LED lamp bead and LED light source

Abstract

The utility model provides an LED lamp bead and an LED light source, and relates to the field of LEDs. The LED lamp bead comprises a plastic base body, a ceramic chip and an LED chip. The plastic base body is provided with stepped holes penetrating through the opposite upper surface and lower surface of the plastic base body, the stepped holes comprise a first hole and a second hole which are coaxially connected, the inner diameter of the first hole is gradually decreased from the upper surface to the end close to the second hole, the hole wall of the first hole is provided with a reflecting layer, and the inner diameter of the second hole is larger than the inner diameter of the end, close to the second hole, of the first hole. A limiting step is formed at the joint of the second hole and the first hole; the ceramic chip is embedded in the second hole and abuts against the limiting step, and two electrodes with different polarities are arranged on the surface of the ceramic chip; the LED chip is arranged on the surface of the ceramic chip and electrically connected with the electrode, the LED chip is located in the first hole, and the face, away from the ceramic chip, of the LED chip is lower than the upper surface. The manufacturing process is low in difficulty and low in cost, and high reflection and high thermal conductivity are integrated.

Description

Technical Field

[0001] The present application relates to the field of LEDs, and more specifically, to an LED lamp bead and an LED light source. Background Art

[0002] At present, there are several solutions for the lamp beads used in LED light sources with reflective cups. The first is EMC or SMD brackets, which have the problem of thermal and electrical separation, and the reflective cup cannot achieve high reflection effect. The second is the copper dam reflective cup structure of the ceramic substrate, which is difficult to achieve high reflection due to its manufacturing process and is costly. The third solution is to add a silicon-based or quartz reflective cup on the original flat substrate, but the cost is high. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide an LED lamp bead and an LED light source, wherein the manufacturing process of the LED lamp bead is low in difficulty and cost, and achieves integration of high reflection and high thermal conductivity.

[0004] In a first aspect, an embodiment of the present application provides an LED lamp bead, which includes a plastic substrate, a ceramic sheet and an LED chip.

[0005] The plastic substrate is provided with stepped holes penetrating its relative upper and lower surfaces, the stepped holes include a first hole and a second hole which are coaxially connected, the inner diameter of the first hole gradually decreases from the upper surface to the end close to the second hole, the hole wall of the first hole is provided with a reflective layer, the inner diameter of the second hole is larger than the end of the first hole close to the second hole, so that a limiting step is formed at the connection between the second hole and the first hole; the ceramic sheet is embedded in the second hole and abuts against the limiting step, and two electrodes with different polarities are provided on the surface of the ceramic sheet; the LED chip is arranged on the surface of the ceramic sheet and is electrically connected to the electrodes, the LED chip is located in the first hole, and the side of the LED chip facing away from the ceramic sheet is lower than the upper surface.

[0006] In the above implementation process, plastic is used to prepare a plastic matrix as the LED lamp bead base material, which not only has good insulation properties, but also can be injection molded according to the light output requirements, with low preparation difficulty and low cost. At the same time, the inner diameter of the first hole gradually decreases from the upper surface to the end close to the second hole, and a reflective layer is provided on the hole wall of the first hole to form a bowl-shaped high-reflection structure together; the LED chip is arranged on the surface of the ceramic sheet and electrically connected to the electrode, so that the generated heat can be directly conducted through the ceramic sheet, with good thermal conductivity, which can effectively reduce thermal effect problems, thereby realizing the integration of high reflection and high thermal conductivity.

[0007] In a possible implementation, a cross section of the hole wall of the first hole in the axial direction is an arc, and the arc protrudes toward a side away from the axial direction of the first hole.

[0008] In the above implementation process, the reflection structure can be further optimized structurally to improve the reflection effect.

[0009] In a possible implementation, the cross-sectional shape of the first hole is circular; and / or,

[0010] the cross-sectional shape of the second hole is a regular polygon.

