Stack pumping structure and device

Abstract

The utility model relates to a stack pumping structure, which comprises a heat sink, a stack source and a plurality of light-emitting chips, the stack source is arranged on one surface of the heat sink, the stack source comprises an isolation bar group and two rigid bars, the isolation bar group comprises a plurality of isolation bars which are arranged at intervals, and the two rigid bars are respectively arranged at two ends of the isolation bar group and are fixedly connected with the adjacent isolation bars; and the plurality of light-emitting chips are arranged in gaps between two adjacent isolation bars one by one. The stack pumping structure provided by the utility model has the characteristics of small volume, high energy, long service life, low power consumption, compact structure and the like, the average service life is more than 20000 hours, and the portability and mobility of an instrument based on the application of the stack pumping structure are also improved due to the characteristic of small volume.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to a stack pump structure. Background Art

[0002] In recent years, the proportion of energy-based medical aesthetics in the medical aesthetics equipment market has become increasingly important. Energy-based medical aesthetics mainly refers to the application of energy forms such as laser, radio frequency, and ultrasound in medical aesthetics. According to the technical principles, it can be divided into three categories: light waves, electromagnetic waves, and sound waves. Among them, energy-based medical aesthetics using laser technology has ultra-high precision and high stability. Various lasers including picosecond laser therapy devices are applied to energy-based medical aesthetics.

[0003] Due to technical maturity and cost issues, picosecond laser therapy devices in the past usually use lamp pumping technology as the pump source. However, the effective life of the lamp is short. Generally, imported lamps can only reach 20 million uses before the lamp tube needs to be replaced, and they need to be replaced after 1 year or less. In the case of lamp pumping, the pump power is evenly dispersed in a broadband spectrum, and only a small part is absorbed by the crystal, and the rest is converted into heat, and the conversion efficiency is too low. In addition, the power consumption and size of the lamp pump are too large, which is not easy to handle from the perspective of electromagnetic compatibility (EMC) and safety regulations. The production reliability and safety are not high, and it is not suitable for portability.

[0004] Therefore, the existing picosecond laser therapy device adopts a stack pump structure as the pump source, see Figure 1 The existing stack pump structure includes a heat sink 10, a stack source 20, a plurality of light-emitting chips 30, a chip insulating sheet 40 and two electrode sheets 50; the heat sink 10 is a block-shaped object whose temperature does not change with the amount of heat energy transferred to it; the stack source 20 is arranged on one surface of the heat sink 10, and the stack source 20 includes an isolation bar group, which includes a plurality of isolation bars 21 arranged in parallel, and there is an isolation gap of a fixed width between each two adjacent isolation bars 21; the plurality of light-emitting chips 30 are arranged in the isolation gaps in the stack source 20 one by one, and are fixed to the isolation bars 21 by soldering together; the chip insulating sheet 40 is arranged between the stack source 20 and the heat sink 10, the chip insulating sheet 40 includes an isolation insulating part 41 and an electrode insulating part 42, the isolation insulating part 41 includes a plurality of insulating strips, the insulating strips are arranged one by one between the isolation bar strip 21 and the surface of the heat sink 10, the isolation bar strip 21 is electrically isolated from the heat sink 10, the electrode insulating part 42 is connected to both sides of the isolation insulating part 41, and is fixed on the surface of the heat sink 10; one end of the electrode sheet 50 is fixed on the electrode insulating part 42 of the chip insulating sheet 40, and the other end is arranged on the two side surfaces of the heat sink 10.

[0005] However, in the existing stack pumping structure, the size of the stack source 20 is relatively large, resulting in a relatively large overall volume of the stack pumping structure, low energy utilization rate, high production cost, and being complex and troublesome in actual production applications. Summary of the Invention

[0006] Based on this, the purpose of the present utility model is to provide a stack pumping structure, which has a smaller volume and high energy utilization rate at the same time.

[0007] A stack pumping structure includes a heat sink, a stack source, and multiple light-emitting chips; the stack source is arranged on one surface of the heat sink, the stack source includes an isolation bar group and two rigid bars, the isolation bar group includes multiple isolation bars arranged at intervals, the two rigid bars are respectively arranged at both ends of the isolation bar group and fixedly connected to the adjacent isolation bars; the multiple light-emitting chips are respectively arranged in the gaps between adjacent two isolation bars.

