Mixed state mode control system

Abstract

The utility model discloses a mixed state mode control system, which relates to the technical field of motor drive control systems and comprises an aluminum shell film capacitor, a radiator, an insulating support, an insulated gate bipolar transistor (IGBT) power module, a silicon carbide (SiC) power module and an integrated drive control board. The IGBT power module and the SiC power module are mounted above the radiator through the insulating support, different module mixed-state layout modes are adopted, meanwhile, different direct connection mutual welding processes are adopted, the structure arrangement is more compact, and the structure is more compact. The IGBT module has the technical characteristics of small size, light weight, high reliability, high working efficiency compared with a full IGBT module, greatly reduced cost compared with a full SiC module and the like, meanwhile, the design omits the traditional bolt connection and wiring harness connection, is simpler and more convenient to assemble, is suitable for automatic batch manufacturing, and provides a process basis for higher-automation-degree assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of motor drive control systems, and particularly relates to a hybrid mode control system. Background Technique

[0002] The motor control system is an important component for the stable and precise operation of the motor, and it can control the motor according to parameters such as the set direction, speed, angle, response time, etc. The internal structure of the traditional motor control system is loosely arranged and has a large volume, making it difficult to arrange and install. Moreover, the traditional motor control system has poor internal heat dissipation performance and low power density, and the connection reliability between components is poor. In view of the deficiencies of the current motor control system, this application proposes a hybrid mode control system to solve the above problems. Content of the Utility Model

[0003] The purpose of the utility model is to provide a hybrid mode control system to solve the problems existing in the prior art as mentioned in the above background technique.

[0004] To achieve the above purpose, the utility model provides the following technical solutions:

[0005] A hybrid mode control system includes an aluminum shell film capacitor, a radiator, an insulating support, an IGBT power module, a SiC power module, and an integrated drive control board. The radiator is installed on the aluminum shell film capacitor. The IGBT power module and the SiC power module are installed above the radiator through the insulating support. The negative output copper row of the aluminum shell film capacitor and the negative pole of the SiC power module are laser welded with a negative input electrode plate. The positive output copper row of the aluminum shell film capacitor and the positive pole of the SiC power module are laser welded with a positive input electrode plate. The output end of the SiC power module is laser welded with a three-phase output electrode plate. The integrated drive control board is connected to each module, a current sensor, and a positive terminal through a selective wave soldering process and is installed on the aluminum shell film capacitor.

[0006] Preferably, the aluminum shell film capacitor includes a film capacitor module and a capacitor housing. The film capacitor module is installed in the capacitor housing, and a module water channel is provided in the capacitor housing.

[0007] Preferably, the SiC power module includes a plurality of SiC module combinations, and each SiC module combination is composed of two SiC modules connected in series.

[0008] Preferably, the IGBT power module includes a plurality of IGBT module combinations, and each IGBT module combination is composed of four IGBT modules connected in series and parallel.

[0009] Preferably, the SiC module combination and the IGBT module combination together constitute a half-bridge module combination, and two of the three half-bridge module combinations together constitute a full-bridge module combination.

[0010] Preferably, the full-bridge module combination is directly welded to the radiator by vacuum reflow soldering or silver paste sintering.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] The present utility model adopts a mixed layout method of different modules and simultaneously adopts a direct connection and mutual welding process in different ways. The structure layout is more compact, and it has technical characteristics such as small volume, light weight, high reliability, high working efficiency compared with all IGBT modules, and a significant reduction in cost compared with all SiC modules. At the same time, this design eliminates the traditional bolt connection and wire harness connection, making the assembly more convenient, suitable for automated batch manufacturing, and providing a process basis for higher automation level assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic diagram of the overall exploded structure of the present utility model.

[0014] Figure 2 is a schematic diagram of the aluminum shell thin film capacitor structure of the present utility model.

[0015] Figure 3 is a schematic diagram of the IGBT power module and SiC power module structure of the present utility model.

[0016] In the figure: 1-1, aluminum shell thin film capacitor; 1-2, radiator; 1-3, insulating support; 1-4, IGBT power module; 1-5, SiC power module; 1-6, negative input electrode plate; 1-7, positive input electrode plate; 1-8, three-phase output electrode plate; 1-9, integrated drive control board; 2-1, thin film capacitor module; 2-2, capacitor housing; 3-1, SiC module combination; 3-2, IGBT module combination; 3-3, half-bridge module combination; 3-4, full-bridge module combination. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] In order to make the technical means, creative features, achieved purposes and effects of the present utility model easy to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0018] Please refer to Figures 1 - 3 , the present utility model provides the following technical solutions:

[0019] A mixed-mode control system includes an aluminum-shell thin-film capacitor 1-1, a radiator 1-2, an insulating support 1-3, an IGBT power module 1-4, a SiC power module 1-5, and an integrated drive control board 1-9. The aluminum-shell thin-film capacitor 1-1 includes a thin-film capacitor module 2-1 and a capacitor housing 2-2. The thin-film capacitor module 2-1 is installed inside the capacitor housing 2-2. A module water channel is provided inside the capacitor housing 2-2. The capacitor housing 2-2 is made of aluminum alloy material and is integrally designed with the power module water channel. The output terminal of the thin-film capacitor module 2-1 is directly connected to the input terminal of the IGBT module by a laser welding process, replacing the conventional bolt fastening connection method, reducing the main circuit inductance, and improving the system reliability at the same time.

