Dispensing device for MEMS sensor processing
The MEMS sensor processing point glue device addresses imprecision and complexity issues by enabling 6-degree-of-freedom movement and magnetic-elastic needle attachment, ensuring precise glue application and easy chip replacement.
Patent Information
- Application Number
- CN202422074821.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-08-27
AI Technical Summary
The existing MEMS sensor dispensing device has a complex structure, and it is inconvenient to install and exchange for dispensing needles, cannot accurately position, and is cumbersome to operate.
A dispensing device including a microscope, a syringe Z-axis displacement platform, a syringe X-axis displacement platform, a dispensing platform, a chip container positioning component, a syringe clamping component and a microscope clamping component was designed, which realizes multi-directional movement of the glue needle, a microscope and a chip, simplifies the installation of the glue needle, and achieves accurate observation and positioning through a microscope.
It improves the dispensing efficiency, simplifies the operation process, enhances the vibration resistance of the device, and realizes flexible control of the glue needle and fast replacement and precise positioning of the chip.
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Figure CN223097188U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of sensor processing, in particular to a dispensing device for processing MEMS flow sensors. Background Art
[0002] The MEMS flow sensor is a flow measurement device based on microelectromechanical system technology. It combines microelectronic technology and mechanical engineering technology. Through tiny sensor structures and electronic components, it can monitor the flow rate of fluids in real time. During the production and processing of MEMS flow sensors, it is necessary to dispense glue on their outer casings. Specifically, the flow sensor to be dispensed is placed in a carrier tray, and then the carrier tray is transported to the dispensing mechanism by a conveying device for dispensing treatment.
[0003] The patent with the publication number CN110918384A discloses an ultra-precision dispensing system. The dispensing machine is connected to the dispensing plane, the glue supply device is connected to the glue storage cylinder. There is a motor on the housing of the dispensing machine, the motor is connected to a threaded rod installed inside the housing. Above the threaded rod, a lead screw slider is installed, the lead screw slider is connected to the glue needle cylinder, a glue needle tube is installed inside the glue needle cylinder. The dispensing plane support frame installed below the threaded rod is connected to the dispensing plane. The dispensing method is to first select a glue needle, then put the glue needle tube with the glue needle into the glue needle cylinder. The motor drives the threaded rod of the dispensing machine to rotate. The threaded rod drives the lead screw slider to move up and down, thereby driving the glue needle to pass through the glue storage cylinder for dispensing. While the threaded rod rotates, it drives the dispensing plane support frame to move. The dispensing plane support frame drives the dispensing plane to move differentially with the glue needle. The patent with the publication number CN118437576A discloses an ultra-chip dispensing device, including a printing platform, a dispensing component and an observation module. The printing platform is used to fix the product to be printed and can move the product to be printed in the XY plane and rotate around the Z axis. The printing needle of the dispensing component can move along the Z axis relative to the printing platform and rotate around an axis parallel to the XY plane. The observation module is relatively fixed to the printing needle of the dispensing component and is used to observe the glue discharging and real-time printing situation of the printing needle.
[0004] The existing technologies have the following disadvantages: (1) The structure of the MEMS sensor chip is relatively small, and it is impossible to determine whether the dispensing is accurate with the naked eye. Some existing dispensing devices lack an observation module and cannot observe the surface of the sensor, so the dispensing accuracy cannot be guaranteed. The observation module of some dispensing devices is fixed to the glue needle and cannot flexibly adjust the relative position with the glue needle; (2) The diameter of the dispensing needle is small, and it is inconvenient to install and replace; (3) It is difficult to align the dispensing needle with the center of the sensor chip; (4) The existing dispensing device has a complex structure and a high cost; (5) During the dispensing process, it is necessary to continuously replace the sensor chip and adjust the position of the glue needle, and the operation is cumbersome. Summary of the Invention
[0005] The object of the present invention is to provide a dispensing device for MEMS sensor processing, which solves the problems of complex structure and operation of the existing dispensing device and inconvenient installation and replacement of the dispensing needle.
