Material containing frame

Abstract

The utility model discloses a material containing frame which comprises a frame body, a film tension component and a magnetic attraction assembly. The frame body is provided with a vertically-through through hole, and the inner side wall of the frame body is provided with a protruding part in a protruding mode. The film tension component is arranged in the through hole in a lifting mode, the film tension component can descend to exceed the lower surface of the frame body, the film tension component is provided with a vertically-through material containing part, and the outer side wall of the material containing part is provided with a limiting part corresponding to the protruding and extending part. The magnetic attraction assembly comprises a first magnetic attraction piece and a second magnetic piece, the first magnetic piece is arranged on the protruding extending part, and magnetic attraction force can be formed between the first magnetic attraction piece and the second magnetic piece. According to the material containing frame, the descending range of the film tension component is precisely limited, it is ensured that the film tension component can descend to the position below the lower surface of the frame body, and therefore the release film is evenly tensioned; under the action of magnetic attraction force of the magnetic attraction assembly, the film tension component is prevented from being stuck in the descending process.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic component packaging, and particularly relates to a material storage frame. Background Art

[0002] In modern electronic devices, the packaging technology of chips is particularly important. The packaging technology can not only protect the chips from the influence of the external environment, but also enhance the mechanical strength of the chips, improve their heat dissipation performance, and ensure the reliability and stability of the chips during use.

[0003] In the existing chip packaging technology, the compression molding method is widely used because it can achieve high-precision packaging effects. The basic principle of the compression molding method is that in a packaging device, resin particles are supplied to a molding die and heated to melt the resin particles into molten resin. Then, the molding die is closed, and the chips on the substrate are immersed in the molten resin. Pressure is applied to the molten resin through the molding die to harden the molten resin to form hardened resin, thereby encapsulating the chips on the substrate with resin. This method can ensure that the chips are evenly covered with resin during the packaging process and provides a good packaging effect.

[0004] However, there are some problems in the existing technology that need to be solved urgently. The resin particles are usually supplied by a material storage frame cooperating with a release film to carry the resin particles and then transported to the cavity of the molding die. However, the existing material storage frame has a poor tensioning function for the release film, and the release film is prone to relaxation, resulting in uneven distribution of the carried resin particles, which will cause uneven distribution of the molten resin in the molding die during the packaging process, thereby causing packaging defects.

[0005] Therefore, in view of the above technical problems, it is necessary to provide a new solution. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a material storage frame, which can provide a good tensioning function for the release film, so that the resin particles carried on the release film are more evenly distributed.

[0007] To achieve the above purpose, the technical solution provided by the utility model is as follows:

[0008] In a first aspect, the present utility model provides a material receiving frame, which comprises: a frame body, a film tension member and a magnetic attraction assembly; the frame body has a through hole that penetrates up and down, and a protruding portion protrudes from the inner side wall of the frame body; the film tension member is disposed in the through hole in a liftable manner, and the film tension member can descend to exceed the lower surface of the frame body. The film tension member has a material receiving portion that penetrates up and down, and a limiting portion corresponding to the protruding portion is provided on the outer side wall of the material receiving portion. The limiting portion cooperates with the protruding portion to limit the descent of the film tension member; the magnetic attraction assembly includes a first magnetic member and a second magnetic member. The first magnetic member is disposed on the protruding portion, the second magnetic member is disposed on the limiting portion and corresponds to the position of the first magnetic member, and a magnetic attraction force can be formed between the first magnetic member and the second magnetic member.

[0009] In one or more embodiments, the protruding portion is arranged along the circumferential direction of the inner side wall of the frame body.

[0010] In one or more embodiments, the protruding portion is in the shape of a rectangular frame, and first magnetic members are provided on two opposite side frames of the protruding portion.

[0011] In one or more embodiments, the limiting portion is arranged along the circumferential direction of the outer side wall of the material receiving portion.

[0012] In one or more embodiments, the excess height of the film tension member descending to exceed the lower surface of the frame body is 0.2 - 1 cm.

