Valve assembly for integrated piezoelectric pump

Abstract

The utility model relates to a valve assembly for an integrated piezoelectric pump, which belongs to the technical field of piezoelectric pumps, solves the problems of larger volume and insufficient integration level in the prior art, and comprises a first fixing plate, an elastic film layer and a second fixing plate which are sequentially assembled from top to bottom, the first fixing plate, the elastic film layer and the second fixing plate are contained in a space defined by the side wall; the PCB bottom plate is fixed at the bottom of the side wall; wherein the side wall and the PCB bottom plate have the same peripheral size and peripheral shape; the thickness of the side wall is larger than the total thickness of the first fixing plate, the elastic film layer and the second fixing plate. The first fixing plate, the elastic film layer and the side wall are combined to form a normally-closed valve and a normally-open valve.

Description

Technical Field

[0001] The utility model relates to the technical field of piezoelectric pumps, in particular to a valve assembly for an integrated piezoelectric pump. Background Art

[0002] As a micro device with strong multi-disciplinary coupling of materials, structures, fluids, electronics, and processes, the micro piezoelectric pump has the advantages of small size, low power consumption, high specific back pressure, large specific flow rate, high-speed response, high flow accuracy, etc. It has a wide application space in the fields of medical devices and semiconductor thermal management, and is particularly suitable for the applications of wearable and portable medical devices and ultra-thin micro-space heat dissipation management applications.

[0003] The valve body in the micro piezoelectric pump is an important part of the micro piezoelectric pump. The valve body in the piezoelectric micro pump is one of the core components to realize its functions, which has a direct impact on the performance of the system. The functions of the valve in the piezoelectric micro pump include: accurately controlling the flow rate and flow direction of the fluid, isolating the pump chamber, preventing the fluid from flowing back into the pump chamber, and providing pressure control inside the pump body. Such micro pumps are usually applied to scenarios of microfluidic manipulation, such as biochips, microfluidic devices, etc.

[0004] At present, the conventional piezoelectric pumps in this field need to be provided with an externally connected high-voltage drive circuit, and this externally connected high-voltage drive circuit usually has a large shape, resulting in a large overall volume of the components of the piezoelectric pump, insufficient integration of the piezoelectric pump, and being not conducive to being applied in small wearable devices (such as smart watches).

[0005] Therefore, there is a need in this technical field for a valve structure for a piezoelectric pump that provides high integration for integrated control, precise pumping ability, and improves the space benefit of downstream applications. Summary of the Utility Model

[0006] In order to solve the above problems of the prior art, the utility model provides a valve assembly for an integrated piezoelectric pump, which integrates the driving IC and the algorithm IC on a high-integration driving valve body structure, reduces the volume of the traditional piezoelectric pump body, greatly reduces the overall area and volume of the mechanical and electronic overall solutions, improves the space benefit of downstream users, and is conducive to high-integration requirements.

[0007] A valve assembly for an integrated piezoelectric pump provided according to an embodiment of the utility model includes:

[0008] A first fixing plate, an elastic film layer, and a second fixing plate assembled in sequence from top to bottom;

[0009] Side walls, the space enclosed by which houses the first fixing plate, the elastic film layer, and the second fixing plate;

[0010] A PCB bottom plate, which is fixed to the bottom of the side walls;

[0011] Wherein, the side wall and the PCB bottom plate have the same outer peripheral dimensions and outer peripheral shapes;

[0012] Wherein, the thickness of the side wall is greater than the total thickness of the first fixing plate, the elastic film layer and the second fixing plate; and

[0013] Wherein, the first fixing plate, the elastic film layer and the side wall are combined to form a normally closed valve and a normally open valve.

[0014] Optionally, the first fixing plate is formed with a normally closed hole and a first avoidance opening; the elastic film layer includes a first deformation part corresponding to the normally closed hole of the first fixing plate, and a second deformation part corresponding to the first avoidance opening of the first fixing plate; the second fixing plate is formed with a transmission avoidance opening corresponding to the first deformation part of the elastic film layer, and a second avoidance opening corresponding to the first avoidance opening of the first fixing plate; wherein, the normally closed hole of the first fixing plate and the first deformation part of the elastic film layer constitute the normally closed valve.