[0011] In the above implementation process, the setting that the cross-sectional shape of the first hole is circular is conducive to the uniform reflection effect of the reflection layer provided on the inner wall of the first hole, which is beneficial to optimizing the reflection effect. Since the first hole and the second hole are coaxially connected, controlling the second hole to be a regular polygon is beneficial in two aspects. On the one hand, it is conducive to limiting the ceramic sheet embedded therein and suppressing the circumferential rotation of the ceramic sheet. On the other hand, it is also conducive to the uniform contact and uniform force application between the ceramic sheet and the plastic matrix, improving the stability of the overall structure and the uniformity of heat dissipation.

[0012] In a possible implementation, the cross-sectional area of the outer contour of the plastic matrix gradually decreases from the upper surface to the lower surface.

[0013] In the above implementation process, on the one hand, the manufacturing cost can be reduced. On the other hand, when multiple LED lamp beads are installed on the PCB board, the upper surfaces of the plastic matrices of two adjacent LED lamp beads are in mutual contact, improving the overall stability, and the spaced lower surfaces can form heat dissipation gaps, improving the heat dissipation effect.

[0014] In a possible implementation, the cross-sectional shape of the outer contour of the plastic matrix is a rectangle with one corner missing.

[0015] In the above implementation process, the side with the missing corner of the plastic matrix can be used as a mark to identify the positive and negative electrodes of the LED chip, improving the installation efficiency of installing the LED lamp bead onto the PCB substrate. At the same time, when multiple LED lamp beads are installed on the PCB board and the upper surfaces of the plastic matrices of two adjacent LED lamp beads are in contact with each other, the missing corner can form a gap for heat dissipation.

[0016] In a possible implementation, there is a gap between the ceramic sheet and the inner wall of the first hole, and the width of the gap is 0.1 mm - 0.2 mm.

[0017] In the above implementation process, through the setting of the gap, it is convenient to install the ceramic sheet into the first hole, and it can also reduce the direct contact area between the ceramic sheet and the plastic substrate, reducing heat transfer. And this gap can also be used as a heat dissipation gap for heat dissipation, thereby improving the overall heat dissipation effect.

[0018] In a possible implementation, the upper surface is provided with a limiting convex rib, and the limiting convex rib protrudes from the upper surface and surrounds the circumference of the first hole.

[0019] In the above implementation process, the provision of the limiting convex ridges facilitates the positioning and limiting of the installation position of the glass window, and is conducive to the stable installation of the glass window on the plastic substrate.

[0020] In a possible implementation, the LED lamp bead further includes a glass window, and the glass window is snap-connected to the limiting convex ridges so that the glass window covers the upper surface.

[0021] In the above implementation process, the introduction of the glass window effectively protects the LED chip, and at the same time, the snap connection method is convenient for installation.

[0022] In a possible implementation, the plastic substrate is an integrally formed PP plastic substrate.

[0023] In a second aspect, an embodiment of the present application provides an LED light source, which includes a PCB substrate and the LED lamp bead provided in the first aspect. The PCB substrate is provided with a positive electrode circuit and a negative electrode circuit. The ceramic sheet and the plastic substrate are respectively installed on the PCB substrate. The positive electrode of the LED chip is connected to the positive electrode circuit, and the negative electrode of the LED chip is connected to the negative electrode circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0025] Figure 1 It is a schematic structural diagram of the first perspective of the LED lamp bead provided by the embodiment of the present application;

[0026] Figure 2 It is a schematic structural diagram of the second perspective of the LED lamp bead provided by the embodiment of the present application;

[0027] Figure 3 It is a schematic structural diagram of the third perspective of the LED lamp bead provided by the embodiment of the present application;

[0028] Figure 4 It is a schematic structural diagram of the fourth perspective of the LED lamp bead provided by the embodiment of the present application.

[0029] Reference numerals: 1000 - LED lamp bead; 10 - plastic substrate; 101 - upper surface; 102 - lower surface; 103 - side wall; 105 - first hole; 106 - second hole; 107 - reflective layer; 11 - ceramic sheet; 110 - gap; 12 - LED chip; 13 - limiting convex ridge. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, rather than all of them. Usually, the components of the embodiments of this application described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of this application claimed, but merely represents selected embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts belong to the scope of protection of this application.

[0032] It should be noted that similar reference numerals and letters indicate similar items in the following accompanying drawings. Therefore, once an item is defined in one accompanying drawing, it does not need to be further defined and explained in subsequent accompanying drawings.

