Multi-runner water-cooling heat dissipation device applied to semiconductor laser

Abstract

A multi-runner water-cooling heat dissipation device applied to a semiconductor laser comprises a driving plate and a water-cooling heat dissipation assembly installed on the driving plate, and a plurality of laser diode packaging assemblies are assembled on the water-cooling heat dissipation assembly. The water-cooling heat dissipation assembly comprises two water-cooling blocks which are communicated with each other; the plurality of laser diode packaging assemblies are assembled on the two water-cooling blocks in an array manner; cooling flow channels wrapping the array type laser diode packaging assemblies are formed in the two water cooling blocks, each cooling flow channel is composed of a plurality of cooling branches, and the cooling branches and the array type laser diode packaging assemblies are alternately arranged layer by layer; compared with the prior art, the laser diode packaging assembly in array arrangement is wrapped by the plurality of cooling branches, so that the heat exchange area between the cooling branches and the laser diode packaging assembly is increased, and a better cooling effect and a better temperature equalizing effect are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of water-cooled heat dissipation, and particularly relates to a multi-channel water-cooled heat dissipation device applied to a semiconductor laser. Background Art

[0002] A semiconductor laser, also known as a laser diode, is a laser using a semiconductor material as the working substance. Due to differences in material structures, the specific processes of generating laser in different types are relatively special. Common working substances include gallium arsenide, cadmium sulfide, indium phosphide (InP), zinc sulfide (ZnS), etc. The excitation methods include three forms: electrical injection, electron beam excitation, and optical pumping. Semiconductor laser devices can be divided into several types such as homojunction, single heterojunction, and double heterojunction. Homojunction lasers and single heterojunction lasers are mostly pulsed devices at room temperature, while double heterojunction lasers can achieve continuous operation at room temperature.

[0003] During use, the light power of the light-emitting source of a semiconductor laser is generally about 25% of the total power, that is, about 75% of the energy will be converted into heat. The stable operating temperature of a laser diode is between 20°C and 30°C. The higher the temperature, the lower the light power, that is, the greater the heat generation. Moreover, the greater the temperature fluctuation range, the more unstable the light power. Excessive temperature or excessive temperature fluctuation range will cause the light attenuation of the laser diode to be faster, the service life to be shortened, and even directly damaged. Therefore, effective cooling of the laser is one of the most critical factors to ensure its normal, stable, safe, and reliable operation.

[0004] Chinese Patent Application No. 2016105860380 discloses a circulating water-cooled device for a semiconductor laser, including a water inlet pipe, a water outlet pipe, an upper heat-conducting copper block, and a lower heat-conducting copper block. The upper heat-conducting copper block and the lower heat-conducting copper block are both installed in a box body. The water inlet pipe and the water outlet pipe are both installed on the same side of the housing. The water inlet pipe is installed at one end of a series of cooling water pipes through an upper straight-through quick connector, and a lower right-angle quick connector is installed at the other end of the series of cooling water pipes.

[0005] The above-disclosed circulating water-cooled device adopts a single-waterway design. Under the action of a single waterway, the heat exchange area of the semiconductor laser is limited, resulting in too large a thermal conduction thermal resistance of the semiconductor laser, causing uneven working temperatures, large individual differences, and inconsistent light powers among array laser diodes, which brings inconvenience to the use and later maintenance of the laser and increases the maintenance cost. Summary of the Utility Model

[0006] The utility model aims to overcome the above-mentioned defects in the prior art and provides a multi-channel water-cooled heat dissipation device applied to a semiconductor laser with good heat dissipation effect and simple structure.

[0007] To achieve the above-mentioned utility model purpose, the present utility model adopts the following technical solutions: A multi-channel water-cooled heat dissipation device applied to a semiconductor laser, including a driving board and a water-cooled heat dissipation component installed on the driving board, and a plurality of laser diode packaging components are assembled on the water-cooled heat dissipation component; the water-cooled heat dissipation component includes two water-cooled blocks that are connected and communicated, and a plurality of laser diode packaging components are assembled on the two water-cooled blocks in an array; cooling channels covering and arranged with the plurality of laser diode packaging components in an array are formed in both of the two water-cooled blocks, and the cooling channels are composed of a plurality of cooling branches, and the plurality of cooling branches and the plurality of laser diode packaging components in an array are arranged alternately layer by layer.

[0008] As a preferred solution of the present utility model, the two water-cooled blocks are arranged oppositely, and a connecting pipe communicating with the other water-cooled block is formed at the end of the water-cooled block.

[0009] As a preferred solution of the present utility model, pipeline connectors connected to the connecting pipe are provided at the ends of both of the two water-cooled blocks, and the pipeline connectors are communicated with the cooling channels in the water-cooled blocks.