[0015] Optionally, the first deformation part of the elastic film layer includes an occlusion part in a solid area and a plurality of film holes surrounding the occlusion part, wherein the area of the occlusion part is larger than the area of the normally closed hole; the second deformation part of the elastic film layer is a solid area, and its area is larger than the area of the first avoidance opening of the first fixing plate; the area of the transmission avoidance opening of the second fixing plate is larger than the area of the first deformation part.

[0016] Optionally, the occlusion part of the first deformation part of the elastic film layer is circular; each film hole of the first deformation part is fan-shaped.

[0017] Optionally, the elastic film layer and the second fixing plate have the same shape and size, and the length and width of the first fixing plate are greater than the length and width of the elastic film layer and the second fixing plate.

[0018] Optionally, the side wall is a multi-layer stepped structure surrounded by four side walls to form a hollow opening, including from top to bottom: a first stepped wall forming a first opening, the shape and size of the first opening being consistent with those of the first fixing plate; a second stepped wall forming a second opening, the length and width of the second opening being smaller than the length and width of the first opening; and a third stepped wall forming a third opening, the length and width of the third opening being smaller than the length and width of the second opening.

[0019] Optionally, the side wall includes a boss extending inwards from one side of the third stepped wall, and the thickness of the boss is less than that of the third stepped wall. A boss transfer hole extending downwards from its upper surface is formed in the boss, and the position of the boss transfer hole corresponds to the second deformation part of the elastic film layer; a side wall outlet is formed on the side of the side wall where the boss is provided, one end of the side wall outlet communicates with the boss transfer hole in the boss, and the other end communicates with the outside of the side wall; wherein the second deformation part of the elastic film layer and the boss transfer hole of the boss constitute the normally open valve.

[0020] Optionally, a power supply unit and a control unit are provided on the PCB bottom plate, and a bottom plate hole penetrating through the PCB bottom plate is provided.

[0021] Optionally, two conductive through holes are formed in the side wall, which are respectively electrically connected to the power supply unit of the PCB bottom plate.

[0022] Optionally, the outer peripheral shapes of the side wall and the PCB bottom plate are rectangular or circular.

[0023] Compared with the prior art, a valve assembly for an integrated piezoelectric pump provided by the present utility model has at least the following beneficial effects:

[0024] 1. By adopting the integrated design of microelectronics and micromechanics, the chip and the driving device are arranged inside the valve assembly, that is, on the PCB bottom plate, optimizing the internal structure distribution, reducing the volume of the piezoelectric pump body, simplifying the assembly steps and improving the overall integration degree of the system, thereby greatly reducing the overall shape of the mechanical and electronic overall solution, and greatly reducing the downstream application development cycle, and improving the space benefit of downstream users.

[0025] 2. In the valve assembly, by including a conductive through hole structure that penetrates up and down, the number of components can be effectively reduced, a compact, efficient and reliable power supply and control method can be realized, the structural size can be reduced, and the valve assembly can be applied to more application scenarios.

[0026] 3. Using the side wall as a three-dimensional circuit path to supply power to the piezoelectric pump, the piezoelectric micropump design with the driving circuit integrated on the valve assembly, the driving circuit and the micropump structure are compactly integrated. The integrated multiple I / O ports can supply power to and communicate with the piezoelectric pump after receiving signals. Integrating the circuit path in the side wall not only reduces the volume and has high space utilization rate, but also reduces external interference, optimizes the flow path layout, and can also reduce external wiring, which is beneficial to improving the reliability and portability of the system, and is suitable for microfluidic applications with limited space or high integration requirements, such as portable medical detection devices, micro chemical reactors, etc.

[0027] 4. The internal flow path layout of the valve assembly is reasonable and convenient to control. Description of the Drawings

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the embodiments. By referring to the drawings, the features and advantages of the present invention can be more clearly understood. The drawings are schematic and should not be construed as imposing any limitations on the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0029] Figure 1 It is a schematic diagram after assembly of a valve assembly for an integrated piezoelectric pump according to the first embodiment of the present invention.

[0030] Figure 2 It is an exploded view of a valve assembly for an integrated piezoelectric pump according to the first embodiment of the present invention.

[0031] Figure 3 It is a top view of the first fixing plate of a valve assembly for an integrated piezoelectric pump according to the first embodiment of the present invention.

[0032] Figure 4 It is a top view of the elastic film layer of a valve assembly for an integrated piezoelectric pump according to the first embodiment of the present invention.

[0033] Figure 5 It is a top view of the second fixing plate of a valve assembly for an integrated piezoelectric pump according to the first embodiment of the present invention.