[0013] In one or more embodiments, a guiding column arranged in the up and down direction is provided on the protruding portion, a guiding hole matching the guiding column is provided on the limiting portion, and the guiding column penetrates through the guiding hole.

[0014] In one or more embodiments, an adsorption member for adsorbing a release film to the lower surface of the frame body is provided on the frame body.

[0015] In one or more embodiments, the adsorption member includes a negative pressure interface and a plurality of adsorption holes communicated with the negative pressure interface, and the adsorption holes penetrate through the lower surface of the frame body.

[0016] In one or more embodiments, the plurality of adsorption holes are uniformly arranged on the frame body around the outer circumference of the through hole.

[0017] In one or more embodiments, a clamping portion is fixedly connected to the outer side wall of the frame body.

[0018] Compared with the prior art, the material storage frame provided by the present utility model precisely limits the descending range of the film tension member by the cooperation of the protruding portion provided on the inner side wall of the frame body and the limiting portion on the film tension member, ensuring that it can smoothly descend below the lower surface of the frame body, thereby realizing uniform tensioning of the release film; through the action of the magnetic attraction force of the magnetic attraction assembly, the smoothness and stability of the film tension member during the descending process are ensured, preventing the film tension member from jamming during the descending process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 Structural schematic diagram of the material storage frame in an embodiment of the present utility model;

[0021] Figure 2 is Figure 1 A-A cross-sectional view of the shown material storage frame;

[0022] Figure 3 is Figure 1 B-B cross-sectional view of the shown material storage frame;

[0023] Figure 4 is Figure 1 Cross-sectional view of the shown material storage frame in a use scenario.

[0024] Main reference numeral description:

[0025] 1 - Frame body, 11 - Through hole, 12 - Protruding portion, 13 - Guide post, 14 - Adsorption member, 141 - Negative pressure interface, 142 - Adsorption hole, 15 - Clamping portion, 2 - Film tension member, 21 - Material storage portion, 22 - Limiting portion, 3 - Magnetic attraction assembly, 31 - First magnetic attracting member, 32 - Second magnetic member, 4 - Release film, 5 - Resin particles. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] In order to enable those skilled in the art to better understand the technical solutions in the present utility model, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] Unless otherwise expressly stated, throughout the specification and claims, the term "comprising" or variations thereof such as "comprises" or "comprising" shall be understood to include the stated element or component without excluding other elements or other components.

[0028] With the development of miniaturization and high performance of electronic devices, higher requirements are put forward for chip packaging technology. Chip packaging not only needs to protect the chip from the influence of the external environment, but also improve the mechanical strength and heat dissipation performance of the chip, so as to ensure the reliability and stability of the chip during use. The existing compression molding method has been widely used in chip packaging because it can achieve high-precision packaging effects. However, in practical applications, there are some deficiencies in the way of supplying resin particles. Usually, a material receiving frame is used in combination with a release film to carry resin particles. However, due to the poor tensioning function of the release film, the resin particles carried are unevenly distributed, which in turn causes uneven distribution of the molten resin in the molding die during the packaging process, resulting in packaging defects.

[0029] In view of the deficiencies of the prior art, the present utility model proposes an improved material receiving frame. By reasonably designing the frame body, film tension member and magnetic attraction assembly, the material receiving frame can always keep the release film in a tensioned state during the process of transporting resin particles, so as to ensure the uniform distribution of resin particles during the packaging process.

[0030] The core idea of the present utility model is to keep the release film in a tensioned state through the lifting mechanism of the film tension member and the cooperation of the magnetic attraction assembly. Specifically, the material receiving frame includes a frame body with upper and lower through holes, and a protruding portion protrudes from the inner side wall of the frame body; the film tension member is disposed in the through hole in a liftable manner and is provided with a material receiving portion. A limiting portion corresponding to the protruding portion is provided on the outer side wall of the film tension member. The descending position of the film tension member is restricted by the cooperation of the limiting portion and the protruding portion; the magnetic attraction assembly includes a first magnetic attraction member disposed on the protruding portion and a second magnetic attraction member disposed on the limiting portion. The magnetic attraction ensures that the film tension member smoothly descends under the action of gravity and presses down the release film to keep it in a tensioned state.

