Chip transmission mechanism of chip test equipment

Abstract

The utility model relates to the technical field of chip testing, in particular to a chip transmission mechanism of chip testing equipment, which comprises an adsorption seat. The adsorption base is sequentially provided with a first movable plate, a second movable plate, a third movable plate and a fourth movable plate side by side. The rotating speed of the first belt wheel, the rotating speed of the second belt wheel, the rotating speed of the third belt wheel and the rotating speed of the fourth belt wheel are the same, and the radius of the third belt wheel is smaller than that of the first belt wheel, so that the moving speed of the first movable plate and the second movable plate located on the outer side is larger than that of the third movable plate and the fourth movable plate located on the inner side. By means of the arrangement, the first movable plate, the second movable plate, the third movable plate and the fourth movable plate can achieve the equal variable pitch function by controlling the rotating speed of the belt wheels, four chips can be conveyed at a time, and the working efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a chip transmission mechanism of chip testing equipment. Background Art

[0002] In the semiconductor industry, chip testing is one of the key steps to ensure product quality. During chip testing, the chips usually need to be taken out of the tray and placed in the testing mechanism for testing. Since the spacing of the chips in the tray is different from the spacing in the testing mechanism, it is necessary to change the spacing of two adjacent chips during chip transmission to adapt to different spacing requirements.

[0003] At present, the common chip variable-distance transmission in the industry adopts a method of transmitting only two chips at a time, and adjusting the distance between the two chips through a driving device; this method can only process two chips at a time, which limits the transmission efficiency. Utility Model Content

[0004] The utility model aims to provide a chip transmission mechanism of a chip testing device in view of the above-mentioned deficiencies in the prior art.

[0005] The purpose of the utility model is achieved through the following technical solutions: A chip transmission mechanism of a chip testing device comprises an adsorption seat; the adsorption seat is sequentially and side by side provided with a first movable plate, a second movable plate, a third movable plate and a fourth movable plate;

[0006] The first movable plate, the second movable plate, the third movable plate and the fourth movable plate are all provided with adsorption plates movably arranged in the height direction; the adsorption plates are provided with suction nozzles;

[0007] The adsorption seat is provided with a first synchronous belt and a second synchronous belt in the transverse direction; the adsorption seat is rotatably provided with a first pulley, a second pulley, a third pulley and a fourth pulley; the first pulley and the third pulley are coaxially driven; the second pulley and the fourth pulley are coaxially driven; the radius of the first pulley is the same as the radius of the second pulley; the radius of the third pulley is the same as the radius of the fourth pulley; the radius of the third pulley is smaller than the radius of the first pulley; the first synchronous belt is provided between the first pulley and the second pulley; the second synchronous belt is provided between the third pulley and the fourth pulley;

[0008] The first movable plate is connected to the bottom of the first synchronous belt; the second movable plate is connected to the bottom of the second synchronous belt; the third movable plate is connected to the top of the second synchronous belt; and the fourth movable plate is connected to the top of the first synchronous belt.

[0009] The present utility model is further configured such that the first movable plate, the second movable plate, the third movable plate, and the fourth movable plate are respectively provided with a first clamping block, a second clamping block, a third clamping block, and a fourth clamping block; the first movable plate is connected to the bottom of the first synchronous belt through the first clamping block; the second movable plate is connected to the bottom of the second synchronous belt through the second clamping block; the third movable plate is connected to the top of the second synchronous belt through the third clamping block; the fourth movable plate is connected to the top of the first synchronous belt through the fourth clamping block.

[0010] The present utility model is further configured such that the adsorption seat is provided with a variable pitch motor; the output end of the variable pitch motor is connected to the first pulley.

[0011] The present utility model is further configured such that the first movable plate, the second movable plate, the third movable plate, and the fourth movable plate are all provided with a suction motor, a suction slide rail arranged in the height direction, and a suction synchronous belt arranged in the height direction;

[0012] The suction motor is used to drive the suction synchronous belt to move; the adsorption plate is connected to the suction synchronous belt; the adsorption plate is slidably arranged on the suction slide rail.

[0013] The present utility model is further configured such that a protective cover is sleeved outside the adsorption seat.

[0014] The present utility model is further configured such that the chip transfer mechanism of the chip testing device further includes a lateral movement driving assembly for driving the adsorption seat to move laterally.

[0015] The present utility model is further configured such that the lateral movement driving assembly is a lateral linear module; the adsorption seat is arranged at the output end of the lateral linear module.

[0016] The present utility model is further configured such that the chip transfer mechanism of the chip testing device further includes a longitudinal movement driving assembly for driving the adsorption seat to move longitudinally.

[0017] The present utility model is further configured such that the longitudinal movement driving assembly is a longitudinal linear module; the lateral movement driving assembly is arranged at the output end of the longitudinal linear module.

