Radiator and electronic equipment

Abstract

The utility model relates to the technical field of semiconductor chip heat radiation, and discloses a heat radiator and electronic equipment, the heat radiator comprises a heat radiation member, a heat transfer member and a first heat pipe; the heat dissipation piece comprises a first heat dissipation plate, and a mounting hole is formed in the first heat dissipation plate; the heat transfer piece comprises a first heat transfer plate, the first heat transfer plate penetrates through the mounting hole, the outer side wall of the first heat transfer plate is connected with the hole wall of the mounting hole, and the first heat transfer plate is provided with a first heat transfer surface and a second heat transfer surface; the first heat pipe is connected to the first heat transfer surface; the heat conductivity of the heat transfer piece is greater than that of the heat dissipation piece; according to the radiator provided by the utility model, the first heat transfer plate penetrates through the mounting hole of the first radiating plate and is tightly connected with the first radiating plate, and the heat conductivity of the heat transfer piece is greater than that of the radiating piece, so that the manufacturing process can be simplified, the processing cost is reduced, the structure is simpler and more compact, and the material cost and weight are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip heat dissipation, in particular to a radiator and an electronic device. Background Art

[0002] With the development of semiconductor chip technology towards high performance and high integration, as the core of data processing, the computing power of artificial intelligence chips has increased significantly with a sharp increase in power consumption, posing stringent requirements for heat dissipation performance. In server systems adopting the OAM (Open Accelerator Module) standard, to meet the high throughput requirements of AI operations, large-power bare Die packaged chips are the mainstream choice for heat dissipation in electronic devices because they can reduce thermal resistance and improve heat dissipation efficiency. Currently, there are mainly two technical routes for bare Die package heat dissipation: The first is the VC (vapor chamber) + heat pipe radiator solution. Although this solution can achieve heat conduction, the vapor chamber mostly uses copper material, resulting in high material costs. Moreover, its complex structure not only leads to an increase in processing costs but also wastes heat dissipation space due to its large volume, making it difficult to adapt to the increasingly stringent thin and light requirements of electronic devices under the OAM standard. The second is the 3DVC radiator solution, which enhances heat dissipation capacity through a three-dimensional structure. However, its complex process and extremely high manufacturing precision requirements lead to a low yield rate, a significant increase in costs, a substantial extension of the production cycle, and further reduce the reliability of the heat dissipation system, making it difficult to meet the requirements of high-stability operation of artificial intelligence chips. Summary of the Utility Model

[0003] Aiming to solve at least one of the technical problems existing in the prior art, the utility model aims to provide a radiator and an electronic device with the radiator, and the structure of the radiator is simple and the processing cost is low.

[0004] To achieve the above object, in a first aspect, the utility model provides a radiator having a first direction, a second direction, and a third direction that are perpendicular to each other in pairs. The radiator is used for dissipating heat from a chip, and the radiator includes a heat dissipation member, a heat transfer member, and a first heat pipe; the heat dissipation member includes a first heat dissipation plate, and the first heat dissipation plate is provided with an installation hole penetrating along the first direction; the heat transfer member includes a first heat transfer plate, the first heat transfer plate is inserted into the installation hole, and the outer side wall of the first heat transfer plate is connected to the hole wall of the installation hole. The first heat transfer plate has a first heat transfer surface and a second heat transfer surface opposite to each other in the first direction; the first heat pipe is connected to the first heat transfer surface; wherein, the thermal conductivity of the heat transfer member is greater than the thermal conductivity of the heat dissipation member.

[0005] In some embodiments, the first heat transfer surface is provided with first heat transfer grooves; the first heat pipe includes a first horizontal pipe section and a first vertical pipe section, at least part of the first horizontal pipe section is disposed in the first heat transfer grooves, and the outer wall of the first horizontal pipe section is connected to the groove wall of the first heat transfer grooves. The first vertical pipe section extends along the first direction, and the first vertical pipe sections are connected to both ends of the first horizontal pipe section in the second direction.

[0006] In some embodiments, the heat sink further includes a plurality of heat dissipation fins, the heat dissipation fins are located on a side of the first heat transfer surface away from the second heat transfer surface, the plurality of heat dissipation fins are arranged along the first direction, and the heat dissipation fins are provided with first connection holes; the first vertical pipe section passes through the first connection holes, and the outer side wall of the first vertical pipe section is connected to the hole wall of the first connection holes.

[0007] In some embodiments, the first heat pipe further includes a first bent pipe section, and the first horizontal pipe section is connected to the first vertical pipe section through the first bent pipe section.

[0008] In some embodiments, the number of the first heat pipes is multiple, the multiple first heat pipes are arranged at intervals along the third direction; the first vertical pipe sections of the multiple first heat pipes are arranged in a straight line along the third direction.

[0009] In some embodiments, the heat sink further includes a plurality of heat conducting fins, the heat conducting fins are located on a side of the first heat transfer surface away from the second heat transfer surface, the heat conducting fins are connected to the first heat dissipation plate, the plurality of heat conducting fins are arranged along the second direction, the heat conducting fins are provided with first heat conducting grooves, and the groove walls of the first heat conducting grooves are connected to the outer walls of the first horizontal pipe sections.

[0010] In some embodiments, the radiator further includes a second heat pipe, which is located on one side of the first heat pipe in the third direction; the second heat pipe includes a second horizontal pipe section and a second vertical pipe section, the second vertical pipe section extends along the first direction, and both ends of the second horizontal pipe section in the second direction are connected to the second vertical pipe section; the heat dissipation fins are provided with second connection holes; the second vertical pipe section passes through the second connection holes, and the outer wall of the second vertical pipe section is connected to the hole wall of the second connection holes; the heat transfer member further includes a second heat transfer plate, and both ends of the first heat transfer plate in the third direction are connected to the second heat transfer plate, and each second heat transfer plate is connected to at least one second heat pipe; the second heat transfer plate has opposite third heat transfer surfaces and fourth heat transfer surfaces in the first direction, the third heat transfer surface is located on one side of the first heat transfer surface away from the second heat transfer surface, the second horizontal pipe section is connected to the third heat transfer surface, and the fourth heat transfer surface is connected to the first heat dissipation plate.

[0011] In some embodiments, the first heat dissipation plate has opposite first heat conduction surfaces and second heat conduction surfaces in the first direction, the first heat conduction surface is located on one side of the first heat transfer surface away from the second heat transfer surface, the first heat conduction surface is provided with a mounting groove, the mounting groove has a groove bottom surface, the mounting hole penetrates through the groove bottom surface, and the fourth heat transfer surface is adhesively connected to the groove bottom surface.

[0012] In some embodiments, the heat transfer member further includes a third heat transfer plate, the third heat transfer plate is connected to the third heat transfer surface, a second heat transfer groove is provided on a surface of the third heat transfer plate on a side away from the third heat transfer surface in the first direction, at least a part of the second horizontal pipe section is disposed in the second heat transfer groove, and the outer wall of the second horizontal pipe section is connected to the groove wall of the second heat transfer groove.

[0013] In some embodiments, the second heat pipe further includes a second bent pipe section, the second horizontal pipe section is connected to the second vertical pipe section through the second bent pipe section; the third heat transfer surface is a flat surface, the first heat conduction surface is a flat surface, and the lowest points of the third heat transfer surface, the first heat conduction surface and the second heat transfer groove are all located in the same reference plane; both the first heat conduction surface and the third heat transfer surface are welded to the second horizontal pipe section.

[0014] In some embodiments, the second horizontal pipe section includes a first straight pipe, a first arc-shaped pipe, and a second straight pipe. The first straight pipe extends along the second direction. The first arc-shaped pipe is connected to both ends of the first straight pipe in the second direction. The second straight pipe is connected to one end of the first arc-shaped pipe away from the first straight pipe. The second bent pipe section is connected to one end of the second straight pipe away from the first arc-shaped pipe. The first straight pipe is welded to the third heat transfer surface. The first arc-shaped pipe is welded to the first heat conduction surface and the third heat transfer surface. The second straight pipe is welded to the first heat conduction surface.

[0015] In some embodiments, the heat conduction fins are provided with second heat conduction grooves, and the groove walls of the second heat conduction grooves are connected to the outer walls of the second horizontal pipe section.

[0016] In some embodiments, the radiator further includes a third heat pipe. Along the third direction, the third heat pipe is located between the first heat pipe and the second heat pipe. Each second heat transfer plate is connected to at least one third heat pipe. The third heat pipe includes a third horizontal pipe section and a third vertical pipe section. The third horizontal pipe section is connected to the third heat transfer surface. The third vertical pipe section extends along the first direction. The third horizontal pipe section is connected to the third vertical pipe section at both ends in the second direction. The heat dissipation fins are provided with third connection holes. The third vertical pipe section passes through the third connection holes, and the outer side wall of the third vertical pipe section is connected to the hole walls of the third connection holes.