[0020] The radiator 1-2 is installed on the aluminum-shell thin-film capacitor 1-1. The inside of the radiator 1-2 is designed with a pin structure to increase the effective heat dissipation area. The surface of the radiator is nickel-plated and welded to the power device by a vacuum reflow soldering or silver paste sintering welding process. This design has a compact structure and a small total thermal resistance of the IGBT module, greatly improving the system power density and significantly increasing the working efficiency by using a mixed method.

[0021] The IGBT power module 1-4 and the SiC power module 1-5 are installed above the radiator 1-2 through the insulating support 1-3. The SiC power module 1-5 includes several SiC module combinations 3-1. The SiC module combination 3-1 is composed of two SiC modules connected in series. The IGBT power module 1-4 includes several IGBT module combinations 3-2. The IGBT module combination 3-2 is composed of four IGBT modules connected in series and parallel. The SiC module and the IGBT module are selected with Tpak packaging.

[0022] The SiC module combination 3-1 and the IGBT module combination 3-2 together constitute a half-bridge module combination 3-3. Two sets of the half-bridge module combinations 3-3 together constitute a full-bridge module combination 3-4. The full-bridge module combination 3-4 is composed of 18 single tubes. The upper and lower bridges of the same-phase bridge arm are connected in parallel in three groups. The full-bridge module combination 3-4 is directly welded to the radiator 1-2 by a vacuum reflow soldering or silver paste sintering method, eliminating the traditional thermal conductive silicone grease and reducing the system thermal resistance at the same time.

[0023] The negative output copper row of the aluminum-shell thin-film capacitor 1-1 and the negative pole of the SiC power module 1-5 are laser welded with a negative input electrode plate 1-6. The positive output copper row of the aluminum-shell thin-film capacitor 1-1 and the positive pole of the SiC power module 1-5 are laser welded with a positive input electrode plate 1-7. The output end of the SiC power module 1-5 is laser welded with a three-phase output electrode plate 1-8, improving the reliability of the power terminal connection.

[0024] The integrated drive control board 1-9 is connected to each module, current sensor, and positive terminal through selective wave soldering process and is installed on the aluminum shell film capacitor 1-1; the control board and drive board adopt an integrated design. The pads of the integrated drive control board 1-9 are soldered to the gate pins of the IGBT module and are directly soldered to the positive pins of the capacitor for bus voltage sampling.

[0025] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mixed state mode control system, characterized in that, It includes an aluminum shell film capacitor (1-1), a radiator (1-2), an insulating support (1-3), an IGBT power module (1-4), a SiC power module (1-5), and an integrated drive control board (1-9). The radiator (1-2) is installed on the aluminum shell film capacitor (1-1). The IGBT power module (1-4) and the SiC power module (1-5) are installed above the radiator (1-2) through the insulating support (1-3). The negative output copper row of the aluminum shell film capacitor (1-1) and the negative pole of the SiC power module (1-5) are laser welded with a negative input plate (1-6). The positive output copper row of the aluminum shell film capacitor (1-1) and the positive pole of the SiC power module (1-5) are laser welded with a positive input plate (1-7). The output end of the SiC power module (1-5) is laser welded with a three-phase output plate (1-8). The integrated drive control board (1-9) is connected to each module, a current sensor, and a positive terminal through a selective wave soldering process and is installed on the aluminum shell film capacitor (1-1).

2. The hybrid state mode control system according to claim 1, wherein: The aluminum shell film capacitor (1-1) includes a film capacitor module (2-1) and a capacitor housing (2-2). The film capacitor module (2-1) is installed inside the capacitor housing (2-2). A module water channel is provided inside the capacitor housing (2-2).

3. The hybrid mode control system according to claim 1, characterized in that: The SiC power module (1-5) includes a plurality of SiC module combinations (3-1). The SiC module combination (3-1) is composed of two SiC modules connected in series.

4. A hybrid state mode control system according to claim 3, characterized in that: The IGBT power module (1-4) includes a plurality of IGBT module combinations (3-2). The IGBT module combination (3-2) is composed of four IGBT modules connected in series and parallel.

5. A hybrid state mode control system according to claim 4, characterized in that: The SiC module combination (3-1) and the IGBT module combination (3-2) together constitute a half-bridge module combination (3-3). Two sets of the half-bridge module combinations (3-3) together constitute a full-bridge module combination (3-4).

6. A hybrid state mode control system according to claim 5, characterized in that: The full-bridge module combination (3-4) is directly welded to the radiator (1-2) by vacuum reflow soldering or silver paste sintering.

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