[0031] Please refer to Figures 1 to 4 As shown, the material receiving frame in an embodiment of the present utility model includes a frame body 1, a film tension member 2 and a magnetic attraction assembly 3.

[0032] The frame 1 has a through hole 11 extending vertically, and a protruding portion 12 protrudes from the inner wall of the frame 1. The membrane tension member 2 is arranged in the through hole 11 in a manner that it can be raised and lowered, and the membrane tension member 2 can be lowered to exceed the lower surface of the frame 1. The membrane tension member 2 has a material receiving portion 21 extending vertically, and a limiting portion 22 corresponding to the protruding portion 12 is provided on the outer wall of the material receiving portion 21. The limiting portion 22 cooperates with the protruding portion 12 to limit the descent of the membrane tension member 2. The magnetic attraction component 3 includes a first magnetic attraction member 31 and a second magnetic member 32. The first magnetic member is arranged on the protruding portion 12, and the second magnetic attraction member is arranged on the limiting portion 22 and corresponds to the position of the first magnetic attraction member 31. A magnetic attraction force can be formed between the first magnetic attraction member 31 and the second magnetic member 32.

[0033] The frame 1 is the main structure of the entire material receiving frame, and has a through hole 11 that passes through from top to bottom, and the through hole 11 provides a space for accommodating and guiding the movement of the membrane tension member 2. The inner wall of the frame 1 is provided with protruding parts 12, and these protruding parts 12 structurally provide a limiting function for the membrane tension member 2 to ensure that the membrane tension member 2 moves within a specific range. The lower surface of the frame 1 is used to contact with a workbench or other substrate to maintain stability during operation.

[0034] The membrane tension member 2 can be raised and lowered in the through hole 11, and its main function is to tension the release film 4 by moving up and down. The membrane tension member 2 has a material receiving portion 21 that passes through from top to bottom, and the material receiving portion 21 is used to hold the resin particles 5. On the outer wall of the membrane tension member 2, there is a limit portion 22 corresponding to the protruding portion 12 of the frame 1. The limit portion 22 cooperates with the protruding portion 12 to limit the depth of descent of the membrane tension member 2 to ensure that it does not detach from the frame 1 structure. The membrane tension member 2 can be lowered to exceed the lower surface of the frame 1, and the release film 4 can be tensioned by gravity and the cooperation of the magnetic suction component 3.

[0035] The magnetic component 3 is composed of a first magnetic component 31 and a second magnetic component. The first magnetic component 31 is arranged on the protruding portion 12 of the inner wall of the frame 1, and the second magnetic component is arranged on the limiting portion 22 of the membrane tension member 2, and the positions of the two correspond. Through the magnetic component 3, a magnetic attraction force is formed to ensure that the membrane tension member 2 will not get stuck during the lifting process and can be smoothly lowered to a predetermined position. The magnetic attraction force not only provides a stable descending force, but also prevents the membrane tension member 2 from being offset due to other external forces.

[0036] Before feeding the resin particles 5, it is necessary to prepare the release film 4. The release film 4 is usually a thin and soft material, and its main function is to prevent the resin particles 5 from adhering to other surfaces during the feeding and packaging process, and to ensure that the resin particles 5 can be evenly distributed. Spread the release film 4 flat on the workbench to ensure that its surface is flat and wrinkle-free.

[0037] Then, place the material receiving frame on the laid release film 4. During this process, the film tension member 2 is lifted, and its lower surface is flush with the lower surface of the frame body 1. This means that the film tension member 2 is at its highest position, enabling the release film 4 to cover the bottom of the through hole 11. At this time, a preliminary closed structure is formed between the release film 4 and the bottom of the frame body 1, providing a receiving basis for the subsequent feeding of the resin particles 5. After the material receiving frame is placed on the release film 4, the release film 4 and the material receiving portion 21 of the film tension member 2 jointly enclose a receiving space for receiving the resin particles 5.

