Ultrasonic vibrator and temperature control suite structure

The thermally controlled assembly for ultrasonic transducers addresses overheating issues by using a heat exchange system to cool the piezoelectric components, ensuring frequency stability and prolonging the transducer's lifespan.

CN223097282UActive Publication Date: 2025-07-15ALPHA THERMAL ENERGY SOLUTIONS LTD
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Patent Information

Application Number
CN202421733461.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-22
Publication Date
2025-07-15
Estimated Expiration
2034-07-22

AI Technical Summary

Technical Problem

The local structure of ultrasonic vibrators is too high to cause piezoelectric body failure, affecting the working frequency and stability of the ultrasonic system, and it is difficult for the prior art to effectively control the temperature.

Method used

A temperature control kit structure is designed, including multiple temperature control kit bodies, which uses thermally conductive liquid to transfer and take away heat through the socket slot and the temperature control chamber, and combines a temperature difference refrigeration piece and a current regulator for precise temperature control.

Benefits of technology

Effectively reduce the temperature of ultrasonic vibrators, protect the piezoelectric body, ensure the frequency stability and energy transmission of ultrasonic system, extend the service life, and the structural design is flexible and removable.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an ultrasonic vibrator and a temperature control kit structure. The ultrasonic vibrator comprises a transducer, an amplitude modulation rod, a body to be subjected to temperature control and the temperature control kit structure. The transducer includes a piezoelectric body. And the amplitude modulation rod is connected with the transducer. And the temperature-to-be-controlled body is fixed in the amplitude modulation rod node area. The temperature control suite structure comprises a plurality of temperature control suite bodies, the temperature control suite bodies are provided with sleeving grooves, and the sleeving grooves are connected to the body to be subjected to temperature control in a sleeving mode in the radial direction of the amplitude modulation rod. A temperature control cavity adjacent to the sleeving groove in the temperature control kit body is formed in the temperature control kit body, and the temperature control kit body is used for transmitting heat on the body to be subjected to temperature control to the temperature control cavity through the sleeving groove. A liquid inlet and a liquid outlet which are both communicated with the temperature control cavity are further formed in the temperature control kit main body, so that heat conduction liquid flows into the temperature control cavity from the liquid inlet and flows out of the temperature control cavity from the liquid outlet, heat in the temperature control cavity is taken away, and then the temperature of the body to be subjected to temperature control is reduced. The transducer and the body to be subjected to temperature control both belong to one part of the ultrasonic vibrator, and heat conduction exists between the transducer and the body, so that the piezoelectric body in the transducer is indirectly cooled.
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Description

Technical Field

[0001] The present application relates to the technical field of ultrasonic vibrators, and particularly relates to an ultrasonic vibrator and a temperature control kit structure. Background Art

[0002] The emergence of ultrasonic technology can be widely applied to various technical fields and solve certain problems. An ultrasonic system includes an ultrasonic power supply and an ultrasonic vibrator. The ultrasonic vibrator generally includes a transducer, an amplitude modulation rod, and an ultrasonic vibration head. When using the ultrasonic vibrator, over time, there will be a certain degree of heat generation between the various parts of the ultrasonic vibrator. When the temperature of the local structure of the ultrasonic vibrator is too high, ultrasonic failure will occur. For example, when the temperature of the piezoelectric body in the transducer increases, the piezoelectric body may physically break, thereby causing ultrasonic failure. For another example, when the piezoelectric body is electrically broken down or the temperature rises, depolarization occurs, thereby causing the piezoelectric effect of the piezoelectric body to fail. When the piezoelectric effect of the piezoelectric body fails, the frequency of the ultrasonic vibrator will be outside the normal frequency range, making the ultrasonic system unable to lock the operating frequency and fail. Therefore, it is very necessary to control the temperature of the ultrasonic vibrator, especially to control the temperature of the piezoelectric body in the transducer. Summary of the Utility Model

[0003] The present application provides an ultrasonic vibrator and a temperature control kit structure, and its main purpose is to cool the piezoelectric body in the transducer.

[0004] According to the first aspect of the present application, an ultrasonic vibrator is provided, including:

[0005] A transducer, the transducer includes a piezoelectric body;

[0006] An amplitude modulation rod, one end of the amplitude modulation rod is connected to the transducer;

[0007] A body to be temperature-controlled, the body to be temperature-controlled is fixed in the node area of the amplitude modulation rod; and

[0008] A temperature control kit structure, the temperature control kit structure includes a plurality of temperature control kit bodies, a socket groove is formed on the temperature control kit body, the socket groove is sleeved on the body to be temperature-controlled along the radial direction of the amplitude modulation rod, the plurality of temperature control kit bodies are arranged along the circumferential direction of the body to be temperature-controlled, adjacent temperature control kit bodies are connected, and the plurality of temperature control kit bodies are detachably fixed to the body to be temperature-controlled;

[0009] A temperature control cavity adjacent to the socket groove is formed inside the main body of the temperature control kit, and the main body of the temperature control kit is used to transfer the heat on the body to be temperature-controlled to the temperature control cavity through the socket groove; an inlet and an outlet, both communicating with the temperature control cavity, are further formed on the main body of the temperature control kit, for allowing a heat-conducting liquid to flow into the temperature control cavity from the inlet and flow out of the temperature control cavity from the outlet, so as to take away the heat in the temperature control cavity.

[0010] In one embodiment, the groove wall of the socket groove contacts the end face of the body to be temperature-controlled along the axial direction of the amplitude modulation rod, and the groove bottom of the socket groove contacts the end face of the body to be temperature-controlled along the radial direction of the amplitude modulation rod. The socket grooves on multiple main bodies of the temperature control kit can wrap part or all of the surfaces of the body to be temperature-controlled.

[0011] In one embodiment, the temperature control cavity is adjacent to the socket groove along the radial direction of the amplitude modulation rod, and / or the temperature control cavity is adjacent to the socket groove along the axial direction of the amplitude modulation rod.

[0012] In one embodiment, a thermoelectric cooling element is further placed in the temperature control cavity. The thermoelectric cooling element has a cold end and a hot end, and the cold end is attached to the cavity wall adjacent to the temperature control cavity and the socket groove.

[0013] In one embodiment, a heat insulation and waterproof layer is arranged around the thermoelectric cooling element, and the heat insulation and waterproof layer is used to prevent the heat-conducting liquid in the temperature control cavity from contacting the cavity wall adjacent to the temperature control cavity and the socket groove.

[0014] In one embodiment, the thermoelectric cooling element is provided with leads. The leads are arranged between the heat insulation and waterproof layer and the cavity wall adjacent to the temperature control cavity and the socket groove, or the leads are arranged in the heat insulation and waterproof layer. The leads are used to be electrically connected to a current regulator outside the main body of the temperature control kit.