[0010] As a preferred solution of the present utility model, a liquid inlet connector communicating with the cooling channel in one of the water-cooled blocks is provided at the end of one of the water-cooled blocks, and a liquid outlet connector communicating with the cooling channel in the other water-cooled block is provided at the end of the other water-cooled block.

[0011] As a preferred solution of the present utility model, a pipeline interface for installing the pipeline connector is formed on the water-cooled block, and an installation interface for installing the liquid outlet connector or the liquid inlet connector is also formed on the water-cooled block, and the opening direction of the pipeline interface is arranged crosswise with the opening direction of the installation interface.

[0012] As a preferred solution of the present utility model, a first chamber communicated with the installation interface and a second chamber communicated with the pipeline interface are formed in the water-cooled block, and the first chamber and the second chamber are respectively communicated with opposite ends of the plurality of cooling branches.

[0013] As a preferred solution of the present utility model, the plurality of cooling branches are distributed layer by layer along the height direction of the water-cooled block.

[0014] As a preferred solution of the present utility model, a boss for increasing the contact area between the water-cooled block and the driving board is formed at the bottom of the water-cooled block.

[0015] As a preferred solution of the present utility model, a heat conduction layer for enhancing the heat conduction effect between the water-cooled block and the driving board is installed on the driving board.

[0016] As a preferred solution of the present utility model, an assembly hole for assembling the laser diode packaging component is formed on the water-cooled block.

[0017] Compared with the prior art, the beneficial effects of the present utility model are as follows: By forming several cooling branches to wrap the laser diode packaging components arranged in an array, the heat exchange area between the cooling branches and the laser diode packaging components is increased, thereby achieving a better cooling effect and a better temperature equalization effect;

[0018] At the same time, different flow rates and cooling requirements can be achieved by adjusting the structural sizes and positions of the three cooling branches;

[0019] By controlling the temperature and fluctuation range of the cooling liquid entering the multi-channel water-cooled heat dissipation device, the temperature of the photodiode packaging components is controlled, and the temperature of the heating devices on the driving board is effectively controlled;

[0020] The integrated processing design of the water-cooling block has higher heat conduction efficiency and lower conduction thermal resistance, avoiding the defect of high conduction thermal resistance of the combined type. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is an exploded view of the present utility model;

[0022] Figure 2 is a schematic structural diagram of the water-cooled heat dissipation component;

[0023] Figure 3 is a schematic structural diagram of the water-cooling block;

[0024] Figure 4 is a schematic layout diagram of the cooling channels;

[0025] Figure 5 is a schematic layout diagram of the cooling branches;

[0026] Reference numerals: driving board 1, water-cooled heat dissipation component 2, laser diode packaging component 3, water-cooling block 4, mounting interface 41, pipeline interface 42, boss 43, assembly hole 44, cooling channel 45, cooling branch 46, first chamber 47, second chamber 48, pipeline joint 5, connecting pipe 6, liquid inlet joint 7, liquid outlet joint 8, heat conduction layer 9. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] The following will describe the embodiments of the present utility model in detail with reference to the accompanying drawings.

[0028] As Figures 1-5As shown in the figure, a multi-channel water-cooled heat dissipation device for a semiconductor laser includes a driving board 1 and a water-cooled heat dissipation component 2 mounted on the driving board 1. A plurality of laser diode packaging components 3 are assembled on the water-cooled heat dissipation component 2; the water-cooled heat dissipation component 2 includes two water-cooling blocks 4 that are connected and communicated. A plurality of laser diode packaging components 3 are assembled on the two water-cooling blocks 4 in an array; cooling channels 45 are formed in both of the two water-cooling blocks 4 to cover the array of a plurality of laser diode packaging components 3. The cooling channels 45 are composed of a plurality of cooling branches 46, and the plurality of cooling branches 46 and the array of a plurality of laser diode packaging components 3 are arranged alternately layer by layer.

[0029] The bottom of the water-cooled heat dissipation component 2 is in contact with the driving board 1. A plurality of laser diode packaging components 3 pass through the water-cooled heat dissipation component 2, and under the action of the water-cooled heat dissipation component 2, synchronous cooling operations for the driving board 1 and a plurality of laser diode packaging components 3 are realized.

[0030] The number of a plurality of laser diode packaging components 3 is set according to actual needs, and the plurality of laser diode packaging components 3 form a multi-row structure. The number of rows formed by the plurality of laser diode packaging components 3 is set according to actual needs. The plurality of cooling branches 46 also form a multi-row structure. The laser diode packaging components 3 arranged in rows are located between the cooling branches 46 of adjacent rows, so as to realize the covering operation of the laser diode packaging components 3 arranged in rows under the action of the cooling branches 46.