[0008] Furthermore, it further includes a chip insulating sheet, which includes an isolation insulating part and an electrode insulating part, the isolation insulating part includes multiple insulating strips, the insulating strips are respectively arranged between each isolation bar and the surface of the heat sink to electrically isolate the isolation bar from the heat sink; the electrode insulating part is arranged between the rigid bar and the heat sink and is connected to both sides of the isolation insulating part to electrically isolate the rigid bar from the heat sink.

[0009] Furthermore, it further includes two electrode plates, one pole of the two electrode plates is arranged on the electrode insulating part of the chip insulating sheet and is respectively connected to both ends of the stack source, the electrode insulating part electrically isolates this pole from the heat sink, and the other pole is arranged on the other surface of the heat sink.

[0010] Furthermore, the minimum thickness of the isolation bar is 0.125 mm, and the minimum width of the isolation gap is 0.1 mm.

[0011] Furthermore, the heat sink is made of tungsten copper alloy, and a diversion hole passing through both surfaces of the heat sink is provided in the middle.

[0012] Furthermore, the thickness of the light-emitting chip is 0.1 mm.

[0013] Furthermore, it further includes two electrode insulating sheets, which are respectively arranged between the pole of the two electrode plates that does not contact the stack source and the surface of the heat sink to electrically isolate this pole from the heat sink.

[0014] Furthermore, both side surfaces of the light-emitting chip are respectively welded to the adjacent two isolation bars through solder, and one side of the rigid bar is welded to the adjacent isolation bar through solder.

[0015] The present utility model also provides a stack pumping device, which includes the above-mentioned stack pumping structure and a plurality of cylindrical lenses. The cylindrical lenses are arranged in parallel and are correspondingly arranged one by one with a plurality of light-emitting chips in the stack pumping structure to collimate the light beams emitted by the light-emitting chips.

[0016] Further, it also includes two reflector plates. The reflector plates are fixed on both sides of the surface where the stack source in the stack pumping structure is located, and both ends of the cylindrical lens are respectively fixed on the two reflector plates.

[0017] For better understanding and implementation, the present utility model will be described in detail below with reference to the accompanying drawings. Description of the Drawings

[0018] Figure 1 It is a schematic diagram of an existing stack pumping structure.

[0019] Figure 2 It is a schematic diagram of the stack pumping structure of the present utility model.

[0020] Figure 3 It is a schematic diagram of the structure of the stack pumping device of the present utility model. Detailed Embodiment

[0021] The applicant carefully analyzed the existing stack pumping structure and found that the reason for its large size is the thickness of the isolation bar 21 itself in the stack source 20 and the certain width of the isolation gap formed between adjacent isolation bars 21. Therefore, the applicant tried to reduce the thickness of the isolation bar 21 itself. However, after the thickness of the isolation bar 21 was reduced, the isolation bar group was not sufficient to support the stress received in actual production, and problems such as cracking of the structure would occur. To solve this problem, the applicant respectively arranged a rigid bar 22 on both sides of the isolation bar group to disperse the stress borne by the isolation bar group. In addition, there is no isolation gap between the rigid bar 22 and the isolation bar 21, but they are directly welded, which can provide sufficient lateral support force for the isolation bar group. Therefore, the thickness of the solder required for welding the light-emitting chips in the isolation bar and the isolation gap can be reduced, thereby reducing the width of the isolation gap. Through the above settings, the size of the stack source 20 can be reduced, and the heat sink 10 used to support and cool the stack source 20 can also be reduced in size accordingly, so that the overall volume of the stack pumping structure is reduced.

[0022] Please refer to Figure 2 , the stack pumping structure includes a heat sink 10, a stack source 20, a plurality of light-emitting chips 30, a chip insulating sheet 40, two electrode sheets 50, and two electrode insulating sheets 60.

[0023] The heat sink 10 is a square block object, in which a guide hole is provided through the two surfaces of the heat sink 10. The coolant can take away the heat inside the heat sink 10 through the guide hole A, and the temperature of the heat sink 10 will not change with the heat contained. Specifically, the heat sink 10 can be made of materials such as tungsten copper alloy, and its temperature does not change with the heat transferred to itself. The shape of the guide hole A can be cylindrical, square, S-shaped, etc., and it is only limited to connecting from one surface of the heat sink 10 to another surface of the heat sink 10 parallel to the surface.