[0015] In one embodiment, a heat-conducting layer is arranged between the thermoelectric cooling element and the cavity wall of the temperature control cavity, and / or a heat-conducting layer is arranged between the socket groove and the body to be temperature-controlled.

[0016] In one embodiment, along the radial direction of the amplitude modulation rod, from the side far away from the amplitude modulation rod to the side close to the amplitude modulation rod, the thickness of the body to be temperature-controlled continuously and uniformly increases, and the socket groove is a trapezoidal groove adapted to the outer shape of the body to be temperature-controlled.

[0017] In one embodiment, the temperature control kit structure includes two temperature control kit bodies. One end of each temperature control kit body is provided with a first connection part, and the other end of each temperature control kit body is provided with a second connection part. The first connection parts on the two temperature control kit bodies are rotatably and fixedly connected, and the second connection parts on the two temperature control kit bodies are detachably connected.

[0018] In one embodiment, the two temperature control kit bodies have the same structure.

[0019] In one embodiment, the body to be temperature-controlled is an annular block.

[0020] In one embodiment, a first liquid supply channel communicating with the outside is axially formed in the amplitude modulation rod, and a second liquid supply channel communicating with the outside is formed in the body to be temperature-controlled. The first liquid supply channel and the second liquid supply channel are communicated; and / or, the ultrasonic oscillator further includes an ultrasonic vibration head, and one end of the amplitude modulation rod away from the transducer is connected to the ultrasonic vibration head.

[0021] According to the second aspect of the present application, there is provided an ultrasonic oscillator, including:

[0022] A transducer, the transducer including a piezoelectric body;

[0023] An amplitude modulation rod, one end of the amplitude modulation rod being connected to the transducer;

[0024] A body to be temperature-controlled, the body to be temperature-controlled being fixed in the node area of the amplitude modulation rod; and

[0025] A temperature control kit structure, the temperature control kit structure including a temperature control kit body and a fixing member, the temperature control kit body being configured as at least one; a socket groove is formed in the temperature control kit body, the socket groove is sleeved on the body to be temperature-controlled along the radial direction of the amplitude modulation rod, a plurality of the temperature control kit bodies are arranged along the circumferential direction of the body to be temperature-controlled, adjacent temperature control kit bodies are connected, the temperature control kit body is connected to the fixing member, and the fixing member is used for detachably fixing the temperature control kit body to the body to be temperature-controlled;

[0026] A temperature control cavity adjacent to the socket groove is formed in the temperature control kit body, and the temperature control kit body is used for transferring the heat on the body to be temperature-controlled to the temperature control cavity through the socket groove; an inlet and an outlet both communicating with the temperature control cavity are further formed in the temperature control kit body, for allowing a heat-conducting liquid to flow into the temperature control cavity from the inlet and flow out of the temperature control cavity from the outlet, so as to take away the heat in the temperature control cavity

[0027] According to a third aspect of the present application, a temperature control kit structure is provided, including a plurality of temperature control kit bodies. A socket groove is formed on the temperature control kit body, and the socket groove is used for radially sleeving on the body to be temperature-controlled. The plurality of temperature control kit bodies are arranged along the circumferential direction of the body to be temperature-controlled, and adjacent temperature control kit bodies are connected, and the plurality of temperature control kit bodies are detachably fixed to the body to be temperature-controlled;

[0028] A temperature control cavity adjacent to the socket groove is formed in the temperature control kit body. An inlet and an outlet, both communicating with the temperature control cavity, are further formed on the temperature control kit body. The inlet is used for allowing a heat-conducting liquid to flow into the temperature control cavity, and the outlet is used for allowing the heat-conducting liquid to flow out of the temperature control cavity;

[0029] The temperature control kit body is used to transfer the heat on the body to be temperature-controlled to the temperature control cavity through the socket groove, and take away the heat in the temperature control cavity through the heat-conducting liquid;

[0030] Or, the temperature control kit body is used to release heat into the temperature control cavity through the heat-conducting liquid, and transfer the heat on the temperature control cavity to the body to be temperature-controlled through the socket groove.

[0031] Based on the ultrasonic vibrator in the above embodiment, by contacting the body to be temperature-controlled through the socket groove on the temperature control kit body, the heat on the body to be temperature-controlled can be conducted away, and through the heat-conducting liquid flowing in the temperature control cavity adjacent to the socket groove in the temperature control kit body, the heat on the temperature control kit body can be conducted away in time, so that the designed temperature control kit body can continuously cool the body to be temperature-controlled in the ultrasonic vibrator. The transducer and the body to be temperature-controlled are both part of the ultrasonic vibrator and there is a heat conduction effect between them. Therefore, when cooling the body to be temperature-controlled, it also indirectly cools the piezoelectric body in the transducer. The node area of the amplitude modulation rod does not vibrate. The body to be temperature-controlled is fixed to the node area of the amplitude modulation rod, and the temperature control kit body is fixed to the body to be temperature-controlled. Therefore, neither the body to be temperature-controlled nor the temperature control kit body will vibrate, which will neither affect the frequency of the ultrasonic vibrator nor the effective transmission of energy in the ultrasonic vibrator. More preferably, the temperature control kit body is detachably fixed to the body to be temperature-controlled, making the designed ultrasonic vibrator more flexible to use. When the ultrasonic vibrator needs a cooling function, the temperature control kit body can be installed on the body to be temperature-controlled. When the cooling function is not needed, the temperature control kit body can be removed, and it can be flexibly selected according to the actual working scenario whether to install the temperature control kit structure on the body to be temperature-controlled. Description of the Drawings

[0032] Figure 1 It is a schematic three-dimensional structure diagram of an ultrasonic vibrator in an embodiment of the present application;

[0033] Figure 2Schematic diagram of the cross-sectional structure of an ultrasonic oscillator in an embodiment of the present application;

[0034] Figure 3 Schematic diagram of the explosion structure of an ultrasonic oscillator in an embodiment of the present application;

[0035] Figure 4 Schematic diagram of the explosion structure of an ultrasonic oscillator in an embodiment of the present application;

[0036] Figure 5 Schematic diagram of the three-dimensional structure of an ultrasonic oscillator in another embodiment of the present application;

[0037] Figure 6 Schematic diagram of the explosion structure of an ultrasonic oscillator in another embodiment of the present application;

[0038] Figure 7 Schematic diagram of the explosion structure of an ultrasonic oscillator in another embodiment of the present application;

[0039] Figure 8 Schematic diagram of the closed state structure of the temperature control kit structure in an embodiment of the present application;

[0040] Figure 9 Schematic diagram of the open state structure of the temperature control kit structure in an embodiment of the present application;

[0041] Figure 10 Schematic diagram of the structure of the liquid power component in an embodiment of the present application;

[0042] Figure 11 Schematic diagram of the cross-sectional structure of the amplitude modulation rod and the object to be temperature-controlled in an embodiment of the present application;

[0043] Figure 12 Schematic diagram of the temperature control kit structure in an embodiment of the present application.