[0018] The beneficial effects of the present utility model: By making the rotation speeds of the first pulley, the second pulley, the third pulley, and the fourth pulley the same, and since the radius of the third pulley is smaller than the radius of the first pulley, the moving speeds of the first movable plate and the second movable plate located on the outside are greater than the moving speeds of the third movable plate and the fourth movable plate located on the inside. Therefore, through the above settings, by controlling the rotation speed of the pulley, an equal variable pitch function can be realized among the first movable plate, the second movable plate, the third movable plate, and the fourth movable plate, so that four chips can be transferred at one time, greatly improving the working efficiency. Description of the Drawings

[0019] The utility model is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the utility model. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0020] Figure 1 It is a structural schematic diagram of the utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the utility model after the transverse drive component, the longitudinal drive component and the protective cover are hidden;

[0022] Figure 3 This is a schematic diagram of the structure of the utility model from another perspective after the transverse drive assembly, the longitudinal drive assembly and the protective cover are hidden;

[0023] Wherein: 1. adsorption seat; 11. variable pitch motor; 12. protective cover; 21. first movable plate; 22. second movable plate; 23. third movable plate; 24. fourth movable plate; 3. adsorption plate; 31. suction nozzle; 41. first pulley; 42. second pulley; 43. third pulley; 44. fourth pulley; 51. first synchronous belt; 52. second synchronous belt; 61. first clamping block; 62. second clamping block; 63. third clamping block; 64. fourth clamping block; 71. suction motor; 72. suction slide rail; 73. suction synchronous belt; 8. transverse drive assembly; 9. longitudinal drive assembly. DETAILED DESCRIPTION

[0024] The utility model is further described in conjunction with the following embodiments.

[0025] Depend on Figures 1 to 3 It can be seen that the chip transfer mechanism of a chip testing device described in this embodiment includes an adsorption seat 1; the adsorption seat 1 is sequentially and side by side provided with a first movable plate 21, a second movable plate 22, a third movable plate 23 and a fourth movable plate 24;

[0026] The first movable plate 21, the second movable plate 22, the third movable plate 23 and the fourth movable plate 24 are all provided with a suction plate 3 movably arranged in the height direction; the suction plate 3 is provided with a suction nozzle 31;

[0027] The adsorption seat 1 is provided with a first synchronous belt 51 and a second synchronous belt 52 in the transverse direction; the adsorption seat 1 is rotatably provided with a first pulley 41, a second pulley 42, a third pulley 43 and a fourth pulley 44; the first pulley 41 and the third pulley 43 are coaxially driven; the second pulley 42 and the fourth pulley 44 are coaxially driven; the radius of the first pulley 41 is the same as that of the second pulley 42; the radius of the third pulley 43 is the same as that of the fourth pulley 44; the radius of the third pulley 43 is smaller than that of the first pulley 41; the first synchronous belt 51 is arranged between the first pulley 41 and the second pulley 42; the second synchronous belt 52 is arranged between the third pulley 43 and the fourth pulley 44;

[0028] The first movable plate 21 is connected to the bottom of the first synchronous belt 51; the second movable plate 22 is connected to the bottom of the second synchronous belt 52; the third movable plate 23 is connected to the top of the second synchronous belt 52; the fourth movable plate 24 is connected to the top of the first synchronous belt 51.

[0029] Specifically, for the chip transmission mechanism of the chip testing equipment in this embodiment, since the first pulley 41, the second pulley 42, the third pulley 43 and the fourth pulley 44 rotate synchronously, that is, the rotation speeds of the first pulley 41, the second pulley 42, the third pulley 43 and the fourth pulley 44 are the same, and because the radius of the third pulley 43 is smaller than that of the first pulley 41, the moving speeds of the first movable plate 21 and the second movable plate 22 located on the outside are greater than the moving speeds of the third movable plate 23 and the fourth movable plate 24 located on the inside. Therefore, through the above settings, by controlling the rotation speed of the pulley, the first movable plate 21, the second movable plate 22, the third movable plate 23 and the fourth movable plate 24 can achieve an equal variable pitch function, so that four chips can be transmitted at one time, greatly improving the working efficiency.

[0030] For the chip transmission mechanism of a chip testing equipment in this embodiment, the first movable plate 21, the second movable plate 22, the third movable plate 23 and the fourth movable plate 24 are respectively provided with a first clamping block 61, a second clamping block 62, a third clamping block 63 and a fourth clamping block 64; the first movable plate 21 is connected to the bottom of the first synchronous belt 51 through the first clamping block 61; the second movable plate 22 is connected to the bottom of the second synchronous belt 52 through the second clamping block 62; the third movable plate 23 is connected to the top of the second synchronous belt 52 through the third clamping block 63; the fourth movable plate 24 is connected to the top of the first synchronous belt 51 through the fourth clamping block 64. Specifically, through the above settings, the first movable plate 21 and the second movable plate 22 are respectively firmly connected to the first synchronous belt 51; and the third movable plate 23 and the fourth movable plate 24 are respectively firmly connected to the second synchronous belt 52.

[0031] The chip transfer mechanism of a chip testing device according to this embodiment, the adsorption seat 1 is provided with a variable pitch motor 11; the output end of the variable pitch motor 11 is connected to the first pulley 41. Through the above settings, it is convenient to drive the first pulley 41 and the third pulley 43 to rotate.

