Suspension type temporary storage device and automatic material carrying system

Abstract

The utility model provides a suspension type temporary storage device and an automatic material carrying system. Wherein a locking unit is additionally arranged in the suspension type temporary storage device. The locking unit comprises a clamping arm assembly; the clamping arm assembly is arranged on the side edge of the device body so as to clamp and lock the wafer box and the device body when the bearing surface bears the wafer box. Therefore, when the device body introduces purified gas into the wafer box, based on position locking of the wafer box and the device body, displacement of the wafer box caused by gas impact can be avoided, the problem of gas leakage in the gas supply process is effectively relieved, and stable gas supply to the wafer box by the device body is facilitated. And meanwhile, the safety risk in the gas supply process can be reduced, and the purification effect on the wafer box is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, and particularly relates to an overhead hoist buffer and an automatic material handling system. Background Art

[0002] An automatic material handling system (AMHS), also known as an overhead crane system, is a software and hardware integrated device for material handling on a semiconductor production line. Among them, an overhead hoist buffer (OHB) is a storage platform in the overhead crane system for temporarily storing a front opening unified pod (FOUP). And because wafers are easily affected by oxygen, water vapor, or contaminant particles in the environment during storage, the existing OHB has a purification function and can fill nitrogen gas (N2 Purge) into the carried FOUP to reduce the oxygen content inside the FOUP, extend the quality time (Q-Time) of the wafers, and improve the wafer yield.

[0003] However, when the existing OHB fills nitrogen gas into the FOUP, it is easy to cause the FOUP to be blown up due to factors such as different weights of each FOUP and different inflation pressures, and there are prone to air leakage problems or other safety risks.

[0004] Therefore, there is an urgent need for a new overhead hoist buffer to ensure that the OHB can supply gas to the FOUP stably. Summary of the Utility Model

[0005] The purpose of the utility model is to provide an overhead hoist buffer and an automatic material handling system to solve the problem of how to improve the purification effect and gas supply stability of the OHB for the wafer cassette.

[0006] To solve the above technical problems, the utility model provides an overhead hoist buffer, including a device body and a locking unit; wherein,

[0007] The device body has a bearing surface for bearing the wafer cassette;

[0008] The locking unit includes a clamping arm assembly; the clamping arm assembly is arranged on the side of the device body to be able to clamp and lock the wafer cassette and the device body when the bearing surface bears the wafer cassette; and,

[0009] Purified gas is passed through the device body, and the bearing surface has a ventilation port; and when the clamping arm assembly locks the wafer cassette and the device body, the purified gas can enter the wafer cassette through the ventilation port.

[0010] Optionally, in the suspended buffer device, the clamping arm assembly includes a first clamping arm and a second clamping arm; the first clamping arm and the second clamping arm are respectively arranged on two sides of the device body and can slide towards each other to clamp and lock the wafer cassette and the device body.

[0011] Optionally, in the suspended buffer device, the locking unit further includes a bidirectional lead screw; the first clamping arm and the second clamping arm are respectively connected to the bidirectional lead screw.

[0012] Optionally, in the suspended buffer device, the bidirectional lead screw includes a screw rod and a driving motor; the screw rod sequentially passes through and is respectively connected to one ends of the first clamping arm and the second clamping arm; the driving motor is arranged at one end of the screw rod, and under the drive of the driving motor, the screw rod rotates to drive the first clamping arm and the second clamping arm to slide towards each other or away from each other.

[0013] Optionally, in the suspended buffer device, the locking unit further includes a bottom plate; the bidirectional lead screw is arranged on the bottom plate and is detachably connected to the bottom plate.

[0014] Optionally, in the suspended buffer device, the surface of the bottom plate facing the bidirectional lead screw has a guide rail, and the guide rail extends along the moving direction of the first clamping arm and the second clamping arm; and,

[0015] Both ends of the first clamping arm and the second clamping arm connected to the bidirectional lead screw have connecting parts, and the connecting parts are adapted to the guide rail so that the first clamping arm and the second clamping arm can slide along the guide rail.

[0016] Optionally, in the suspended buffer device, the device body further has a through cavity, the bottom plate penetrates through the through cavity and is detachably connected to the bottom wall of the through cavity.

[0017] Optionally, in the suspended buffer device, clamping claws are respectively arranged on the opposite surfaces of the first clamping arm and the second clamping arm, and the clamping claws are located above the bearing surface so as to be able to at least clamp the wafer cassette when the bearing surface bears the wafer cassette.

[0018] Optionally, in the suspended buffer device, the clamping arm assembly further includes a plurality of pressure sensors, and the plurality of pressure sensors are arranged on the first clamping arm and the second clamping arm and are used for detecting the clamping force when the first clamping arm and the second clamping arm clamp the wafer cassette and the device body.