[0044] Explanation of reference numerals: 10. Transducer, 11. Piezoelectric body, 20. Amplitude modulation rod, 21. First liquid supply channel, 30. Object to be temperature-controlled, 31. Second liquid supply channel, 40. Temperature control kit structure, 41. Temperature control kit main body, 41a. First temperature control kit main body, 41b. Second temperature control kit main body, 42. Socket groove, 421. Groove wall, 422. Groove bottom, 43. Temperature control cavity, 431. Temperature control plane, 432. Cavity sealing cover, 44. Liquid inlet, 45. Liquid outlet, 46. First connection part, 47. Second connection part, 48. Liquid supply avoidance hole, 48a. First semi-circular through hole, 48b. Second semi-circular through hole, 49. Fixing part, 50. Thermoelectric cooler, 51. Cold end, 52. Hot end, 60. Ultrasonic vibration head, 70. Current regulator, 80. Liquid power component, 90. Y-shaped tube. Detailed implementation manners

[0045] The present application will be further described in detail below through specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are denoted by related similar element numbers. In the following embodiments, many detailed descriptions are provided to enable a better understanding of the present application. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification to avoid overshadowing the core part of the present application. For those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the description in the specification and the general technical knowledge in the field.

[0046] In addition, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can also be reordered or adjusted in a manner obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for clearly describing a certain embodiment and do not mean that they are necessary sequences, unless it is stated otherwise that a certain sequence must be followed.

[0047] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any sequential or technical meaning. And the terms "connection" and "coupling" used in the present application, unless otherwise specified, both include direct and indirect connection (coupling).

[0048] Please refer to Figures 1-11 , in an embodiment of the present application, an ultrasonic oscillator is provided, including: a transducer 10, an amplitude modulation rod 20, a body to be temperature-controlled 30, and a temperature control kit structure 40.

[0049] The transducer 10 includes a piezoelectric body 11. One end of the amplitude modulation rod 20 is connected to the transducer 10. The body to be temperature-controlled 30 is fixed to the nodal region of the amplitude modulation rod 20.

[0050] The temperature control kit structure 40 includes a plurality of temperature control kit bodies 41. A socket groove 42 is formed on the temperature control kit body 41. The socket groove 42 is sleeved on the body to be temperature-controlled 30 along the radial direction of the amplitude modulation rod 20. The plurality of temperature control kit bodies 41 are arranged along the circumferential direction of the body to be temperature-controlled 30. Adjacent temperature control kit bodies 41 are connected, and the plurality of temperature control kit bodies 41 are detachably fixed to the body to be temperature-controlled 30. Herein, the radial direction refers to the installation direction perpendicular to the axial direction of the amplitude modulation rod 20. Whether the body to be temperature-controlled 30 is circular, rectangular, or other irregular shapes, as long as it is perpendicular to the axial direction of the amplitude modulation rod 20, it refers to the radial direction mentioned herein in the present application.

[0051] A temperature control cavity 43 adjacent to the socket groove 42 is formed inside the temperature control kit body 41. The temperature control kit body 41 is used to transfer the heat on the body 30 to be temperature-controlled to the temperature control cavity 43 through the socket groove 42. An inlet port 44 and an outlet port 45, both of which are communicated with the temperature control cavity 43, are also formed on the temperature control kit body 41, for allowing the heat-conducting liquid to flow into the temperature control cavity 43 from the inlet port 44 and flow out of the temperature control cavity 43 from the outlet port 45, so as to take away the heat in the temperature control cavity 43.

[0052] By using the ultrasonic oscillator in the above embodiment, contacting the body 30 to be temperature-controlled through the socket groove 42 on the temperature control kit body 41 can conduct away the heat on the body 30 to be temperature-controlled, and the heat on the temperature control kit body 41 can be conducted away in time through the heat-conducting liquid flowing in the temperature control cavity 43 adjacent to the socket groove 42 in the temperature control kit body 41, so that the designed temperature control kit body 41 can continuously cool the body 30 to be temperature-controlled in the ultrasonic oscillator. Both the transducer 10 and the body 30 to be temperature-controlled are part of the ultrasonic oscillator and there is a heat conduction effect between them. Therefore, when cooling the body 30 to be temperature-controlled, it also indirectly cools the piezoelectric body 11 in the transducer 10. The node area of the amplitude modulation rod 20 does not vibrate. The body 30 to be temperature-controlled is fixed to the node area of the amplitude modulation rod 20, and the temperature control kit body 41 is fixed to the body 30 to be temperature-controlled. Therefore, neither the body 30 to be temperature-controlled nor the temperature control kit body 41 will vibrate, which will neither affect the frequency of the ultrasonic oscillator nor the effective transmission of energy in the ultrasonic oscillator. More preferably, the temperature control kit body 41 is detachably fixed to the body 30 to be temperature-controlled, making the designed ultrasonic oscillator more flexible to use. When the ultrasonic oscillator needs a cooling function, the temperature control kit body 41 can be installed on the body 30 to be temperature-controlled. When the cooling function is not needed, the temperature control kit body 41 can be removed, and it can be flexibly selected according to the actual working scenario whether to install the temperature control kit structure 40 on the body 30 to be temperature-controlled.

[0053] It should be noted that a frequency tracking unit or module is generally also provided in the ultrasonic system. By using the ultrasonic oscillator designed in the present application, since the set temperature control kit structure 40 will not have an adverse effect on the frequency of the ultrasonic oscillator and can better ensure the frequency stability of the ultrasonic oscillator, it is also beneficial to the simplification design of the frequency tracking unit or module in the ultrasonic system.

[0054] Please refer to Figure 4 , specifically, the groove wall 421 of the socket groove 42 contacts the end face of the body 30 to be temperature-controlled along the axial direction of the amplitude modulation rod 20, and the groove bottom 422 of the socket groove 42 contacts the end face of the body 30 to be temperature-controlled along the radial direction of the amplitude modulation rod 20. The socket grooves 42 on multiple temperature control kit bodies 41 can wrap part or all of the surfaces of the body 30 to be temperature-controlled. By contacting both the groove wall 421 and the groove bottom 422 of the socket groove 42 with the body 30 to be temperature-controlled simultaneously, the heat conduction path of the socket groove 42 can be effectively increased, and the heat conduction efficiency and the amount of heat conducted can be improved.

[0055] Specifically, in the embodiments of the present application, the piezoelectric body 11 is a piezoelectric ring.