[0032] The chip transfer mechanism of a chip testing device according to this embodiment, the first movable plate 21, the second movable plate 22, the third movable plate 23 and the fourth movable plate 24 are all provided with a suction motor 71, a suction slide rail 72 arranged in the height direction and a suction synchronous belt 73 arranged in the height direction; the suction motor 71 is used to drive the suction synchronous belt 73 to move; the adsorption plate 3 is connected to the suction synchronous belt 73; the adsorption plate 3 is slidably arranged on the suction slide rail 72.

[0033] Specifically, in this embodiment, through the above settings, by driving the suction synchronous belt 73 by the suction motor 71, the adsorption plate 3 can be driven to lift along the suction slide rail 72.

[0034] The chip transfer mechanism of a chip testing device according to this embodiment, a protective cover 12 is sleeved outside the adsorption seat 1. Through the above settings, the adsorption seat 1 can be protected.

[0035] The chip transfer mechanism of a chip testing device according to this embodiment, the chip transfer mechanism of the chip testing device further includes a lateral movement driving component 8 for driving the adsorption seat 1 to move laterally. The chip transfer mechanism of a chip testing device according to this embodiment, the lateral movement driving component is a lateral linear module; the adsorption seat 1 is arranged at the output end of the lateral linear module. Specifically, through the above settings, the adsorption seat 1 can perform lateral movement.

[0036] The chip transfer mechanism of a chip testing device according to this embodiment, the chip transfer mechanism of the chip testing device further includes a longitudinal movement driving component 9 for driving the adsorption seat 1 to move longitudinally. The chip transfer mechanism of a chip testing device according to this embodiment, the longitudinal movement driving component is a longitudinal linear module; the lateral movement driving component 8 is arranged at the output end of the longitudinal linear module. Specifically, through the above settings, the adsorption seat 1 can perform longitudinal movement; through cooperation with the lateral movement driving component 8, the chip can be driven to move on the carrier board in the testing mechanism.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. A chip transfer mechanism of a chip testing device, characterized in that: It comprises an adsorption seat; the adsorption seat is provided with a first movable plate, a second movable plate, a third movable plate and a fourth movable plate in sequence and side by side; The first movable plate, the second movable plate, the third movable plate and the fourth movable plate are all provided with adsorption plates movably arranged in the height direction; the adsorption plates are provided with suction nozzles; The adsorption seat is provided with a first synchronous belt and a second synchronous belt in the transverse direction; the adsorption seat is rotatably provided with a first pulley, a second pulley, a third pulley and a fourth pulley; the first pulley and the third pulley are coaxially driven; the second pulley and the fourth pulley are coaxially driven; the radius of the first pulley is the same as the radius of the second pulley; the radius of the third pulley is the same as the radius of the fourth pulley; the radius of the third pulley is smaller than the radius of the first pulley; the first synchronous belt is provided between the first pulley and the second pulley; the second synchronous belt is provided between the third pulley and the fourth pulley; The first movable plate is connected to the bottom of the first synchronous belt; the second movable plate is connected to the bottom of the second synchronous belt; the third movable plate is connected to the top of the second synchronous belt; and the fourth movable plate is connected to the top of the first synchronous belt.

2. The chip transfer mechanism of a chip testing device according to claim 1, wherein: The first movable plate, the second movable plate, the third movable plate and the fourth movable plate are respectively provided with a first clamping block, a second clamping block, a third clamping block and a fourth clamping block; the first movable plate is connected to the bottom of the first synchronous belt through the first clamping block; the second movable plate is connected to the bottom of the second synchronous belt through the second clamping block; the third movable plate is connected to the top of the second synchronous belt through the third clamping block; the fourth movable plate is connected to the top of the first synchronous belt through the fourth clamping block.

3. The chip transfer mechanism of a chip testing device according to claim 1, characterized in that: The adsorption seat is provided with a variable pitch motor; the output end of the variable pitch motor is connected to the first pulley.

4. The chip transfer mechanism of a chip testing device according to claim 1, characterized in that: The first movable plate, the second movable plate, the third movable plate and the fourth movable plate are all provided with a suction motor, a suction slide rail arranged along the height direction and a suction synchronous belt arranged along the height direction; The suction motor is used to drive the suction synchronous belt to move; the suction plate is connected with the suction synchronous belt; the suction plate is slidably arranged on the suction slide rail.

5. The chip transfer mechanism of a chip testing device according to claim 1, characterized in that: The adsorption seat outer shell is provided with a protective cover.

6. The chip transfer mechanism of a chip testing device according to claim 1, characterized in that: The chip transmission mechanism of the chip testing device further comprises a lateral movement driving component for driving the adsorption seat to move lateraly.

7. The chip transfer mechanism of a chip testing device according to claim 6, characterized in that: The transverse driving component is a transverse linear module; the adsorption seat is arranged at the output end of the transverse linear module.

8. The chip transfer mechanism of a chip testing device according to claim 6, characterized in that: The chip transmission mechanism of the chip testing device further comprises a longitudinal movement driving component for driving the adsorption seat to move longitudinally.

9. The chip transfer mechanism of a chip testing device according to claim 8, characterized in that: The longitudinal drive component is a longitudinal linear module; the transverse drive component is arranged at the output end of the longitudinal linear module.

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