[0031] The two water-cooling blocks 4 are arranged oppositely, and a connecting pipe 6 communicating with the other water-cooling block 4 is formed at the end of the water-cooling block 4. The laser diode packaging components 3 pass through both of the two water-cooling blocks 4 at the same time, and cooling channels 45 are formed in both of the two water-cooling blocks 4. Therefore, the two cooling channels 45 simultaneously realize heat exchange for the laser diode packaging components 3.

[0032] And under the action of the connecting pipe 6, the two cooling channels 45 in the two water-cooling blocks 4 are connected and communicated, so as to realize the effect of synchronous heat exchange at multiple places for the laser diode packaging components 3 under the action of the same water flow, and strengthen the heat dissipation effect of the laser diode packaging components 3.

[0033] Pipe connectors 5 connected to the connecting pipe 6 are provided at the ends of the two water-cooling blocks 4. The pipe connectors 5 are communicated with the cooling channels 45 in the water-cooling blocks 4. Internal thread structures connected to the pipe connectors 5 are formed in the water-cooling blocks 4. The pipe connectors 5 are connected to the water-cooling blocks 4 under the action of the threads, and the two water-cooling blocks 4 are connected and communicated through the connecting pipe 6 under the action of the two pipe connectors 5.

[0034] One end of one of the water cooling blocks 4 is provided with an inlet joint 7 communicating with the cooling flow channel 45 in the water cooling block 4, and the other end of the other water cooling block 4 is provided with an outlet joint 8 communicating with the cooling flow channel 45 in the water cooling block 4. One of the two water cooling blocks 4 is used to receive the coolant, and the other is used to discharge the heated coolant after heat exchange, so as to realize the heat dissipation of a plurality of laser diode packaging components 3 under the action of continuously inputting the coolant.

[0035] A pipeline interface 42 for installing a pipeline joint 5 is formed on the water cooling block 4, and an installation interface 41 for installing the outlet joint 8 or the inlet joint 7 is also formed on the water cooling block 4. The opening direction of the pipeline interface 42 is arranged crosswise with the opening direction of the installation interface 41.

[0036] The pipeline interface 42 and the installation interface 41 are respectively used at both ends of the cooling flow channel 45. Under the action of the pipeline interface 42 and the installation interface 41, the communication between the cooling flow channel 45 and external components is realized. Under the action of the crosswise arranged pipeline interface 42 and installation interface 41, the flow of the coolant in the cooling flow channel 45 is buffered to ensure sufficient heat exchange between the coolant and the laser diode packaging components 3.

[0037] A first chamber 47 communicating with the installation interface 41 and a second chamber 48 communicating with the pipeline interface 42 are formed in the water cooling block 4. The first chamber 47 and the second chamber 48 are respectively communicated with opposite ends of a plurality of cooling branches 46. The first chamber 47 and the second chamber 48 are both communicated with the ends of a plurality of cooling branches 46 at the same time. Under the action of the cooling branches 46, the first chamber 47 or the second chamber 48 is shunted to increase the heat exchange area between the coolant and the laser diode packaging components 3.

[0038] One of the first chamber 47 or the second chamber 48 is used to inject the coolant, and the other first chamber 47 or the second chamber 48 is used to converge the coolant after heat exchange, which is convenient for discharging the coolant after heat exchange.

[0039] A plurality of the cooling branches 46 are distributed layer by layer along the height direction of the water cooling block 4. Similarly, a plurality of laser diode packaging components 3 are also distributed layer by layer along the height direction of the water cooling block 4. Therefore, a plurality of cooling branches 46 and a plurality of laser diode packaging components 3 are alternately distributed layer by layer in sequence along the height direction of the water cooling block 4.

[0040] A boss 43 for increasing the contact area between the water cooling block 4 and the driving board 1 is formed at the bottom of the water cooling block 4. The water cooling block 4 is arranged corresponding to the heat generating components of the driving board 1, and the boss 43 is arranged between adjacent electronic components on the driving board 1, so as to increase the contact area between the water cooling block 4 and the driving board 1. At the same time, a heat conducting layer 9 for strengthening the heat conduction effect between the water cooling block 4 and the driving board 1 is installed on the driving board 1.

[0041] An assembly hole 44 for assembling the laser diode package component 3 is formed on the water cooling block 4.