[0056] In some embodiments, the temperature control cavity 43 is adjacent to the socket groove 42 along the radial direction of the amplitude modulation rod 20, and / or the temperature control cavity 43 is adjacent to the socket groove 42 along the axial direction of the amplitude modulation rod 20. For example, in one embodiment, as Figures 1-4 shown, the temperature control cavity 43 is adjacent to the socket groove 42 along the radial direction of the amplitude modulation rod 20. For another example, in one embodiment, as Figures 5-7 shown, the temperature control cavity 43 is adjacent to the socket groove 42 along the axial direction of the amplitude modulation rod 20. At this time, the temperature control cavity 43 can be arranged on any side of the temperature control kit main body 41, or the temperature control cavity 43 can be arranged on both sides of the temperature control kit main body 41. For another example, in one embodiment, the temperature control cavity 43 is adjacent to the socket groove 42 along both the radial direction and the axial direction of the amplitude modulation rod 20. At this time, the temperature control cavities 43 in the two directions can be directly connected or independently distributed.

[0057] Taking Figure 1 as an example, in the embodiments of the present application, the liquid inlet 44 and the liquid outlet 45 on the same temperature control kit main body 41 are distributed relatively farther apart, so that the heat-conducting liquid can have a larger flow range in the temperature control cavity 43, which can ensure the heat-conducting effect of the heat-conducting liquid. If the liquid inlet 44 and the liquid outlet 45 on the same temperature control kit main body 41 are distributed relatively closer, a flow guide plate can be arranged in the temperature control cavity 43 between the liquid inlet 44 and the liquid outlet 45 to play a role in guiding the heat-conducting liquid in the temperature control cavity 43, so as to avoid the heat-conducting liquid that has just passed through the liquid inlet 44 flowing out from the liquid outlet 45 before it has time to flow in the temperature control cavity 43. Among them, the heat-conducting liquid is a liquid with heat-conducting function, such as water, refrigerating liquid, etc.

[0058] Specifically, the ultrasonic vibrator further includes a liquid power component 80 (such as a water pump), and the liquid power component 80 is respectively connected to the liquid inlet 44 and the liquid outlet 45 through a pipe body. The cooling effect of the temperature control kit structure 40 depends on the flow rate of the heat-conducting liquid in the temperature control cavity 43. The greater the flow rate, the more obvious the cooling effect. At this time, the flow rate of the heat-conducting liquid in the temperature control cavity 43 can be changed through the liquid power component 80, thereby changing the cooling effect of the temperature control kit structure 40.

[0059] Please refer to Figure 3 or Figure 6, Preferably, the ultrasonic oscillator further includes a thermoelectric cooler 50 placed in the temperature control cavity 43. The thermoelectric cooler 50 has a cold end 51 and a hot end 52. The cold end 51 is in contact with the cavity wall adjacent to the temperature control cavity 43 and the socket groove 42. The cold end 51 of the thermoelectric cooler 50 can generate a low temperature in the temperature control cavity 43. The heat at the object to be temperature-controlled 30 is quickly conducted from the cold end 51 to the hot end 52, and then the heat at the hot end 52 is conducted out through the heat-conducting liquid in the temperature control cavity 43, thereby indirectly conducting out part of the heat of the piezoelectric body 11 during operation to control the temperature of the piezoelectric body 11.

[0060] It should be noted that the thermoelectric cooler 50 used in this application has a thin-film structure. Specifically, the thermoelectric cooler 50 can be, as Figure 3 shown, a multi-chip type, or as Figure 6 shown, the thermoelectric cooler 50 is a single-piece type. When the thermoelectric cooler 50 is of a multi-chip structure, the multiple thermoelectric coolers 50 can be connected in series in sequence. It should also be noted that the surfaces of the thermoelectric cooler 50 described in this application are all flat surfaces for ease of processing and use. Correspondingly, the cavity wall adjacent to the temperature control cavity 43 and the socket groove 42 should also at least contain a temperature control plane 431 adapted to the shape of the thermoelectric cooler 50 to facilitate the fitting and fixing of the thermoelectric cooler 50 on the cavity wall of the temperature control cavity 43.

[0061] Preferably, a heat-conducting layer (not shown) is provided between the thermoelectric cooler 50 and the cavity wall of the temperature control cavity 43, and / or a heat-conducting layer is provided between the socket groove 42 and the object to be temperature-controlled 30.

[0062] Specifically, in the embodiment of this application, a heat-conducting layer is provided between the thermoelectric cooler 50 and the cavity wall of the temperature control cavity 43, and a heat-conducting layer is provided between the socket groove 42 and the object to be temperature-controlled 30.

[0063] The heat-conducting layer can play a role in heat transfer / heat conduction. The material of the heat-conducting layer is, for example, heat-conducting silicone grease, nano boron nitride, aluminum nitride, etc. The heat-conducting layer can also withstand a certain amount of stress and strain, facilitating the installation and fixing of the thermoelectric cooler 50 and the socket groove 42. More specifically, to ensure the contact (when a heat-conducting layer is provided, the contact between the socket groove 42 and the object to be temperature-controlled 30 is indirect) and installation effect between the socket groove 42 and the object to be temperature-controlled 30, the heat-conducting layer between the socket groove 42 and the object to be temperature-controlled 30 is thinner than the heat-conducting layer between the thermoelectric cooler 50 and the cavity wall of the temperature control cavity 43. For example, the thickness of the heat-conducting layer between the socket groove 42 and the object to be temperature-controlled 30 is 10 micrometers - 100 micrometers.

[0064] Preferably, to ensure smooth installation between the socket groove 42 and the object to be temperature-controlled 30, the heat-conducting layer between the socket groove 42 and the object to be temperature-controlled 30 is filled and fixed in a liquid state. The liquid heat-conducting layer can be, for example, heat-conducting glue, liquid alloy, or heat-conducting paste. When the socket groove 42 is sleeved on the object to be temperature-controlled 30, the liquid heat-conducting layer is filled between the socket groove 42 and the object to be temperature-controlled 30. Due to the limitations of processing effects, inevitably, there is a certain surface roughness on the surfaces of the socket groove 42 and the object to be temperature-controlled 30, and the fitting effect between the socket groove 42 and the object to be temperature-controlled 30 cannot be ensured. The thinner heat-conducting layer can fill the surface micropores to better ensure the indirect fitting effect between the socket groove 42 and the object to be temperature-controlled 30, thereby ensuring the effectiveness of heat transfer between the object to be temperature-controlled 30 and the socket groove 42.

[0065] Of course, in other embodiments, if both the temperature control kit main body 41 and the object to be temperature-controlled 30 are expansion-type metals, when the ultrasonic oscillator operates and the temperature rises, the temperature control kit main body 41 and the object to be temperature-controlled 30 will heat up and expand, thereby ensuring the contact effect between the socket groove 42 and the object to be temperature-controlled 30. At this time, the heat-conducting layer may not be provided.