[0017] In some embodiments, the second vertical pipe section and the third vertical pipe section are arranged in a straight line along the third direction.

[0018] In some embodiments, along the second direction, the distance between the two first vertical pipe sections of the first heat pipe is amm, and the distance between the two second vertical pipe sections of the second heat pipe is bmm. It satisfies: a < b.

[0019] In some embodiments, the heat transfer member further includes a third heat transfer plate. The third heat transfer plate is connected to the third heat transfer surface. A third heat transfer groove is provided on one surface of the third heat transfer plate facing away from the third heat transfer surface in the first direction. At least a part of the third horizontal pipe section is arranged in the third heat transfer groove, and the outer wall of the third horizontal pipe section is connected to the groove wall of the third heat transfer groove.

[0020] In some embodiments, the third heat pipe further includes a third bent pipe section. The third horizontal pipe section is connected to the third vertical pipe section through the third bent pipe section. The third heat transfer surface is a flat surface. The third heat transfer surface and the lowest point of the third heat transfer groove are both located in the same reference plane. The third heat transfer surface is welded to the third horizontal pipe section.

[0021] In some embodiments, the third horizontal pipe section includes a third straight pipe and a second arc-shaped pipe. The third straight pipe extends along the second direction, and the second arc-shaped pipes are connected to both ends of the third straight pipe in the second direction. The third bent pipe section is connected to one end of the second arc-shaped pipe away from the third straight pipe; both the third straight pipe and the second arc-shaped pipe are welded to the third heat transfer surface.

[0022] In some embodiments, the radiator further includes a fourth heat pipe. The fourth heat pipe includes a fourth horizontal pipe section and a fourth vertical pipe section. The fourth vertical pipe section extends along the first direction, and the fourth horizontal pipe section is connected to the fourth vertical pipe sections at both ends in the third direction; the heat dissipation member further includes a second heat dissipation plate, and the second heat dissipation plates are connected to both ends of the first heat dissipation plate in the second direction; the first heat dissipation plate has a first heat conduction surface and a second heat conduction surface opposite to each other in the first direction, and the first heat conduction surface is located on the side of the first heat transfer surface away from the second heat transfer surface; the second heat dissipation plate has a third heat conduction surface and a fourth heat conduction surface opposite to each other in the first direction, and the third heat conduction surface is located on the side of the first heat transfer surface away from the second heat transfer surface; along the third direction, the first heat conduction surface is located between the third heat conduction surface and the second heat conduction surface; at least one fourth heat pipe is connected to each second heat dissipation plate, the third heat conduction surface is provided with heat dissipation grooves, the fourth horizontal pipe section is arranged in the heat dissipation grooves, and the outer wall of the fourth horizontal pipe section is connected to the groove wall of the heat dissipation grooves; the heat dissipation fins are provided with fourth connection holes; the fourth vertical pipe section passes through the fourth connection holes, and the outer side wall of the fourth vertical pipe section is connected to the hole wall of the fourth connection holes.

[0023] In some embodiments, the radiator further includes a limiting member. The limiting member is located on the side of the fourth horizontal pipe section away from the fourth heat conduction surface in the first direction and is in contact with the fourth horizontal pipe section, and both ends of the limiting member are respectively connected to the two side walls of the heat dissipation grooves in the second direction; the fourth heat pipe further includes a fourth bent pipe section, and the fourth horizontal pipe section is connected to the fourth vertical pipe section through the fourth bent pipe section.

[0024] In some embodiments, the heat dissipation member further includes a plurality of first heat dissipation fins and a plurality of second heat dissipation fins. The first heat dissipation fins are connected to the first heat conduction surface, and the plurality of first heat dissipation fins are arranged at intervals along the second direction; the second heat dissipation fins are connected to the first heat conduction surface, and the plurality of second heat dissipation fins are arranged at intervals along the second direction; along the third direction, the first heat pipe is located between the first heat dissipation fins and the second heat dissipation fins.

[0025] In some embodiments, the material of the heat dissipating member is selected from aluminum alloy, and the material of the heat transfer member is selected from copper or copper alloy.

[0026] In a second aspect, the present utility model further provides an electronic device, which includes the radiator described in any one of the above, and further includes a circuit board. The circuit board includes a substrate and a main chip. The main chip is connected to the substrate, and the second heat transfer surface is adhesively connected to the main chip.

[0027] Compared with the prior art, the radiator provided by the embodiment of the present utility model has the following beneficial effects:

[0028] (1) By passing the first heat transfer plate through the mounting hole of the first heat dissipation plate and tightly connecting the two, and making the thermal conductivity of the heat transfer member greater than that of the heat dissipating member, the first heat transfer surface of the heat transfer member with a higher thermal conductivity can be adhesively connected to the bare DIE surface of the high-power consumption chip to enhance the heat conduction of the bare DIE surface. By connecting the first heat pipe to the first heat transfer surface, the heat conduction of the bare DIE surface can be further enhanced, enabling heat to be quickly dissipated along the first heat pipe, improving the heat dissipation efficiency of the radiator to meet the heat dissipation requirements of high-power consumption chips. Compared with the traditional VC + heat pipe radiator solution, the radiator provided by the present utility model does not require a complex heat spreader structure, which can not only simplify the manufacturing process and reduce the processing cost, but also make the structure of the radiator simpler and more compact, reducing the occupied space of the radiator, avoiding waste of heat dissipation space, and better meeting the requirements of the thin and light of electronic devices. Compared with the 3DVC radiator solution, the radiator provided by the present utility model does not require a complex three-dimensional molding process, has a simple process and a simple structure, can reduce the manufacturing precision requirements, improve the production yield, shorten the production cycle, and can reduce the reliability problems of the heat dissipation system caused by complex processes and structures to meet the requirements of the high-stability operation of artificial intelligence chips.

[0029] (2) By defining that the thermal conductivity of the heat transfer member is greater than that of the heat dissipating member, an aluminum alloy material with a lower thermal conductivity, lower density and lower cost can be selected to make the heat dissipating member, and copper or copper alloy with a higher thermal conductivity, higher density and higher cost can be selected to make the heat transfer member, so that the radiator provided by the present utility model can reduce the material cost and weight by using copper locally. Description of the Drawings

[0030] Figure 1 is a schematic structural diagram of a radiator provided by an embodiment of the present utility model;

[0031] Figure 2 is a front view of a radiator provided by an embodiment of the present utility model;

[0032] Figure 3It is a schematic structural diagram of a radiator after omitting the heat dissipation fins provided by an embodiment of the present utility model;

[0033] Figure 4 It is a front view of a radiator after omitting the heat dissipation fins provided by an embodiment of the present utility model;

[0034] Figure 5 It is a top view of a radiator after omitting the heat dissipation fins provided by an embodiment of the present utility model;

[0035] Figure 6 It is a schematic structural diagram of a heat dissipation member provided by an embodiment of the present utility model;

[0036] Figure 7 It is a schematic structural diagram of a heat transfer member provided by an embodiment of the present utility model;

[0037] Figure 8 It is a front view of a heat transfer member provided by an embodiment of the present utility model;

[0038] Figure 9 It is a side view of a first heat pipe provided by an embodiment of the present utility model;

[0039] Figure 10 It is a schematic structural diagram of a heat dissipation fin provided by an embodiment of the present utility model;

[0040] Figure 11 It is a schematic structural diagram of a heat conduction fin provided by an embodiment of the present utility model;

[0041] Figure 12 It is a schematic structural diagram of a second heat pipe provided by an embodiment of the present utility model;

[0042] Figure 13 It is a side view of a second heat pipe provided by an embodiment of the present utility model;

[0043] Figure 14 It is a top view of a second heat pipe provided by an embodiment of the present utility model;

[0044] Figure 15 It is a schematic structural diagram of a third heat pipe provided by an embodiment of the present utility model;

[0045] Figure 16 It is a side view of a third heat pipe provided by an embodiment of the present utility model;

[0046] Figure 17 It is a top view of a third heat pipe provided by an embodiment of the present utility model

[0047] Figure 18 It is a front view of a fourth heat pipe provided by an embodiment of the present utility model;

[0048] Figure 19It is a top view of a circuit board provided by an embodiment of the present utility model.

[0049] In the figure, 1 is a heat dissipation component; 11 is a first heat dissipation plate; 12 is a second heat dissipation plate; 13 is a first heat dissipation fin; 14 is a second heat dissipation fin; 111 is a mounting hole; 112 is a mounting groove; 113 is an avoidance groove; 121 is a heat dissipation groove; 1121 is a groove bottom surface.

[0050] 2 is a heat transfer component; 21 is a first heat transfer plate; 22 is a second heat transfer plate; 23 is a third heat transfer plate; 211 is a first heat transfer groove; 231 is a second heat transfer groove; 232 is a third heat transfer groove.