[0024] The stack source 20 is arranged on a side plane of the heat sink 10 without the guide hole A. The stack source 20 includes an isolation bar group and two rigid bars respectively arranged on both sides of the isolation bar group. The isolation bar group includes a plurality of isolation bars 21 arranged in parallel. There is an isolation gap of fixed width between each two adjacent isolation bars 21. The direction of the isolation gap is perpendicular to the surface connected to the guide hole A. The rigid bar 22 is directly welded to the isolation bar 21 by solder, serving as a rigid support for the isolation bar 21. Specifically, the thickness of the isolation bar 21 is at least 0.125 mm, and the width of the isolation gap is 0.1-0.4 mm. In particular, in the existing stack pump structure, the stack source 20 only disperses the stress by arranging the isolation bars 21 in parallel, enhances the longitudinal external pressure resistance, and makes it less likely to be broken or other strong damage; however, this arrangement will cause the lateral stability of the stack source 20 to decrease, and it is easy to fall off or shift when disturbed; therefore, in addition to arranging the isolation bars 21 in parallel to disperse the stress, the present invention also adds the rigid bars 22 at both ends of the stack source 20 as a support. Under this arrangement, the thickness of the isolation bars 21 can be reduced to 0.125mm without causing problems with the rigidity of the structure. Although the two added rigid bars 22 themselves have a certain thickness, the total thickness of the stack source 20 is still reduced, thereby reducing the size of the stack source 20. In addition, due to the reduction in the size of the stack source 20, the heat sink 10 does not need to support the original area size, so the volume of the heat sink 10 can also be adaptively reduced.

[0025] The multiple light-emitting chips 30 are respectively disposed in the isolation gaps in the stack source 20, and their two side planes are welded and fixed together with the isolation bar strips 21 on both sides by solder. Specifically, since the thickness of the solder is only on the order of μm and can be ignored compared to the width of the isolation gap, those skilled in the art can understand that the width setting of the isolation gap only needs to consider the thickness of the light-emitting chip 30. When the thickness of the light-emitting chip 30 can be less than 0.1 mm, the width setting of the isolation gap can also be less than 0.1 mm. It should be noted that although the thickness of the solder can be ignored in mathematical calculations when considering the thickness of the light-emitting chip 30 for setting the width of the isolation gap, the width of the isolation gap will actually decrease objectively when the solder thickness is reduced. In particular, since the thickness of the isolation bar strip 21 can be reduced to 0.125 mm, the spacing between adjacent light-emitting chips 30 can be reduced to 0.225 mm. The smaller the spacing between adjacent light-emitting chips 30, the more concentrated the energy of the emitted light beam and the higher the energy density, thereby improving the energy utilization rate of the stack pumping structure.

[0026] The chip insulating sheet 40 is disposed between the stack source 20 and the heat sink 10. The chip insulating sheet 40 includes an isolation insulating portion 41 and an electrode insulating portion 42. The isolation insulating portion 41 includes a plurality of insulating strips, and the insulating strips are respectively disposed between the surfaces of the isolation bar strip 21 and the heat sink 10 to electrically isolate the isolation bar strip 21 from the heat sink 10; the electrode insulating portion 42 is connected to both sides of the isolation insulating portion 41 and is fixed on the surface of the heat sink 10 to electrically isolate the rigid bar strip 22 from the heat sink 10.

[0027] The two electrode sheets 50 are disposed on the surface of the heat sink 10. For one of the electrode sheets 50, one end is fixed on the electrode insulating portion 42 at one end of the chip insulating sheet 40, and the other end is disposed on the two side surfaces of the heat sink 10.

[0028] The electrode insulating sheet 60 is disposed between the pole of the electrode sheet 50 that does not contact the stack source 20 and the surface of the heat sink 10 to electrically isolate the electrode sheet 50 from the heat sink 10.

[0029] Specifically, when the stack pumping structure is connected to an external power supply, current flows in from one of the electrode sheets 50, passes through the rigid bar strip 22 on one side of the stack source 20, and then successively flows through the plurality of spaced isolation bar strips 21 and the light-emitting chips 30 to reach the rigid bar strip 22 on the other side of the stack source 20, and then flows back to the outside through the other electrode sheet 50 to form a loop. During this process, the light-emitting chips 30 continuously emit light and can be used as the pumping source for the subsequent laser gain medium.