[0038] After forming the receiving space, the resin particles 5 can be fed into this space. The resin particles 5 can be evenly scattered into the receiving space through an automatic feeding system or a manual feeding method. When feeding the resin particles 5, it is necessary to ensure the uniform distribution of the particles to avoid problems such as particle accumulation or uneven distribution during the subsequent encapsulation process.

[0039] After the feeding is completed, carefully transport the material receiving frame and the release film 4 together to the molding die. During this process, it is necessary to ensure that the outer peripheral edge of the release film 4 is always clamped on the material receiving frame to prevent the release film 4 from loosening or shifting. When the material receiving frame and the release film 4 are transported to the molding die, the release film 4 and the resin particles 5 thereon are fed into the cavity of the molding die together.

[0040] During the process of being transported to the molding die, the outer peripheral edge of the release film 4 is always clamped by the material receiving frame to ensure that it does not slacken. At the same time, the film tension member 2 begins to descend under the action of its own gravity and the magnetic attraction assembly 3. The magnetic attraction force in the magnetic attraction assembly 3 ensures that the film tension member 2 will not get stuck during the descent process and can smoothly descend beyond the lower surface of the frame body 1.

[0041] The descent of the film tension member 2 is not only due to the action of gravity but also utilizes the magnetic attraction force of the magnetic attraction assembly 3, enabling it to move smoothly. When the film tension member 2 descends, its lower surface gradually extends beyond the lower surface of the frame body 1 and begins to press down on the release film 4. This process can effectively tension the release film 4, ensuring that the release film 4 remains flat during transportation, without generating wrinkles or slack, and the release film 4 can closely adhere to the lower surface of the material receiving portion 21 of the film tension member 2, preventing the resin particles 5 from entering between the lower surface of the frame body 1 and the release film 4.

[0042] In an exemplary embodiment, please refer to Figure 1 and Figure 2As shown, the protruding portion 12 is arranged circumferentially along the inner side wall of the frame body 1. In this embodiment, the protruding portion 12 does not protrude at a certain point or on a certain side, but surrounds the entire inner side wall of the frame body 1 for one week. In this way, a continuous annular structure is formed, and this annular design provides omnidirectional support and limiting functions, enabling the lifting movement of the film tension member 2 at various positions to be effectively restricted and guided.

[0043] Since the protruding portion 12 is arranged circumferentially along the inner side wall of the frame body 1, the film tension member 2 can always be evenly supported during the up and down movement. This avoids the situation where the film tension member 2 is tilted or stuck due to uneven support.

[0044] Specifically, please refer to Figure 1 As shown, the protruding portion 12 is in the shape of a rectangular frame, and first magnetic attraction members 31 are provided on both opposite side frames of the protruding portion 12. The protruding portion 12 is arranged circumferentially along the inner side wall of the frame body 1 to form a complete rectangular frame structure. First magnetic attraction members 31 are provided on both opposite side frames of the protruding portion 12, and the positions of these magnetic attraction members correspond to the second magnetic attraction members on the film tension member 2.

[0045] The first magnetic attraction members 31 on the two opposite side frames interact with the second magnetic attraction members of the film tension member 2 to form a balanced magnetic attraction force. The balanced magnetic attraction force ensures that the film tension member 2 can receive a stable and uniform attraction force during the descending process, avoiding jamming or deviation caused by single-point force application.

[0046] Specifically, the limiting portion 22 is arranged circumferentially along the outer side wall of the material receiving portion 21. The limiting portion 22 is evenly distributed along the entire outer side wall, and this circumferential arrangement ensures that the limiting portion 22 can provide a uniform limiting effect on the film tension member 2 at any position.

[0047] In terms of structure, the limiting portion 22 is closely combined with the material receiving portion 21 to form a continuous annular structure along the outer side wall. When the film tension member 2 moves up and down in the through hole 11, the limiting portion 22 can interact with the protruding portion 12 on the inner side wall of the frame body 1 to provide comprehensive support and limitation.

