Heat dissipation device for printing and packaging machinery
Through the combination of semiconductor refrigeration plate and heat dissipation components, the heat dissipation area is increased, and the fixed ring design with magnet adsorption connection is used to facilitate cleaning of the dustproof net, solving the problems of low efficiency and dust pollution in high temperature environments of traditional printing and packaging machinery heat dissipation devices, achieving efficient heat dissipation and clean operation.
Patent Information
- Application Number
- CN202422203493.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-09
AI Technical Summary
Traditional printing and packaging machinery heat dissipation devices have low heat dissipation efficiency in high temperature environments, and dust is easy to enter the device and affect the heat dissipation effect.
The semiconductor refrigeration plate and heat dissipation components are combined to increase the heat dissipation area, and the fixed ring connected by magnet adsorption is designed to easily clean the dustproof net to prevent dust from entering.
Improves heat dissipation efficiency, keeps the interior of the device clean, ensures that the equipment operates within a reasonable temperature range, and extends the equipment life.
Smart Images

Figure CN223085666U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of packaging printing, in particular to a heat dissipation device for printing and packaging machinery. Background Art
[0002] Printing and packaging refers to a series of technological processes in which information such as text, patterns, and colors is printed on various materials (such as paper, plastic, metal, fabric, etc.) through printing technology, and then processes such as cutting, folding, bonding, and shaping are carried out to finally make product packaging. Printing and packaging are widely used in the packaging of commodities such as books, newspapers, magazines, food, daily necessities, and electronic products. When printing machines and other related equipment are operating, especially under high-speed operation, a large amount of heat will be generated. Overheating will affect the performance, accuracy, and lifespan of the equipment. Therefore, a heat dissipation device for printing and packaging machinery is required.
[0003] During the use of traditional heat dissipation devices for printing and packaging machinery, the heat generated by the equipment is transferred to the radiator, and then the heat is carried away by air flow or coolant, thereby reducing the operating temperature of the equipment. This process ensures that the equipment operates at an appropriate temperature and avoids the impact of overheating on performance and lifespan.
[0004] However, during heat dissipation, the problem that traditional heat dissipation devices only circulate cooling water, but when the temperature of the cooling water is too high, only rely on natural cooling and the heat dissipation efficiency is low when the ambient temperature is too high, affects the heat dissipation efficiency of the heat dissipation device for printing and packaging machinery. Summary of the Utility Model
[0005] In order to make up for the above deficiencies, the utility model provides a heat dissipation device for printing and packaging machinery, aiming to improve the problem that when the temperature of the cooling water is too high, only rely on natural cooling and the heat dissipation efficiency is low when the ambient temperature is too high.
[0006] In order to achieve the above object, the utility model adopts the following technical scheme: A heat dissipation device for printing and packaging machinery, including a printing machine, a box body is fixedly connected to one side of the printing machine, a top cover is fixedly connected to the top of the box body, a semiconductor refrigeration plate is fixedly connected inside the box body, a temperature guiding plate is fixedly connected to the top of the printing machine, a coil pipe is fixedly connected inside the temperature guiding plate, a heat dissipation port is opened inside the box body, a partition board is fixedly connected inside the printing machine, a semiconductor refrigeration plate is fixedly connected inside the partition board, a temperature guiding block is fixedly connected to one side of the semiconductor refrigeration plate, a heat dissipation component is arranged on the other side of the semiconductor refrigeration plate, and the heat dissipation component is used to increase the contact area between the heat dissipation surface of the semiconductor refrigeration plate and the air. A water outlet pipe is fixedly connected inside the top cover, one end of the water outlet pipe is fixedly connected with a water pump, the input end of the water pump is connected with the water outlet pipe, the output end of the water pump is connected with one end of the coil pipe, and the other end of the coil pipe is fixedly connected inside the top cover.
[0007] As a further description of the above technical solution:
[0008] The heat dissipation component includes a heat dissipation plate, heat dissipation columns, and a heat dissipation fan. The heat dissipation fan is arranged inside the box body. The heat dissipation columns are arranged in a rectangular array and fixedly connected to one side of the heat dissipation plate. The heat dissipation plate is fixedly connected to the other side of the semiconductor refrigeration plate.