[0066] Actually, when manufacturing the ultrasonic oscillator, if the thermoelectric cooler is placed between the socket groove 42 and the object to be temperature-controlled 30, the fastening force generated by the installation structure cannot be transmitted, otherwise the relatively brittle thermoelectric cooling element 50 will be damaged. When the mechanical fastening cannot be ensured, the heat conduction efficiency cannot be ensured. Moreover, at this time, to avoid damage to the thermoelectric cooling element 50, the heat-conducting layer needs to be relatively thick, but this will cause the gap between the socket groove 42 and the object to be temperature-controlled 30 to become larger. Considering the heat loss of the relatively thick heat-conducting layer, it is not conducive to efficient heat transfer. Based on this, in the present application, the socket groove 42 is directly in indirect contact with the object to be temperature-controlled 30 through the heat-conducting layer, which can not only ensure the contact effect and installation reliability between the socket groove 42 and the object to be temperature-controlled 30, but also ensure the effectiveness of heat transfer. And when the thermoelectric cooling element 50 is placed in the temperature control cavity 43, there is more installation space. At this time, if a better cooling effect is required, multiple thermoelectric cooling elements 50 can be stacked to generate a lower temperature zone, providing a greater cooling driving force for the ultrasonic oscillator. For example, two or three layers of thermoelectric cooling elements 50 can be stacked to generate a lower temperature zone. When multiple thermoelectric cooling elements 50 are stacked, a heat-conducting layer can also be placed between adjacent thermoelectric cooling elements 50.

[0067] Preferably, in the embodiment of the present application, a heat-insulating and waterproof layer (not shown) is provided around the thermoelectric cooling element 50. The heat-insulating and waterproof layer is used to prevent the heat-conducting liquid in the temperature control cavity 43 from coming into contact with the cavity wall adjacent to the temperature control cavity 43 and the socket groove 42, thereby ensuring the working effectiveness of the thermoelectric cooling element 50. The heat-insulating and waterproof layer is made of a heat-insulating, waterproof, and insulating polymer material, for example, a heat-insulating and waterproof layer made of epoxy material or epoxy composite. The heat-insulating and waterproof layer is fixed around the thermoelectric cooling element 50 similar to a glue layer.

[0068] Specifically, the ultrasonic oscillator further includes a current regulator 70. The thermoelectric cooler 50 is provided with leads, and the leads are arranged between the heat insulation and waterproof layer and the cavity wall adjacent to the temperature control cavity 43 and the socket groove 42, or the leads are arranged within the heat insulation and waterproof layer. The leads are used for electrically connecting to the current regulator 70 outside the temperature control kit main body 41. During the actual processing of the ultrasonic oscillator, holes are opened at the positions corresponding to the temperature control kit main body 41 and the leads to lead out the leads. Since the leads are between the heat insulation and waterproof layer and the cavity wall adjacent to the temperature control cavity 43 and the socket groove 42, or the leads are arranged within the heat insulation and waterproof layer, there is no need to perform waterproof sealing treatment on the leads, effectively simplifying the structural design. The current regulator 70 controls the temperature by adjusting the current to change the heat flow of the thermoelectric cooler 50. When the ultrasonic oscillator includes a liquid power component 80 and a current regulator 70, the heat conduction speed can depend on the flow rate of the heat-conducting liquid and / or the current of the thermoelectric cooler 50. At this time, more flexible and better cooling control can be achieved. The ultrasonic oscillator adopts an electronically controlled water cooling design to reduce the severity of heat generation during the operation of the transducer 10, and effectively takes away the heat generated by the piezoelectric body 11 in the transducer 10 due to electrical loss and mechanical internal loss through an electronically controlled method, achieving the purpose of reducing the temperature change of the piezoelectric body 11, thereby extending the service life of the ultrasonic oscillator.

[0069] Please refer to Figure 2 Preferably, in one embodiment, along the radial direction of the amplitude modulation rod 20, from the side away from the amplitude modulation rod 20 to the side close to the amplitude modulation rod 20, the thickness of the body to be temperature-controlled 30 continuously and uniformly increases, and the socket groove 42 is a trapezoidal groove adapted to the outer shape of the body to be temperature-controlled 30. Correspondingly, that is, along the radial direction of the amplitude modulation rod 20, from the side away from the amplitude modulation rod 20 to the side close to the amplitude modulation rod 20, the width of the socket groove 42 (the width direction is parallel to the axial direction of the amplitude modulation rod 20) continuously increases. In this way, when the socket groove 42 is sleeved on the body to be temperature-controlled 30, it is not only convenient to realize the detachable sleeving of the two, but also can ensure the fitting effect between the socket groove 42 and the body to be temperature-controlled 30. In other embodiments, the body to be temperature-controlled 30 and the socket groove 42 are both structures with a constant thickness (the thickness direction is parallel to the axial direction of the amplitude modulation rod 20), or the thicknesses of the body to be temperature-controlled 30 and the socket groove 42 both change in a coordinated manner.

[0070] Please refer to Figures 1-9, Preferably, in the embodiment of the present application, the temperature control kit structure 40 includes two temperature control kit bodies 41. One end of the temperature control kit body 41 is provided with a first connection portion 46, and the other end of the temperature control kit body 41 is provided with a second connection portion 47. The first connection portions 46 on the two temperature control kit bodies 41 are rotatably and fixedly connected, and the second connection portions 47 on the two temperature control kit bodies 41 are detachably connected. Specifically, the first connection portion 46 is a protruding block structure on the temperature control kit body 41. The first connection portions 46 on the two temperature control kit bodies 41 are in concave-convex fit through a groove and a protruding portion, and are rotatably and fixedly connected by combining a rotating shaft or a pin. The second connection portion 47 is a protruding block structure on the temperature control kit body 41. The second connection portions 47 on the two temperature control kit bodies 41 are detachably connected by means of screws, buckles, magnetic attraction, etc. In this way, when it is necessary to fix the temperature control kit structure 40 on the body to be temperature-controlled 30, taking Figure 4 as an example, the two temperature control kit bodies 41 have been connected in advance through the first connection portion 46, or the two temperature control kit bodies 41 are already connected and fixed through the first connection portion 46 at the time of leaving the factory. Only need to open and socket the two temperature control kit bodies 41 on the body to be temperature-controlled 30, and then lock the two second connection portions 47. This structure can simplify the installation or disassembly operation of the temperature control kit structure 40.

[0071] In other embodiments, the number of temperature control kit bodies 41 can also be changed to 3, 4, 5, 6, etc. according to actual use requirements or processing requirements. When the number of temperature control kit bodies 41 is more, although the processing is slightly more troublesome, it is more flexible to use. For example, when the temperature control kit body 41 is configured to be 6, in actual use, 4 or 5 or 6 can be used according to requirements.