[0048] In an exemplary embodiment, please refer to Figure 4 As shown, when the film tension member 2 descends to exceed the lower surface of the frame body 1 by a height of 0.2 - 1 cm. By controlling the height of the film tension member 2 exceeding the lower surface of the frame body 1 between 0.2 and 1 cm, it is possible to ensure that the release film 4 is tensioned while avoiding applying excessive tension.

[0049] If the descending height is too large, exceeding 1 cm, the release film 4 may be damaged due to excessive tension. The damage of the release film 4 will not only interrupt the encapsulation process, but also may cause uneven distribution of the resin particles 5, thus affecting the encapsulation quality. On the contrary, if the descending height is too small, less than 0.2 cm, the tension degree of the release film 4 may be insufficient, and the release film 4 cannot be closely attached to the film tension member 2, so that the uniform supply of the resin particles 5 cannot be achieved, which will also affect the encapsulation effect.

[0050] In an exemplary embodiment, please refer to Figure 1 and Figure 3 As shown, a guide post 13 is provided on the protruding portion 12 in the up and down direction, and a guide hole matching the guide post 13 is provided on the limiting portion 22, and the guide post 13 is inserted into the guide hole.

[0051] The guide post 13 is arranged on the protruding portion 12 in the up and down direction, and can provide support and guidance in the vertical direction. The guide hole on the limiting portion 22 matches the size of the guide post 13 to ensure that the guide post 13 can smoothly pass through the guide hole, so as to realize the precise positioning of the film tension member 2. The cooperation of the guide post 13 and the guide hole makes the movement of the film tension member 2 in the through hole 11 more stable and not prone to tilt or deviation.

[0052] The arrangement of the guide post 13 and the guide hole ensures that the lifting path of the film tension member 2 is straight, thus avoiding the problem of uneven film tension caused by path deviation. Secondly, the guide post 13 provides additional supporting force, enhancing the stability of the film tension member 2, so that it is not easily affected by external interference during the movement.

[0053] In an exemplary embodiment, please refer to Figure 1 As shown, an adsorption member 14 for adsorbing the release film 4 to the lower surface of the frame body 1 is provided on the frame body 1 to ensure that the release film 4 can be closely attached to the lower surface of the frame body 1, so as to provide effective tension.

[0054] The adsorption member 14 is installed on the frame body 1, and by forming a certain adsorption force, the release film 4 is firmly adsorbed on the lower surface of the frame body 1. Such a design ensures that the release film 4 always remains flat and closely attached during the feeding and encapsulation processes, avoiding uneven distribution of the resin particles 5 caused by film relaxation or displacement. When the film tension member 2 descends to the lower surface of the frame body 1, the release film 4 will tend to be tightened under the action of tension. The presence of the adsorption member 14 can prevent the release film 4 from detaching from the lower surface of the frame body 1 due to the tension action.

[0055] Specifically, the adsorption member 14 includes a negative pressure interface 141 and a plurality of adsorption holes 142 communicating with the negative pressure interface 141. The adsorption holes 142 penetrate through the lower surface of the frame body 1. The negative pressure interface 141 is connected to an external negative pressure source. Through the action of the negative pressure source, a negative pressure environment is formed inside the frame body 1. The negative pressure interface 141 can be connected to the external negative pressure source through a conduit or a direct connection method, so that the negative pressure can be effectively transmitted to the inside of the adsorption member 14.

[0056] The adsorption holes 142 are extensions of the negative pressure interface 141. These adsorption holes 142 are evenly distributed on the lower surface of the frame body 1 and communicate with the negative pressure interface 141. When the negative pressure source is started, the negative pressure environment formed through the negative pressure interface 141 will be transmitted to the lower surface of the frame body 1 through the adsorption holes 142, thereby forming a uniform adsorption force field on the lower surface of the frame body 1.

[0057] Further, please refer to Figure 1 As shown, a plurality of adsorption holes 142 are evenly arranged on the frame body 1 around the outer periphery of the through hole 11, so as to be able to adsorb the release film 4 around the through hole 11. The arrangement method of the adsorption holes 142 is evenly distributed around the outer periphery of the through hole 11. These adsorption holes 142 act together to form an annular adsorption area on the lower surface of the frame body 1, so that the release film 4 is uniformly adsorbed around the through hole 11.