[0042] During actual use, a plurality of laser diode package components 3 form a two-row structure distributed vertically, and the cooling branch flows 46 form a three-row structure distributed in the upper, middle and lower parts. The row-arranged laser diode package components 3 are located between adjacent cooling branch flows 46. Coolant is injected into one of the water cooling blocks 4, and the coolant sequentially passes through this water cooling block 4, the connecting pipe 6 and the other water cooling block 4 and then is discharged. Thus, when the coolant passes through the two water cooling blocks 4, heat exchange with the laser diode package component 3 is realized.

[0043] At the same time, different flow rates and cooling requirements can be achieved by adjusting the structural sizes and positions of the three cooling branch flows 46.

[0044] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present utility model. Various modifications to these embodiments will be apparent to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present utility model. Therefore, the present utility model will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0045] Although terms such as driving board 1, water cooling heat dissipation component 2, laser diode package component 3, water cooling block 4, mounting interface 41, pipeline interface 42, boss 43, assembly hole 44, cooling channel 45, cooling branch flow 46, first chamber 47, second chamber 48, pipeline joint 5, connecting pipe 6, liquid inlet joint 7, liquid outlet joint 8, heat conducting layer 9 and the like are used more frequently in this text, the possibility of using other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the present utility model. Interpreting them as any additional limitation is contrary to the spirit of the present utility model.

Claims

1. A multi-channel water-cooled heat dissipation device applied to a semiconductor laser, comprising a driving board (1) and a water-cooled heat dissipation component (2) mounted on the driving board (1), and a plurality of laser diode packaging components (3) are assembled on the water-cooled heat dissipation component (2); characterized in that, The water-cooled heat dissipation component (2) includes two water-cooling blocks (4) that are connected and communicate with each other. A number of laser diode packaging components (3) are assembled on the two water-cooling blocks (4) in an array; cooling channels (45) that cover and are arranged around the array of a number of laser diode packaging components (3) are formed in both of the two water-cooling blocks (4). The cooling channels (45) are composed of a number of cooling branches (46), and the number of cooling branches (46) and the array of a number of laser diode packaging components (3) are arranged in an alternating layer-by-layer manner.

2. The multi-channel water-cooled heat dissipation device for a semiconductor laser according to claim 1, wherein The two water-cooling blocks (4) are arranged opposite to each other, and a connecting pipe (6) that communicates with the other water-cooling block (4) is formed at the end of the water-cooling block (4).

3. The multi-channel water-cooled heat dissipation device for a semiconductor laser according to claim 2, wherein, Pipeline connectors (5) connected to the connecting pipe (6) are provided at the ends of both of the two water-cooling blocks (4), and the pipeline connectors (5) communicate with the cooling channels (45) inside the water-cooling blocks (4).

4. The multi-channel water-cooled heat dissipation device for a semiconductor laser according to claim 3, wherein, A liquid inlet connector (7) that communicates with the cooling channel (45) inside the water-cooling block (4) is provided at the end of one of the water-cooling blocks (4), and a liquid outlet connector (8) that communicates with the cooling channel (45) inside the water-cooling block (4) is provided at the end of the other water-cooling block (4).

5. The multi-channel water-cooled heat dissipation device for a semiconductor laser according to claim 4, characterized in that, Pipeline interfaces (42) for installing the pipeline connectors (5) are formed on the water-cooling blocks (4). Installation interfaces (41) for installing the liquid outlet connectors (8) or the liquid inlet connectors (7) are also formed on the water-cooling blocks (4). The opening directions of the pipeline interfaces (42) and the installation interfaces (41) are arranged in a cross manner.

6. The multi-channel water-cooled heat dissipation device applied to a semiconductor laser according to claim 5, wherein, A first chamber (47) that communicates with the installation interface (41) and a second chamber (48) that communicates with the pipeline interface (42) are formed inside the water-cooling blocks (4). The first chamber (47) and the second chamber (48) are respectively connected to the opposite ends of a number of cooling branches (46).

7. A multi-channel water-cooled heat dissipation device applied to a semiconductor laser according to claim 1, characterized in that, A number of the cooling branches (46) are distributed layer by layer along the height direction of the water-cooling block (4).

8. A multi-channel water-cooled heat dissipation device applied to a semiconductor laser according to claim 1, wherein, A boss (43) for increasing the contact area between the water-cooling block (4) and the driving board (1) is formed at the bottom of the water-cooling block (4).

9. The multi-channel water-cooled heat dissipation device for a semiconductor laser according to claim 8, wherein, A heat-conducting layer (9) for enhancing the heat conduction effect between the water-cooling block (4) and the driving board (1) is installed on the driving board (1).

10. A multi-channel water-cooled heat dissipation device applied to a semiconductor laser according to claim 1, characterized in that, Assembly holes (44) for assembling the laser diode packaging components (3) are formed on the water-cooling blocks (4).

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