[0034] Figure 6 It is an isometric side view of the side wall of a valve assembly for an integrated piezoelectric pump according to the first embodiment of the present invention.

[0035] Figure 7 It is a top view of the PCB bottom plate of a valve assembly for an integrated piezoelectric pump according to the first embodiment of the present invention.

[0036] Figure 8 It is an exploded view of a valve assembly for an integrated piezoelectric pump according to the second embodiment of the present invention.

[0037] Explanation of reference numerals:

[0038] 1, 2 Valve assembly;

[0039] 10 First fixing plate;

[0040] 12 Normally closed hole;

[0041] 18 First avoidance opening;

[0042] 20 Elastic film layer;

[0043] 22 First deformation part;

[0044] 24 Obstruction part;

[0045] 26 Film hole;

[0046] 28 Second deformation part;

[0047] 30 Second fixing plate;

[0048] 32 Transmission avoidance opening;

[0049] 38 Second avoidance opening;

[0050] 40, 240 Side wall;

[0051] 41 First step wall;

[0052] 42 Second step wall;

[0053] 43 Third step wall;

[0054] 46 Conductive through hole;

[0055] 48 Side wall outlet;

[0056] 50 Boss;

[0057] 58 Boss transmission hole;

[0058] 60, 260 PCB bottom plate;

[0059] 62 Power supply unit;

[0060] 64 Control unit;

[0061] 66 Bottom plate hole;

[0062] 68 Chip. Detailed implementation manners

[0063] In order to be able to more clearly understand the above-mentioned objects, features and advantages of the present utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific implementation manners. It should be noted that, without conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other.

[0064] In the following description, many specific details are set forth in order to fully understand the present utility model, but the present utility model can also be implemented in other ways different from those described herein. Therefore, the protection scope of the present utility model is not limited by the specific embodiments disclosed below.

[0065] The following references Figure 1-7, a valve assembly for an integrated piezoelectric pump provided according to the first embodiment of the present utility model will be described in detail.

[0066] As Figure 1 and Figure 2 shown, the valve assembly 1 for an integrated piezoelectric pump provided according to the first embodiment of the present utility model includes: a first fixing plate 10, an elastic film layer 20, and a second fixing plate 30 assembled in sequence from top to bottom; a side wall 40 for accommodating the first fixing plate 10, the elastic film layer 20, and the second fixing plate 30; and a PCB bottom plate 60 fixed to the bottom of the side wall 40. The PCB bottom plate 60 includes a power supply unit 62 and a control unit 64, and a bottom plate hole 66 is provided on the PCB bottom plate 60. The bottom plate hole 66 can serve as a passage for fluid to enter and exit the valve assembly 1. Among them, the first fixing plate 10, the elastic film layer 20, and the side wall 40 can be combined to form a normally closed valve and a normally open valve of the fluid passage.

[0067] As Figure 1 shown, in the valve assembly 1 for an integrated piezoelectric pump provided by this first embodiment, the elastic film layer 20 and the second fixing plate 30 have the same shape and size, and the length and width of the first fixing plate 10 are greater than the length and width of the elastic film layer 20 and the second fixing plate 30, so that when assembled to the side wall 40, the first fixing plate 10 can press and hold the elastic film layer 20 and the second fixing plate 30 from above. The side wall 40 and the PCB bottom plate 60 have consistent outer peripheral dimensions and shapes, forming a consistent outer shape of the valve assembly 1 after assembly. The thickness of the side wall 40 is greater than the total thickness of the first fixing plate 10, the elastic film layer 20, and the second fixing plate 30 to form a space in the valve assembly 1 for accommodating the components on the PCB bottom plate 60, accommodating the deformation of the elastic film layer 20, and providing fluid circulation. The first fixing plate 10, the elastic film layer 20, the second fixing plate 30, and the side wall 40 of the valve assembly 1 together form a normally closed valve and a normally open valve.

[0068] Referring to Figure 3 , a normally closed hole 12 and a first avoidance opening 18 are formed on the first fixing plate 10, and the size of the first avoidance opening 18 is larger than the size of the normally closed hole 12. The first avoidance opening 18 is used to provide an avoidance space for accommodating the upward deformation of the elastic film layer 20 when it deforms upward.