[0058] The uniform arrangement of the adsorption holes 142 can not only ensure the tight state of the release film 4 around the through hole 11, but also prevent the release film 4 from being damaged or displaced due to uneven tension during the feeding and encapsulation processes. When the film tension member 2 descends, the release film 4 will be tensioned. If the adsorption holes 142 are unevenly distributed, some areas may be subjected to excessive tension, while other areas may be loose, resulting in damage to the release film 4 or uneven distribution of the resin particles 5.

[0059] In an exemplary embodiment, please refer to Figure 1 As shown, a clamping portion 15 is fixedly connected to the outer side wall of the frame body 1. The design purpose of the clamping portion 15 is to provide a part for the conveying mechanism of the material storage frame to grasp the material storage frame, so as to realize the stable conveying of the material storage frame.

[0060] The clamping portion 15 is tightly combined with the frame body 1. Through a firm fixed connection, it is ensured that there will be no loosening or falling off during the conveying process. The clamping portion 15 can be arranged at multiple positions on the frame body 1 to facilitate the conveying mechanism to grasp and convey from different angles. This multi-point fixed design increases the stability of grasping and avoids the inclination or dropping of the material storage frame caused by single-point force.

[0061] In summary, for the material receiving frame provided by the present utility model, through the cooperation between the protruding portions provided on the inner side wall of the frame body and the limiting portions on the film tension member, the descending range of the film tension member is accurately limited, ensuring that it can smoothly descend below the lower surface of the frame body, thereby achieving uniform tensioning of the release film; through the action of the magnetic attraction force of the magnetic attraction assembly, the smoothness and stability of the film tension member during the descending process are ensured, preventing the film tension member from jamming during the descending process.

[0062] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present utility model, the present utility model can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.

[0063] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A material receiving frame, characterized in that, Comprising: A frame body having a through hole penetrating up and down, and a protruding portion protruding from the inner side wall of the frame body; A film tension member that is vertically movable and disposed in the through hole, and the film tension member can descend beyond the lower surface of the frame body. The film tension member has a material receiving portion penetrating up and down, and a limiting portion corresponding to the protruding portion is provided on the outer side wall of the material receiving portion. The limiting portion and the protruding portion cooperate to limit the descent of the film tension member; A magnetic attraction assembly including a first magnetic attraction member and a second magnetic member. The first magnetic attraction member is disposed on the protruding portion, and the second magnetic attraction member is disposed on the limiting portion and corresponds to the position of the first magnetic attraction member. A magnetic attraction force can be formed between the first magnetic attraction member and the second magnetic member.

2. The material receiving frame according to claim 1, wherein The protruding portion is arranged along the circumferential direction of the inner side wall of the frame body.

3. The material storage frame according to claim 2, wherein The protruding portion is in the shape of a rectangular frame, and the first magnetic attraction members are provided on two opposite side frames of the protruding portion.

4. The material receiving frame according to claim 2, wherein The limiting portion is arranged along the circumferential direction of the outer side wall of the material receiving portion.

5. The material storage frame according to claim 1, characterized in that, The exceeding height that the film tension member descends beyond the lower surface of the frame body is 0.2 - 1 cm.

6. The material storage frame according to claim 1, wherein, A guiding column arranged in the up and down direction is provided on the protruding portion, and a guiding hole matching the guiding column is provided on the limiting portion. The guiding column penetrates through the guiding hole.

7. The material storage frame according to claim 1, wherein An adsorption member for adsorbing a release film to the lower surface of the frame body is provided on the frame body.

8. The material receiving frame according to claim 7, wherein The adsorption member includes a negative pressure interface and a plurality of adsorption holes communicated with the negative pressure interface. The adsorption holes penetrate through the lower surface of the frame body.

9. The material receiving frame according to claim 8, wherein, The plurality of adsorption holes are uniformly arranged on the frame body around the outer circumference of the through hole.

10. The material receiving frame according to claim 1, characterized in that, A clamping portion is fixedly connected to the outer side wall of the frame body.

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