[0006] In order to achieve the above object, the present invention adopts the following technical solutions:
[0007] A dispensing device for MEMS sensor processing includes a microscope, a syringe Z-axis displacement platform, a syringe X-axis displacement platform, a dispensing platform, a chip container positioning component, a chip container, a syringe clamping component, a microscope clamping component, a column, an inclined rod and a platform; the column, the dispensing platform and the inclined rod are sequentially installed on the platform along the Y direction; the chip container positioning component is fixed on the upper part of the dispensing platform. During use, the chip container is placed in the fixed position of the chip container positioning component, and the chip to be processed is placed in the chip container; the syringe X-axis displacement platform is installed on the top of the column, the syringe Z-axis displacement platform is fixed on the syringe X-axis displacement platform, and the syringe clamping component is fixed on the syringe Z-axis displacement platform for clamping the syringe. The syringe is located above the chip container. The syringe X-axis displacement platform is used to drive the syringe clamping component and the syringe to move in the X direction, and the syringe Z-axis displacement platform is used to drive the syringe clamping component and the syringe to move in the Z direction; the microscope is fixed on the inclined rod through the microscope clamping component, and the microscope clamping component is used to drive the microscope to move up and down along the inclined rod.
[0008] As a realization mode, the syringe clamping component includes a non-ferrous metal fixing plate, a groove, a magnetic adsorption clamping component, a magnet fixing groove and a magnet. A vertical groove is opened in the middle of one side of the non-ferrous metal fixing plate, and a magnet fixing groove is opened on the other side. The magnet fixing groove is communicated with the vertical groove. The magnet is fixed in the magnet fixing groove. The upper part of the syringe is embedded in the groove, and the magnetic adsorption clamping component is close to the upper part of the syringe and attracted to the magnet, and adsorbed on the groove side of the non-ferrous metal fixing plate.
[0009] As another realization mode, the syringe clamping component includes an iron fixing plate, a groove and a magnetic adsorption clamping component. A vertical groove is opened in the middle of one side of the iron fixing plate, and the upper part of the syringe is embedded in the groove. The magnetic adsorption clamping component is close to the upper part of the syringe and adsorbed on the groove side of the iron fixing plate. The magnetic adsorption clamping component contains magnetic materials.
[0010] The syringe clamping component further includes an elastic layer, and elastic layers are arranged on both sides of the syringe.
[0011] It should be noted that: the dispensing platform is an XYZ displacement platform, and the XYZ displacement platform is used to drive the chip container positioning component and the chip container to move in the X, Y and Z directions.
[0012] As an implementation, the chip container positioning component includes a flat plate and an embedding groove with an included angle of α opened at one corner of the flat plate. The chip container includes a chip slot fixing part and a chip slot. The cross-section of the chip slot fixing part is a regular N-sided polygon, where N = 360 / α. Any corner of the chip slot fixing part is exactly clamped into the embedding groove. N chip slots are equally spaced around the center position at the upper part of the chip slot fixing part. The chips to be processed are placed in the chip slots. After rotating the chip container, the chips in the chip slots in the fixed positions are exactly in the positions of the previous chips.
[0013] It should be noted that N is a positive integer greater than, preferably 3 - 8.
[0014] Advantages of the present invention: (1) The glue needle, microscope, and chip can all move, and the entire device has 6 degrees of freedom, which is convenient to operate and greatly improves the glue dispensing efficiency; (2) The syringe clamping component simplifies the installation of the glue needle, and the design of the elastic layer can better protect the glue needle against vibration; (3) The syringe Z-axis displacement platform and the syringe X-axis displacement platform enable flexible control of the glue needle; (4) The microscope enables microscopic observation of the glue dispensing process and achieves precise positioning of glue dispensing. In addition, its separate fixed setting greatly increases the convenience of use; (5) The chip container positioning component and the chip container cooperate with each other to achieve rapid replacement and precise positioning of the chips; (6) The structure is simple and the anti-vibration performance is enhanced. Description of the Drawings
[0015] Figure 1 It is a three-dimensional view of the glue dispensing device for MEMS flow sensor processing involved in Embodiment 1.