[0069] As Figure 4As shown, below the first fixed plate 10 is an elastic film layer 20. The elastic film layer 20 is made of a material with good elasticity. The elastic film layer 20 includes a first deformation part 22 corresponding to the normally closed hole 12 of the first fixed plate 10, and a second deformation part 28 corresponding to the first avoidance opening 18 of the first fixed plate 10. The second deformation part 28 is a solid area, and its area covers the first avoidance opening 18. The specific structure of the first deformation part 22 may include a shielding part 24 aligned with the normally closed hole 12, and a plurality of film holes 26 arranged around the shielding part 24. The shielding part 24 may be a generally circular solid area, and its area is larger than the area of the normally closed hole 12 to block the normally closed hole 12 when the elastic film layer 20 is in a flat and undeformed state. The film holes 26 may include a plurality of independent fan-shaped small holes around the circular shielding part 24. For example but not limited to, 6 or 8 fan-shaped small holes may be provided. When the elastic film layer 20 is in a flat state or an upward deformation state, the normally closed hole 12 can be blocked by the shielding part 24 of the first deformation part 22; when the elastic film layer 20 is in a downward deformation state, the shielding part 24 of the first deformation part 22 deforms downward to open the normally closed hole 12, and the normally closed hole 12 communicates with the film holes 26. In this embodiment, the elastic film layer 20 is integrally made of a single-piece elastic film material. However, the present invention is not limited thereto. In other embodiments, two independent elastic film pieces may be respectively arranged at positions corresponding to the normally closed hole 12 and the first avoidance opening 18.

[0070] As Figure 5 shown, below the elastic film layer 20 is a second fixed plate 30. A transmission avoidance opening 32 corresponding to the first deformation part 22 of the elastic film layer 20, and a second avoidance opening 38 corresponding to the first avoidance opening 18 of the first fixed plate 10 are formed on the second fixed plate 30. The transmission avoidance opening 32 may be circular, and its area is larger than the area of the first deformation part 22 of the elastic film layer 20, and is used to provide an avoidance space for the downward deformation of the first deformation part 22 when the elastic film layer 20 deforms downward, and at the same time provide a fluid communication path from the normally closed hole 12 through the film holes 26 of the downward-deformed elastic film layer 20 and the transmission avoidance opening 32. The shape and size of the second avoidance opening 38 may be the same as the shape and size of the first avoidance opening 18 of the first fixed plate 10, and the position of the second avoidance opening 38 corresponds to the position of the first avoidance opening 18 of the first fixed plate 10 and the second deformation part 28 of the elastic film layer 20, and is used to provide an avoidance space for its downward deformation when the elastic film layer 20 deforms downward. The area of the solid second deformation part 28 is larger than the first avoidance opening 18 and the second avoidance opening 38.

[0071] Refer to Figure 6, in this embodiment, the sidewall 40 is a multi-step structure with a hollow opening surrounded by four surrounding walls, facilitating the installation of the first fixing plate 10, the elastic film layer 20, and the second fixing plate 30. The multi-step structure includes, from top to bottom, a first step wall 41 forming a first opening, a second step wall 42 forming a second opening, and a third step wall 43 forming a third opening. The size and shape of the first opening surrounded by the first step wall 41 are consistent with those of the first fixing plate 10; the length and width of the second opening surrounded by the second step wall 42 are smaller than the length and width of the first opening, so that the length and width of the second opening are smaller than the first fixing plate 10, providing support for the first fixing plate 10 through the top surface of the second step wall 42; the length and width of the third opening surrounded by the third step wall 43 are smaller than the length and width of the second opening. After installation, the elastic film layer 20 and the second fixing plate 30 can be supported and fixed by a part of the top surface of the third step wall 43. The sizes of the first opening, the second opening, and the third opening have a gradually decreasing relationship from top to bottom. When installing the first fixing plate 10, the elastic film layer 20, and the second fixing plate 30 into the multi-step structure of the sidewall 40, the upper surface of the assembled component is a flat surface, facilitating the assembly with other components of the integrated piezoelectric pump.

