Big data server heat dissipation device

Abstract

The utility model relates to the field of big data servers, in particular to a big data server heat dissipation device which comprises a shell, a mounting plate is arranged in the shell, circuit boards arranged at equal intervals are arranged above the mounting plate, a processing device and a partition plate are fixedly mounted on the upper surface of each circuit board, and the processing device is arranged on the upper surface of each circuit board. The heat dissipation device comprises a shell, a plurality of partition plates are arranged in the shell, a clamping groove is formed in each partition plate, a cooling fin is connected to the inner wall of each clamping groove in a clamped mode, a first exhaust fan is installed in the shell, and the lower end of each first exhaust fan makes contact with the corresponding cooling fin. According to the server heat dissipation device, the space for air circulation in the shell is separated through the partition plate, then the temperature of equipment prone to heating is converted and transferred to the upper portion of the partition plate through the cooling fins, then the first exhaust fan is started to dissipate heat of the cooling fins, and the effect that the device can dissipate heat of the equipment prone to heating in the server according to needs is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of big data servers, in particular to a heat dissipation device for a big data server. Background Technique

[0002] Big data, or mass data, refers to a large amount of, high-growth-rate, and diverse information assets that require new processing models to have stronger decision-making power, insight, and process optimization capabilities. A big data server consists of one or more computers and database management system software, and the database server provides services for client applications, including queries, updates, transaction management, indexing, caching, query optimization, security, and multi-user access control, etc.

[0003] When the big data server is used for a long time, as the amount of data processed increases, the computing amount of the device becomes larger, and the heat generated by it will also become larger. To avoid equipment overload, multiple heat dissipation devices are usually equipped for heat dissipation to ensure the operation of the device.

[0004] Due to the different workloads of the equipment components, the heat dissipated by each component is also different. In the existing heat dissipation devices, the method of using an installed exhaust fan to ventilate the inside of the device to achieve heat dissipation is more common, but the heat dissipation effect of this method is too uniform and it is difficult to meet the heat dissipation requirements of some high-workload equipment.

[0005] Therefore, a new solution needs to be proposed to solve this problem. Content of the Utility Model

[0006] Aiming at the problem in the above background technique that the heat dissipation effect of the existing heat dissipation device is too uniform and it is difficult to meet the heat dissipation of high-workload equipment.

[0007] A heat dissipation device for a big data server disclosed by the utility model includes a housing. An installation plate is arranged inside the housing. Circuit boards arranged at equal distances are arranged above the installation plate. A processing device and a partition are fixedly installed on the upper surface of each circuit board. A card slot is opened inside each partition. A heat sink is clamped on the inner wall of each card slot. An exhaust fan I is installed inside the housing. The lower end of each exhaust fan I is in contact with the corresponding heat sink.

[0008] Furthermore, the bottom surface of each heat sink is in contact with the processing device, and heat dissipation silicone grease is applied at the connection between each heat sink and the processing device.

[0009] Furthermore, the bottom surface of the installation plate is fixedly connected with a baffle, and an operation slot is opened inside the baffle.

[0010] Further, two second exhaust fans are fixedly installed on the left side surface of the housing, and two extraction fans are fixedly installed on the upper surface of the mounting plate.

[0011] Further, two connecting plates are installed on the inner side wall of the housing, and a sliding groove is formed in the interior of each connecting plate, and the inner wall of each sliding groove is slidably connected to the mounting plate.

[0012] Further, a limiting plate is fixedly installed on the inner bottom wall of the housing, and the right side surface of the limiting plate is in contact with the mounting plate.

[0013] Further, rollers arranged at equal distances are rotatably connected inside the housing, and the outer surface of each roller is in contact with the mounting plate.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] 1. By providing components such as a housing, a partition, heat sinks, and a first exhaust fan, when using the present device, the partition is used to separate the space for air circulation inside the housing, and the heat of the devices prone to heat generation is transferred to the upper part of the partition through the heat sinks, and then the first exhaust fan is started to accelerate the heat dissipation of the heat sinks and the heat-generating devices below, achieving the effect that the device can dissipate heat from the devices prone to heat generation inside the server according to requirements.