[0033] In the description of this application, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this application is usually placed when in use. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0034] In the description of this application, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] An LED light source includes an LED lamp bead and a PCB board.

[0036] Please refer to Figure 1 , the LED lamp bead 1000 includes a plastic substrate 10, a ceramic sheet 11, and an LED chip 12.

[0037] The plastic substrate 10 is provided with a stepped hole penetrating through its opposite upper surface 101 and lower surface 102. The stepped hole includes a first hole 105 and a second hole 106 that are coaxially connected. The inner diameter of the first hole 105 gradually decreases from the upper surface 101 to the end close to the second hole 106. A reflective layer 107 is provided on the hole wall of the first hole 105. The inner diameter of the second hole 106 is larger than the end of the first hole 105 close to the second hole 106, so as to form a limiting step at the connection between the second hole 106 and the first hole 105. The ceramic chip 11 is embedded in the second hole 106 and abuts against the limiting step. Two electrodes with different polarities are provided on the surface of the ceramic chip 11. The LED chip 12 is disposed on the surface of the ceramic chip 11 and electrically connected to the electrodes. The LED chip 12 is located in the first hole 105, and the side of the LED chip 12 facing away from the ceramic chip 11 is lower than the upper surface 101.

[0038] Using plastic to prepare the plastic substrate 10 as the base material of the LED lamp bead 1000 not only has good insulation, but also can be injection-molded according to the light-emitting requirements, with low preparation difficulty and low cost. At the same time, the inner diameter of the first hole 105 gradually decreases from the upper surface 101 to the end close to the second hole 106, and a reflective layer 107 is provided on the hole wall of the first hole 105 to jointly form a bowl-shaped high-reflection structure.

[0039] Among them, the material of the reflective layer 107 includes but is not limited to aluminum film, silver film, nickel film or gold film, and can be deposited on the hole wall of the first hole 105 by magnetron sputtering or electroplating, or the reflective layer 107 can also be formed by screen printing with silica gel or epoxy-based high-reflection materials.

[0040] The ceramic chip 11 has high thermal conductivity and insulation. Therefore, the LED chip 12 is disposed on the surface of the ceramic chip 11 and electrically connected to the electrodes. The ceramic chip 11 is embedded in the second hole 106 and abuts against the limiting step, so that the LED chip 12 is located in the first hole 105, and the side of the LED chip 12 facing away from the ceramic chip 11 is lower than the upper surface 101. In this way, the generated heat can be directly conducted through the ceramic chip 11, with good heat conduction effect, which can effectively reduce the thermal effect problem, thereby realizing the integration of high reflection and high heat conduction.

[0041] The LED chip 12 includes but is not limited to ordinary LED chips 12, and can also be UV-LED chips 12, which can be specifically selected according to actual needs and are not limited here.

[0042] In summary, the LED lamp bead 1000 provided by the present application, through the improvement of the structure, not only has low process difficulty in preparing it and low implementation cost, but also has good reflection effect of the product, and realizes the integration of high reflection and high heat conduction.

[0043] It should be noted that there are many ways to achieve the inner diameter of the first hole 105 gradually decreasing from the upper surface 101 to the end close to the second hole 106. For example, in some other embodiments, the cross-section of the hole wall of the first hole 105 in the axial direction is a straight line.

[0044] In this embodiment, the cross section of the hole wall of the first hole 105 in the axial direction is an arc, and the arc is convex to the side away from the axial direction of the first hole 105 .

[0045] Under the above setting conditions, the reflection structure can be further optimized structurally to improve the reflection effect.

[0046] It should be noted that the cross-section of the first hole 105 and the cross-section of the second hole 106 both refer to radial cross-sections. The cross-sectional shape of the first hole 105 and the cross-sectional shape of the second hole 106 can be the same or different. The shapes of the two include but are not limited to circular, elliptical, rectangular, polygonal, etc.

[0047] In some embodiments, the cross-sectional shape of the first hole 105 is circular; and / or,

[0048] The cross-sectional shape of the second hole 106 is a regular polygon.

[0049] In this embodiment, the cross-sectional shape of the first hole 105 is a circle, and the cross-sectional shape of the second hole 106 is a regular polygon.