[0051] 3 is a first heat pipe; 31 is a first horizontal pipe section; 32 is a first vertical pipe section; 33 is a first bent pipe section.

[0052] 4 is a heat dissipation fin; 41 is a first connection hole; 42 is a second connection hole; 43 is a third connection hole; 44 is a fourth connection hole.

[0053] 5 is a heat conduction fin; 51 is a first heat conduction groove; 52 is a second heat conduction groove; 53 is a third heat conduction groove.

[0054] 6 is a second heat pipe; 61 is a second horizontal pipe section; 62 is a second vertical pipe section; 63 is a second bent pipe section; 611 is a first straight pipe; 612 is a first arc pipe; 613 is a second straight pipe.

[0055] 7 is a third heat pipe; 71 is a third horizontal pipe section; 72 is a third vertical pipe section; 73 is a third bent pipe section; 711 is a third straight pipe; 712 is a second arc pipe.

[0056] 8 is a fourth heat pipe; 81 is a fourth horizontal pipe section; 82 is a fourth vertical pipe section; 83 is a fourth bent pipe section.

[0057] 9 is a limiting component.

[0058] 101 is a first heat conduction surface; 102 is a second heat conduction surface; 103 is a third heat conduction surface; 104 is a fourth heat conduction surface.

[0059] 201 is a first heat transfer surface; 202 is a second heat transfer surface; 203 is a third heat transfer surface; 204 is a fourth heat transfer surface.

[0060] 300 is a circuit board; 301 is a substrate; 302 is a main chip; 303 is a first power chip; 304 is a second power chip.

[0061] Z is the first direction; X is the second direction; Y is the third direction. Specific embodiments

[0062] The specific embodiments of the present utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following embodiments are used to illustrate the present utility model, but are not used to limit the scope of the present utility model.

[0063] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.

[0064] The terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0065] In the present utility model, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0066] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath" and "under" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the horizontal height of the first feature is lower than that of the second feature.

[0067] Unless otherwise defined, all technical and scientific terms used in this utility model have the same meaning as commonly understood by those skilled in the technical field to which this utility model belongs; the terms used in the description of the application of this utility model are only for the purpose of describing specific embodiments and are not intended to limit this utility model; the terms "comprising" and "having" and any variations thereof in the description and claims of this utility model and the above drawings are intended to cover non-exclusive inclusion.

[0068] Referring to "embodiment" in this utility model means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of this utility model. The appearance of this phrase in various positions in the description does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments.

[0069] First aspect

[0070] As Figures 1-18 shown, a radiator preferably used in an embodiment of this utility model has a first direction Z, a second direction X and a third direction Y that are perpendicular to each other in pairs. The radiator is used for dissipating heat from a chip. The radiator includes a heat dissipation member 1, a heat transfer member 2 and a first heat pipe 3; the heat dissipation member 1 includes a first heat dissipation plate 11, and the first heat dissipation plate 11 is provided with a mounting hole 111 penetrating along the first direction Z; the heat transfer member 2 includes a first heat transfer plate 21, the first heat transfer plate 21 is inserted into the mounting hole 111, and the outer side wall of the first heat transfer plate 21 is connected to the hole wall of the mounting hole 111. The first heat transfer plate 21 has opposite first heat transfer surfaces 201 and second heat transfer surfaces 202 in the first direction Z; the first heat pipe 3 is connected to the first heat transfer surface 201; the thermal conductivity of the heat transfer member 2 is greater than the thermal conductivity of the heat dissipation member 1.

[0071] Based on this technical solution, by passing the first heat transfer plate 21 through the mounting hole 111 of the first heat dissipation plate 11 and tightly connecting the two, and making the thermal conductivity of the heat transfer member 2 greater than that of the heat dissipation member 1, the first heat transfer surface 201 of the heat transfer member 2 with a greater thermal conductivity can be adhesively connected to the bare DIE surface of the high-power chip, strengthening the heat conduction of the bare DIE surface. By connecting the first heat pipe 3 to the first heat transfer surface 201, the heat conduction of the bare DIE surface can be further strengthened, enabling heat to be quickly dissipated along the first heat pipe 3, improving the heat dissipation efficiency of the radiator to meet the heat dissipation requirements of the high-power chip. Compared with the traditional VC + heat pipe radiator solution, the radiator provided by the present utility model does not require a complex vapor chamber structure, which can not only simplify the manufacturing process and reduce the processing cost, but also make the structure of the radiator simpler and more compact, making the radiator occupy less space, avoiding waste of heat dissipation space, and better meeting the requirements of the thinning of electronic devices; compared with the 3D VC radiator solution, the radiator provided by the present utility model does not require a complex three-dimensional molding process, has a simple process and a simple structure, can reduce the manufacturing precision requirements, improve the production yield, shorten the production cycle, and can reduce the reliability problems of the heat dissipation system caused by complex processes and structures, so as to meet the requirements of the high-stability operation of artificial intelligence chips.

[0072] By defining that the thermal conductivity of the heat transfer member 2 is greater than that of the heat dissipation member 1, an aluminum alloy material with a lower thermal conductivity, lower density, and lower cost can be selected to make the heat dissipation member, and a copper or copper alloy with a higher thermal conductivity, higher density, and higher cost can be selected to make the heat transfer member, so that the radiator provided by the present utility model can reduce the material cost and weight by using copper locally.

[0073] A bare DIE refers to an unpackaged semiconductor small piece cut from a wafer, and is also called a bare die, bare chip, or die.

[0074] That the thermal conductivity of the heat transfer member 2 is greater than that of the heat dissipation member 1 means that the thermal conductivity of the heat transfer member 2 at the same temperature is greater than that of the heat dissipation member 1.

[0075] In this embodiment, the heat transfer member 2 and the heat dissipation member 1 are welded.

[0076] In this embodiment, the heat dissipation member 1 is obtained by a die-casting molding process.

[0077] In this embodiment, the first direction Z is the height direction of the radiator, the second direction X is the width direction of the radiator, and the third direction Y is the length direction of the radiator.

[0078] It should be noted that in the embodiments of the present utility model, the introduction of the first direction Z, the second direction X, and the third direction Y is only for the convenience of describing the spatial position relationship and should not be construed as a limitation on the scope of the embodiments of the present utility model. Therefore, the pairwise perpendicular relationship between the first direction Z, the second direction X, and the third direction Y can, according to the actual technical scenario, be interpreted as the first direction Z, the second direction X, and the third direction Y respectively representing three mutually perpendicular directions in three-dimensional space, or can reasonably be interpreted as a direction relationship that is nearly relatively perpendicular between the first direction Z, the second direction X, and the third direction Y. For example, the included angles between the first direction Z, the second direction X, and the third direction Y are all within the range of 85° - 95°... As long as the technical solution can conform to the spirit of the present utility model or achieve the technical effects described in the present utility model, it can be considered to fall within the scope defined by the appended claims.

[0079] Preferably, the material of the heat dissipation member 1 is selected from aluminum alloy, and the material of the heat transfer member 2 is selected from copper or copper alloy. The models of the aluminum alloy can include but are not limited to 6063 aluminum alloy, 6061 aluminum alloy, LF series aluminum alloy, LY series aluminum alloy, etc.

[0080] Referring to Figures 1-5 , the radiator provided by the embodiment of the present utility model further includes a plurality of heat dissipation fins 4, a plurality of heat conduction fins 5, a second heat pipe 6, a third heat pipe 7, a fourth heat pipe 8, and a limiting member 9.

[0081] Referring to Figures 1-6 , the heat dissipation member 1 further includes a second heat dissipation plate 12, a first heat dissipation fin 13, and a second heat dissipation fin 14.

[0082] Both ends of the first heat dissipation plate 11 in the second direction X are connected with a second heat dissipation plate 12. The second heat dissipation plate 12 has opposite third heat conduction surfaces 103 and fourth heat conduction surfaces 104 in the first direction Z, and the third heat conduction surface 103 is located on the side of the first heat transfer surface 201 away from the second heat transfer surface 202. Along the third direction Y, the first heat conduction surface 101 is located between the third heat conduction surface 103 and the second heat conduction surface 102. By providing the second heat dissipation plate 12 at both ends of the first heat dissipation plate 11 in the second direction X and making the first heat conduction surface 101 located between the third heat conduction surface 103 and the second heat conduction surface 102, the third heat conduction surface 103 of the second heat dissipation plate 12 protrudes upward relative to the first heat conduction surface 101 in the first direction Z, and the second heat dissipation plate 12 can play the role of a reinforcing rib to improve the structural strength of the heat dissipation member 1.

[0083] Each second heat dissipation plate 12 is connected with at least one fourth heat pipe 8, and the third heat conduction surface 103 is provided with a heat dissipation groove 121.