[0072] Continue to refer to Figure 6 , the third step wall 43 further includes a boss 50 extending inwards from one side, and a boss transmission hole 58 formed in the boss 50 and extending downwards from the upper surface of the boss 50, and the thickness of the boss 50 is lower than the thickness of the third step wall 43. Optionally, the boss transmission hole 58 can extend downwards from the upper surface of the boss 50 and penetrate through the boss 50. A sidewall outlet 48 communicating from the boss transmission hole 58 to the outside of the sidewall 40 is formed on the sidewall portion of the sidewall 40 where the boss 50 is provided. One end of the sidewall outlet 48 communicates with the boss transmission hole 58 in the boss 50, and the other end communicates with the outside of the sidewall. In the figure, the sidewall outlet 48 is shown at the bottom of the sidewall 40. It should be understood that the sidewall outlet 48 can be set at other suitable positions on the sidewall portion according to needs. The boss transmission hole 58 of the boss 50 corresponds to the position of the second avoidance opening 38 of the second fixing plate 30. Thus, the boss 50 of the sidewall 40 can cooperate with the elastic film layer 20, the first fixing plate 10, and the second fixing plate 30 to block the boss transmission hole 58 of the boss 50 when the elastic film layer 20 is in a downward deformation state; when the elastic film layer 20 is in a flat state or an upward deformation state, the boss transmission hole 58 is communicated with the inner space of the valve assembly 1.

[0073] In this embodiment, the first fixing plate 10 and the second fixing plate 30 can be made of stainless steel, the elastic film layer 20 can be made of silicone or fluororubber, and the side wall 40 can be made of materials such as stainless steel and fiber composite materials. The thicknesses of the first fixing plate 10, the second fixing plate 30, and the elastic film layer 20 can be in the range of 0.08 mm to 1.2 mm. The thickness of the side wall 40 in the vertical direction can be in the range of 0.8 mm to 1.5 mm, and the preferred range of the thickness of the side wall 40 is 1.0 mm to 1.2 mm.

[0074] After assembly, the normally closed hole 12 of the first fixing plate 10 and the first deformation portion 22 of the elastic film layer 20 jointly form a normally closed valve, and the first avoidance opening 18 of the first fixing plate 10, the second deformation portion 28 of the elastic film layer 20, and the boss transmission hole 58 of the boss 50 jointly form a normally open valve. The working processes of the normally closed valve and the normally open valve are as follows. When the elastic film layer 20 is in the undeformed flat state, the normally closed hole 12 is blocked by the blocking portion 24 of the first deformation portion 22, and the normally closed valve is closed; the second deformation portion 28 is in the flat undeformed state, and there is a gap between it and the boss transmission hole 58 of the boss 50, and the fluid can flow through the valve assembly 1 from the inside through the boss transmission hole 58 and the side wall outlet 48, and the normally open valve is open. When the elastic film layer 20 is in the upward deformation state, the normally closed hole 12 is blocked by the blocking portion 24 of the upward deformed first deformation portion 22, and the normally closed valve is closed; the second deformation portion 28 is in the upward deformation state, and there is a gap between it and the boss transmission hole 58 of the boss 50, and the fluid can flow through the valve assembly 1 from the inside through the boss transmission hole 58 and the side wall outlet 48, and the normally open valve is open. When the elastic film layer 20 is in the downward deformation state, the blocking portion 24 of the first deformation portion 22 deforms downward, allowing the normally closed hole 12, so that the normally closed hole 12 and the film hole 26 of the first deformation portion 22 jointly form a path for the fluid to flow through, and the normally closed valve is open; the second deformation portion 28 deforms downward, blocking the opening of the boss transmission hole 58, and the normally open valve is closed.

[0075] In addition, continuing to refer to Figure 6 , two separated through holes penetrating up and down can be formed in the side wall 40, and the through holes are filled with a conductive material to form a conductive through hole 46. Through the conductive through hole 46, the power supply unit 62 of the PCB bottom plate 60 supplies power to the integrated piezoelectric pump and transmits control signals. The setting of the through-conductive through hole 46 of the valve assembly 1 can effectively reduce the number of components, realize a compact, efficient and reliable power supply and control method, reduce the structural size, and enable the valve assembly 1 to be applicable to more application scenarios. The conductive material can be, for example but not limited to, copper material, silver material, etc.