[0009] As a further description of the above technical solution:
[0010] A first magnet is fixedly connected inside the box body, and the first magnets are arranged in an annular array and fixedly connected inside the box body.
[0011] As a further description of the above technical solution:
[0012] A fixing ring is arranged on one side of the box body, and a second magnet is fixedly connected inside the fixing ring.
[0013] As a further description of the above technical solution:
[0014] An installation ring is arranged inside the fixing ring, and a dust-proof net is fixedly connected inside the installation ring.
[0015] As a further description of the above technical solution:
[0016] A first sealing ring is fixedly connected to one side of the fixing ring, and one side of the first sealing ring is attached to the outer wall of the box body.
[0017] As a further description of the above technical solution:
[0018] A second sealing ring is fixedly connected to one side of the fixing ring, and one side of the second sealing ring is attached to the outer wall of the installation ring.
[0019] As a further description of the above technical solution:
[0020] The second magnets are arranged in an annular array and fixedly connected inside the fixing ring, and the second magnets are adsorbed to the outer wall of the first magnets.
[0021] The utility model has the following beneficial effects:
[0022] 1. In the utility model, first, the cooling water returns to the inside of the box body through the coil pipe. When dissipating heat from the cooling water, the refrigerating surface of the semiconductor refrigeration plate refrigerates at a low temperature and conducts the low temperature to the temperature conduction block to contact and cool the cooling water, achieving the effect of rapid heat dissipation. It solves the problem that when the temperature of the cooling water is too high, only relying on natural cooling has a low heat dissipation efficiency when the ambient temperature is too high, and improves the heat dissipation efficiency of the heat dissipation device of the printing and packaging machine.
[0023] 2. In the present utility model, the fixing ring can be directly pulled off the box body. The fixing ring is connected by fitting and adsorbing to the first magnet through the second magnet. Subsequently, the dust-proof net can be removed through the mounting ring for cleaning, achieving the effect of dust prevention, solving the problem that dust in the external air is inhaled into the shell interior together during heat dissipation, resulting in dust adhering to the internal heat dissipation columns and affecting heat dissipation, and improving the practicability of the heat dissipation device for printing and packaging machinery. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 is a perspective view of a heat dissipation device for a printing and packaging machine proposed by the present utility model;
[0025] Figure 2 is a schematic diagram of the internal structure of the box body of a heat dissipation device for a printing and packaging machine proposed by the present utility model;
[0026] Figure 3 is Figure 2 an enlarged structural schematic diagram of part A in
[0027] Legend:
[0028] 1. Printing press; 2. Box body; 3. Top cover; 4. Heat conduction plate; 5. Water pump; 6. Water outlet pipe; 7. Coiled pipe; 8. Partition board; 9. Semiconductor refrigeration plate; 10. Heat conduction block; 11. Heat dissipation port; 12. Heat dissipation plate; 13. Heat dissipation column; 14. Heat dissipation fan; 15. First magnet; 16. Mounting ring; 17. Dust-proof net; 18. Fixing ring; 19. Second magnet; 20. First sealing ring; 21. Second sealing ring. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0029] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0030] Refer to Figure 1 and Figure 2, an embodiment provided by the present utility model: a heat dissipation device for a printing and packaging machine, comprising a printing machine 1, a box body 2 fixedly connected to one side of the printing machine 1, a top cover 3 fixedly connected to the top of the box body 2, a semiconductor refrigeration plate 9 fixedly connected inside the box body 2, a temperature guiding plate 4 fixedly connected to the top of the printing machine 1, a coil pipe 7 fixedly connected inside the temperature guiding plate 4, a heat dissipation port 11 opened inside the box body 2, a partition plate 8 fixedly connected inside the printing machine 1, a semiconductor refrigeration plate 9 fixedly connected inside the partition plate 8, a temperature guiding block 10 fixedly connected to one side of the semiconductor refrigeration plate 