[0050] The circular cross-sectional shape of the first hole 105 is conducive to uniform reflection effect of the reflection layer 107 disposed on the hole wall of the first hole 105, and is conducive to optimizing the reflection effect. Since the first hole 105 and the second hole 106 are coaxially connected, the second hole 106 is controlled to be a regular polygonal setting, which is conducive to limiting the ceramic sheet 11 embedded therein and inhibiting the ceramic sheet 11 from rotating in the circumferential direction, and is also conducive to uniform contact and uniform force between the ceramic sheet 11 and the plastic substrate 10, thereby improving the stability of the overall structure and the uniformity of heat dissipation.

[0051] like Figure 1 As shown, a gap 110 is left between the ceramic sheet 11 and the hole wall of the first hole 105 , and the width of the gap 110 is 0.1 mm-0.2 mm.

[0052] The gap 110 is provided to facilitate installation of the ceramic sheet 11 in the first hole 105 , and can also reduce the direct contact area between the ceramic sheet 11 and the plastic substrate, reduce heat transfer, and the gap 110 can also be used as a heat dissipation gap to dissipate heat, thereby improving the overall heat dissipation effect.

[0053] Exemplarily, the width of the gap 110 is any value among 0.1 mm, 0.12 mm, 0.15 mm, 0.17 mm, or 0.2 mm, or between any two of these values.

[0054] Among them, the material of the plastic substrate 10 includes but is not limited to PP, PA, PC, ABS, etc.

[0055] In this embodiment, the plastic substrate 10 is an integrally formed PP plastic substrate.

[0056] Among them, the PP material has excellent properties such as non-toxicity, easy processing, high impact strength, chemical corrosion resistance, good flexural resistance, and good electrical insulation. It has excellent comprehensive performance, reasonable price, and the integrally formed structure has a good support effect.

[0057] Among them, the cross-sectional shape of the outer contour of the plastic substrate 10 can be rectangular.

[0058] As Figure 2 , Figure 3 and Figure 4 shown, in this embodiment, the cross-sectional shape of the outer contour of the plastic substrate 10 is a rectangle with one corner missing.

[0059] Through the above settings, the side with the missing corner can be used as an identifier to identify the positive and negative electrodes of the LED chip 12, improving the installation efficiency of mounting the LED lamp bead 1000 onto the PCB substrate. At the same time, when multiple LED lamp beads 1000 are mounted on the PCB board and the upper surfaces 101 of the plastic substrates 10 of two adjacent LED lamp beads 1000 are in contact with each other, the missing corner can form a gap for heat dissipation.

[0060] Among them, the shape of the plastic substrate 10 is a cube, and the installation stability is good.

[0061] Among them, the cross-sectional area of the outer contour of the plastic substrate 10 can remain unchanged from the upper surface 101 to the lower surface 102, that is, at this time, the shape of the plastic substrate 10 is a cuboid or a cube.

[0062] As Figure 1 shown, in this embodiment, the cross-sectional area of the outer contour of the plastic substrate 10 gradually decreases from the upper surface 101 to the lower surface 102.

[0063] The above settings can, on the one hand, reduce the manufacturing cost. On the other hand, when multiple LED lamp beads 1000 are mounted on the PCB board, the upper surfaces 101 of the plastic substrates 10 of two adjacent LED lamp beads 1000 are in abutment with each other, improving the overall stability. The lower surfaces 102 are spaced apart to form heat dissipation gaps, improving the heat dissipation effect.

[0064] As Figure 2 , Figure 3 andFigure 4 As shown, the corners of the outer contour of the plastic substrate 10 can be rounded.

[0065] Please refer to Figure 2 and Figure 3 , the upper surface 101 is provided with a limiting convex rib 13, which protrudes from the upper surface 101 and surrounds the circumference of the first hole 105.

[0066] Through the setting of the limiting convex rib 13, it is beneficial to position and limit the installation position of the glass window, and it is beneficial to stably install the glass window on the plastic substrate 10.