[0072] Please refer to Figures 1-9, Preferably, in the embodiments of the present application, the two temperature control kit bodies 41 have the same structure, and the two temperature control kit bodies 41 are symmetrically distributed on both sides of the axial direction of the amplitude modulation rod 20. When the two temperature control kit bodies 41 have the same structure, correspondingly, the socket grooves 42 and temperature control cavities 43 thereon and other structures are also the same. When the two temperature control kit bodies 41 have the same structure and are fixed on the body to be temperature-controlled 30, it is convenient for the overall structure of the ultrasonic vibrator to be stressed evenly, facilitating the operation and performance control of the ultrasonic vibrator. In other embodiments, the two temperature control kit bodies 41 can also have different structures. For example, one temperature control kit body 41 occupies 3 / 4 of the circumference of the entire temperature control kit structure 40, and the other temperature control kit body 41 occupies 1 / 4 of the circumference of the entire temperature control kit structure 40. A socket groove 42 similar to a U-shape is correspondingly provided on the temperature control kit body 41 that occupies 3 / 4 of the circumference, and a strip-shaped socket groove 42 is correspondingly provided on the temperature control kit body 41 that occupies 1 / 4 of the circumference. Another example is that one temperature control kit body 41 occupies 1 / 3 of the circumference of the entire temperature control kit structure 40, and the other temperature control kit body 41 occupies 1 / 2 of the circumference of the entire temperature control kit structure 40. At this time, the two temperature control kit bodies 41 can wrap around a partial circumference of the body to be temperature-controlled 30 when surrounded together.

[0073] Preferably, in the embodiments of the present application, please refer to Figure 10 , the ultrasonic vibrator further includes a Y-shaped tube 90. The liquid inlets 44 on the two temperature control kit bodies 41 are respectively connected to the branches of the same Y-shaped tube 90, and the liquid outlets 45 on the two temperature control kit bodies 41 are respectively connected to the branches of the same Y-shaped tube 90. There are two Y-shaped tubes 90, one for liquid inlet and one for liquid outlet. At this time, the design of the Y-shaped tube 90 can not only simplify the structure, but also facilitate the synchronous flow of the heat-conducting liquid in the temperature control cavities 43 of the two temperature control kit bodies 41, ensuring the consistency of cooling different parts of the body to be temperature-controlled 30.

[0074] Specifically, in the embodiments of the present application, the body to be temperature-controlled 30 is an annular block, similar to a flange structure. Correspondingly, the socket grooves 42 on the two temperature control kit bodies 41 form an annular socket groove 42 when surrounded together. The outer periphery of the temperature control kit body 41, that is, the side away from the amplitude modulation rod 20, can be square, circular, elliptical, etc. The present application does not limit the outer shape of the temperature control kit body 41. In other embodiments, in addition to being circular, the body to be temperature-controlled 30 can also be square, triangular, elliptical, or even other special shapes.

[0075] Please refer to Figure 11, in one embodiment, a first liquid supply channel 21 communicating with the outside is axially formed in the amplitude modulation rod 20, and a second liquid supply channel 31 communicating with the outside is formed in the body 30 to be temperature-controlled. The first liquid supply channel 21 is communicated with the second liquid supply channel 31. The ultrasonic oscillator further includes an ultrasonic vibration head 60. One end of the amplitude modulation rod 20 away from the transducer 10 is connected to the ultrasonic vibration head 60. At the same time, the first liquid supply channel 21 extends to one end of the ultrasonic vibration head 60 away from the transducer 10.

[0076] The ultrasonic tool head is specifically an ultrasonic atomizing head. Through the designed first liquid supply channel 21 and second liquid supply channel 31, the ultrasonic oscillator can add the required liquid during use. For example, when using the ultrasonic atomizing head to treat the eyes, eye drops can be added. The ultrasonic vibration head 60 is connected to the amplitude modulation rod 20. The transducer 10, the amplitude modulation rod 20, and the ultrasonic vibration head 60 form an integral body. During the operation of the ultrasonic oscillator, due to the mutual heat conduction between different structures, the ultrasonic vibration head 60 also has a problem of heat generation. For example, when the ultrasonic vibration head 60 is used to treat the eyes, if the temperature of the ultrasonic vibration head 60 is too high, there will be a burning sensation in the human eye, which is likely to affect the normal treatment of the eyes. When using the ultrasonic oscillator designed in this application, since the body 30 to be temperature-controlled on the amplitude modulation rod 20 can be cooled, the ultrasonic vibration head 60 is also indirectly cooled, making the ultrasonic oscillator safer when applied to eye treatment.

[0077] Please refer to Figures 8-9 , when the first liquid supply channel 21 and the second liquid supply channel 31 are formed in the ultrasonic oscillator, a liquid supply avoidance hole 48 is also formed in the temperature control kit structure 40 to facilitate the delivery of liquid to the second liquid supply channel 31 of the body 30 to be temperature-controlled. Specifically, semi-circular through holes can be respectively formed in the second connection parts 47 of the two second temperature control kit bodies 41, and the two semi-circular through holes together form a complete liquid supply avoidance hole 48. Forming the liquid supply avoidance hole 48 in the second connection part 47 can avoid affecting the structural strength and the temperature reduction effect of the temperature control kit body 41. To clearly describe the technical solution, the two temperature control kit bodies 41 are respectively named the first temperature control kit body 41a and the second temperature control kit body 41b. The semi-circular through hole formed in the second connection part 47 of the first temperature control kit body 41a is the first semi-circular through hole 48a, and the semi-circular through hole formed in the second connection part 47 of the second temperature control kit body 41a is the second semi-circular through hole 48b. Among them, in the embodiments of the present application, the letter a represents the structure on the first temperature control kit body, and the letter b represents the structure on the second temperature control kit body. For example, 47a corresponds to the second connection part on the first temperature control kit body, and 47b corresponds to the second connection part on the second temperature control kit body. The semi-circular through hole is only for illustrative purposes here and should not be construed as a limitation on the shape of the liquid supply avoidance hole 48 of the present application.

[0078] In other embodiments, the ultrasonic tool head can also be an ultrasonic welding head, an ultrasonic cleaning head, an ultrasonic emulsifying head, etc.

[0079] Please refer to Figure 3 or Figure 6 , in the embodiment of the present application, the main body 41 of the temperature control kit includes a cavity sealing cover 432. One side of the temperature control cavity 43 is the cavity wall adjacent to the socket groove 42, and the opposite side is fixedly provided with the cavity sealing cover 432. Specifically, for example, the cavity sealing cover 432 is fixed to the edge of the temperature control cavity 43 by welding to seal the temperature control cavity 43.

[0080] The ultrasonic oscillator in the above-described embodiments designed in the present application can cool the piezoelectric body 11 in the transducer 10, effectively protect the piezoelectric body 11, and prevent the phenomenon of ultrasonic failure caused by the failure of the piezoelectric body 11. It can cool the ultrasonic vibration head 60, avoid physical wear and damage of the ultrasonic vibration head 60 due to excessive temperature, effectively protect the mechanical structure of the ultrasonic oscillator, and extend the service life of the ultrasonic oscillator. The temperature control kit structure 40 works relatively quietly and has a large heat conduction path, enabling rapid cooling, quick disassembly and assembly. The temperature control kit structure 40 can continuously play a cooling role, facilitating the guarantee of the frequency stability of the ultrasonic oscillator and facilitating the efficient transmission of electric energy to the workpiece to be processed.