[0016] Figure 2 It is a three-dimensional view of the syringe Z-axis displacement platform involved in Embodiment 1.
[0017] Figure 3 It is a three-dimensional view of the syringe X-axis displacement platform involved in Embodiment 1.
[0018] Figure 4 It is a three-dimensional view of the XYZ displacement platform involved in Embodiment 1.
[0019] Figure 5 It is a three-dimensional view of the syringe clamping component involved in Embodiment 1 Figure 1 。
[0020] Figure 6 It is a three-dimensional view of the syringe clamping component involved in Embodiment 1 Figure 2 。
[0021] Figure 7 It is a three-dimensional view of the chip container positioning component involved in Embodiment 1.
[0022] Figure 8 It is a three-dimensional view of the chip container involved in Embodiment 1. Detailed implementation manners
[0023] The following further describes the detailed implementation manners of the present invention in conjunction with the accompanying drawings and technical solutions.
[0024] Embodiment 1
[0025] As shown in Figure 1 a dispensing device for processing a MEMS flow sensor according to this embodiment includes a microscope 1, a syringe Z-axis displacement platform 2, a syringe X-axis displacement platform 3, a dispensing platform 4, a chip container positioning component 5, a chip container 6, a syringe clamping component 7, a microscope clamping component 8, a column 9, an inclined rod 10, and a platform 11.
[0026] The column 9, the dispensing platform 4, and the inclined rod 10 are sequentially installed on the platform 11 along the Y direction.
[0027] The chip container positioning component 5 is fixed on the upper part of the dispensing platform 4. During use, the chip container 6 is placed at the fixed position of the chip container positioning component 5, and the chip to be processed is placed in the chip container 6.
[0028] The syringe X-axis displacement platform 3 is installed on the top of the column 9. The syringe Z-axis displacement platform 2 is fixed on the syringe X-axis displacement platform 3. The syringe clamping component 7 is fixed on the syringe Z-axis displacement platform 2 and is used to clamp the syringe. The syringe is located above the chip container 6. The syringe X-axis displacement platform 3 is used to drive the syringe clamping component 7 and the syringe to move in the X direction, and the syringe Z-axis displacement platform 2 is used to drive the syringe clamping component 7 and the syringe to move in the Z direction.
[0029] The microscope 1 is fixed on the inclined rod 10 through the microscope clamping component 8. The microscope clamping component 8 is used to drive the microscope 1 to move up and down along the inclined rod 10. The objective lens of the microscope 1 is aligned with the dispensing platform 4.
[0030] As an implementation manner, the syringe clamping component 7 includes a non-ferrous fixing plate 701, a groove 702, a magnetic adsorption clamping component 703, a magnet fixing groove, and a magnet 704. A vertical groove 702 is opened in the middle of one side of the non-ferrous fixing plate 701, and a magnet fixing groove is opened on the other side. The magnet fixing groove is communicated with the vertical groove 702. The magnet 704 is fixed in the magnet fixing groove. The upper part of the syringe is embedded in the groove 702. The magnetic adsorption clamping component 703 is close to the upper part of the syringe and attracts the magnet 704, and is adsorbed on the groove side of the ferrous fixing plate 701.
[0031] As another implementation, the syringe clamping component 7 includes an iron fixing plate 701', a groove 702, and a magnetic adsorption clamping component 703. A vertical groove 702 is formed in the middle of one side of the iron fixing plate 701'. The upper part of the syringe is embedded in the groove 702, and the magnetic adsorption clamping component 703 is adsorbed on the groove side of the iron fixing plate 701 close to the upper part of the syringe. The magnetic adsorption clamping component 703 contains magnetic materials.
[0032] The syringe clamping component 7 further includes an elastic layer. Elastic layers are provided on both sides of the syringe, that is, an elastic layer is provided between the syringe and the magnetic adsorption clamping component 703, and an elastic layer is provided between the syringe and the non-iron fixing plate 701 (magnet 704) or the iron fixing plate 701'. The elastic layer includes materials such as sponge and silica gel that have certain shock absorption and buffering effects, and play a role in protecting the syringe.