[0019] Based on the same concept, the present invention further provides an automatic material handling system including the suspended buffer device.

[0020] In summary, the present utility model provides a suspended buffer device and an automatic material handling system. Compared with the prior art, a locking unit is added to the suspended buffer device. The locking unit includes a clamping arm assembly; the clamping arm assembly is disposed on the side of the device body so as to clamp and lock the wafer cassette and the device body when the wafer cassette is placed on the bearing surface. Therefore, when the device body supplies purified gas to the wafer cassette, based on the position locking between the wafer cassette and the device body, displacement of the wafer cassette caused by gas impact can be avoided, effectively alleviating the air leakage problem during the gas supply process, facilitating stable gas supply from the device body to the wafer cassette. At the same time, the safety risk during the gas supply process can also be reduced, and the purification effect on the wafer cassette can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Those of ordinary skill in the art will understand that the provided drawings are used to better understand the present utility model and do not constitute any limitation to the scope of the present utility model.

[0022] Figure 1 is a schematic structural diagram of the suspended buffer device in the embodiment of the present utility model.

[0023] Figure 2 is a schematic structural diagram of the bearing surface of the device body in the embodiment of the present utility model.

[0024] Figure 3 is a schematic structural diagram of the ventilation pipeline of the device body in the embodiment of the present utility model.

[0025] Figure 4 is a schematic structural diagram of the locking unit in the embodiment of the present utility model.

[0026] Figure 5 is a schematic cross-sectional view of the locking unit in the embodiment of the present utility model.

[0027] Figure 6 is a schematic cross-sectional view of the first clamping arm in the embodiment of the present utility model.

[0028] Figure 7 is a schematic cross-sectional view of the bottom plate in the embodiment of the present utility model.

[0029] Figure 8 is in the embodiment of the present utility model Figure 1 a schematic cross-sectional view of AA' in

[0030] And, in the drawings:

[0031] 10 - device body; 100 - housing; 100a - bearing surface; 101 - seating sensor;

[0032] 20 - Locking unit; 200 - Jaw assembly; 200a - First jaw; 200b - Second jaw; 200c - Connecting part; 200d - Claw; 200e - Pressure sensor; 201 - Bi - directional lead screw; 201a - Lead screw; 201b - Driving motor; 202 - Base plate; 202a - Guide rail;

[0033] 30 - Wafer cassette;

[0034] 40 - Connecting rod;

[0035] G - Ventilation port; T - Ventilation pipe; C - Through hole. Detailed implementation mode

[0036] To make the objectives, advantages and features of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are all in a very simplified form and not drawn to scale, only for conveniently and clearly assisting in explaining the objectives of the embodiments of the present utility model. In addition, the structures shown in the accompanying drawings are often part of the actual structures. In particular, the focuses to be shown in each drawing are different, and sometimes different scales are used. It should also be understood that unless otherwise specified or indicated, the terms "first", "second", "third", etc. in the specification are only used to distinguish each component, element, step, etc. in the specification, rather than to represent the logical relationship or sequential relationship, etc. between each component, element, step. And, the X - axis direction, Y - axis direction and Z - axis direction referred to in the specification of this application are three mutually perpendicular directions in three - dimensional space.

[0037] Please refer to Figure 1 , this embodiment provides a suspended buffer device, including a device body 10 and a locking unit 20; wherein, the device body 10 has a bearing surface 100a for bearing a wafer cassette; the locking unit 20 includes a jaw assembly 200; the jaw assembly 200 is arranged on the side of the device body 10 so as to be able to clamp and lock the wafer cassette and the device body 10 when the bearing surface 100a bears the wafer cassette; and, a purification gas is passed through the device body 10, the bearing surface 100a has a ventilation port G; and when the jaw assembly 200 locks the wafer cassette and the device body 10, the purification gas can enter the wafer cassette through the ventilation port G.

[0038] Based on this, the suspension type buffer device provided in this embodiment is additionally provided with the locking unit 20, which is used to clamp the wafer cassette and the device body 10 when the bearing surface 100a bears the wafer cassette, so as to lock the position of the wafer cassette relative to the device body 10. Thus, when the device body 10 supplies purified gas to the wafer cassette, the wafer cassette can be prevented from being displaced due to gas impact, effectively alleviating the air leakage problem during the air supply process, facilitating the stable air supply of the device body 10 to the wafer cassette, and improving the purification effect on the wafer cassette.

[0039] The following will specifically describe the suspension type buffer device provided in this embodiment with reference to the attached Figures 1 to 8 drawings to specifically illustrate the suspension type buffer device provided in this embodiment.

