Semiconductor packaging structure and selenium drum

Abstract

The utility model provides a semiconductor packaging structure and a selenium drum, the packaging structure comprises a substrate, and the substrate is provided with a plurality of bonding pads; an ASIC (Application Specific Integrated Circuit) chip, wherein the ASICS chip is welded on the substrate in an inverted manner; the MEMS sensor chip is attached to the top surface of the ASIC chip, and the MEMS sensor chip and the ASICS chip are directly bonded in a silicon melting mode; and the plastic package layer wraps the ASICS chip and the MEMS sensor chip, and blind holes are reserved in the positions of the connecting bumps of the ASICS chip and the MEMS sensor chip. According to the invention, the MEMS device and the ASIC chip are directly bonded, and the plastic package body is subjected to flip-chip bonding, so that the stability and air tightness of a packaged product are improved; the chip signal transmission efficiency and stability are improved, a plurality of packaging bodies do not need to be stacked after a single chip is packaged, the thickness and the size of a packaged finished product are greatly reduced, and the problem of electrical connection performance between the packaging bodies does not need to be considered.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and particularly to a semiconductor packaging structure and a toner cartridge. Background Art

[0002] In current chip products involving MEMS devices, 50% of the reliability problems of the MEMS system come from the packaging process. As the chip in the printing consumables industry depends more and more on MEMS devices, the frequent occurrence of reliability problems in chip products related to MEMS devices under the traditional packaging mode has become a key factor restricting the development of the printing consumables industry.

[0003] To solve the above problems, a semiconductor packaging structure and a toner cartridge are proposed. Summary of the Utility Model

[0004] To overcome the existing problems, this application provides a semiconductor packaging structure, including:

[0005] A substrate, on which a plurality of pads are provided;

[0006] An ASIC chip, which is flip-chip welded on the substrate, and the gap between the ASIC chip and the substrate is filled with underfill;

[0007] A MEMS sensor chip, attached to the top surface of the ASIC chip, and the MEMS sensor chip and the ASIC chip are directly bonded by silicon melting;

[0008] A plastic encapsulation layer, which encapsulates the ASIC chip and the MEMS sensor chip, and blind holes are reserved at the positions of the connection bumps of the ASIC chip and the MEMS sensor chip.

[0009] Preferably, the plastic encapsulation layer and the substrate are fitted by a metal frame.

[0010] Further, a plurality of grooves are provided at the bottom of the plastic encapsulation layer corresponding to the positions of the reserved blind holes, the underfill is injected into the grooves, and the gap between the connection bumps and the substrate is filled.

[0011] Further, the frame is located on the substrate, the plastic encapsulation layer is installed by fitting with the frame, the outer edge of the metal frame extends around to be a metal connection part, and the metal connection part is connected to the pads of the substrate.

[0012] Preferably, the distance between the bottom of the plastic encapsulation layer and the substrate is less than 0.5 μm.

[0013] Preferably, the connection bumps are copper pillars or solder balls.

[0014] On the other hand, the present application provides a toner cartridge, which includes a circuit board and the above-mentioned semiconductor packaging structure, and the semiconductor packaging structure is mounted on the circuit board.

[0015] As can be seen from the above technical solutions, compared with the prior art, the present utility model has at least the following advantages and positive effects:

[0016] The present application adopts the direct bonding method of MEMS sensor chip and ASIC chip, which has better temperature stability and airtightness compared with the traditional anodic bonding method used in the packaging of MEMS sensor chips; and the packaging product based on the MEMS sensor chip in the present application can achieve extremely accurate measurement and calculation of the remaining amount of toner after being applied to the toner cartridge; on the other hand, the present application adopts the packaging form of flip chip bonding combined with a frame, which greatly reduces the connection path length between the chip and the substrate, improves the efficiency and stability of chip signal transmission, and at the same time introduces a frame to assist in positioning and packaging the overall chip group structure, eliminating the need to stack multiple packages after packaging individual chips, greatly reducing the thickness and volume of the packaging finished product, and also eliminating the need to consider the electrical connection performance problems between the packages. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present utility model will be further described below with reference to the drawings and embodiments.

[0018] Figure 1 FIG. is an overall structural schematic diagram of the semiconductor packaging structure provided for Embodiment 1;

[0019] Figure 2 and 3 is a top view of the semiconductor packaging structure provided for Embodiment 2 Figure 1 in;

[0020] Figure 4 is a front view of the substrate of the semiconductor packaging structure provided for Embodiment 3 Figure 1 in. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] Embodiment 1:

[0022] This embodiment gives an overall structural schematic diagram of the semiconductor packaging structure, as Figure 1 shown, including a substrate 10, a MEMS sensor chip 20, an ASIC chip 30, a plastic encapsulation layer 40, a metal frame 50, an underfill 60, a pad 101, and solder balls 301.

[0023] The substrate 10 is provided with a plurality of pads 101;

[0024] The ASIC chip 30 is flip-chip soldered on the substrate 10, and the gap between the ASIC chip 30 and the substrate 10 is filled with an underfill 60;

[0025] The MEMS sensor chip 20 can adopt a MEMS microfluidic chip, and one of its functions is to accurately detect and calculate the remaining toner amount in the toner cartridge.

