TVS packaging unit

Abstract

The utility model relates to the technical field of TVS packaging, in particular to a TVS packaging unit which comprises a TVS core body, a packaging assembly is arranged on the outer side of the TVS core body, the packaging assembly is composed of an outer shell body and an inner shell body, the outer shell body comprises a lower shell body and an upper shell body, and the inner shell body comprises packaging seats which are distributed in a bilateral symmetry mode. The inner wall of the lower shell and the inner wall of the upper shell are each provided with four sets of symmetrically-distributed sliding grooves, sliding blocks slidably connected with the sliding grooves are arranged on the front side and the rear side of the packaging base, limiting mechanisms for fixing the packaging base are arranged on the inner sides of the sliding blocks, vertically-symmetrical heat dissipation frames are arranged on the inner wall of the outer shell, and a heat conduction mechanism is arranged on the inner side of the packaging base. The heat conduction mechanism comprises a square frame, a U-shaped piece and a second cooling fin. The TVS core packaging unit is provided with the outer shell, the inner shell and the limiting mechanism, the packaging process is rapid, simple and convenient, packaging work can be carried out according to the actual length of the TVS core, the applicability of the packaging unit is improved, and the packaging unit has high heat dissipation performance.

Description

Technical Field

[0001] The utility model relates to the technical field of TVS packaging, in particular to a packaging unit of a TVS. Background Technique

[0002] TVS is a high-efficiency protection device in the form of a diode. When processing TVS, in order to improve the insulation performance, mechanical strength and heat dissipation performance of TVS and protect the electronic circuit from transient overvoltage damage, the TVS core is usually packaged and fixed.

[0003] In the prior art, a packaging unit of a TVS with the publication number of CN220543898U adopts the scheme of "including an upper packaging shell and a lower packaging shell, a heat-conducting silica gel is fixedly connected to the bottom side inside the lower packaging shell, a TVS diode is arranged on the top side of the heat-conducting silica gel, and a plurality of first heat dissipation structures are arranged on the bottom side of the heat-conducting silica gel". This scheme can discharge the heat generated by the TVS diode during operation to the outside, avoiding the situation of temperature rise inside the upper packaging shell and the lower packaging shell, and further avoiding the influence of high temperature on the TVS diode, ensuring the service life of the TVS diode.

[0004] However, the above scheme still has some deficiencies. For example, the above scheme adjusts and fixes according to the actual length of the TVS diode through the cooperation of a slide plate, a fixing plate, a fixing screw rod and a fixing nut. During the fixing process, it is necessary to repeatedly control the rotation of the fixing nut, and the space inside the packaging shell is relatively narrow, and the control of the fixing nut is inconvenient, resulting in a cumbersome packaging process of the TVS and a low packaging efficiency. In addition, when the TVS is installed and used, the heat sink at its bottom is easy to rub against the circuit board, resulting in scratches on the surface of the circuit board. In view of this, the utility model provides a packaging unit of a TVS. Summary of the Invention

[0005] The purpose of the utility model is to provide a packaging unit of a TVS, which has the advantages of a fast and simple packaging process and can be adjusted according to the actual length of the TVS diode, so as to solve the problems of cumbersome packaging process and low efficiency proposed in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solutions:

[0007] A packaging unit for a TVS, comprising a TVS chip body, with a packaging component arranged on the outer side of the TVS chip body. The packaging component consists of an outer shell and an inner shell. The outer shell includes a lower shell and an upper shell symmetrically distributed up and down. The inner shell includes packaging seats symmetrically distributed left and right. Four groups of symmetrically distributed sliding grooves are provided on the inner walls of the lower shell and the upper shell. Sliders slidingly connected to the sliding grooves are provided on the front and rear sides of the packaging seats, and a limiting mechanism for fixing the packaging seats is provided on the inner sides of the sliders. Heat dissipation racks symmetrically distributed up and down are arranged on the inner wall of the outer shell. A heat conduction mechanism is provided inside the packaging seats. The heat conduction mechanism includes a square frame, a U-shaped piece, and a second heat dissipation fin.