[0076] As Figure 7As shown, in this embodiment, the valve assembly 1 uses the PCB bottom plate 60 as its bottom plate. The PCB bottom plate 60 is consistent with the outer shape and size of the side wall 40, and the PCB bottom plate 60 is fixedly connected to the lower part of the side wall 40. The PCB bottom plate 60 is provided with: a power supply unit 62, which corresponds to and is electrically connected to the conductive through holes 46 in the side wall 40; a control unit 64; a bottom plate hole 66, which is arranged at the center of the PCB bottom plate 60 and is used for fluid to enter and exit the valve assembly 1 without additional connecting pipes. A multifunctional chip 68 and input / output ports for electrical connection and communication with the outside can be arranged on the PCB bottom plate 60 as required. The components arranged on the PCB bottom plate 60 can avoid the positions of the bottom plate hole 66 and the boss 50 of the side wall 40 to facilitate assembly. The PCB bottom plate 60 is made by laminating a circuit layer and an insulating layer. The PCB bottom plate 60 can be made of FR4 material, and the components in this embodiment can be fixed using a film adhesive. In this embodiment, the chip and the driving device are installed on the PCB bottom plate, reducing the volume of the valve assembly, and thus greatly reducing the overall mechanical and electronic solution area and volume of the integrated pump device, improving the space benefit of downstream users and being conducive to high integration requirements.

[0077] The working process of the valve assembly 1 for the integrated piezoelectric pump according to the first embodiment of the present invention will be described in detail below.

[0078] When the valve assembly 1 provided according to the embodiment of the present invention is in the first working state, under the condition that the internal and external pressures are the same, the elastic film layer 20 is in a flat and undeformed state, and the normally closed one-way valve is closed, that is, the normally closed hole 12 of the first fixing plate 10 is blocked by the blocking portion 24 of the first deformation portion 22; the normally open one-way valve is open, that is, the gap between the upper part of the boss transmission hole 58 and the second deformation portion 28 of the flat elastic film layer 20 is not blocked, allowing fluid to flow through.

[0079] When the valve assembly 1 is in the second working state, when the pressure above the valve assembly 1 is greater than the pressure inside the valve assembly 1, the elastic film layer 20 deforms downward, and the normally closed one-way valve opens, that is, the blocking portion 24 of the first deformation portion 22 deforms downward to open the normally closed hole 12 of the first fixing plate 10, so that the normally closed hole 12 communicates with the inside of the valve assembly 1 through the film hole 26 of the first deformation portion 22, and the fluid enters the inside of the valve assembly 1 from above through the normally closed hole 12 and the film hole 26 and flows out from the bottom plate hole 66 of the PCB bottom plate 60; at the same time, the normally open one-way valve is closed, that is, the second deformation portion 28 deforms downward to block the boss transmission hole 58 on the boss 50, and the fluid cannot flow through here.

[0080] When the valve assembly 1 is in the third working state, the air pressure inside the valve assembly 1 is higher than the air pressure above the valve assembly 1. The elastic film layer 20 deforms upward, and the normally closed one-way valve closes, that is, the blocking portion 24 of the first deformation portion 22 deforms upward to block the normally closed hole 12 of the first fixing plate 10, and the fluid cannot flow through this. At the same time, the normally open one-way valve opens, that is, the second deformation portion 28 deforms upward to open the boss transmission hole 58 on the boss 50. The fluid enters the inside of the valve assembly 1 from below through the bottom plate hole 66 in the center of the PCB bottom plate 60, passes through the boss transmission hole 58, and then is discharged outside the valve assembly 1 through the side wall outlet 48.

[0081] The following refers to Figure 8 , and the valve assembly for an integrated piezoelectric pump provided according to the second embodiment of the present invention will be described.

[0082] As Figure 8 shown, the valve assembly 2 for an integrated piezoelectric pump provided according to the second embodiment of the present invention includes: a first fixing plate 10, an elastic film layer 20, and a second fixing plate 30 assembled in sequence from top to bottom; a side wall 240 for accommodating the first fixing plate 10, the elastic film layer 20, and the second fixing plate 30; and a PCB bottom plate 260 fixed to the bottom of the side wall 240. The difference between the valve assembly 2 of this second embodiment and the valve assembly 1 of the above first embodiment is that the outer peripheral shapes of its side wall 240 and PCB bottom plate 260 are circular, so that the assembled valve assembly 2 has a circular outer peripheral shape. Although the outer peripheral shapes of the side wall 240 and PCB bottom plate 260 are circular, its internal structure is the same as that of the side wall 40 and PCB bottom plate 60 of the above first embodiment, and will not be described in detail here. Since the cavity structure surrounded by the side wall 240 is the same as the cavity structure surrounded by the side wall 40 in the above first embodiment, the first fixing plate 10, the elastic film layer 20, and the second fixing plate 30 in the first embodiment can be matched therein. The valve assembly 2 with a circular outer peripheral shape can be applied to applications that require a circular integrated piezoelectric pump.

[0083] It should be understood that, as needed, the valve assembly for an integrated piezoelectric pump of the present invention may also have shapes such as oval, polygon, trapezoid, rhombus, etc.