[0026] The MEMS sensor chip 20 is attached to the top surface of the ASIC chip 30, and the MEMS sensor chip 20 and the ASIC chip 30 are directly bonded by silicon melting;

[0027] The plastic encapsulation layer 40 wraps the ASIC chip 30 and the MEMS sensor chip 20, and blind holes are reserved at the positions of the connection bumps of the ASIC chip 30 and the MEMS sensor chip 20.

[0028] Preferably, the encapsulant in the plastic encapsulation layer 40 can be epoxy resin.

[0029] Preferably, the plastic encapsulation layer 40 and the substrate 10 are fitted together by a metal frame 50.

[0030] Furthermore, several grooves are provided at the bottom of the plastic encapsulation layer 40 corresponding to the positions of the reserved blind holes, and the bottom filling adhesive 60 is injected into the grooves and fills the gap between the connection bumps and the substrate.

[0031] Furthermore, the metal frame 50 is located on the substrate 10, the plastic encapsulation layer 40 is installed by fitting with the metal frame 50, the outer edge of the metal frame 50 extends around to be metal connection components 501, and the metal connection components 501 are connected to the pads 101 of the substrate.

[0032] Preferably, the distance between the bottom of the plastic encapsulation layer and the substrate is 0.4 μm.

[0033] Preferably, the connection bumps are solder balls 301.

[0034] Example 2:

[0035] This example gives Figure 1 a top view of the semiconductor packaging structure in Figure 2 as shown, including a substrate 10, a metal frame 50, pads 101, and metal connection components 501.

[0036] The outer edge of the metal frame 50 extends around to be metal connection components 501, and the metal connection components 501 are connected to the pads 101 of the substrate 10.

[0037] Preferably, the metal frame 50 is integrally formed by an etching or semi-etching method combined with a numerical control program. The number of the pads 101 can be increased according to the actual need to firmly fix the plastic encapsulation layer, as Figure 3 shown.

[0038] Embodiment 3:

[0039] This embodiment gives Figure 1 A front view of a substrate of a semiconductor package structure, such as Figure 3 As shown, the substrate 10 includes a pad 101 , a circuit layer 102 , a packaging unit 103 , and a substrate 104 .

[0040] The packaging unit 103 and the substrate 10 are surrounded by pads 101. The packaging unit 103 is divided by horizontal and vertical marking cutting lines that cover the circuit layer 102. Figure 1 The plastic encapsulation layer 40 and the substrate 10 are formed as the minimum cutting unit of the packaging process. The plastic encapsulation layer 40 and the substrate 10 can be cut according to the minimum cutting unit or several minimum cutting units according to actual needs to form the final toner cartridge chip packaging product. When the toner cartridge chip packaging product includes several packaging units 103, the conductive pin groups of the ASIC chip and the MEMS sensor chipset in the packaging unit 103 go down into the circuit layer 102 through the pads in the respective packaging units 103, and complete the circuit routing wiring in the circuit layer, that is, the ASIC chip and the MEMS sensor chipset are electrically connected and communicated through the circuit layer 102.

[0041] Furthermore, the substrate 104 may be an organic substrate or an inorganic substrate, such as a glass substrate, a ceramic substrate, etc.

[0042] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. A semiconductor package structure, characterized in that, include: A substrate, wherein a plurality of pads are provided on the substrate; An ASIC chip, wherein the ASIC chip is flip-chip soldered on the substrate, and a gap between the ASIC chip and the substrate is filled with bottom filling glue; A MEMS sensor chip is attached to the top surface of the ASIC chip, and the MEMS sensor chip and the ASIC chip are directly bonded by silicon melting; A plastic encapsulation layer, wherein the plastic encapsulation layer encapsulates the ASIC chip and the MEMS sensor chip, and blind holes are reserved at the positions of the connection bumps of the ASIC chip and the MEMS sensor chip.

2. The semiconductor package structure according to claim 1, wherein The plastic sealing layer and the substrate are embedded through a metal frame.

3. The semiconductor package structure according to claim 1, wherein A plurality of grooves are arranged at the bottom of the plastic encapsulation layer corresponding to the positions of the reserved blind holes, and the bottom filling glue is injected into the grooves to fill the gaps between the connecting bumps and the substrate.

4. The semiconductor package structure according to claim 2, wherein, The frame is located on the substrate, the plastic sealing layer is installed in contact with the frame, and the outer edge of the metal frame extends in all directions to form a metal connecting component, and the metal connecting component is connected to the pad of the substrate.

5. The semiconductor package structure according to claim 3, wherein The distance between the bottom of the plastic packaging layer and the substrate is less than 0.5 μm.

6. The semiconductor package structure according to claim 1 or 3, wherein The connecting bumps are copper pillars or solder balls.

7. A toner cartridge, characterized in that: The toner cartridge comprises a circuit board and a semiconductor package structure as claimed in any one of claims 1 to 6, wherein the semiconductor package structure is mounted on the circuit board.

Images