Spraying plate and spraying head
By designing turbulent trenches and non-radial ventilation holes on the shower head, the problems of particle shedding and film defects in traditional shower head design are solved, and the uniformity of the film and the accuracy of the semiconductor manufacturing process are improved.
Patent Information
- Application Number
- CN202421934001.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-09
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-09
AI Technical Summary
Traditional spray head designs can easily lead to particle shedding and film defects during thin film deposition, affecting the electrical performance and reliability of the wafer.
A spray plate is designed with multiple turbulent grooves and non-radially distributed ventilation holes to form turbulent airflow to reduce particle shedding and prevent chemical reactions through precoating to improve film flatness.
Effectively reduce the fall of particles on the surface of the shower head, improve the flatness of the film, improve the uniformity of the deposited film and the accuracy of the semiconductor manufacturing process.
Smart Images
Figure CN223087906U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a shower plate and a shower head. Background Art
[0002] In the process of semiconductor manufacturing, the uniformity and quality of the thin film deposited on the wafer directly affect the performance of the final product. As an important component in the thin film deposition equipment, the main function of the shower head is to distribute process gases to form a uniform thin film on the wafer surface. Traditional shower head designs usually adopt a porous structure flat panel, and the holes on these panels are arranged in a circular pattern or a triangular pattern. However, this traditional shower head design has some limitations.
[0003] During the thin film deposition process, due to the action of air flow, the pre - coating on the surface of the shower head may fall off and form particles. These particles will contaminate the wafer surface and affect the thin film quality. In addition, due to the uniform distribution of the holes on the surface of the shower head, defects such as a cross - shaped mark or a striped mark may appear on the thin film deposited on the wafer surface, and these defects will affect the electrical performance and reliability of the wafer.
[0004] In order to overcome the above - mentioned defects existing in the prior art, there is an urgent need in the art for a shower plate to change the flow state of the flow field on the surface of the shower head, so as to reduce the particle shedding on the surface of the shower head and improve the flatness of the thin film, thereby improving the precision of the semiconductor manufacturing process. Summary of the Utility Model
[0005] The following gives a brief overview of one or more aspects to provide a basic understanding of these aspects. This overview is not an exhaustive survey of all contemplated aspects, and is neither intended to identify key or decisive elements of all aspects nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to a more detailed description to follow.
[0006] In order to overcome the above - mentioned defects existing in the prior art, the utility model provides a shower plate and a shower head, which are used to change the flow state of the flow field on the surface of the shower head, so as to reduce the particle shedding on the surface of the shower head and improve the flatness of the thin film, thereby improving the precision of the semiconductor manufacturing process.
[0007] Specifically, the shower plate provided according to the first aspect of the utility model includes a first surface facing the process chamber; and a second surface facing the air inlet of the shower head. Wherein, a plurality of turbulent grooves are provided on the second surface, and a plurality of ventilation holes are provided in the channels of each turbulent groove structure. The plurality of ventilation holes are non - radially distributed and are arranged in the channels of each turbulent groove structure. Among them, the ventilation holes are non - radially distributed to avoid dense hole distribution in the same radial direction.
[0008] Furthermore, in some embodiments of the present utility model, the multiple turbulent flow grooves are distributed in the form of concentric circles, parallel lines or grids, and / or the multiple vent holes are distributed in the form of spiral lines, concentric circles or triangles.
[0009] Furthermore, in some embodiments of the present utility model, the multiple vent holes are distributed in the form of spiral lines. Among them, the multiple spiral lines start from the center point of the second surface, are distributed at preset angular intervals and / or width intervals, and extend in the clockwise or counterclockwise direction.
[0010] Furthermore, in some embodiments of the present utility model, a pre-coating layer is further provided on the second surface and / or in each of the vent holes. Among them, the pre-coating layer includes an oxide film and / or a fluoride film, which is used to prevent the reaction gas introduced into the process chamber from chemically reacting with the material of the spray plate.