[0084] All the above optional technical solutions can be combined arbitrarily to form optional embodiments of the present application, and will not be elaborated one by one here.

[0085] It should be understood that the magnitudes of the sequence numbers of the steps in the above embodiments do not mean the order of execution. The order of execution of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0086] As described above, it is only the preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present utility model should be covered within the protection scope of the present utility model.

Claims

1. A valve assembly for an integrated piezoelectric pump, characterized in that, Comprising: A first fixing plate, an elastic film layer, and a second fixing plate assembled successively from top to bottom; Side walls that enclose a space for accommodating the first fixing plate, the elastic film layer, and the second fixing plate; A PCB bottom plate fixed to the bottom of the side walls; Wherein, the side walls and the PCB bottom plate have the same outer peripheral dimensions and outer peripheral shapes; Wherein, the thickness of the side walls is greater than the total thickness of the first fixing plate, the elastic film layer, and the second fixing plate; and Wherein, the combination of the first fixing plate, the elastic film layer, and the side walls constitutes a normally closed valve and a normally open valve.

2. The valve assembly for an integrated piezoelectric pump according to claim 1, wherein: The first fixing plate is formed with a normally closed hole and a first avoiding opening; The elastic film layer includes a first deformation part corresponding to the normally closed hole of the first fixing plate, and a second deformation part corresponding to the first avoiding opening of the first fixing plate; The second fixing plate is formed with a transmission avoiding opening corresponding to the first deformation part of the elastic film layer, and a second avoiding opening corresponding to the first avoiding opening of the first fixing plate; Wherein, the normally closed hole of the first fixing plate and the first deformation part of the elastic film layer constitute the normally closed valve.

3. The valve assembly for an integrated piezoelectric pump according to claim 2, wherein: The first deformation part of the elastic film layer includes an occlusion part in a solid area and a plurality of film holes surrounding the occlusion part, wherein the area of the occlusion part is greater than the area of the normally closed hole; The second deformation part of the elastic film layer is a solid area, and its area is greater than the area of the first avoiding opening of the first fixing plate; The area of the transmission avoiding opening of the second fixing plate is greater than the area of the first deformation part.

4. The valve assembly for an integrated piezoelectric pump according to claim 3, wherein: The occlusion part of the first deformation part of the elastic film layer is circular; Each of the film holes of the first deformation part is fan-shaped.

5. The valve assembly for an integrated piezoelectric pump according to claim 3, characterized in that, The elastic film layer and the second fixing plate have the same shape and size, and the length and width of the first fixing plate are greater than the length and width of the elastic film layer and the second fixing plate.

6. The valve assembly for an integrated piezoelectric pump according to claim 5, characterized in that, The side walls are a multi-layer stepped structure formed by surrounding side walls to enclose a hollow opening, including from top to bottom: A first stepped wall forming a first opening, the shape and size of the first opening being consistent with those of the first fixing plate; A second stepped wall forming a second opening, the length and width of the second opening being smaller than the length and width of the first opening; and A third stepped wall forming a third opening, the length and width of the third opening being smaller than the length and width of the second opening.

7. The valve assembly for an integrated piezoelectric pump according to claim 6, wherein: The side walls include a boss extending inwards from one side of the third stepped wall, and the thickness of the boss is smaller than the thickness of the third stepped wall, wherein a boss transmission hole extending downwards from its upper surface is formed in the boss, and the position of the boss transmission hole corresponds to the second deformation part of the elastic film layer; A side wall outlet is formed on the side of the side walls where the boss is provided, one end of the side wall outlet communicating with the boss transmission hole in the boss, and the other end communicating with the outside of the side walls; The second deformation part of the elastic film layer and the boss transfer hole of the boss constitute the normally open valve.

8. The valve assembly for an integrated piezoelectric pump according to claim 1, characterized in that, A power supply unit and a control unit are arranged on the PCB bottom plate, and a bottom plate hole penetrating through the PCB bottom plate is arranged.

9. The valve assembly for an integrated piezoelectric pump according to claim 1, characterized in that: Two conductive through holes are formed in the side wall, and are respectively electrically connected to the power supply unit of the PCB bottom plate.

10. The valve assembly for an integrated piezoelectric pump according to any one of claims 1-9, characterized in that, The outer peripheral shapes of the side wall and the PCB bottom plate are rectangular or circular.

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