[0033] It should be noted that: the syringe Z-axis displacement platform 2, the syringe X-axis displacement platform 3, and the microscope clamping component 8 all include a fixed slide (201 or 301), a moving part (202 or 302), and an adjusting part (203 or 303). The moving part cooperates with the fixed slide and moves along the length direction of the fixed slide under the control of the adjusting part. By setting different positions and directions, the required relative movement is completed. This structure is a conventional structure in the prior art. For example, the fixed slide (301) of the syringe Y-axis displacement platform 3 is fixed on the top of the column 9. The moving part (302) of the syringe Y-axis displacement platform 3 cooperates with the corresponding fixed slide (301), and the moving part (302) of the syringe Y-axis displacement platform 3 moves in the Y direction along the fixed slide (301) of the syringe Y-axis displacement platform 3. The fixed slide (201) of the syringe Z-axis displacement platform 2 is fixed on the moving part (302) of the syringe Y-axis displacement platform 3. The moving part (202) of the syringe Z-axis displacement platform 2 cooperates with the fixed slide (201) of the syringe Z-axis displacement platform 2, and the moving part (202) of the syringe Z-axis displacement platform 2 moves in the Z direction along its fixed slide (201). The non-iron fixing plate 701 or the iron fixing plate 701' is installed on the moving part (202) of the syringe Z-axis displacement platform 2 by screws.
[0034] It should be noted that: the dispensing platform 4 is an XYZ displacement platform 4. The XYZ displacement platform 4 is used to drive the chip container positioning component 5 and the chip container 6 to move in three directions of X, Y, and Z. The XYZ displacement platform 4 is a device in the prior art that can drive the items on the top of the platform to move in three perpendicular directions of X, Y, and Z.
[0035] As an implementation, the chip container positioning component 5 includes a flat plate and an embedding groove 502 with an included angle of α opened at a corner of the flat plate 501. The chip container 6 includes a chip groove fixing part 601 and a chip groove 602. The cross-section of the chip groove fixing part 601 is a regular N-sided polygon, where N = 360 / α. Each corner of the chip groove fixing part 601 is exactly stuck into the embedding groove 502. N chip grooves 602 are equally spaced around the center position on the upper part of the chip groove fixing part 601. The chips to be processed are placed in the chip grooves 602. One corner of a chip groove fixing part 601 in the chip container 6 corresponds to one chip groove 602, and their relative positions are fixed, which is convenient for the chip (the replaced chip) in the chip groove 602 in the fixed position to be in the position of the previous chip after rotating the chip container 6.
[0036] It should be noted that: the chip grooves 602 are divided into No. 1 chip groove, No. 2 chip groove... and No. N chip groove. The chips placed in the No. 1 chip groove, No. 2 chip groove... and No. N chip groove are No. 1 chip, No. 2 chip... and No. N chip respectively.
[0037] It should be noted that N is a positive integer greater than 2, preferably 3, 4, 5, 6, 7, 8, etc. For example, when N is 4, the included angle of the embedding groove 502 is 90°, the chip groove fixing part 601 is a regular quadrilateral, and the corners of the chip groove fixing part 601 are exactly embedded in the embedding groove 502.
[0038] The specific use process of the dispensing device for MEMS flow sensor processing involved in this embodiment is as follows:
[0039] (1) Embed the upper part of the syringe into the groove 702. The magnetic clamping component 703 is close to the upper part of the syringe and attracts with the magnet 704, and is adsorbed on the side of the groove of the iron fixing plate 701, and the syringe is fixed;
[0040] (2) Adjust the syringe Z-axis displacement platform 2 and the syringe X-axis displacement platform 3 to make the tip of the syringe located at the center of the field of view of the microscope 1, and then adjust the position of the microscope 1 until the tip of the syringe can be clearly observed;
[0041] (3) Place the sensor chip in the chip groove 602 of the chip container 6, and one corner of the chip groove fixing part 601 is stuck into the embedding groove 502;
[0042] (4) Adjust the XYZ displacement platform 4 in the X, Y, and Z directions to make the No. 1 chip directly below the tip of the syringe. Observe through the microscope to complete the glue encapsulation of the No. 1 chip. Rotate the chip container 6 to make the No. 2 chip directly below the tip of the syringe. Observe through the microscope to complete the glue encapsulation of the No. 2 chip. Repeat this way until the glue encapsulation of the No. N chip is completed. Remove the chip container 6, replace the chip and continue the encapsulation.