[0011] Furthermore, in some embodiments of the present utility model, the pre-coating layer has an upper limit of impact force corresponding to its service life, and the depth of each of the turbulent flow grooves is not less than the lower limit of the depth corresponding to the upper limit of the impact force.
[0012] Furthermore, in some embodiments of the present utility model, the ratio of the depth to the width of each of the turbulent flow grooves is 2:1.
[0013] Furthermore, in some embodiments of the present utility model, a first depth of each of the turbulent flow grooves in the central region of the second surface is less than a second depth of each of the turbulent flow grooves in the edge region of the second surface.
[0014] Furthermore, in some embodiments of the present utility model, the vent hole is at least one of a straight hole, a stepped hole and a flared hole.
[0015] In addition, the spray head provided according to the second aspect of the present utility model includes: a spray plate as described in the first aspect of the present utility model; and a spray upper cover, which is provided with an air inlet and is located above the spray plate. Among them, the spray upper cover and the spray plate enclose a gas mixing chamber. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] After reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings, the above features and advantages of the present utility model can be better understood. In the drawings, the components are not necessarily drawn to scale, and components with similar related characteristics or features may have the same or similar reference numerals.
[0017] Figure 1A The structural schematic diagram of the spray plate provided according to some embodiments of the present utility model is shown.
[0018] Figure 1B Shows a schematic cross-sectional view of a spray plate provided according to some embodiments of the present invention.
[0019] Figures 2A to 2C Shows a schematic distribution view of turbulent grooves provided according to some embodiments of the present invention.
[0020] Figure 3 Shows a schematic distribution view of ventilation holes provided according to some embodiments of the present invention.
[0021] Figure 4 Shows a schematic distribution view of ventilation holes provided according to some embodiments of the present invention.
[0022] Figure 5 Shows a schematic flow chart of a preparation method of a spray plate provided according to some embodiments of the present invention.
[0023] Figure 6 Shows a schematic flow chart of a processing method of a spray plate provided according to some embodiments of the present invention.
[0024] Figure 7A Shows a schematic velocity simulation diagram of a spray plate without turbulent grooves provided according to some embodiments of the present invention.
[0025] Figure 7B Shows a schematic velocity simulation diagram of a spray plate with turbulent grooves provided according to some embodiments of the present invention.
[0026] Figure 8A Shows a schematic particle distribution diagram of the pre-coated layer peeling off of the cross-shaped ventilation holes in some embodiments.
[0027] Figure 8B Shows a schematic particle distribution diagram of the pre-coated layer peeling off of the spiral ventilation holes provided according to some embodiments of the present invention.
[0028] Figure 9A Shows a schematic film thickness distribution diagram of the cross-shaped ventilation holes in some embodiments.
[0029] Figure 9B Shows a schematic film thickness distribution diagram of the spiral ventilation holes provided according to some embodiments of the present invention.
[0030] Reference numerals:
[0031] 10 Turbulent grooves
[0032] 20 Ventilation holes Detailed implementation manners
[0033] The following specific embodiments illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. Although the description of the present utility model will be introduced in combination with preferred embodiments, this does not mean that the features of this utility model are limited to this implementation manner. On the contrary, the purpose of introducing the utility model in combination with the implementation manner is to cover other alternatives or modifications that may be extended based on the claims of the present utility model. In order to provide a deep understanding of the present utility model, many specific details will be included in the following description. The present utility model can also be implemented without using these details. In addition, in order to avoid confusing or obscuring the key points of the present utility model, some specific details will be omitted in the description.
[0034] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0035] In addition, the "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the orientations shown in this paragraph and the related drawings. This relative term is only for the convenience of description, and it does not mean that the device described needs to be manufactured or operated in a specific orientation, so it should not be construed as a limitation to the present utility model.
[0036] It can be understood that although terms such as "first", "second", "third", etc. can be used here to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below can be called the second component, region, layer and / or part without departing from some embodiments of the present utility model.