[0067] Among them, it should be noted that the limiting convex rib 13 can continuously surround the circumference of the first hole 105 in a ring shape, or can be dispersed around the circumference of the first hole 105. For example, the limiting convex rib 13 includes a plurality of limiting convex rib units distributed in an annular array. It can be understood that the annular shape includes but is not limited to a circular ring, and can also be a square ring, etc., which can be selected according to the shape of the upper surface 101 of the plastic substrate 10 or the shape of the glass window.

[0068] In this embodiment, the limiting convex rib 13 is in a ring shape surrounding the circumference of the first hole 105, and the limiting convex rib 13 has a notch. The setting of the notch is beneficial to release heat.

[0069] The plastic substrate 10 has a side wall 103 connecting the upper surface 101 and the lower surface 102. Optionally, the outer edge of the limiting convex rib 13 is flush with the side wall 103 of the plastic substrate 10.

[0070] In some embodiments, the LED lamp bead 1000 further includes a glass window (not shown in the figure), and the glass window is snap-connected to the limiting convex rib 13 so that the glass window covers the upper surface 101.

[0071] By introducing the glass window, the LED chip 12 can be effectively protected, and at the same time, the snap connection method is convenient for installation.

[0072] The specific setting of the glass window can refer to the related technology and will not be limited here.

[0073] The number of LED lamp beads 1000 is one or more, such as two, three, etc., and those skilled in the art can select according to actual needs.

[0074] The PCB substrate is provided with a positive electrode circuit and a negative electrode circuit. The ceramic sheet and the plastic substrate are respectively installed on the PCB substrate. The positive electrode of the LED chip is connected to the positive electrode circuit, and the negative electrode of the LED chip is connected to the negative electrode circuit.

[0075] In summary, the LED lamp bead and the LED light source provided by the present application have low manufacturing process difficulty and low cost, and achieve the integration of high reflectivity and high thermal conductivity.

[0076] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An LED lamp bead, characterized in that, Comprising: A plastic substrate is provided with a stepped hole penetrating through its opposite upper surface and lower surface. The stepped hole includes a first hole and a second hole connected coaxially. The inner diameter of the first hole gradually decreases from the upper surface to one end close to the second hole. A reflective layer is provided on the inner wall of the first hole. The inner diameter of the second hole is larger than that of the end of the first hole close to the second hole, so as to form a limiting step at the connection of the second hole and the first hole; A ceramic chip is embedded in the second hole and abuts against the limiting step. Two electrodes with different polarities are provided on the surface of the ceramic chip; And An LED chip is disposed on the surface of the ceramic chip and electrically connected to the electrode. The LED chip is located in the first hole, and the side of the LED chip facing away from the ceramic chip is lower than the upper surface.

2. The LED lamp bead according to claim 1, wherein The cross-section of the inner wall of the first hole in the axial direction is an arc, and the arc protrudes towards the side away from the axis of the first hole.

3. The LED lamp bead according to claim 1, characterized in that, The cross-sectional shape of the first hole is circular; and / or, The cross-sectional shape of the second hole is a regular polygon.

4. The LED lamp bead according to claim 1, characterized in that, The cross-sectional area of the outer contour of the plastic substrate gradually decreases from the upper surface to the lower surface.

5. The LED lamp bead according to claim 1, wherein, The cross-sectional shape of the outer contour of the plastic substrate is a rectangle with one corner missing.

6. The LED lamp bead according to claim 1, wherein A gap is left between the ceramic chip and the inner wall of the first hole, and the width of the gap is 0.1mm - 0.2mm.

7. The LED lamp bead according to claim 1, characterized in that, The upper surface is provided with a limiting rib, and the limiting rib protrudes from the upper surface and surrounds the circumference of the first hole.

8. The LED lamp bead according to claim 7, wherein It further includes a glass window, and the glass window is clamped with the limiting rib so that the glass window covers the upper surface.

9. The LED lamp bead according to claim 1, wherein The plastic substrate is an integrally formed PP plastic substrate.

10. An LED light source, characterized in that, Comprising a PCB substrate and the LED lamp bead according to any one of claims 1 - 9. The PCB substrate is provided with a positive circuit and a negative circuit. The ceramic chip and the plastic substrate are respectively mounted on the PCB substrate. The positive electrode of the LED chip is connected to the positive circuit, and the negative electrode of the LED chip is connected to the negative circuit.

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