[0008] As a preferred technical solution, first connection blocks are arranged on the outer wall of the lower shell and near the four corners. First insertion rods are arranged on the outer wall of the upper shell and near the four corners. The first insertion rods are in snap-fit connection with the first connection blocks. The front and rear sides of the lower shell and the upper shell are fixed by screws.

[0009] As a preferred technical solution, second connection blocks are arranged on the outer wall of the lower inner shell and near the four corners. Second insertion rods are arranged on the outer wall of the upper inner shell and near the four corners. The second insertion rods are in snap-fit connection with the second connection blocks.

[0010] As a preferred technical solution, a number of uniformly distributed limiting teeth are arranged inside the sliding grooves. A cavity is arranged inside the slider, and the side of the cavity close to the limiting teeth is of an open structure. The limiting mechanism includes a spring piece installed inside the cavity. The end of the spring piece is in snap-fit connection with the limiting teeth for restricting the outward sliding of the packaging seat.

[0011] As a preferred technical solution, the heat dissipation rack consists of two groups of parallel heat dissipation plates, and a number of arrayed air flow channels are arranged between the two groups of heat dissipation plates.

[0012] As a preferred technical solution, a number of uniformly distributed first heat dissipation fins are arranged on the top of the upper shell. The first heat dissipation fins are welded and fixed to the heat dissipation rack on the inner top wall of the upper shell.

[0013] As a preferred technical solution, the square frame, the U-shaped piece, and the second heat dissipation fin are integrally formed with the packaging seat. The square frame is arranged inside the packaging seat and near the edge. The U-shaped piece is arranged on the left side of the square frame, and the lower surface of the U-shaped piece is in contact with the heat dissipation rack. A number of heat conduction grooves spaced from the U-shaped piece are provided at the bottom of the packaging seat. The second heat dissipation fin penetrates through the side wall of the packaging seat and is connected to the packaging seat.

[0014] As a preferred technical solution, a number of evenly distributed heat-conducting fins are fixedly welded inside the square frame, and a buffer pad is fixedly adhered to the side wall of the square frame close to the TVS core body.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0016] 1. In the present utility model, by providing an outer shell, an inner shell and a limiting mechanism, after the TVS core body is placed inside the inner shell, it is only necessary to push the encapsulation seat to contact the edge of the TVS core body, and fix the encapsulation seat through the limiting mechanism, then the encapsulation work can be completed. The encapsulation process is fast and simple, and the encapsulation work can be carried out according to the actual length of the TVS core body, improving the applicability of the encapsulation unit.

[0017] 2. In the present utility model, by providing a heat dissipation frame and a heat conduction mechanism, after encapsulating the TVS core body, the square frame, the U-shaped sheet and the second heat dissipation fin cooperate with each other to guide and dissipate the heat generated by the TVS core body, and enhance the heat dissipation effect on the TVS core body through the heat dissipation frame. Moreover, the bottom of the lower shell is a flat structure, which can avoid damaging the circuit board when the TVS is installed while ensuring the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0020] Figure 2 It is a cross-sectional view of the overall structure of the present utility model;

[0021] Figure 3 It is a schematic diagram of the structure of the encapsulation component of the present utility model;

[0022] Figure 4 It is a schematic diagram of the structure of the outer shell of the present utility model;

[0023] Figure 5 It is a schematic diagram of the structure of the encapsulation seat of the present utility model;

[0024] Figure 6 It is a schematic diagram of the structure of the heat conduction mechanism of the present utility model;

[0025] Figure 7 It is a schematic diagram of the structure of the limiting mechanism of the present utility model.

