange support 1, the bottom of the first connecting plate 201 is provided with a vibrating cylinder 203, one end of the piston rod of the vibrating cylinder 203 is provided with a suction cup fixing seat 207, and the suction cup fixing seat 207 is also provided at one end of the suction cup mounting plate 202. Suction cups 206 are provided at both ends of the suction cup fixing seat 207. The suction cups 206 can adsorb and fix the target material by evacuating. Once the material is firmly adsorbed by the suction cups 206, the entire material taking component is moved to a new position by the robot arm, transporting the material to the designated position. After reaching the destination, the vibrating cylinder 203 is activated, and the piston rod expands and contracts to generate vibration to help loosen or separate the material. The suction cups 206 close the adsorption function, so that the material can be placed at the target position, and the material taking component returns to the initial position or is ready for the next operation.

[0020] The No. 2 material picking component 3 further includes: a second connecting plate 301, the second connecting plate 301 is fixedly connected to the flange support 1, a rotary cylinder 302 is provided on one side of the second connecting plate 301, a nozzle mounting plate 303 is provided at one end of the rotary cylinder 302, nozzles 304 are provided at the four corners of the nozzle mounting plate 303, a side bracket 305 is provided on one side of the top of the nozzle mounting plate 303, a connecting block 306 is provided on one side of the bottom of the side bracket 305, and a nozzle 304 is also provided at the bottom end of the connecting block 306. The No. 2 material picking component 3 can adsorb and rotate to pick and place semiconductor semi-finished products through the nozzles and the rotary cylinder 302.

[0021] A film tearing component 4 is provided on the bottom of the flange support 1 on the side away from the No. 1 material picking component 2. The film tearing component 4 further includes: a third connecting plate 401, the third connecting plate 401 is L-shaped, a film pressing cylinder 402 is provided on one side of the third connecting plate 401, a pressing block 403 is provided at one end of the film pressing cylinder 402, a roller support 407 is provided at the bottom end of the pressing block 403, rollers 405 are provided between the bottoms of the roller supports 407, a film sensor bracket 406 is provided on one side of the outer wall of the middle part of the film pressing cylinder 402, and a film sensor 404 is provided at one end of the film sensor bracket 406. The roller support 407 is fixed to the bottom of the pressing block 403, and the rollers 405 are installed between the bottoms of the brackets. When the pressing block 403 moves, the rollers 405 gently press on the film and move along with it, using the rolling action to reduce friction and avoid damaging the film material. The film sensor 404 is installed on the film sensor bracket 406 and is used to monitor the state and position of the film in real time during the film tearing process. This helps to detect and correct possible problems in a timely manner, such as film offset or tearing.

[0022] A light source 205 is provided on the side of the suction cup mounting plate 202 close to the suction cup 206. The light source 205 can be immediately lit to provide real-time light support for the vision system.

[0023] A sensor bracket 208 is provided at one end of the suction cup mounting plate 202, and a displacement sensor 204 is provided on one side of the sensor bracket 208. The main function of the sensor bracket 208 is to fix the displacement sensor 204 to ensure its accurate measurement at an appropriate position and angle. This is crucial for whether the material picking component 2 can accurately handle materials. The sensor bracket 208 is designed to be adjustable, enabling the displacement sensor 204 to be finely adjusted according to specific application scenarios and requirements to adapt to different working environments and improve the detection accuracy. The flange support 1 is used to connect to the six-axis robotic arm.

[0024] When the robot gripper for semiconductor equipment is in use, it is connected to the robot arm through the flange support 1. By setting multiple groups of gripper fixtures on the flange support 1, among which, the No. 1 material taking component 2 can adsorb and pick up and place semiconductor semi-finished products through the suction cup 206 and the vibrating cylinder 203, and can vibrate the materials at the same time. The No. 2 material taking component 3 can rotate and pick up and place semiconductor semi-finished products after adsorption through the suction nozzle and the rotating cylinder 302. The film tearing component 4 performs the film tearing process on the semiconductor semi-finished product through the roller 405 and the film sensor 404. Through the set robot gripper of the present utility model, it is possible to realize that one gripper can pick up materials for multiple processes of semiconductor semi-finished products, with high flexibility and applicability. Cooperating with the robot arm and the sensor, it can replace manual handling of semiconductor products, improving the efficiency and the accuracy of handling at the same time.

[0025] Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present utility model.

Claims

1. A robot gripper for a semiconductor device, comprising: Flange support (1), No. 1 material taking component (2) and No. 2 material taking component (3), characterized in that: on one side of the bottom of the flange support (1) there is a No. 1 material taking component (2), and in the center of the bottom of the flange support (1) there is a No. 2 material taking component (3); The No. 1 material taking component (2) further includes: a first connecting plate (201), one end of the first connecting plate (201) is provided with a suction cup mounting plate (202), the first connecting plate (201) is fixedly connected to the flange support (1), a vibrating cylinder (203) is provided at the bottom of the first connecting plate (201), one end of the piston rod of the vibrating cylinder (203) is provided with a suction cup fixing seat (207), and a suction cup fixing seat (207) is also provided at one end of the suction cup mounting plate (202), and suction cups (206) are provided at both ends of the suction cup fixing seat (207).

2. The robotic gripper for a semiconductor device according to claim 1, wherein: The No. 2 material taking component (3) further includes: a second connecting plate (301), the second connecting plate (301) is fixedly connected to the flange support (1), a rotary cylinder (302) is provided on one side of the second connecting plate (301), one end of the rotary cylinder (302) is provided with a nozzle mounting plate (303), nozzles (304) are provided at the four corners of the nozzle mounting plate (303), a side bracket (305) is provided on one side of the top of the nozzle mounting plate (303), a connecting block (306) is provided on one side of the bottom of the side bracket (305), and a nozzle (304) is also provided at the bottom end of the connecting block (306).

3. The robotic gripper for semiconductor equipment according to claim 1, wherein: On the side of the bottom of the flange support (1) away from the No. 1 material taking component (2) there is a film tearing component (4), and the film tearing component (4) further includes: a third connecting plate (401), the third connecting plate (401) is L-shaped, a film pressing cylinder (402) is provided on one side of the third connecting plate (401), one end of the film pressing cylinder (402) is provided with a pressing block (403), a roller support (407) is provided at the bottom end of the pressing block (403), rollers (405) are provided between the bottoms of the roller supports (407), a film sensor support (406) is provided on one side of the outer wall of the middle part of the pressing block (403), and a film sensor (404) is provided at one end of the film sensor support (406).

4. The robotic gripper for a semiconductor device according to claim 1, wherein: A light source (205) is provided on the side of the suction cup mounting plate (202) close to the suction cup (206).

5. The robotic gripper for a semiconductor device according to claim 1, wherein: One end of the suction cup mounting plate (202) is provided with a sensor support (208), and a displacement sensor (204) is provided on one side of the sensor support (208).

6. The robotic gripper for a semiconductor device according to claim 1, wherein: The flange support (1) is used for connecting with a six-axis robotic arm.

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