[0037] As mentioned above, in the semiconductor manufacturing process, the uniformity and quality of the thin film deposited on the wafer directly affect the performance of the final product. As an important component in the thin film deposition equipment, the main function of the showerhead is to distribute process gases to form a uniform thin film on the wafer surface. The traditional showerhead design usually adopts a porous structure flat panel, and the holes on these panels are arranged in a circular pattern or a triangular pattern. However, this traditional showerhead design has some limitations.
[0038] During the thin film deposition process, due to the action of the gas flow, the pre-coating on the surface of the showerhead may fall off and form particles. These particles will contaminate the surface of the wafer and affect the quality of the thin film. In addition, due to the uniform distribution of the holes on the surface of the showerhead, the thin film deposited on the surface of the wafer may have defects such as a cross-shaped mark or a striped mark, which will affect the electrical performance and reliability of the wafer.
[0039] In order to overcome the above-mentioned defects existing in the prior art, the present utility model particularly provides a shower plate and a showerhead for changing the flow state of the flow field on the surface of the showerhead, so as to reduce the particle shedding on the surface of the showerhead and improve the flatness of the thin film, thereby improving the precision of the semiconductor manufacturing process.
[0040] In some non-limiting embodiments, the shower plate provided in the first aspect of the present utility model can be configured in the showerhead provided in the second aspect of the present utility model. The showerhead further includes a shower upper cover provided with an air inlet and located above the shower plate. Among them, the shower upper cover and the shower plate enclose a mixing cavity.
[0041] For details, please refer to Figures 1A to 1B 、 Figures 2A to 2C , Figure 1A FIG. Figure 1B shows a schematic structural view of a shower plate provided according to some embodiments of the present utility model. Figures 2A to 2C FIG.
[0042] As Figures 1A to 1B shown, the shower plate includes a first surface facing the process chamber and a second surface facing the air inlet of the showerhead. Here, a plurality of turbulent flow grooves 10 and a plurality of ventilation holes 20 are provided on the second surface. The plurality of ventilation holes 20 are non-radially distributed and are provided in each turbulent flow groove 10, so as to avoid dense hole distribution in the same radial direction, thereby forming thin films with different thicknesses.
[0043] As Figures 2A to 2C shown, the plurality of turbulent flow grooves 10 can be distributed in the form of concentric circles, parallel lines or grids, which are used to improve the air flow condition when the gas contacts the showerhead, make the gas form a turbulent flow, and prevent the pre-coating from falling off. Optionally, the grooves can also be formed by other regular distribution forms according to actual needs, and the ventilation holes 20 are also non-radially distributed in each turbulent flow groove 10, so as to achieve the same technical effect.
[0044] Please refer to Figure 3 , Figure 3 FIG.
[0045] Multiple vent holes 20 can be distributed in the form of a helix, concentric circles, or triangles. In an embodiment such as Figure 3 , the multiple vent holes 20 are distributed in the form of a helix. Multiple helical lines start from the center point of the second surface, are distributed at a preset angular interval and / or width interval, and extend in a clockwise or counterclockwise direction. Here, the preset angle can be 5° or 10°, etc. The width interval can be 5 mm or 10 mm, etc.
[0046] Furthermore, the vent hole 20 can be at least one of a straight hole, a stepped hole, and a flared hole. These three hole types can be changed according to different process requirements. For example, when the flow rate of the straight hole is too small, stepped holes, flared holes, etc. can be used to increase the single-hole flow rate to meet the overall process flow rate requirements.
[0047] In some other embodiments, a pre-coating is further provided on the second surface and / or in each vent hole 20. The pre-coating includes an oxide film and / or a fluoride film, which is used to prevent the reaction gas introduced into the process chamber from chemically reacting with the material of the shower plate. The pre-coating has an upper limit of impact force corresponding to its service life, and the depth of each turbulent groove 10 is not less than the lower limit of the depth corresponding to the upper limit of the impact force, so as to prevent the pre-coating from falling off due to impact during the flow of the reaction gas.
[0048] Please refer to Figure 4 , Figure 4 , which shows a schematic diagram of the distribution of the vent holes provided according to some embodiments of the present invention.