[0026] In the figure: 1. TVS chip body; 2. Outer housing; 21. Lower housing; 211. First connecting block; 22. Upper housing; 221. First insertion rod; 23. Heat dissipation frame; 231. Air flow channel; 24. First heat sink; 25. Slide groove; 251. Limiting teeth; 3. Inner housing; 31. Second connecting block; 32. Second insertion rod; 33. Encapsulation seat; 34. Slide block; 341. Cavity; 35. Spring piece; 4. Square frame; 41. U-shaped piece; 411. Heat conduction groove; 42. Second heat sink; 43. Heat conduction fin; 44. Buffer pad. Specific embodiments

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] According to the attached Figure 1-7 As shown, the embodiment of the present invention provides a packaging unit for a TVS, including a TVS chip body 1. An encapsulation component is arranged on the outer side of the TVS chip body 1. The encapsulation component is composed of an outer housing 2 and an inner housing 3. The outer housing 2 includes a lower housing 21 and an upper housing 22 that are symmetrically distributed up and down. The inner housing 3 includes encapsulation seats 33 that are symmetrically distributed left and right. Four groups of symmetrically distributed slide grooves 25 are provided on the inner walls of the lower housing 21 and the upper housing 22. Slide blocks 34 that are slidably connected to the slide grooves 25 are arranged on the front and rear sides of the encapsulation seats 33. And a limiting mechanism for fixing the encapsulation seats 33 is arranged inside the slide blocks 34. Heat dissipation frames 23 that are symmetrically distributed up and down are arranged on the inner wall of the outer housing 2. A heat conduction mechanism is arranged inside the encapsulation seats 33. The heat conduction mechanism includes a square frame 4, a U-shaped piece 41, and a second heat sink 42.

[0029] When encapsulating the TVS chip 1, first move the TVS chip 1 to the inside of the lower shell 21 so that the TVS chip 1 is located between the encapsulation seats 33 on the left and right. Then, move the upper shell 22 and drive the inner shell 3 on the upper side. After the upper and lower groups of outer shells 2 and inner shells 3 are assembled respectively, push the encapsulation seat 33 to make the encapsulation seat 33 close to the TVS chip 1 and make the square frame 4 contact the edge of the TVS chip 1, thereby encapsulating and fixing the TVS chip 1. And fix the encapsulation seat 33 through the limiting mechanism to prevent the encapsulation seat 33 from moving and affecting the encapsulation effect. The encapsulation process is fast and simple, and can encapsulate TVS chips 1 of different lengths, improving the applicability of the encapsulation unit. After encapsulation, through the cooperation of the square frame 4, the U-shaped piece 41 and the second heat sink 42, the heat generated by the TVS chip 1 can be guided and dissipated, and the heat dissipation effect of the TVS chip 1 is enhanced through the heat dissipation frame 23.

[0030] First connection blocks 211 are provided on the outer wall of the lower shell 21 and near the four corners. First insertion rods 221 are provided on the outer wall of the upper shell 22 and near the four corners. The first insertion rods 221 are in snap-fit with the first connection blocks 211. The front and back of the lower shell 21 and the upper shell 22 are fixed by screws, so that the outer shells 2 on the upper and lower sides can be quickly connected and fixed, improving the convenience of the encapsulation process.

[0031] Second connection blocks 31 are provided on the outer wall of the lower inner shell 3 and near the four corners. Second insertion rods 32 are provided on the outer wall of the upper inner shell 3 and near the four corners. The second insertion rods 32 are in snap-fit with the second connection blocks 31, so that the upper and lower groups of inner shells 3 can be quickly connected and fixed, facilitating the encapsulation of the TVS chip 1.

[0032] A number of uniformly distributed limiting teeth 251 are provided inside the sliding groove 25. A cavity 341 is provided inside the sliding block 34, and one side of the cavity 341 close to the limiting teeth 251 is an open structure. The limiting mechanism includes a spring piece 35 installed inside the cavity 341. The end of the spring piece 35 is in snap-fit with the limiting teeth 251 for restricting the outward sliding of the encapsulation seat 33.