[0030] In addition, based on the above-described stack pumping structure, please refer to Figure 3The applicant also provides a stack pumping device, including a stack pumping structure, a plurality of column mirrors 70 and two reflection plates 80.

[0031] The column mirror 70 is a cylindrical lens. Multiple column mirrors 70 are arranged in parallel and are set one by one with multiple light-emitting chips 30. The light beams emitted by the light-emitting chips 30 are collimated and their fast axes are compressed so that the divergence angles of the fast and slow axis light spots are close. The collimated light spots are uniform and can meet any angle, and can be directly used for the excitation of laser gain materials. In addition, by combining the column mirror 70, the pump light energy can be concentrated at the absorption peak of the laser gain medium, and a higher energy conversion efficiency can be obtained.

[0032] The stack pump structure has grooves at the two intersections of the plane where the stack source 20 is located and the two planes where the guide hole A is located. The two reflectors 80 are respectively arranged on the grooves on both sides of the stack pump structure, and the two ends of the column mirror 70 are respectively fixed on the two reflectors 80 by UV glue (shadowless glue). The two reflectors provide support for the column mirror. At the same time, the reflectors are reflective materials such as glass, which can reflect the light leaked from the light-emitting chip along the isolation gap to the reflectors on both sides, reduce light loss, and improve energy utilization.

[0033] The stack pump structure of the utility model achieves a reduction in overall volume by reducing the width of the isolation bar and the size of the heat sink. It has the characteristics of small size, high energy, long service life, low power consumption, compact structure, etc. The average service life is more than 20,000 hours. The small size also improves the portability and mobility of instruments based on the stack pump structure.

[0034] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and the utility model is also intended to include these modifications and modifications.

Claims

1. A stack pump structure, characterized in that: It includes a heat sink, a stack source, and multiple light-emitting chips; the stack source is disposed on one surface of the heat sink, and the stack source includes an isolation bar group and two rigid bars. The isolation bar group includes multiple isolation bars arranged at intervals from each other. The two rigid bars are respectively disposed at both ends of the isolation bar group and fixedly connected to the adjacent isolation bars; the multiple light-emitting chips are respectively disposed in the gaps between two adjacent isolation bars.

2. The stack pump structure according to claim 1, wherein: It further includes a chip insulating sheet, which includes an isolation insulating part and an electrode insulating part. The isolation insulating part includes multiple insulating bars, and the insulating bars are respectively disposed between each isolation bar and the surface of the heat sink one by one to electrically isolate the isolation bar from the heat sink; the electrode insulating part is disposed between the rigid bar and the heat sink and connected to both sides of the isolation insulating part to electrically isolate the rigid bar from the heat sink.

3. The stack pump structure according to claim 2, wherein: It further includes two electrode plates. One pole of the two electrode plates is disposed on the electrode insulating part of the chip insulating sheet and respectively connected to both ends of the stack source. The electrode insulating part electrically isolates this pole from the heat sink, and the other pole is disposed on the other surface of the heat sink.

4. The stack pump structure according to claim 3, wherein: The minimum thickness of the isolation bar is 0.125 mm, and the minimum width of the isolation gap is 0.1 mm.

5. The stack pump structure according to claim 4, wherein: The heat sink is made of tungsten copper alloy, and a diversion hole passing through the two surfaces of the heat sink is provided in the middle.

6. The stack pump structure according to claim 5, characterized in that: The thickness of the light-emitting chip is 0.1 mm.

7. The stack pump structure according to claim 6, wherein: It further includes two electrode insulating sheets, which are respectively disposed between one pole of the two electrode plates that does not contact the stack source and the surface of the heat sink to electrically isolate this pole from the heat sink.

8. The stack pump structure according to claim 7, wherein: Both side surfaces of the light-emitting chip are respectively welded to the two adjacent isolation bars by solder, and one side of the rigid bar is welded to the adjacent isolation bar by solder.

9. A stack pumping device, characterized in that: It includes the stack pumping structure according to any one of claims 1-8 and multiple cylindrical lenses. The cylindrical lenses are arranged in parallel and respectively correspond to the multiple light-emitting chips in the stack pumping structure to collimate the light beams emitted by the light-emitting chips.

10. The stack pump device according to claim 9, wherein: It further includes two reflector plates, which are fixed on both sides of the surface where the stack source is located in the stack pumping structure, and both ends of the cylindrical lens are respectively fixed on the two reflector plates.

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