[0049] As Figure 4 shown, the ratio of the depth H (for example, 10 mm) to the width W (for example, 5 mm) of each turbulent groove 10 is preferably 2:1, or other ratios can be selected according to actual needs. Further, the first depth of each turbulent groove 10 in the central region of the second surface is less than the second depth of each turbulent groove 10 in the edge region of the second surface.
[0050] Please refer to Figure 5 , Figure 5 , which shows a schematic flow chart of the preparation method of the shower plate provided according to some embodiments of the present invention.
[0051] As Figure 5As shown, the preparation equipment of the spray plate can first rough-turn the base blank of the spray plate to obtain the first spray plate. Then, through vertical machining, a groove structure is prepared on the first spray plate to obtain the second spray plate. According to the thermal expansion coefficient of the spray plate and the gap between it and the adjacent components, the tolerance between the external dimensions of the spray plate and the adjacent components is determined, and based on the preset tolerance, the second spray plate is precision-turned to obtain the third spray plate. Finally, according to the preset drilling trajectory, drilling depth, and drilling diameter, the third spray plate is horizontally machined to prepare ventilation holes 20 on the third spray plate. At this time, the first depth of each turbulent flow groove 10 on the second surface of the spray plate in the central region is equal to the second depth in the edge region.
[0052] Further, after the spray plate is prepared and before it is used, the spray plate also needs to be processed and corrected to improve the uniformity of the deposited thin film.
[0053] Please refer to Figure 6 , Figure 6 which shows a schematic flow chart of the processing method of the spray plate provided by some embodiments of the present invention.
[0054] As Figure 6 shown, the processing equipment of the spray plate can first install the spray plate above the process chamber. Then, through the spray plate, process gas is sprayed onto the wafer sample in the process chamber to deposit a thin film on its surface. After that, the wafer sample is detected to determine the first thin film thickness in its central region and the second thin film thickness in its edge region. According to the difference between the first thin film thickness and the second thin film thickness, the corresponding correction value is determined; and according to the correction value, the depth of the turbulent flow groove 10 in the central region or the edge region of the second surface is increased to correct the thickness difference of the prepared thin film between the central region and the edge region.
[0055] Here, the thickness of the spray plate is a fixed value, the ventilation holes 20 are located at the bottom of the grooves, and the length of the ventilation holes 20 shortens as the grooves deepen, resulting in a smaller flow resistance and a larger flow rate. In response to too low a flow rate in the central region, the depth of the grooves in the central region is increased, and in response to too low a flow rate in the edge region, the depth of the grooves in the edge region is increased, thereby correcting the thickness difference of the thin film.
[0056] Those skilled in the art can understand that applying the processing method of the spray plate to the use process of the spray plate is only a preferred embodiment provided by this application, and is not used to limit all implementation manners of the processing method of the spray plate.
[0057] In some other embodiments, after the equipment cavity is reinstalled, due to the change in the relative position, the parameters adjusted before the cavity opening will change, resulting in the unevenness of the generated film thickness again. Therefore, after the equipment cavity is reinstalled, the spray plate can be adjusted again through the processing method of the spray plate, so as to eliminate the equipment error after reinstallation.
[0058] Please refer to Figures 7A to 7B and Figures 8A to 8B , Figure 7A which shows a flow velocity simulation schematic diagram of a non-turbulent groove spray plate provided according to some embodiments of the present invention. Figure 7B which shows a flow velocity simulation schematic diagram of a turbulent groove spray plate provided according to some embodiments of the present invention. Figure 8A which shows a schematic diagram of the particle distribution of the pre-coating shedding of the cross-shaped ventilation holes in some embodiments. Figure 8B which shows a schematic diagram of the particle distribution of the pre-coating shedding of the spiral ventilation holes provided according to some embodiments of the present invention.