[0016] 2. By providing components such as connecting plates, sliding grooves, limiting plates, and rollers, by aligning the mounting plate with the sliding grooves to connect the mounting plate with the connecting plates, and then pushing the mounting plate, the circuit board and the partition can be driven into the housing. The bottom surface of the mounting plate will contact the rollers inside the housing. When the housing moves to the limiting plate, it is clamped with the housing through the operation slot, achieving the effect that the device can conveniently move the mounting plate in the housing according to requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application, and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application, and do not constitute an improper limitation to the present application. In the drawings:

[0018] Figure 1 is a three-dimensional structural schematic diagram of the whole of the present utility model;

[0019] Figure 2 is a structural schematic diagram of the interior of the housing of the present utility model;

[0020] Figure 3 is a three-dimensional structural schematic diagram of the partition of the present utility model;

[0021] Figure 4 is a top-view structural schematic diagram of the circuit board of the present utility model

[0022] Figure 5 This is a schematic diagram of the inner wall structure of the housing of the present utility model.

[0023] In the figure: 1. Housing; 2. Mounting plate; 3. Circuit board; 4. Processing device; 5. Partition; 6. Heat sink; 7. First exhaust fan; 8. Second exhaust fan; 9. Exhaust fan; 10. Baffle; 11. Operation slot; 12. Connection plate; 13. Sliding slot; 14. Limiting plate; 15. Roller; 16. Card slot. Specific embodiments

[0024] The following will disclose multiple embodiments of the present utility model with diagrams. For the sake of clear illustration, many physical details will be described together in the following narrative. However, it should be understood that these physical details are not used to limit the present utility model. That is to say, in some embodiments of the present utility model, these physical details are not necessary. In addition, for the sake of simplifying the diagrams, some conventional structures and components will be illustrated in a simple schematic manner in the diagrams.

[0025] Please refer to Figure 2 , Figure 3 and Figure 4 , a heat dissipation device for a big data server of the present utility model includes a housing 1. By providing the housing 1, not only can it provide protection for the device, but also a wind channel can be formed after the housing 1 wraps the circuit board, avoiding the loss of wind power and increasing the heat dissipation effect. Specifically, an installation plate 2 is provided inside the housing 1. By providing the installation plate 2, it is convenient to install and fix the circuit board 3, and when the installation plate 2 moves in the housing 1, it will drive the installation plate 3 to move. Above the installation plate 2, there are circuit boards 3 arranged at equal distances. By providing the circuit boards 3, electronic components required for various devices can be installed to achieve signal and power transmission.

[0026] In this embodiment, a processing device 4 and a partition 5 are fixedly installed on the upper surface of each circuit board 3. The processing device 4 refers to electronic components that are prone to heat generation during operation. By providing the partition 5, the heat dissipation of the heat-generating electronic components can be separated from that of ordinary electronic components. A card slot 16 is opened inside each partition 5. By opening the card slot 16, it is convenient to install the heat sink 6. The inner wall of each card slot 16 is clamped with a heat sink 6. By installing the heat sink 6, the heat of the processing device 4 can be transferred to help the processing device 4 dissipate heat. A first exhaust fan 7 is installed inside the housing 1. By installing the first exhaust fan 7, it can help the heat sink 6 dissipate heat quickly. The lower end of each first exhaust fan 7 is in contact with the corresponding heat sink 6.

[0027] Please refer to Figure 1 , Figure 2 and Figure 5, the bottom surface of each heat sink 6 is in contact with the processing device 4. The contact between the heat sink 6 and the processing device 4 can help the processing device 4 transfer heat and dissipate heat quickly. Specifically, heat-conducting silicone grease is applied at the connection between each heat sink 6 and the processing device 4. The applied silicone grease can make the connection surface between the heat sink 6 and the processing device 4 more uniform and transfer heat more efficiently. Two exhaust fans II 8 are fixedly installed on the left side surface of the housing 1. The arranged exhaust fans II 8 can accelerate the discharge of heat inside the housing 1. Two extraction fans 9 are fixedly installed on the upper surface of the mounting plate 2. The arranged extraction fans 9 extract the cooler air outside into the housing 1. The extracted air is divided into two parts by the partition 5. One part enters the lower part of the partition 5 to dissipate heat from the ordinary electronic components, and the other part enters the upper part of the partition 5 to assist in dissipating heat from the heat sink 6.