[0081] In another embodiment of the present application, an ultrasonic oscillator is provided, including: a transducer 10, an amplitude modulation rod 20, a body to be temperature-controlled 30, and a temperature control kit structure 40. The transducer 10 includes a piezoelectric body 11. One end of the amplitude modulation rod 20 is connected to the transducer 10. The body to be temperature-controlled 30 is fixed to the node area of the amplitude modulation rod 20.

[0082] Among them, the temperature control kit structure 40 includes a temperature control kit main body 41 and a fixing member 49. The temperature control kit main body 41 is configured to be at least one. A socket groove 42 is formed on the temperature control kit main body 41. The socket groove 42 is sleeved on the body to be temperature-controlled 30 along the radial direction of the amplitude modulation rod 20. A plurality of temperature control kit main bodies 41 are arranged along the circumferential direction of the body to be temperature-controlled 30. The adjacent temperature control kit main bodies 41 are connected. The temperature control kit main body 41 is connected to the fixing member 49. The fixing member 49 is used to detachably fix the temperature control kit main body 41 to the body to be temperature-controlled 30.

[0083] A temperature control cavity 43 adjacent to the socket groove 42 on the temperature control kit main body 41 is formed inside the temperature control kit main body 41. The temperature control kit main body 41 is used to transfer the heat on the body to be temperature-controlled 30 to the temperature control cavity 43 through the socket groove 42. An inlet 44 and an outlet 45 both communicating with the temperature control cavity 43 are further formed on the temperature control kit main body 41, for allowing the heat-conducting liquid to flow into the temperature control cavity 43 from the inlet 44 and flow out of the temperature control cavity 43 from the outlet 45 to take away the heat in the temperature control cavity 43.

[0084] Please refer toFigure 12 When the temperature control kit main body 41 is configured as one, in order to ensure the cooling effect on the object to be temperature-controlled 30, it is necessary to ensure the contact area between the socket groove 42 on the temperature control kit main body 41 and the object to be temperature-controlled 30. At this time, along the circumferential direction of the object to be temperature-controlled 30, the volume or area ratio of the temperature control kit main body 41 is greater than that of the fixing member 49. Taking the square object to be temperature-controlled 30 as an example, at this time, for example, the proportion of the temperature control kit main body 41 along the circumferential direction of the object to be temperature-controlled 30 can be adjusted to 3 / 4 (the temperature control kit main body 41 is similar to a U-shaped structural member), and the corresponding proportion of the fixing member 49 along the circumferential direction of the object to be temperature-controlled 30 is adjusted to 1 / 4. The temperature control kit main body 41 can wrap and cool 3 / 4 of the circumference of the object to be temperature-controlled 30 through the socket groove 42 thereon. Specifically, one end of the fixing member 49 can be hinged and fixed to one end of the temperature control kit main body 41 in advance, and the other end of the fixing member 49 and the other end of the temperature control kit main body 41 are in a detachable fixing manner. For example, the fixing member 49 and the temperature control kit main body 41 are detachably connected by means of screws, buckles, magnetic attraction, etc. In this way, when using the temperature control kit structure 40, the detachable fixing end between the temperature control kit main body 41 and the fixing member 49 is released. After the temperature control kit main body 41 is sleeved on the object to be temperature-controlled 30, the temperature control kit main body 41 and the fixing member 49 are detachably connected, and the temperature control kit structure 40 can be detachably fixed on the object to be temperature-controlled 30. When the temperature control kit main body 41 is configured as multiple, the adjacent temperature control kit main bodies 41 can be hinged and fixed in advance, and both ends of the fixing member 49 are respectively connected to the outermost ends (free ends without hinges) of the multiple temperature control kit main bodies 41 to detachably fix the temperature control kit structure 40 on the object to be temperature-controlled 30.

[0085] Please refer to Figures 1-10 In another embodiment of the present application, a temperature control kit structure 40 is provided, including a plurality of temperature control kit main bodies 41. A socket groove 42 is formed on the temperature control kit main body 41. The socket groove 42 is used for sleeving on the object to be temperature-controlled 30 along the radial direction. The plurality of temperature control kit main bodies 41 are arranged along the circumferential direction of the object to be temperature-controlled 30, and the adjacent temperature control kit main bodies 41 are connected, and the plurality of temperature control kit main bodies 41 are detachably fixed to the object to be temperature-controlled 30.

[0086] The groove wall 421 of the socket groove 42 is in contact with the end face of the object to be temperature-controlled 30, and the groove bottom 422 of the socket groove 42 is in contact with the side face of the object to be temperature-controlled 30. The socket grooves 42 on the plurality of temperature control kit main bodies 41 can wrap part or all of the surfaces of the object to be temperature-controlled 30.

[0087] A temperature control cavity 43 adjacent to the socket groove 42 on the temperature control kit main body 41 is formed inside the temperature control kit main body 41. An inlet port 44 and an outlet port 45 both connected to the temperature control cavity 43 are further formed on the temperature control kit main body 41. The inlet port 44 is used for the heat-conducting liquid to flow into the temperature control cavity 43, and the outlet port 45 is used for the heat-conducting liquid to flow out of the temperature control cavity 45.

[0088] The temperature control kit body 41 is used to transfer the heat on the body 30 to be temperature-controlled to the temperature control cavity 43 through the socket groove 42, and take away the heat in the temperature control cavity 43 through the heat-conducting liquid, so as to play a role in cooling and temperature control for the body 30 to be temperature-controlled.

[0089] Alternatively, the temperature control kit body 41 is used to release heat into the temperature control cavity 43 through the heat-conducting liquid, and transfer the heat on the temperature control cavity 43 to the body 30 to be temperature-controlled through the socket groove 42, so as to play a role in heating and temperature control for the body 30 to be temperature-controlled.

[0090] The temperature control kit structure 40 in the embodiment of the present application is the same as the temperature control kit structure 40 in the ultrasonic oscillator in the above embodiment, that is, the optimized mechanism or extended structure of the temperature control kit structure 40 in the above ultrasonic oscillator can be adopted, and it also has the advantages of the temperature control kit structure 40 in the above ultrasonic oscillator, which will not be elaborated here.

[0091] The above uses specific examples to elaborate on the present application, which is only used to help understand the present application and is not intended to limit the present application. For those skilled in the technical field to which the present application belongs, according to the idea of the present application, several simple deductions, deformations or substitutions can also be made.