[0040] Please continue to refer to Figure 1 the drawings. The suspension type buffer device provided in this embodiment is used to temporarily store the wafer cassette during the wafer handling process and perform a purification treatment process on the wafer cassette. Among them, the suspension type buffer device includes a device body 10 and a locking unit 20. The device body 10 is used to provide a shelf for bearing the wafer cassette and to circulate purified gas into the wafer cassette. The locking unit 20 is used to lock the position of the wafer cassette relative to the device body 10 during the purification process of the wafer cassette, so as to prevent the wafer cassette from being blown up due to gas impact and affecting the purification effect.

[0041] Specifically, please refer to Figure 2 and Figure 3, the device body 10 includes a housing 100. The top surface of the housing 100 is the bearing surface 100a for bearing the wafer cassette. A seating sensor 101 is installed on the bearing surface 100a to detect whether the wafer cassette is transferred to the target position on the bearing surface 100a by an overhead transporter. Optionally, the seating sensor 101 is an optical sensor and / or a pressure sensor, etc. Further, the device body 10 further includes a ventilation duct T, a flow valve, and other control components, etc., and these components are all arranged inside the housing 100. Among them, the bearing surface 100a has a plurality of ventilation ports G adapted to the contact holes on the wafer cassette. The ventilation ports G are connected to the ventilation duct T so that the purified gas in the ventilation duct T can enter and exit the wafer cassette through the ventilation ports G. It should be noted that the ventilation duct T includes an intake duct and an exhaust duct, and some of the ventilation ports G on the bearing surface 100a are connected to the intake duct, and the remaining ventilation ports G are connected to the exhaust duct. When purifying the wafer cassette, the purified gas sequentially passes through the intake duct and the corresponding ventilation ports G and enters the wafer cassette to fill the wafer cassette; at the same time, the air in the wafer cassette is discharged through the exhaust duct and the corresponding ventilation ports G. Preferably, the purified gas is nitrogen or an inert gas. Such gases are not prone to chemical reactions and are conducive to discharging the oxygen in the wafer cassette. For example, the purified gas is nitrogen, helium, or argon, etc.

[0042] Further, when the device body 10 fills the wafer cassette with purified gas, it is easy to cause the wafer cassette to be blown up due to factors such as gravity and air pressure, resulting in air leakage and other safety problems. Therefore, as Figure 1 shown, the suspension buffer device provided in this embodiment further includes the locking unit 20 for locking the position of the wafer cassette relative to the device body 10 during the purification process to ensure the stability of the gas supply.

[0043] Please refer to Figure 1 , Figure 4 and Figure 5 , the locking unit 20 includes a clamping arm assembly 200, a bidirectional lead screw 201, and a bottom plate 202 connected in sequence. Among them, the clamping arm assembly 200 is used to clamp the wafer cassette and the device body 10 during the purification process; the bidirectional lead screw 201 is used to drive the clamping arm assembly 200 to move; and the bottom plate 202 is used to provide a stable working platform. Exemplarily, the clamping arm assembly 200 includes a first clamping arm 200a and a second clamping arm 200b. The first clamping arm 200a and the second clamping arm 200b are respectively arranged on both sides of the device body 10 and can slide towards each other to clamp and lock the wafer cassette and the device body 10. As Figure 4and Figure 5 As shown, the first clamping arm 200a and the second clamping arm 200b are rectangular plate members, extend along the Z-axis direction, and can move along the X-axis direction. Therefore, the bidirectional lead screw 201 extends along the X-axis direction, and one end of each of the first clamping arm 200a and the second clamping arm 200b is connected to the bidirectional lead screw 201. Since the bidirectional lead screw 201 has a double thread, the first clamping arm 200a and the second clamping arm 200b can slide towards each other or away from each other to clamp or loosen the wafer cassette and the device body 10.

[0044] Specifically, as Figure 4 、 Figure 5 and Figure 6 shown, the bidirectional lead screw 201 includes a lead screw 201a and a drive motor 201b. The lead screw 201a extends along the X-axis direction, and the drive motor 201b is disposed at any one end of the lead screw 201a to be able to drive the lead screw 201a to rotate clockwise or counterclockwise. In addition, through holes C adapted to the radial dimension of the lead screw 201a are provided on the plate surfaces of the first clamping arm 200a and the second clamping arm 200b, and corresponding threads are provided on the inner walls of the through holes C, so that the lead screw 201a can sequentially pass through and be respectively connected to one end of the first clamping arm 200a and the second clamping arm 200b. Based on this, under the drive of the drive motor 201b, the lead screw 201a rotates and drives the first clamping arm 200a and the second clamping arm 200b to slide towards each other or away from each other.