[0084] The first heat dissipation plate 11 has opposite first heat conducting surfaces 101 and second heat conducting surfaces 102 in the first direction Z. The first heat conducting surface 101 is located on the side of the first heat transfer surface 201 facing away from the second heat transfer surface 202. The first heat conducting surface 101 is provided with an installation groove 112. The installation groove 112 has a groove bottom surface 1121, and the installation hole 111 penetrates through the groove bottom surface 1121. Through the installation groove 112, the heat transfer component 2 can be quickly and accurately installed at a predetermined position of the heat dissipation component 1, facilitating the assembly between the heat transfer component 2 and the heat dissipation component 1. The second heat conducting surface 102 is provided with a plurality of avoidance grooves 113 for avoiding protrusions or components on the surface of the circuit board 300.

[0085] In this embodiment, along the first direction Z, the second heat conducting surface 102 is located between the first heat transfer surface 201 and the second heat transfer surface 202, that is, the second heat transfer surface 202 of the first heat transfer plate 21 protrudes downward along the first direction Z relative to the second heat conducting surface 102.

[0086] In this embodiment, the first heat conducting surface 101 is a flat surface.

[0087] The first heat sink 13 is connected to the first heat conducting surface 101, and a plurality of first heat sinks 13 are arranged at intervals along the second direction X. The second heat sink 14 is connected to the first heat conducting surface 101, and a plurality of second heat sinks 14 are arranged at intervals along the second direction X. Along the third direction Y, the first heat pipe 3 is located between the first heat sink 13 and the second heat sink 14. Through the first heat sink 13 and the second heat sink 14, the contact area between the heat dissipation component 1 and the air can be increased, which helps to further improve the overall heat dissipation capacity of the radiator, better reduce the chip operating temperature, and ensure the continuous and stable operation of high-power consumption chips.

[0088] Refer to Figures 1-5 、and Figure 7 According to the present invention, the heat transfer component 2 further includes a second heat transfer plate 22 and a third heat transfer plate 23.

[0089] Both ends of the first heat transfer plate 21 in the third direction Y are connected to the second heat transfer plate 22. Each second heat transfer plate 22 is connected to at least one second heat pipe 6. The second heat transfer plate 22 has opposite third heat transfer surfaces 203 and fourth heat transfer surfaces 204 in the first direction Z. The third heat transfer surface 203 is located on the side of the first heat transfer surface 201 facing away from the second heat transfer surface 202, and the fourth heat transfer surface 204 is connected to the first heat dissipation plate 11.

[0090] The fourth heat transfer surface 204 is adhesively connected to the bottom surface 1121 of the groove. By adhesively connecting the fourth heat transfer surface 204 to the bottom surface 1121 of the groove, the contact area between the heat dissipation member 1 and the heat transfer member 2 can be enhanced, enabling heat to be conducted from the second heat transfer plate 22 to the first heat dissipation plate 11 more quickly and efficiently through the fourth heat transfer surface 204, further improving the overall heat dissipation efficiency of the radiator.

[0091] The first heat transfer surface 201 is provided with a first heat transfer groove 211.

[0092] The third heat transfer plate 23 is connected to the third heat transfer surface 203. On the side surface of the third heat transfer plate 23 facing away from the third heat transfer surface 203 in the first direction Z, a second heat transfer groove 231 and a third heat transfer groove 232 are provided.

[0093] In this embodiment, the third heat transfer surface 203 is a flat surface. Moreover, the lowest points of the third heat transfer surface 203, the first heat conducting surface 101, the second heat transfer groove 231, and the third heat transfer groove 232 are all located in the same reference plane; that is, the lowest points of the third heat transfer surface 203, the first heat conducting surface 101, the second heat transfer groove 231, and the third heat transfer groove 232 are flush. In this way, it is convenient to reliably weld the second heat pipe 6 and the third heat pipe 7 to the first heat conducting surface 101 and / or the third heat transfer surface 203.

[0094] Refer to Figures 3-5 and Figure 9 , the first heat pipe 3 provided by the embodiment of the present utility model is a U-shaped heat pipe. Specifically, the first heat pipe 3 includes a first horizontal pipe section 31 and a first vertical pipe section 32. At least a part of the first horizontal pipe section 31 is disposed in the first heat transfer groove 211, and the outer wall of the first horizontal pipe section 31 is connected to the groove wall of the first heat transfer groove 211. The first vertical pipe section 32 extends along the first direction Z. Both ends of the first horizontal pipe section 31 in the second direction X are connected to the first vertical pipe section 32. By providing the first heat transfer groove 211 on the first heat transfer surface 201 and embedding at least a part of the first horizontal pipe section 31 of the first heat pipe 3 in the groove and tightly connecting it to the groove wall, this setting can shorten the distance between the evaporation end of the first heat pipe 3 and the bare DIE of the high-power consumption chip, enabling the heat generated by the bare DIE of the high-power consumption chip to be conducted to the heat pipe at a faster speed, which helps to improve the heat dissipation capacity of the radiator for the high-power consumption chip.

[0095] The first heat pipe 3 further includes a first bent pipe section 33. The first horizontal pipe section 31 is connected to the first vertical pipe section 32 through the first bent pipe section 33. The bending setting of the first bent pipe section 33 makes the layout of the first heat pipe 3 more flexible, enabling it to be reasonably bent according to the internal space of the electronic device and the actual position of the chip, and improving the adaptability of the radiator structure to the internal layout of complex electronic devices. Since the first horizontal pipe section 31 is connected to the first vertical pipe section 32 through the first bent pipe section 33, the first bent pipe section 33 can play a transitional role between the first horizontal pipe section 31 and the first vertical pipe section 32. Therefore, the stress concentration at the connection position between the first horizontal pipe section 31 and the first vertical pipe section 32 is reduced through the first bent pipe section 33.

[0096] Specifically, in this embodiment, the first horizontal pipe section 31 is a straight pipe structure extending along the second direction X, the first vertical pipe section 32 is a straight pipe structure extending along the first direction Z, and the first bent pipe section 33 is an arc-shaped pipe structure.

[0097] The number of the first heat pipes 3 is multiple, and the multiple first heat pipes 3 are arranged at intervals along the third direction Y; the first vertical pipe sections 32 of the multiple first heat pipes 3 are arranged in a straight line along the third direction Y. By arranging the first vertical pipe sections 32 of the multiple first heat pipes 3 in a straight line, when the wind direction flowing through the radiator is parallel to the third direction Y, the multiple first vertical pipe sections 32 arranged in a straight line reduce the blockage and disturbance of the air flow, avoiding the formation of turbulent flow or eddy current between the heat pipes, enabling the air flow to pass through the radiator more smoothly, reducing the flow resistance, improving the air circulation efficiency, enhancing the convective heat dissipation effect, and further improving the heat dissipation performance of the radiator.

[0098] Refer to Figures 1-2 and Figure 10 The radiator provided by the embodiment of the present invention further includes a plurality of heat dissipation fins 4. The heat dissipation fins 4 are located on the side of the first heat transfer surface 201 away from the second heat transfer surface 202, and the plurality of heat dissipation fins 4 are arranged along the first direction Z.

[0099] The heat dissipation fin 4 is provided with a first connection hole 41. The first vertical pipe section 32 passes through the first connection hole 41, and the outer side wall of the first vertical pipe section 32 is connected to the hole wall of the first connection hole 41. By arranging a plurality of heat dissipation fins 4 arranged along the first direction Z, the heat dissipation area of the radiator can be increased, and the overall heat dissipation efficiency of the radiator can be further improved. By passing the first vertical pipe section 32 of the first heat pipe 3 through the first connection hole 41 of the heat dissipation fin 4, an efficient heat conduction connection between the first heat pipe 3 and the heat dissipation fin 4 can be achieved, ensuring that the heat can be smoothly transferred from the first heat pipe 3 to the heat dissipation fin 4, dispersing the heat transferred by the first heat pipe 3 to each heat dissipation fin 4, avoiding the problem of excessive local temperature of the first heat pipe 3, and making the heat dissipation more uniform.

[0100] The heat dissipation fin 4 is further provided with a second connection hole 42 , a third connection hole 43 and a fourth connection hole 44 .