Claims

1. An ultrasonic oscillator, characterized in that, Comprising: A transducer, the transducer including a piezoelectric body; An amplitude modulation rod, one end of the amplitude modulation rod being connected to the transducer; A body to be temperature-controlled, the body to be temperature-controlled being fixed to the nodal region of the amplitude modulation rod; and A temperature control kit structure, the temperature control kit structure including a plurality of temperature control kit bodies, a socket groove being formed in each temperature control kit body, the socket groove being sleeved on the body to be temperature-controlled along the radial direction of the amplitude modulation rod, the plurality of temperature control kit bodies being arranged along the circumferential direction of the body to be temperature-controlled, adjacent temperature control kit bodies being connected, and the plurality of temperature control kit bodies being detachably fixed to the body to be temperature-controlled; A temperature control cavity adjacent to the socket groove is formed in the temperature control kit body, and the temperature control kit body is configured to transfer the heat on the body to be temperature-controlled to the temperature control cavity through the socket groove; a liquid inlet and a liquid outlet both communicating with the temperature control cavity are further formed in the temperature control kit body, for allowing a heat-conducting liquid to flow into the temperature control cavity from the liquid inlet and flow out of the temperature control cavity from the liquid outlet, so as to take away the heat in the temperature control cavity.

2. The ultrasonic vibrator according to claim 1, characterized in that, The groove wall of the socket groove is in contact with the end face of the body to be temperature-controlled along the axial direction of the amplitude modulation rod, and the groove bottom of the socket groove is in contact with the end face of the body to be temperature-controlled along the radial direction of the amplitude modulation rod, and the socket grooves on the plurality of temperature control kit bodies can wrap part or all of the surfaces of the body to be temperature-controlled.

3. The ultrasonic oscillator according to claim 2, wherein, The temperature control cavity is adjacent to the socket groove along the radial direction of the amplitude modulation rod, and / or the temperature control cavity is adjacent to the socket groove along the axial direction of the amplitude modulation rod.

4. The ultrasonic oscillator according to claim 2, wherein Further included is a thermoelectric cooling element placed in the temperature control cavity, the thermoelectric cooling element having a cold end and a hot end, the cold end being attached to the cavity wall adjacent to the temperature control cavity and the socket groove.

5. The ultrasonic oscillator according to claim 4, wherein An insulating and waterproof layer is arranged around the thermoelectric cooling element, and the insulating and waterproof layer is configured to prevent the heat-conducting liquid in the temperature control cavity from contacting the cavity wall adjacent to the temperature control cavity and the socket groove.

6. The ultrasonic oscillator according to claim 5, wherein, The thermoelectric cooling element is provided with leads, the leads being arranged between the insulating and waterproof layer and the cavity wall adjacent to the temperature control cavity and the socket groove, or the leads being arranged in the insulating and waterproof layer, and the leads being configured to be electrically connected to a current regulator outside the temperature control kit body.

7. The ultrasonic oscillator according to claim 4, characterized in that, A heat-conducting layer is arranged between the thermoelectric cooling element and the cavity wall of the temperature control cavity, and / or the heat-conducting layer is arranged between the socket groove and the body to be temperature-controlled.

8. The ultrasonic vibrator according to claim 1, characterized in that, Along the radial direction of the amplitude modulation rod, from the side far away from the amplitude modulation rod to the side close to the amplitude modulation rod, the thickness of the body to be temperature-controlled continuously and uniformly increases, and the socket groove is a trapezoidal groove adapted to the outer shape of the body to be temperature-controlled.

9. The ultrasonic vibrator according to any one of claims 1 to 8, characterized in that, The temperature control kit structure includes two temperature control kit bodies, a first connection portion being provided at one end of each temperature control kit body, a second connection portion being provided at the other end of each temperature control kit body, the first connection portions on the two temperature control kit bodies being rotatably and fixedly connected, and the second connection portions on the two temperature control kit bodies being detachably connected.

10. The ultrasonic vibrator according to claim 9, characterized in that, The two temperature control kit bodies have the same structure.

11. The ultrasonic oscillator according to claim 1, characterized in that, The body to be temperature-controlled is an annular block.

12. The ultrasonic vibrator according to claim 1, characterized in that, The amplitude modulation rod is axially provided with a first liquid supply channel communicating with the outside, and the temperature-controlled body to be controlled is provided with a second liquid supply channel communicating with the outside. The first liquid supply channel is communicated with the second liquid supply channel; and / or, the ultrasonic oscillator further includes an ultrasonic vibration head, and one end of the amplitude modulation rod away from the transducer is connected to the ultrasonic vibration head.

13. An ultrasonic vibrator, characterized in that, Comprising: A transducer, the transducer includes a piezoelectric body; An amplitude modulation rod, one end of the amplitude modulation rod is connected to the transducer; A temperature-controlled body to be controlled, the temperature-controlled body to be controlled is fixed in the node area of the amplitude modulation rod; and A temperature control kit structure, the temperature control kit structure includes a temperature control kit main body and a fixing member, and the temperature control kit main body is configured to be at least one; a socket groove is provided on the temperature control kit main body, and the socket groove is sleeved on the temperature-controlled body to be controlled along the radial direction of the amplitude modulation rod. A plurality of the temperature control kit main bodies are arranged along the circumferential direction of the temperature-controlled body to be controlled, and adjacent temperature control kit main bodies are connected. The temperature control kit main body is connected to the fixing member, and the fixing member is used to detachably fix the temperature control kit main body to the temperature-controlled body to be controlled; A temperature control cavity adjacent to the socket groove is provided in the temperature control kit main body, and the temperature control kit main body is used to transfer the heat on the temperature-controlled body to be controlled to the temperature control cavity through the socket groove; an inlet and an outlet both communicated with the temperature control cavity are further provided on the temperature control kit main body, for allowing a heat-conducting liquid to flow into the temperature control cavity from the inlet and flow out of the temperature control cavity from the outlet, so as to take away the heat in the temperature control cavity.

14. A temperature control kit structure, characterized in that, Comprising a plurality of temperature control kit main bodies, a socket groove is provided on the temperature control kit main body, and the socket groove is used to be sleeved on the temperature-controlled body to be controlled along the radial direction. A plurality of the temperature control kit main bodies are arranged along the circumferential direction of the temperature-controlled body to be controlled, adjacent temperature control kit main bodies are connected, and a plurality of the temperature control kit main bodies are detachably fixed to the temperature-controlled body to be controlled; A temperature control cavity adjacent to the socket groove is provided in the temperature control kit main body, and an inlet and an outlet both communicated with the temperature control cavity are further provided on the temperature control kit main body. The inlet is used to allow a heat-conducting liquid to flow into the temperature control cavity, and the outlet is used to allow the heat-conducting liquid to flow out of the temperature control cavity; The temperature control kit main body is used to transfer the heat on the temperature-controlled body to be controlled to the temperature control cavity through the socket groove, and take away the heat in the temperature control cavity through the heat-conducting liquid; Or, the temperature control kit main body is used to release heat to the temperature control cavity through the heat-conducting liquid, and transfer the heat on the temperature control cavity to the temperature-controlled body to be controlled through the socket groove.