[0028] Please refer to Figure 2 、 Figure 3 and Figure 5 , two connecting plates 12 are installed on the inner side wall of the housing 1. The arranged two connecting plates 12 can facilitate the connection between the housing 1 and the mounting plate 2. Specifically, a sliding groove 13 is formed inside each connecting plate 12. The formed sliding groove 13 can facilitate the connection between the connecting plate 12 and the mounting plate 2. The inner wall of each sliding groove 13 is slidably connected to the mounting plate 2. The sliding connection between the sliding groove 13 and the mounting plate 2 can facilitate the movement of the mounting plate 2 in the housing 1. A limiting plate 14 is fixedly installed on the inner bottom wall of the housing 1. The installed limiting plate 14 can facilitate the limitation of the position of the mounting plate 2 in the housing 1 and prevent the mounting plate 2 from colliding with the exhaust fans II 8 during movement. The right side surface of the limiting plate 14 is in contact with the mounting plate 2. A plurality of rollers 15 arranged at equal intervals are rotatably connected inside the housing 1. The outer surface of each roller 15 is in contact with the mounting plate 2. The contact between the roller 15 and the mounting plate 2 not only provides support for the mounting plate 2 at the bottom but also facilitates the movement of the mounting plate 2 in the housing 1.

[0029] Please refer to Figure 1 and Figure 3 , a baffle 10 is fixedly connected to the bottom surface of the mounting plate 2. The arranged baffle 10 can prevent dust from entering the housing 1 from the bottom of the mounting plate 2. Specifically, an operation groove 11 is formed inside the baffle 10. The formed operation groove 11 can facilitate the control of the movement of the mounting plate 2. A clamping member adapted to the housing 1 is installed in the operation groove 11 to facilitate the fixation of the mounting plate 2 in the housing 1.

[0030] The above are only the embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, various modifications and variations can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the scope of the claims of the present utility model.

Claims

1. A heat dissipation device for a big data server, comprising a housing (1), characterized in that: Inside the housing (1), there is a mounting plate (2). Above the mounting plate (2), circuit boards (3) are arranged at equal distances. On the upper surface of each circuit board (3), a processing device (4) and a partition (5) are fixedly installed. Inside each partition (5), a card slot (16) is formed. Inside the inner wall of each card slot (16), a heat sink (6) is clamped. Inside the housing (1), a first exhaust fan (7) is installed. The lower end of each first exhaust fan (7) is in contact with the corresponding heat sink (6).

2. The heat dissipation device for a big data server according to claim 1, wherein: The bottom surface of each heat sink (6) is in contact with the processing device (4). At the connection between each heat sink (6) and the processing device (4), heat-conducting silicone grease is applied.

3. The heat dissipation device for a big data server according to claim 1, characterized in that: The bottom surface of the mounting plate (2) is fixedly connected to a baffle (10). Inside the baffle (10), an operation slot (11) is formed.

4. A heat dissipation device for a big data server according to claim 1, characterized in that: On the left side surface of the housing (1), two second exhaust fans (8) are fixedly installed. On the upper surface of the mounting plate (2), two extraction fans (9) are fixedly installed.

5. A heat dissipation device for a big data server according to claim 1, characterized in that: On the inner side wall of the housing (1), two connecting plates (12) are installed. Inside each connecting plate (12), a sliding slot (13) is formed. The inner wall of each sliding slot (13) is slidably connected to the mounting plate (2).

6. The heat dissipation device for a big data server according to claim 1, wherein: On the inner bottom wall of the housing (1), a limiting plate (14) is fixedly installed. The right side surface of the limiting plate (14) is in contact with the mounting plate (2).

7. A heat dissipation device for a big data server according to claim 1, wherein: Inside the housing (1), rollers (15) are rotatably connected and arranged at equal distances. The outer surface of each roller (15) is in contact with the mounting plate (2).

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