[0101] See also Figure 3 , Figure 5 and Figure 11 The heat-conducting fins 5 are located on the side of the first heat transfer surface 201 away from the second heat transfer surface 202, the heat-conducting fins 5 are connected to the first heat dissipation plate 11, and multiple heat-conducting fins 5 are arranged along the second direction X. The heat-conducting fins 5 are provided with a first heat-conducting groove 51, and the groove wall of the first heat-conducting groove 51 is connected to the outer wall of the first transverse pipe section 31. Since the heat-conducting fins 5 are located on the side of the first heat transfer surface 201 away from the second heat transfer surface 202 and are connected to the first heat dissipation plate 11, the heat-conducting fins 5 can play a limiting role on the side of the first cross-tube section 31 away from the second heat transfer surface 202 by tightly connecting the first heat-conducting grooves 51 of the heat-conducting fins 5 with the first cross-tube section 31, so that the first heat pipe 3 can be more tightly combined with the heat transfer element 2 through the heat-conducting fins 5, thereby strengthening the bonding force between the first heat pipe 3 and the heat transfer element 2; and when the wind direction flowing through the radiator is parallel to the third direction Y, the heat-conducting fins 5 can play a role in equalizing the temperature between the multiple first heat pipes 3 arranged at intervals along the third direction Y, thereby reducing the temperature difference caused by the multiple first heat pipes 3 being located at the upstream and downstream positions of the wind; specifically, in the actual heat dissipation process, the first heat pipe 3 located upstream of the wind preferentially contacts the cold air and has a higher heat dissipation efficiency, while the heat pipe downstream of the wind has a weakened heat dissipation effect due to the preheating of the air, and a temperature difference is easily formed. The heat-conducting fins 5 can quickly and evenly transfer heat between the first heat pipes 3 by virtue of their good thermal conductivity, so that the temperatures of the plurality of first heat pipes 3 tend to be consistent, thereby reducing the temperature difference between the plurality of first heat pipes 3 .

[0102] The thermal fins 5 can reduce the risk of the evaporation section of the first heat pipe 3 drying out. Specifically, when the chip continues to work at a high load, if the heat of the evaporation section of the first heat pipe 3 cannot be dissipated in time, it may cause the internal working fluid to quickly vaporize and be exhausted, resulting in drying out, which affects the heat dissipation function. The presence of the thermal fins 5 provides an additional heat dissipation path for the first heat pipe 3, which can promptly take away excess heat from the first heat pipe 3, reduce the temperature of the evaporation section of the first heat pipe 3, and slow down the vaporization rate of the working fluid, thereby avoiding the risk of drying out, extending the service life of the first heat pipe 3, and ensuring the long-term stable operation of the radiator.

[0103] The heat conducting fin 5 is provided with a second heat conducting groove 52 and a third heat conducting groove 53 .

[0104] See also Figures 1-5 ,and Figures 12-14 The second heat pipe 6 is located on one side of the first heat pipe 3 in the third direction Y; the second heat pipe 6 includes a second transverse pipe section 61 and a second vertical pipe section 62, the second vertical pipe section 62 extends along the first direction Z, and both ends of the second transverse pipe section 61 in the second direction X are connected to the second vertical pipe section 62.

[0105] The second vertical pipe section 62 passes through the second connection hole 42, and the outer wall of the second vertical pipe section 62 is connected to the hole wall of the second connection hole 42. Specifically, the second horizontal pipe section 61 is connected to the third heat transfer surface 203. By providing the second heat pipe 6 on one side of the first heat pipe 3 in the third direction Y, connecting the second horizontal pipe section 61 to the second heat transfer plate 22, and connecting the second vertical pipe section 62 to the heat dissipation fins 4, heat can be orderly conducted from the chip through the first heat transfer plate 21 and the second heat transfer plate 22 to the second horizontal pipe section 61 of the second heat pipe 6, and then transferred to the heat dissipation fins 4 through the second vertical pipe section 62, so as to ensure that the heat of the chip is more evenly distributed when conducted to the heat dissipation fins 4, better exert the heat dissipation efficiency of the heat dissipation fins 4, and improve the overall heat dissipation efficiency of the radiator.

[0106] The second heat pipe 6 further includes a second bent pipe section 63, and the second horizontal pipe section 61 is connected to the second vertical pipe section 62 through the second bent pipe section 63; the bending setting of the second bent pipe section 63 makes the layout of the second heat pipe 6 more flexible, improves the adaptability of the radiator structure to the internal layout of complex electronic devices, and the second bent pipe section 63 can play a transitional role between the second horizontal pipe section 61 and the second vertical pipe section 62, reducing the stress concentration at the connection position of the second horizontal pipe section 61 and the second vertical pipe section 62. By making the lowest points of the third heat transfer surface 203, the first heat conduction surface 101, and the second heat transfer groove 231 all lie in the same reference plane, the technical problem that the heat of the second heat pipe 6 cannot be evenly diffused to the heat dissipation fins 4 due to the bending angle limitation of the second bent pipe section 63 can be solved.

[0107] Both the first heat conduction surface 101 and the third heat transfer surface 203 are welded to the second horizontal pipe section 61.

[0108] Since the lowest points of the first heat-conducting surface 101, the third heat-transfer surface 203, and the second heat-transfer groove 231 are located in the same reference plane, there is no height difference among the lowest points of the first heat-conducting surface 101, the third heat-transfer surface 203, and the second heat-transfer groove 231, ensuring that the second horizontal pipe section 61 can be welded to the first heat-conducting surface 101 and the third heat-transfer surface 203 more closely and evenly. If there is a height difference, problems such as local virtual soldering and insecure welding are likely to occur during welding, affecting the heat conduction performance. Under the same reference plane, the welding quality of the second horizontal pipe section 61 is improved, the thermal resistance is further reduced, and heat can pass more smoothly through the welded part among the heat sink 1, the heat-transfer part 2, and the second horizontal pipe section 61, which helps the heat of the heat-transfer part 2 and the heat sink 1 to be transferred to the second heat pipe 6 more evenly, so that the second heat pipe 6 can transfer heat to the heat-dissipating fins 4 more evenly; at the same time, the welding connection method is tight and firm, reducing the contact thermal resistance, enabling heat to be transferred from the third heat-transfer surface 203 and the first heat-conducting surface 101 to the second horizontal pipe section 61 quickly and efficiently, and then from the second vertical pipe section 62 to the heat-dissipating fins 4, which helps to further improve the overall heat dissipation efficiency of the radiator.

[0109] At least a part of the second horizontal pipe section 61 is disposed in the second heat-transfer groove 231, and the outer wall of the second horizontal pipe section 61 is connected to the groove wall of the second heat-transfer groove 231. The connection between the third heat-transfer plate 23 and the third heat-transfer surface 203, combined with the tight combination of the second heat-transfer groove 231 and the second horizontal pipe section 61, can enhance the heat conduction efficiency; specifically, the third heat-transfer plate 23 can provide a larger heat-transfer contact area between the second heat pipe 6 and the heat-transfer part 2. At least a part of the second horizontal pipe section 61 is embedded in the second heat-transfer groove 231, making the third heat-transfer plate 23 and the second heat pipe 6 fit tightly, reducing the contact thermal resistance during the heat conduction process. The heat generated by the chip can be quickly conducted to the third heat-transfer plate 23 through the second heat-transfer plate 22, and then efficiently transferred to the second horizontal pipe section 61 through the second heat-transfer groove 231, and then conducted to the heat-dissipating fins 4 through the second vertical pipe section 62, improving the conduction speed and efficiency of heat from the chip to the heat-dissipating fins 4.

[0110] At least a part of the second horizontal pipe section 61 is disposed in the second heat-conducting groove 52, and the groove wall of the second heat-conducting groove 52 is connected to the outer wall of the second horizontal pipe section 61. By tightly connecting the second heat-conducting groove 52 of the heat-conducting fin 5 and the second horizontal pipe section 61, the bonding force between the second heat pipe 6 and the heat-transfer part 2 can be strengthened; with good heat-conducting performance, the heat-conducting fin 5 can quickly transfer heat evenly between the second heat pipe 6 and the multiple first heat pipes 3, making the temperatures of the second heat pipe 6 and the multiple first heat pipes 3 tend to be consistent and reducing the temperature difference between the second heat pipe 6 and the first heat pipes 3. The heat-conducting fin 5 can reduce the risk of the evaporation section of the second heat pipe 6 drying out, extend the service life of the second heat pipe 6, and ensure the long-term stable operation of the radiator.

[0111] The second horizontal pipe section 61 includes a first straight pipe 611, a first arc-shaped pipe 612 and a second straight pipe 613. The first straight pipe 611 extends along the second direction. At both ends of the first straight pipe 611 in the second direction, a first arc-shaped pipe 612 is connected. The second straight pipe 613 is connected to one end of the first arc-shaped pipe 612 away from the first straight pipe 611. The second bent pipe section 63 is connected to one end of the second straight pipe 613 away from the first arc-shaped pipe 612. The first straight pipe 611 is welded to the third heat transfer surface 203, the first arc-shaped pipe 612 is welded to the first heat conduction surface 101 and the third heat transfer surface 203, and the second straight pipe 613 is welded to the first heat conduction surface 101.