Claims
1. A dispensing device for MEMS sensor processing, characterized in that It includes a microscope, a syringe Z-axis displacement platform, a syringe X-axis displacement platform, a dispensing platform, a chip container positioning component, a chip container, a syringe clamping component, a microscope clamping component, a column, an inclined rod and a platform; the column, the dispensing platform and the inclined rod are sequentially installed on the platform along the Y direction; the chip container positioning component is fixed on the upper part of the dispensing platform. During use, the chip container is placed at the fixed position of the chip container positioning component, and the chip to be processed is placed in the chip container; the syringe X-axis displacement platform is installed on the top of the column, the syringe Z-axis displacement platform is fixed on the syringe X-axis displacement platform, and the syringe clamping component is fixed on the syringe Z-axis displacement platform for clamping the syringe. The syringe is above the chip container. The syringe X-axis displacement platform is used to drive the syringe clamping component and the syringe to move in the X direction, and the syringe Z-axis displacement platform is used to drive the syringe clamping component and the syringe to move in the Z direction; the microscope is fixed on the inclined rod through the microscope clamping component, and the microscope clamping component is used to drive the microscope to move up and down along the inclined rod.
2. The dispensing device for MEMS sensor processing according to claim 1, wherein, The syringe clamping component includes a non-ferrous fixing plate, a groove, a magnetic adsorption clamping component, a magnet fixing groove and a magnet. A vertical groove is opened in the middle of one side of the non-ferrous fixing plate, and a magnet fixing groove is opened on the other side. The magnet fixing groove is communicated with the vertical groove. The magnet is fixed in the magnet fixing groove. The upper part of the syringe is embedded in the groove, and the magnetic adsorption clamping component is close to the upper part of the syringe and attracted to the magnet, and is adsorbed on the groove side of the non-ferrous fixing plate.
3. The dispensing device for MEMS sensor processing according to claim 1, characterized in that, The syringe clamping component includes an iron fixing plate, a groove and a magnetic adsorption clamping component. A vertical groove is opened in the middle of one side of the iron fixing plate, and the upper part of the syringe is embedded in the groove. The magnetic adsorption clamping component is close to the upper part of the syringe and adsorbed on the groove side of the iron fixing plate.
4. The dispensing device for MEMS sensor processing according to claim 2 or 3, characterized in that, The syringe clamping component further includes an elastic layer, and the elastic layer is provided on both sides of the syringe.
5. The dispensing device for MEMS sensor processing according to claim 1, characterized in that, The dispensing platform is an XYZ displacement platform, and the XYZ displacement platform is used to drive the chip container positioning component and the chip container to move in the X, Y and Z directions.
6. The dispensing device for MEMS sensor processing according to claim 1, wherein The chip container positioning component includes a flat plate and an embedding groove with an included angle of α opened at one corner of the flat plate. The chip container includes a chip groove fixing part and a chip groove. The cross section of the chip groove fixing part is a regular N-sided polygon, N = 360 / α, and N is a positive integer greater than. Any corner of the chip groove fixing part just fits into the embedding groove. N chip grooves are equally spaced around the center position on the upper part of the chip groove fixing part. The chip to be processed is placed in the chip groove. After rotating the chip container, the chip in the chip groove at the fixed position just reaches the position of the previous chip.
7. The dispensing device for MEMS sensor processing according to claim 6, wherein, N is 3 - 8.
Citation Information
Patent Citations
Ultraprecise adhesive dispensing system and method
CN110918384A
Chip dispensing method and device
CN118437576A