[0045] Furthermore, as Figure 4 、 Figure 5 、 Figure 6 and Figure 7As shown, to ensure the stable movement of the first clamping arm 200a and the second clamping arm 200b, the bidirectional lead screw 201 is installed on the surface of the bottom plate 202. Preferably, the bidirectional lead screw 201 is detachably connected to the bottom plate 202. In addition, the surface of the bottom plate 202 facing the bidirectional lead screw 201 has a guide rail 202a, and the guide rail 202a extends along the moving direction (X-axis direction) of the first clamping arm 200a and the second clamping arm 200b. One end of each of the first clamping arm 200a and the second clamping arm 200b connected to the lead screw 201a has a connecting portion 200c. And the connecting portion 200c is adapted to the guide rail 202a, so that the first clamping arm 200a and the second clamping arm 200b can slide stably along the guide rail 202a. Among them, the specific shapes of the connecting portion 200c and the guide rail 202a are not limited in this embodiment. Exemplarily, if the guide rail 202a is a concave guide rail, then the connecting portion 200c is a convex slider adapted thereto to be able to extend into the concave guide rail. Or, if the guide rail 202a is a convex guide rail, then the connecting portion 200c is a groove adapted thereto to be able to accommodate the convex guide rail. Therefore, based on the cooperative sliding of the guide rail 202a and the connecting portion 200c, the limitation of the first clamping arm 200a and the second clamping arm 200b can be realized, which is beneficial to improving their sliding stability.

[0046] Preferably, please continue to refer to Figure 4 and Figure 5, clamping jaws 200d are respectively provided on the opposite surfaces of the first clamping arm 200a and the second clamping arm 200b, which are used to increase the contact area between the clamping arm assembly 200 and the wafer cassette and the device body 10, improve the clamping stability, and enhance the locking effect. Exemplarily, the clamping jaw 200d is in the shape of a plate and is angularly connected to the corresponding first clamping arm 200a or second clamping arm 200b. For example, the clamping jaw 200d is arranged along the Y-axis direction and forms an angle of 90 degrees with the corresponding first clamping arm 200a or second clamping arm 200b. The clamping jaw 200d is located above the bearing surface 100a so as to be able to clamp the wafer cassette or synchronously clamp the wafer cassette and the device body 10 when the bearing surface 100a bears the wafer cassette. Further, preferably, the clamping arm unit 200 further includes a plurality of pressure sensors 200e, and the plurality of pressure sensors 200e are arranged on the first clamping arm 200a and the second clamping arm 200b, which are used to detect the clamping force when the first clamping arm 200a and the second clamping arm 200b clamp the wafer cassette and the device body 10, so as to avoid damaging the wafer cassette and the device body 10 due to excessive clamping force, or avoid affecting the locking effect due to too small clamping force. Herein, the specific data and installation positions of the pressure sensors 200e are not limited in this embodiment. Exemplarily, the clamping arm unit 200 includes two pressure sensors 200e. And the two pressure sensors 200e are respectively arranged on the opposite surfaces of the first clamping arm 200a and the second clamping arm 200b.

[0047] Further, as Figure 1 and Figure 8 shown, the device body 10 further has a through cavity. The through cavity is formed by the side wall and the bottom wall of the housing 100 in the device body 10. The bottom plate 202 penetrates through the through cavity and is detachably connected to the bottom wall of the through cavity. Among them, the detachable connection includes but is not limited to being threadedly connected. Based on this, the bidirectional lead screw 201 also penetrates through the through cavity, and the clamping arm unit 200 is located on the sides of the two through openings of the through cavity, so as to clamp and lock the wafer cassette 30 and the device body 10 when the wafer cassette 30 is carried on the bearing surface 100a, and ensure stable gas supply to the wafer cassette 30.

[0048] Based on the same concept, this embodiment further provides an automatic material handling system. As Figure 1 shown, the automatic material handling system includes the above-mentioned suspended buffer device. Among them, the suspended buffer device is arranged below the guide rail of the automatic material handling system and is connected to the connecting rod 40 in the system.