[0112] By setting the second horizontal pipe section 61 to include the first straight pipe 611, the first arc-shaped pipe 612 and the second straight pipe 613, and making the first straight pipe 611 extend along the second direction X, and connecting its two ends to the second straight pipe 613 through the first arc-shaped pipe 612 respectively, a flexible layout of the second horizontal pipe section 61 on the third heat transfer surface 203 and the first heat conduction surface 101 can be realized.

[0113] The first straight pipe 611 is welded to the third heat transfer surface 203, the first arc-shaped pipe 612 is welded to both the first heat conduction surface 101 and the third heat transfer surface 203, and the second straight pipe 613 is welded to the first heat conduction surface 101, so that the second horizontal pipe section 61 is firmly connected to the first heat conduction surface 101 and the third heat transfer surface 203, improving the stability of welding and the continuity of heat conduction. This multi-section structure combined with the multi-position welding method helps to improve the overall structural strength and heat transfer uniformity of the heat pipe.

[0114] The first straight pipe 611 is disposed through the second heat conduction groove 52 along the second direction X.

[0115] Refer to Figures 3-5 and Figures 15-17 , along the third direction Y, the third heat pipe 7 is located between the first heat pipe 3 and the second heat pipe 6. Each second heat transfer plate 22 is connected to at least one third heat pipe 7. The third heat pipe 7 includes a third horizontal pipe section 71 and a third vertical pipe section 72. The third horizontal pipe section 71 is connected to the third heat transfer surface 203. The third vertical pipe section 72 extends along the first direction Z. At both ends of the third horizontal pipe section 71 in the second direction X, a third vertical pipe section 72 is connected.

[0116] The third vertical pipe section 72 passes through the third connection hole 43, and the outer wall of the third vertical pipe section 72 is connected to the hole wall of the third connection hole 43. By providing the third heat pipe 7 between the first heat pipe 3 and the second heat pipe 6, connecting the third horizontal pipe section 71 to the second heat transfer plate 22 and connecting the third vertical pipe section 72 to the heat dissipation fins 4, heat can be orderly conducted from the chip through the first heat transfer plate 21 and the second heat transfer plate 22 to the third horizontal pipe section 71 of the third heat pipe 7, and then transferred to the heat dissipation fins 4 through the third vertical pipe section 72. As a result, the heat of the chip is more evenly distributed when conducted to the heat dissipation fins 4, better exerting the heat dissipation efficiency of the heat dissipation fins 4 and improving the overall heat dissipation efficiency of the radiator.

[0117] The second vertical pipe section 62 and the third vertical pipe section 72 are arranged in a straight line along the third direction Y. By arranging the second vertical pipe section 62 and the third vertical pipe section 72 in a straight line, when the wind direction flowing through the radiator is parallel to the third direction Y, the linearly arranged second vertical pipe section 62 and third vertical pipe section 72 reduce the blockage and disturbance of the air flow, preventing the formation of turbulent flow or eddy current between the heat pipes, enabling the air flow to pass through the radiator more smoothly, reducing the flow resistance, improving the air circulation efficiency, enhancing the convective heat dissipation effect, and further improving the heat dissipation performance of the radiator.

[0118] Along the second direction X, the distance between the two first vertical pipe sections 32 of the first heat pipe 3 is a mm, and the distance between the two second vertical pipe sections 62 of the second heat pipe 6 is b mm; satisfying: a < b.

[0119] By defining the relationship of a < b, the vertical pipe sections of the first heat pipe 3 and the second heat pipe 6 have a differentiated lateral space distribution in the radiator structure layout. It can adapt to the difference in heat flux density between the chip heating area and the peripheral extended heat dissipation area, enabling the first heat pipe 3 close to the chip heating center to absorb heat more concentratedly, while the second heat pipe 6 far from the center covers a wider area, thus realizing a more uniform diffusion of heat from the center to the periphery. At the same time, the structural relationship of a < b helps to optimize the spatial arrangement of the heat pipes inside the radiator, avoiding local heat resistance concentration due to too small a spacing between the first heat pipe 3 and the second heat pipe 6, and also providing greater freedom for the design of the air flow channels on the heat dissipation fins 4, which is beneficial to improving the air circulation efficiency, reducing the wind resistance, and further enhancing the convective heat transfer ability.

[0120] At least part of the third horizontal pipe section 71 is arranged in the third heat transfer groove 232, and the outer wall of the third horizontal pipe section 71 is connected to the groove wall of the third heat transfer groove 232. The connection between the third heat transfer plate 23 and the third heat transfer surface 203, combined with the tight combination of the third heat transfer groove 232 and the third horizontal pipe section 71, can enhance the heat conduction efficiency.

[0121] At least a part of the third horizontal pipe section 71 is disposed in the second heat conduction groove 52, and the groove wall of the second heat conduction groove 52 is connected to the outer wall of the third horizontal pipe section 71. By tightly connecting the third heat conduction groove 53 of the heat conduction fin 5 with the third horizontal pipe section 71, the bonding force between the third heat pipe 7 and the heat transfer member 2 can be strengthened; with good heat conduction performance, the heat conduction fin 5 can quickly transfer the heat evenly among the third heat pipe 7, the second heat pipe 6 and a plurality of first heat pipes 3, so that the temperatures of the second heat pipe 6, the third heat pipe 7 and the plurality of first heat pipes 3 tend to be consistent, and the temperature difference between the second heat pipe 6, the third heat pipe 7 and the first heat pipe 3 is reduced. The risk of dry burning of the evaporation section of the third heat pipe 7 can be reduced through the heat conduction fin 5, the service life of the third heat pipe 7 can be extended, and the long-term stable operation of the radiator can be ensured.

[0122] The third heat pipe 7 further includes a third bent pipe section 73, and the third horizontal pipe section 71 is connected to the third vertical pipe section 72 through the third bent pipe section 73; the bending setting of the third bent pipe section 73 makes the layout of the third heat pipe 7 more flexible, improves the adaptability of the radiator structure to the internal layout of complex electronic devices, and the third bent pipe section 73 can play a transitional role between the third horizontal pipe section 71 and the third vertical pipe section 72, reducing the stress concentration at the connection position between the third horizontal pipe section 71 and the third vertical pipe section 72.

[0123] The third heat transfer surface 203 is welded to the third horizontal pipe section 71. The welding connection method is tight and firm, reducing the contact thermal resistance, enabling the heat to be quickly and efficiently transferred from the third heat transfer surface 203 to the third horizontal pipe section 71, and then from the third vertical pipe section 72 to the heat dissipation fin 4, which helps to further improve the overall heat dissipation efficiency of the radiator.

[0124] The third horizontal pipe section 71 includes a third straight pipe 711 and a second arc-shaped pipe 712. The third straight pipe 711 extends along the second direction X, and second arc-shaped pipes 712 are connected to both ends of the third straight pipe 711 in the second direction X. The third bent pipe section 73 is connected to one end of the second arc-shaped pipe 712 away from the third straight pipe 711; both the third straight pipe 711 and the second arc-shaped pipe 712 are welded to the third heat transfer surface 203.

[0125] By setting the third horizontal pipe section 71 to include the third straight pipe 711 and the second arc-shaped pipe 712, and making the third straight pipe 711 extend along the second direction X, with second arc-shaped pipes 712 connected to both ends of the third straight pipe 711 respectively, the flexible layout of the third horizontal pipe section 71 on the third heat transfer surface 203 can be realized, and the connection reliability between the third horizontal pipe section 71 and the third heat transfer surface 203 is improved.

[0126] The third straight tube 711 and the second arc tube 712 are both welded to the third heat transfer surface 203, so that the third transverse tube section 71 can be firmly connected to the third heat transfer surface 203 in a multi-point contact manner, thereby improving the stability of welding and the continuity of heat conduction. This multi-segment structure combined with a multi-position welding method helps to improve the overall structural strength and heat transfer uniformity of the heat pipe, reduce local thermal resistance, and improve heat conduction efficiency.

[0127] See also Figures 3-5 ,and Figure 18 The fourth heat pipe 8 includes a fourth transverse pipe section 81 and a fourth vertical pipe section 82. The fourth vertical pipe section 82 is extended along the first direction Z. Both ends of the fourth transverse pipe section 81 in the third direction Y are connected to the fourth vertical pipe section 82. The fourth transverse pipe section 81 is arranged in the heat dissipation groove 121, and the outer wall of the fourth transverse pipe section 81 is connected to the groove wall of the heat dissipation groove 121. The fourth vertical pipe section 82 is passed through the fourth connection hole 44, and the outer side wall of the fourth vertical pipe section 82 is connected to the hole wall of the fourth connection hole 44. By arranging the fourth heat pipe 8 and connecting the fourth transverse pipe section 81 to the second heat dissipation plate 12 and connecting the fourth vertical pipe section 82 to the heat dissipation fin 4, heat can be orderly conducted from the chip through the first heat dissipation plate 11 and the second heat dissipation plate 12 to the fourth transverse pipe section 81 of the fourth heat pipe 8, and then transferred to the heat dissipation fin 4 through the fourth vertical pipe section 82, thereby further improving the overall heat dissipation efficiency of the radiator.