[0033] When pushing the encapsulation seat 33 close to the TVS chip 1, the sliding block 34 can be driven to slide inside the sliding groove 25, and the limiting teeth 251 and the spring piece 35 interact with each other, causing the spring piece 35 to elastically deform towards the inside of the cavity 341. When the square frame 4 inside the encapsulation seat 33 fits with the edge of the TVS chip 1, the spring piece 35 is in snap-fit with the limiting teeth 251, which can restrict the sliding block 34, thereby preventing the encapsulation seat 33 from moving and affecting the encapsulation of the TVS chip 1. And the whole operation process is fast and convenient, improving the encapsulation efficiency of the encapsulation unit while facilitating the encapsulation of TVS chips 1 of different widths.

[0034] The heat dissipation rack 23 is composed of two groups of parallel heat dissipation plates, and a number of air flow channels 231 are arranged in an array between the two groups of heat dissipation plates. The air flow channels 231 can enhance the air circulation inside the heat dissipation rack 23, facilitating the heat dissipation of the TVS chip 1.

[0035] A number of evenly distributed first heat dissipation fins 24 are arranged on the top of the upper shell 22. The first heat dissipation fins 24 are welded and fixed to the heat dissipation rack 23 on the inner top wall of the upper shell 22. The first heat dissipation fins 24 can be in large-area contact with the air above the upper shell 22, increasing the heat dissipation area and further enhancing the heat dissipation effect of the heat dissipation rack 23. In addition, since the first heat dissipation fins 24 are only arranged on the upper shell 22, the bottom of the lower shell 21 remains flat. When the TVS is installed, the lower shell 21 will not cause excessive friction with the circuit board, thus avoiding scratches on the surface of the circuit board.

[0036] The square frame 4, the U-shaped piece 41 and the second heat dissipation fin 42 are all integrally formed with the encapsulation seat 33. The square frame 4 is arranged inside the encapsulation seat 33 and near the edge. The U-shaped piece 41 is arranged on the left side of the square frame 4, and the lower surface of the U-shaped piece 41 is attached to the heat dissipation rack 23. A number of heat conduction grooves 411 spaced from the U-shaped piece 41 are formed at the bottom of the encapsulation seat 33. The second heat dissipation fin 42 penetrates the side wall of the encapsulation seat 33 and is connected to the encapsulation seat 33.

[0037] Through the mutual cooperation of the square frame 4, the U-shaped piece 41 and the second heat dissipation fin 42, the heat can be guided outside the TVS chip 1, facilitating the heat dissipation of the TVS chip 1. The lower surface of the U-shaped piece 41 is attached to the heat dissipation rack 23, which can quickly conduct the heat to the heat dissipation rack 23 for heat dissipation. The setting of the heat conduction grooves 411 can enhance the air circulation between the heat conduction mechanism and the TVS chip 1, facilitating the heat transfer.

[0038] A number of evenly distributed heat conduction fins 43 are welded and fixed inside the square frame 4. The heat conduction fins 43 can strengthen the structure of the square frame 4, prevent the square frame 4 from being deformed under pressure during the encapsulation process, and further improve the heat conduction and dissipation effect. A buffer pad 44 is adhesively fixed on the side wall of the square frame 4 close to the TVS chip 1. The buffer pad 44 is made of a silicone heat conduction gasket, which has high heat conduction performance and high temperature resistance. While ensuring the heat conduction efficiency, it can buffer between the square frame 4 and the TVS chip 1, thereby ensuring that the end of the spring piece 35 can be tightly clamped with the limit teeth 251, enhancing the fixing effect on the encapsulation seat 33.

[0039] When a TVS packaging unit of the present utility model is in use, first, move the TVS core body 1 to the inside of the lower housing 21 so that the TVS core body 1 is located between the packaging seats 33 on the left and right sides. Then, move the upper housing 22 so that the first insertion rod 221 is provided with the first connection block 211, and the second insertion rod 32 is in snap-fit connection with the second connection block 31, thereby connecting the upper and lower groups of outer housings 2 to each other and connecting the upper and lower groups of inner housings 3 to each other. Then, push the packaging seat 33 close to the TVS core body 1, so that the slider 34 slides inside the chute 25 and the spring piece 35 undergoes elastic deformation. When the buffer pad 44 contacts the side surface of the TVS core body 1 and the packaging seat 33 can no longer move, the end of the spring piece 35 is in snap-fit connection with the limit teeth 251 under its own elastic action, thereby restricting and fixing the packaging seat 33. Then, fix the upper and lower outer housings 2 with bolts to complete the packaging of the TVS core body 1.