[0049] Based on this, when the overhead carrier in the automatic material handling system places the wafer cassette 30 on the bearing surface 100a of the device body 10, the seating sensor 101 detects that the wafer cassette 30 is at the target position. Subsequently, the drive motor 201b in the bidirectional lead screw 201 drives the lead screw 201a to rotate, and drives the first clamping arm 200a and the second clamping arm 200b to slide towards each other to clamp the wafer cassette 30 and the device body 10. And when the pressure sensor 200e detects that the clamping force triggers the threshold range, it indicates that the wafer cassette 30 and the device body 10 are locked, then the drive motor 201b stops driving, and the first clamping arm 200a and the second clamping arm 200b maintain their current positions. The valve in the ventilation pipe T is opened, and air is inflated into the wafer cassette 30 through the ventilation port G to reduce the oxygen content in the wafer cassette 30 and avoid affecting the yield of the wafer due to oxidation. And after the inflation is completed, the drive motor 201b in the bidirectional lead screw 201 drives the lead screw 201a to rotate in the reverse direction, so that the first clamping arm 200a and the second clamping arm 200b slide away from each other, and the relative position locking of the wafer cassette 30 and the device body 10 is released.

[0050] In summary, the hanging buffer device and the automatic material handling system provided in this embodiment are provided with the locking unit 20. The clamping arm assembly 200 in the locking unit 20 can clamp the wafer cassette 30 and the device body 10 when the bearing surface 100a bears the wafer cassette 30, so as to lock the position of the wafer cassette 30 relative to the device body 10, so as to avoid the wafer cassette 30 from being displaced due to gas impact when the device body 10 supplies purified gas into the wafer cassette 30, effectively alleviating the air leakage problem during the air supply process. It not only facilitates the stable air supply of the device body 10 to the wafer cassette 30, but also improves the safety of air supply and the purification effect on the wafer cassette 30.

[0051] In addition, it should also be recognized that although the present invention has been disclosed above with preferred embodiments, the above embodiments are not intended to limit the present invention. For any person skilled in the art, without departing from the scope of the technical solution of the present invention, many possible changes and modifications can be made to the technical solution of the present invention by using the technical content disclosed above, or modified into equivalent embodiments with equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the protection of the technical solution of the present invention.

Claims

1. A suspended caching device, characterized in that, It includes a device body and a locking unit; wherein, The device body has a bearing surface for bearing a wafer cassette; The locking unit includes a clamping arm assembly; the clamping arm assembly is arranged on the side of the device body so as to be able to clamp and lock the wafer cassette and the device body when the bearing surface bears the wafer cassette; and, Purified gas is passed through the device body, and the bearing surface has a ventilation port; and when the clamping arm assembly locks the wafer cassette and the device body, the purified gas can enter the wafer cassette through the ventilation port.

2. The suspended buffer device according to claim 1, characterized in that, The clamping arm assembly includes a first clamping arm and a second clamping arm; the first clamping arm and the second clamping arm are respectively arranged on both sides of the device body and can slide towards each other to clamp and lock the wafer cassette and the device body.

3. The suspended buffer device according to claim 2, wherein The locking unit further includes a bidirectional lead screw; the first clamping arm and the second clamping arm are respectively connected to the bidirectional lead screw.

4. The suspended buffer device according to claim 3, wherein, The bidirectional lead screw includes a lead screw and a driving motor; the lead screw sequentially penetrates and is respectively connected to one ends of the first clamping arm and the second clamping arm; the driving motor is arranged at one end of the lead screw, and under the drive of the driving motor, the lead screw rotates to drive the first clamping arm and the second clamping arm to slide towards each other or away from each other.

5. The suspended buffer device according to claim 3 or 4, characterized in that, The locking unit further includes a bottom plate; the bidirectional lead screw is arranged on the bottom plate and is detachably connected to the bottom plate.

6. The suspension cache device according to claim 5, characterized in that, The surface of the bottom plate facing the bidirectional lead screw has a guide rail, and the guide rail extends along the moving direction of the first clamping arm and the second clamping arm; and, One ends of the first clamping arm and the second clamping arm connected to the bidirectional lead screw both have connecting parts, and the connecting parts are adapted to the guide rail so that the first clamping arm and the second clamping arm can slide along the guide rail.

7. The suspension cache device according to claim 5, characterized in that The device body further has a through cavity, and the bottom plate penetrates through the through cavity and is detachably connected to the bottom wall of the through cavity.

8. The suspended cache device according to claim 2, wherein Claw fingers are respectively arranged on the opposite surfaces of the first clamping arm and the second clamping arm, and the claw fingers are located above the bearing surface so as to be able to at least clamp the wafer cassette when the bearing surface bears the wafer cassette.

9. The suspended buffer device according to claim 2, wherein The clamping arm assembly further includes a plurality of pressure sensors, and the plurality of pressure sensors are arranged on the first clamping arm and the second clamping arm for detecting the clamping force when the first clamping arm and the second clamping arm clamp the wafer cassette and the device body.

10. An automatic material handling system, characterized in that, It includes the suspended buffer device according to any one of claims 1 to 9.

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