9, and a heat dissipation component arranged on the other side of the semiconductor refrigeration plate 9, the heat dissipation component being used to increase the contact area between the heat dissipation surface of the semiconductor refrigeration plate 9 and the air. A water outlet pipe 6 is fixedly connected inside the top cover 3, a water pump 5 is fixedly connected to one end of the water outlet pipe 6, the input end of the water pump 5 is connected to the water outlet pipe 6, and the output end of the water pump 5 is connected to one end of the coil pipe 7. The other end of the coil pipe 7 is fixedly connected inside the top cover 3. The heat dissipation component includes a heat dissipation plate 12, heat dissipation columns 13, and a heat dissipation fan 14. The heat dissipation fan 14 is arranged inside the box body 2. The heat dissipation columns 13 are fixedly connected to one side of the heat dissipation plate 12 in a rectangular array. The heat dissipation plate 12 is fixedly connected to the other side of the semiconductor refrigeration plate 9;
[0031] Specifically, when the heat generated during the operation of the printing machine 1 is gradually conducted to the temperature guiding plate 4, at this time, the input end of the water pump 5 pumps out the cooling water stored inside the box body 2 through the connected water outlet pipe 6 and pumps it into the coil pipe 7 through the output end of the water pump 5, so that the cooling water can flow through the temperature guiding plate 4 and take away the accumulated heat on it. After passing through the temperature guiding plate 4, the cooling water flows back into the box body 2 through the coil pipe 7 again. At this time, the system starts to dissipate heat from the cooling water. The low temperature generated by the refrigerating surface of the semiconductor refrigeration plate 9 during operation is conducted to the temperature guiding block 10, thereby directly cooling the cooling water. At the same time, the heating surface of the semiconductor refrigeration plate 9 conducts heat to the outer wall of the heat dissipation column 13 through the heat dissipation plate 12, increasing its contact area with the air to improve the heat dissipation efficiency. In order to accelerate the dissipation of heat, the heat dissipation fan 14 blows the external air filtered by the dust-proof net 17 towards the outer wall of the heat dissipation column 13, thereby taking away the heat, and finally discharging the hot air out of the box body 2 through the heat dissipation port 11, so that the temperature of the entire system can be controlled within a reasonable range to ensure the normal operation of the printing machine 1.
[0032] Refer to Figure 3, a magnet 15 is fixedly connected inside the box body 2. The magnets 15 are arranged in a circular array and fixedly connected inside the box body 2. A fixing ring 18 is arranged on one side of the box body 2. A magnet 2 is fixedly connected inside the fixing ring 18. An installation ring 16 is arranged inside the fixing ring 18. A dust-proof net 17 is fixedly connected inside the installation ring 16. A sealing ring 20 is fixedly connected to one side of the fixing ring 18. One side of the sealing ring 20 is attached to the outer wall of the box body 2. A sealing ring 21 is fixedly connected to one side of the fixing ring 18. One side of the sealing ring 21 is attached to the outer wall of the installation ring 16. The magnets 2 are fixedly connected in a circular array inside the fixing ring 18. The magnet 2 adsorbs to the outer wall of the magnet 15;
[0033] Specifically, when the dust-proof net 17 needs to be cleaned or replaced, the operation is very simple. First, simply pull the fixing ring 18 off the box body 2 easily. This is due to the strong adsorption connection between the fixing ring 18 and the box body 2 through the magnet 2 and the magnet 15, ensuring stable connection during use and convenient disassembly. Next, after removing the dust-proof net 17 from the installation ring 16, it can be thoroughly cleaned or replaced. When reinstalling, effective sealing is achieved between the fixing ring 18 and the box body 2 through the sealing ring 20, further enhancing the stability and sealing of the connection. At the same time, the fixing ring 18 and the installation ring 16 are sealed through the sealing ring 21 to prevent dust from being sucked into the box body 2 through the gap when the cooling fan 14 is running, thus ensuring the cleanliness of the internal environment and avoiding dust pollution from affecting the heat dissipation effect of the equipment and the reliability of long-term operation.