[0128] By connecting the outer wall of the fourth transverse pipe section 81 and the groove wall of the heat dissipation groove 121, the heat transfer contact area between the second heat dissipation plate 12 and the second heat pipe 6 can be increased, thereby improving the heat conduction speed and efficiency from the chip to the heat dissipation fins 4.

[0129] The fourth heat pipe 8 further includes a fourth bent pipe section 83 , and the fourth horizontal pipe section 81 is connected to the fourth vertical pipe section 82 via the fourth bent pipe section 83 .

[0130] Specifically, in this embodiment, the fourth horizontal pipe section 81 is a straight pipe structure extending along the third direction Y, and the fourth vertical pipe section 82 is a straight pipe structure extending along the first direction Z.

[0131] The limiting member 9 is located on the side of the fourth transverse tube section 81 which is away from the fourth heat-conducting surface 104 in the first direction Z and is in contact with the fourth transverse tube section 81, and the two ends of the limiting member 9 in the second direction X are respectively connected to the two side walls of the heat dissipation groove 121; since the limiting member 9 is located on the side of the fourth transverse tube section 81 which is away from the fourth heat-conducting surface 104 in the first direction Z and is in contact with the fourth transverse tube section 81, the limiting member 9 can play a limiting role on the side of the fourth transverse tube section 81 which is away from the fourth heat-conducting surface 104 in the first direction Z, so as to connect the fourth transverse tube section 81 more stably and firmly in the heat dissipation groove 121.

[0132] The heat dissipation effect of the radiator provided by the present utility model is not weaker than that of the VC + heat pipe radiator, and at the same time, the cost is reduced by more than 40%.

[0133] In a second aspect

[0134] Referring to Figure 19 , the present utility model further provides an electronic device. The electronic device includes the radiator of any one of the above, and further includes a circuit board 300. The circuit board 300 includes a substrate 301 and a main chip 302. The main chip 302 is connected to the substrate 301, and the second heat transfer surface 202 is attached to the main chip 302.

[0135] The electronic device may be any electronic device that requires a chip configuration, including but not limited to computer devices, communication devices, consumer electronic devices, smart wearable devices, digital imaging devices, office equipment, industrial control devices, and automotive electronic devices, etc.

[0136] In this embodiment, the main chip 302 is an SOC chip, and the SOC chip includes a bare DIE. The bare DIE includes a long side extending along the third direction Y and a short side extending along the second direction X. In this way, the arrangement direction of the first heat pipes 3 can be made consistent with the trend of the long side of the bare DIE, so that more heat pipes can be arranged in the area corresponding to the surface of the first heat transfer plate 21 and the main chip 302, to support the heat dissipation requirements of the main chip 302 with a larger power.

[0137] The main chip 302 may also be an artificial intelligence chip; specifically, the artificial intelligence chip may be any one of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a TPU (Tensor Processing Unit), an NPU (Neural network Processing Unit), a DPU (Deep learning Processing Unit), an APU (Accelerated Processing Unit), and a GPGPU (General - Purpose Graphics Processing Unit).

[0138] Preferably, the wind direction flowing through the circuit board 300 is parallel to the third direction Y.

[0139] The circuit board 300 further includes two first power chips 303. The two first power chips 303 are respectively connected to two ends of the substrate 301 in the third direction Y. The second heat-conducting surface 102 is connected to the second power chip 304. Along the third direction Y, the position of the first heat sink 13 corresponds to the position of one of the first power chips 303, and the position of the second heat sink 14 corresponds to the position of the other first power chip 303. The heat dissipation capacity of the first heat dissipation plate 11 for the first power chip 303 is improved through the first heat sink 13 and the second heat sink 14, and the heat dissipation capacity of the first power chip 303 is maximally provided, so that the power supply capacity of the main chip 302 can be improved, and the main chip 302 can also support a greater power consumption.

[0140] The circuit board 300 further includes two third power chips. The two second power chips 304 are respectively connected to two ends of the substrate 301 in the second direction X. The fourth heat-conducting surface 104 is connected to the second power chip 304. The fourth heat pipe 8 is responsible for transferring the heat of the second power chip 304 to the heat dissipation fins 4. The heat dissipation capacity of the second power chip 304 is maximally provided, so that the power supply capacity of the main chip 302 can be improved, and the main chip 302 can also support a greater power consumption accordingly.

[0141] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and replacements can be made, and these improvements and replacements should also be regarded as the protection scope of the present invention.

Claims

1. A radiator having a first direction (Z), a second direction (X), and a third direction (Y) that are perpendicular to each other pairwise, characterized in that, Comprising: A heat dissipation member (1), which includes a first heat dissipation plate (11), and the first heat dissipation plate (11) is provided with a mounting hole (111) penetrating along the first direction (Z); A heat transfer member (2), which includes a first heat transfer plate (21), the first heat transfer plate (21) is inserted into the mounting hole (111), and the outer wall of the first heat transfer plate (21) is connected to the hole wall of the mounting hole (111), and the first heat transfer plate (21) has opposite first heat transfer surfaces (201) and second heat transfer surfaces (202) in the first direction (Z); A first heat pipe (3), which is connected to the first heat transfer surface (201); Wherein, the thermal conductivity of the heat transfer member (2) is greater than that of the heat dissipation member (1).

2. The radiator according to claim 1, characterized in that The first heat transfer surface (201) is provided with a first heat transfer groove (211); The first heat pipe (3) includes a first horizontal pipe section (31) and a first vertical pipe section (32), at least part of the first horizontal pipe section (31) is arranged in the first heat transfer groove (211), and the outer wall of the first horizontal pipe section (31) is connected to the groove wall of the first heat transfer groove (211), both ends of the first horizontal pipe section (31) in the second direction (X) are connected with the first vertical pipe section (32), and the first vertical pipe section (32) extends along the first direction (Z).

3. The radiator according to claim 2, wherein It further includes a plurality of heat dissipation fins (4), the heat dissipation fins (4) are located on one side of the first heat transfer surface (201) away from the second heat transfer surface (202), the plurality of heat dissipation fins (4) are arranged along the first direction (Z), and the heat dissipation fins (4) are provided with first connection holes (41); The first vertical pipe section (32) is inserted into the first connection hole (41), and the outer wall of the first vertical pipe section (32) is connected to the hole wall of the first connection hole (41).

4. The radiator according to claim 2, wherein The first heat pipe (3) further includes a first bent pipe section (33), and the first horizontal pipe section (31) is connected to the first vertical pipe section (32) through the first bent pipe section (33).

5. The radiator according to claim 3, characterized in that The number of the first heat pipes (3) is multiple, and the multiple first heat pipes (3) are arranged at intervals along the third direction (Y); The first vertical pipe sections (32) of the multiple first heat pipes (3) are arranged in a straight line along the third direction (Y).

6. The radiator according to claim 5, wherein It further includes a plurality of heat conduction fins (5), the heat conduction fins (5) are located on one side of the first heat transfer surface (201) away from the second heat transfer surface (202), the heat conduction fins (5) are connected to the first heat dissipation plate (11), the plurality of heat conduction fins (5) are arranged along the second direction (X), the heat conduction fins (5) are provided with first heat conduction grooves (51), and the groove wall of the first heat conduction groove (51) is connected to the outer wall of the first horizontal pipe section (31).

7. The radiator according to claim 6, wherein The heat pipe (6) further comprises a second heat pipe (6), the second heat pipe (6) being located on one side of the first heat pipe (3) in the third direction (Y); the second heat pipe (6) comprises a second transverse pipe section (61) and a second vertical pipe section (62), both ends of the second transverse pipe section (61) in the second direction (X) are connected to the second vertical pipe section (62), and the second vertical pipe section (62) is extended along the first direction (Z); The heat dissipation fin (4) is provided with a second connection hole (42); the second vertical pipe section (62) is passed through the second connection hole (42), and the outer side wall of the second vertical pipe section (62) is connected to the hole wall of the second connection hole (42); The heat transfer element (2) further comprises a second heat transfer plate (22); both ends of the first heat transfer plate (21) in the third direction (Y) are connected to the second heat transfer plates (22); each of the second heat transfer plates (22) is connected to at least one of the second heat pipes (6); the second heat transfer plate (22) has a third heat transfer surface (203) and a fourth heat transfer surface (204) opposite to each other in the first direction (Z); the third heat transfer surface (203) is located on a side of the first heat transfer surface (201) away from the second heat transfer surface (202); the second transverse pipe section (61) is connected to the third heat transfer surface (203); and the fourth heat transfer surface (204) is connected to the first heat dissipation plate (11).