[0040] The above shows and describes the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and descriptions in the specification are only preferred examples of the present utility model and are not used to limit the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. An encapsulation unit of a TVS, comprising a TVS chip (1), wherein an encapsulation component is arranged outside the TVS chip (1), and is characterized in that: The encapsulation component is composed of an outer housing (2) and an inner housing (3). The outer housing (2) includes a lower housing (21) and an upper housing (22) which are symmetrically distributed up and down. The inner housing (3) includes an encapsulation seat (33) which is symmetrically distributed left and right. Four groups of symmetrically distributed sliding grooves (25) are provided on the inner walls of the lower housing (21) and the upper housing (22). Sliders (34) which are slidably connected to the sliding grooves (25) are provided on the front and rear sides of the encapsulation seat (33), and a limiting mechanism for fixing the encapsulation seat (33) is provided inside the sliders (34). Symmetric heat dissipation frames (23) are provided on the inner wall of the outer housing (2) up and down. A heat conduction mechanism is provided inside the encapsulation seat (33). The heat conduction mechanism includes a square frame (4), a U-shaped piece (41), and a second heat sink (42).

2. The encapsulation unit of the TVS according to claim 1, wherein: First connection blocks (211) are provided on the outer wall of the lower housing (21) and near the four corners. First insertion rods (221) are provided on the outer wall of the upper housing (22) and near the four corners. The first insertion rods (221) are in snap-fit connection with the first connection blocks (211). The front and rear sides of the lower housing (21) and the upper housing (22) are fixed by screws.

3. The encapsulation unit of the TVS according to claim 1, characterized in that: Second connection blocks (31) are provided on the outer wall of the lower inner housing (3) and near the four corners. Second insertion rods (32) are provided on the outer wall of the upper inner housing (3) and near the four corners. The second insertion rods (32) are in snap-fit connection with the second connection blocks (31).

4. The encapsulation unit of the TVS according to claim 1, characterized in that: A number of uniformly distributed limiting teeth (251) are provided inside the sliding groove (25). A cavity (341) is provided inside the slider (34), and the side of the cavity (341) close to the limiting teeth (251) is of an open structure. The limiting mechanism includes a spring piece (35) installed inside the cavity (341). The end of the spring piece (35) is in snap-fit connection with the limiting teeth (251) for restricting the outward sliding of the encapsulation seat (33).

5. The encapsulation unit of the TVS according to claim 1, wherein: The heat dissipation frame (23) is composed of two groups of parallel heat dissipation plates, and a number of arrayed air flow channels (231) are provided between the two groups of heat dissipation plates.

6. The encapsulation unit of the TVS according to claim 5, characterized in that: A number of uniformly distributed first heat sinks (24) are provided on the top of the upper housing (22). The first heat sinks (24) are welded and fixed to the heat dissipation frame (23) on the inner top wall of the upper housing (22).

7. The encapsulation unit of the TVS according to claim 1, wherein: The square frame (4), the U-shaped piece (41), and the second heat sink (42) are integrally formed with the encapsulation seat (33). The square frame (4) is provided inside the encapsulation seat (33) and near the edge. The U-shaped piece (41) is provided on the left side of the square frame (4), and the lower surface of the U-shaped piece (41) is in contact with the heat dissipation frame (23). A number of heat conduction grooves (411) which are spaced from the U-shaped piece (41) are provided at the bottom of the encapsulation seat (33). The second heat sink (42) penetrates through the side wall of the encapsulation seat (33) and is connected to the encapsulation seat (33).

8. The encapsulation unit of the TVS according to claim 7, characterized in that: A number of uniformly distributed heat-conducting fins (43) are fixedly welded inside the square frame (4), and a buffer pad (44) is fixedly adhered to the side wall of the square frame (4) close to the TVS core (1).

Images