[0034] Working principle: When using the heat dissipation device of this printing and packaging machine, first, the heat generated by the printing press 1 during operation is conducted to the heat conduction plate 4. Subsequently, the input end of the water pump 5 pumps out the cooling water inside the box body 2 through the water outlet pipe 6 and pumps it into the coil 7 through the output end of the water pump 5, so that the cooling water flows through the heat conduction plate 4 to take away the heat, and then returns to the box body 2 through the coil 7. When dissipating heat from the cooling water, the refrigerating surface of the semiconductor refrigeration plate 9 refrigerates and conducts the low temperature to the heat conduction block 10 and contacts and cools the cooling water. Subsequently, the heating surface of the semiconductor refrigeration plate 9 is conducted to the outer wall of the heat dissipation column 13 through the heat dissipation plate 12 to increase the contact area with the air. Subsequently, the cooling fan 14 blows the external air filtered by the dust-proof net 17 towards the outer wall of the heat dissipation column 13 for heat dissipation. Subsequently, the hot air is discharged from the box body 2 through the heat dissipation port 11. When the dust-proof net 17 needs to be cleaned or replaced, simply pull the fixing ring 18 directly off the box body 2. The fixing ring 18 is connected by fitting and adsorbing the magnet 2 to the magnet 15. Subsequently, the dust-proof net 17 can be removed through the installation ring 16 for cleaning. Subsequently, when installing, the fixing ring 18 and the box body 2 are sealed through the sealing ring 20, and the fixing ring 18 and the installation ring 16 are sealed through the sealing ring 21 to prevent dust from being sucked into the box body 2 through the gap when being sucked in by the cooling fan 14, causing pollution.
[0035] Finally, it should be noted that the above are only preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A heat dissipation device for a printing and packaging machine, comprising a printing press (1), characterized in that: One side of the printing press (1) is fixedly connected to a box body (2), the top of the box body (2) is fixedly connected to a top cover (3), a semiconductor refrigeration plate (9) is fixedly connected inside the box body (2), a temperature guiding plate (4) is fixedly connected to the top of the printing press (1), a coil pipe (7) is fixedly connected inside the temperature guiding plate (4), a heat dissipation port (11) is formed inside the box body (2), a partition plate (8) is fixedly connected inside the printing press (1), a semiconductor refrigeration plate (9) is fixedly connected inside the partition plate (8), a temperature guiding block (10) is fixedly connected to one side of the semiconductor refrigeration plate (9), and a heat dissipation assembly is arranged on the other side of the semiconductor refrigeration plate (9). The heat dissipation assembly is used to increase the contact area between the heat dissipation surface of the semiconductor refrigeration plate (9) and air. A water outlet pipe (6) is fixedly connected inside the top cover (3), one end of the water outlet pipe (6) is fixedly connected to a water pump (5), the input end of the water pump (5) is connected to the water outlet pipe (6), the output end of the water pump (5) is connected to one end of the coil pipe (7), and the other end of the coil pipe (7) is fixedly connected inside the top cover (3).
2. The heat dissipation device for a printing and packaging machine according to claim 1, wherein: The heat dissipation assembly includes a heat dissipation plate (12), heat dissipation columns (13) and a heat dissipation fan (14). The heat dissipation fan (14) is arranged inside the box body (2), the heat dissipation columns (13) are fixedly connected to one side of the heat dissipation plate (12) in a rectangular array, and the heat dissipation plate (12) is fixedly connected to the other side of the semiconductor refrigeration plate (9).
3. A heat dissipation device for a printing and packaging machine according to claim 1, characterized in that: A magnet one (15) is fixedly connected inside the box body (2), and the magnet one (15) is fixedly connected inside the box body (2) in an annular array.
4. A heat dissipation device for a printing and packaging machine according to claim 1, characterized in that: A fixing ring (18) is arranged on one side of the box body (2), and a magnet two (19) is fixedly connected inside the fixing ring (18).
5. The heat dissipation device for a printing and packaging machine according to claim 4, wherein: An installation ring (16) is arranged inside the fixing ring (18), and a dust-proof net (17) is fixedly connected inside the installation ring (16).
6. The heat dissipation device for a printing and packaging machine according to claim 4, wherein: A sealing ring one (20) is fixedly connected to one side of the fixing ring (18), and one side of the sealing ring one (20) is attached to the outer wall of the box body (2).
7. A heat dissipation device for a printing and packaging machine according to claim 4, characterized in that: A sealing ring two (21) is fixedly connected to one side of the fixing ring (18), and one side of the sealing ring two (21) is attached to the outer wall of the installation ring (16).
8. The heat dissipation device for a printing and packaging machine according to claim 4, characterized in that: The magnet two (19) is fixedly connected inside the fixing ring (18) in an annular array, and the magnet two (19) is adsorbed to the outer wall of the magnet one (15).