[0059] As Figures 7A to 7B shown, when the spray plate has no groove structure, the reaction gas directly contacts the surface of the spray head without any damping or shielding. Correspondingly, when the spray plate has a groove structure, part of the reaction gas forms turbulence due to contacting the grooves. Further, by comparing the simulation results, it can be known that in the case of having grooves, the velocity vectors between the second surface of the spray head and the wafer are relatively sparse. Thus, it can be seen that the groove design can be used to change the flow state of the flow field on the surface of the spray head, so as to reduce the overall outflow velocity of the gas.
[0060] As Figures 8A to 8B shown, in the embodiment of the present invention provided with the turbulent grooves 10 and the spiral ventilation holes 20, compared with the ventilation holes 20 distributed in a cross shape in the prior art, the particles of the pre-coating shedding are significantly reduced, thereby improving the level of the semiconductor manufacturing process.
[0061] In addition, please refer to Figures 9A to 9B , Figure 9A which shows a schematic diagram of the film thickness distribution of the cross-shaped ventilation holes in some embodiments. Figure 9B which shows a schematic diagram of the film thickness distribution of the spiral ventilation holes provided according to some embodiments of the present invention.
[0062] As Figures 9A to 9BAs shown, the holes in the same radial direction of the cross-shaped pattern are densely distributed to form a corresponding thin film pattern, and the regular spiral distribution can avoid uneven hole distribution and thus change the gas outflow position. It can be seen from this simulation schematic diagram that the design of the turbulent groove 10 and the spiral ventilation hole 20 can effectively improve the defect of strip-shaped mutation of the thin film thickness compared with the cross-shaped ventilation hole 20 in the prior art, and effectively improve the uniformity of the deposited thin film.
[0063] In summary, the spray plate, spray head, processing method of the spray plate, and computer-readable storage medium provided by the present utility model can be used to change the flow state of the flow field on the surface of the spray head, thereby reducing the particle detachment on the surface of the spray head, improving the level of semiconductor manufacturing technology, and improving the defect of strip-shaped mutation of the thin film thickness, and improving the uniformity of the deposited thin film.
[0064] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions not illustrated and described herein but understood by those skilled in the art.
[0065] The foregoing description of the disclosure has been provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A spray plate, characterized in that, Comprising: A first surface facing the process chamber; And A second surface facing the showerhead inlet, wherein a plurality of turbulent grooves and a plurality of ventilation holes are provided on the second surface, the plurality of ventilation holes are non-radially distributed, and are provided in each of the turbulent grooves.
2. The shower plate according to claim 1, characterized in that, The plurality of turbulent grooves are distributed in the form of concentric circles, parallel lines or grids, and / or The plurality of ventilation holes are distributed in the form of spiral lines, concentric circles or triangles.
3. The shower plate according to claim 2, wherein The plurality of ventilation holes are distributed in the form of spiral lines, wherein the plurality of spiral lines start from the center point of the second surface, are distributed at a preset angular interval and / or width interval, and extend in a clockwise or counterclockwise direction.
4. The spray plate according to claim 1, wherein A pre-coating is further provided on the second surface and / or in each of the ventilation holes, wherein the pre-coating includes an oxide film and / or a fluoride film, and is used to prevent the reaction gas introduced into the process chamber from chemically reacting with the material of the shower plate.
5. The shower plate according to claim 4, characterized in that, The pre-coating has an upper limit of impact force corresponding to its service life, and the depth of each of the turbulent grooves is not less than the lower limit of depth corresponding to the upper limit of impact force.
6. The shower plate according to claim 4, wherein, The ratio of the depth to the width of each of the turbulent grooves is 2:
1.
7. The shower plate according to claim 1, characterized in that, The first depth of each of the turbulent grooves in the central region of the second surface is less than the second depth of each of the turbulent grooves in the edge region of the second surface.
8. The shower plate according to claim 1, characterized in that, The ventilation hole is at least one of a straight hole, a stepped hole and a flared hole.
9. A shower head, characterized in that, Comprising: The shower plate according to any one of claims 1 to 8; And A shower upper cover, provided with an air inlet and located above the shower plate, wherein the shower upper cover and the shower plate enclose a mixing chamber.