8. The radiator according to claim 7, wherein The first heat dissipation plate (11) has a first heat-conducting surface (101) and a second heat-conducting surface (102) opposite to each other in the first direction (Z); the first heat-conducting surface (101) is located on a side of the first heat-conducting surface (201) facing away from the second heat-conducting surface (202); the first heat-conducting surface (101) is provided with a mounting groove (112); the mounting groove (112) has a groove bottom surface (1121); the mounting hole (111) passes through the groove bottom surface (1121); and the fourth heat-conducting surface (204) is fittedly connected to the groove bottom surface (1121).

9. The radiator according to claim 8, characterized in that, The heat transfer element (2) further comprises a third heat transfer plate (23), the third heat transfer plate (23) being connected to the third heat transfer surface (203), a second heat transfer groove (231) being provided on a surface of the third heat transfer plate (23) facing away from the third heat transfer surface (203) in the first direction (Z), at least a portion of the second transverse tube section (61) being provided in the second heat transfer groove (231), and an outer wall of the second transverse tube section (61) being connected to a groove wall of the second heat transfer groove (231).

10. The radiator according to claim 9, characterized in that, The second heat pipe (6) further comprises a second bent pipe section (63), and the second horizontal pipe section (61) is connected to the second vertical pipe section (62) via the second bent pipe section (63); The third heat transfer surface (203) is a flat surface, the first heat conducting surface (101) is a flat surface, and the lowest points of the third heat transfer surface (203), the first heat conducting surface (101) and the second heat transfer groove (231) are all located in the same reference plane; both the first heat conducting surface (101) and the third heat transfer surface (203) are welded to the second horizontal pipe section (61).

11. The radiator according to claim 10, wherein The second horizontal pipe section (61) includes a first straight pipe (611), a first arc-shaped pipe (612) and a second straight pipe (613). The first straight pipe (611) extends along the second direction (X). The first arc-shaped pipes (612) are connected to both ends of the first straight pipe (611) in the second direction (X). The second straight pipe (613) is connected to the end of the first arc-shaped pipe (612) away from the first straight pipe (611). The second bent pipe section (63) is connected to the end of the second straight pipe (613) away from the first arc-shaped pipe (612). The first straight pipe (611) is welded to the third heat transfer surface (203), the first arc-shaped pipe (612) is welded to the first heat conducting surface (101) and the third heat transfer surface (203), and the second straight pipe (613) is welded to the first heat conducting surface (101).

12. The radiator according to claim 10, characterized in that, The heat conducting fin (5) is provided with a second heat conducting groove (52), and the groove wall of the second heat conducting groove (52) is connected to the outer wall of the second horizontal pipe section (61).

13. The radiator according to claim 7, wherein It further includes a third heat pipe (7). Along the third direction (Y), the third heat pipe (7) is located between the first heat pipe (3) and the second heat pipe (6), and at least one third heat pipe (7) is connected to each second heat transfer plate (22). The third heat pipe (7) includes a third horizontal pipe section (71) and a third vertical pipe section (72). The third horizontal pipe section (71) is connected to the third heat transfer surface (203). The third vertical pipe sections (72) are connected to both ends of the third horizontal pipe section (71) in the second direction (X), and the third vertical pipe section (72) extends along the first direction (Z). The heat dissipation fin (4) is provided with a third connection hole (43); the third vertical pipe section (72) passes through the third connection hole (43), and the outer wall of the third vertical pipe section (72) is connected to the hole wall of the third connection hole (43).

14. The radiator according to claim 13, characterized in that, The second vertical pipe section (62) and the third vertical pipe section (72) are arranged in a straight line along the third direction (Y).

15. The radiator according to claim 13 or claim 14, characterized in that, Along the second direction (X), the distance between the two first vertical pipe sections (32) of the first heat pipe (3) is am, and the distance between the two second vertical pipe sections (62) of the second heat pipe (6) is bm; satisfying: a < b.

16. The radiator according to claim 13, characterized in that, The heat transfer member (2) further includes a third heat transfer plate (23). The third heat transfer plate (23) is connected to the third heat transfer surface (203). A third heat transfer groove (232) is provided on a surface of the third heat transfer plate (23) on a side facing away from the third heat transfer surface (203) in the first direction (Z). At least a part of the third horizontal pipe section (71) is disposed in the third heat transfer groove (232), and an outer wall of the third horizontal pipe section (71) is connected to a groove wall of the third heat transfer groove (232).

17. The radiator according to claim 16, characterized in that, The third heat pipe (7) further includes a third bent pipe section (73). The third horizontal pipe section (71) is connected to the third vertical pipe section (72) through the third bent pipe section (73). The third heat transfer surface (203) is a flat surface. The lowest points of the third heat transfer surface (203) and the third heat transfer groove (232) are both located in the same reference plane. The third heat transfer surface (203) and the third horizontal pipe section (71) are welded together.

18. The radiator according to claim 17, characterized in that, The third horizontal pipe section (71) includes a third straight pipe (711) and a second arc-shaped pipe (712). The third straight pipe (711) extends along the second direction (X). The second arc-shaped pipes (712) are connected to both ends of the third straight pipe (711) in the second direction (X). The third bent pipe section (73) is connected to an end of the second arc-shaped pipe (712) away from the third straight pipe (711). Both the third straight pipe (711) and the second arc-shaped pipe (712) are welded to the third heat transfer surface (203).

19. The radiator according to claim 3, wherein, It further includes a fourth heat pipe (8). The fourth heat pipe (8) includes a fourth horizontal pipe section (81) and a fourth vertical pipe section (82). The fourth vertical pipe sections (82) are connected to both ends of the fourth horizontal pipe section (81) in the third direction (Y). The fourth vertical pipe section (82) extends along the first direction (Z). The heat dissipation member (1) further includes a second heat dissipation plate (12). The second heat dissipation plates (12) are connected to both ends of the first heat dissipation plate (11) in the second direction (X). The first heat dissipation plate (11) has opposite first heat conduction surfaces (101) and second heat conduction surfaces (102) in the first direction (Z). The first heat conduction surface (101) is located on a side of the first heat transfer surface (201) facing away from the second heat transfer surface (202). The second heat dissipation plate (12) has opposite third heat conduction surfaces (103) and fourth heat conduction surfaces (104) in the first direction (Z). The third heat conduction surface (103) is located on a side of the first heat transfer surface (201) facing away from the second heat transfer surface (202). Along the third direction (Y), the first heat conduction surface (101) is located between the third heat conduction surface (103) and the second heat conduction surface (102). Each of the second heat sinks (12) is connected to at least one of the fourth heat pipes (8), the third heat conduction surface (103) is provided with a heat dissipation groove (121), the fourth transverse pipe section (81) is arranged in the heat dissipation groove (121), and the outer wall of the fourth transverse pipe section (81) is connected to the groove wall of the heat dissipation groove (121); The heat dissipation fin (4) is provided with a fourth connection hole (44); the fourth vertical pipe section (82) is passed through the fourth connection hole (44), and the outer side wall of the fourth vertical pipe section (82) is connected to the hole wall of the fourth connection hole (44).

20. The radiator according to claim 19, wherein, It also comprises a limiting member (9), the limiting member (9) being located on a side of the fourth transverse tube section (81) away from the fourth heat-conducting surface (104) in the first direction (Z) and in contact with the fourth transverse tube section (81), and the two ends of the limiting member (9) in the second direction (X) are respectively connected to the two side walls of the heat dissipation groove (121); The fourth heat pipe (8) further comprises a fourth bent pipe section (83), and the fourth horizontal pipe section (81) is connected to the fourth vertical pipe section (82) via the fourth bent pipe section (83).

21. The radiator according to claim 19, wherein The heat sink (1) further comprises a plurality of first heat sinks (13) and a plurality of second heat sinks (14); the first heat sinks (13) are connected to the first heat-conducting surface (101), and the plurality of first heat sinks (13) are arranged at intervals along the second direction (X); the second heat sinks (14) are connected to the first heat-conducting surface (101), and the plurality of second heat sinks (14) are arranged at intervals along the second direction (X); Along the third direction (Y), the first heat pipe (3) is located between the first heat sink (13) and the second heat sink (14).

22. The radiator according to claim 1, characterized in that, The material of the heat sink (1) is selected from aluminum alloy, and the material of the heat transfer element (2) is selected from copper or copper alloy.

23. An electronic device, characterized in that, The heat sink comprises the heat sink according to any one of claims 1 to 22, and further comprises a circuit board (300), wherein the circuit board (300) comprises a substrate (301) and a main chip (302), the main chip (302) is connected to the substrate (301), and the second heat transfer surface (202) is bonded to the main chip (302).

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