Silica gel attached hardware support

Abstract

The utility model discloses a silica gel attached hardware support which comprises a support body and a clamping groove formed by the support body, a containing groove with the side face recessed inwards is formed in one corner of the clamping groove, an L-shaped buffer block completely attached to the recessed position of the side face of the containing groove is installed in the containing groove, and a columnar groove is formed in the corner of the inner side of the buffer block. A bonding layer is arranged on the surface, making contact with the containing groove, of the buffer block, it is guaranteed that the buffer block is firmly attached to the interior of the containing groove through the design of the bonding layer, glue is prevented from overflowing, the glue sealing defect of a traditional in-mold beer sleeving technology is overcome, and the stability and durability of the support are improved. In addition, the bonding layer simplifies the installation process of the buffer block, a user can easily paste the buffer block, the buffer block can be replaced or adjusted according to needs, the service life of the support is prolonged, and convenient and efficient maintenance is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of hardware brackets, in particular to a silica gel fitting hardware bracket. Background Art

[0002] The design idea of traditional hardware overmolding silica gel is the in-mold one-piece injection molding process. Due to structural limitations, it is impossible to achieve the sealing glue defects caused by in-mold overmolding, and there will be a problem of silica gel overflow in the injection molding process. The overflowing silica gel will not only affect the appearance quality of the product, but may also have a negative impact on the performance and reliability of the product. For example, the overflowing silica gel may contaminate other parts of the product, resulting in product function failure or reduced product service life. In addition, the overflowing silica gel may also increase production costs because additional steps are required to clean the overflowing silica gel and may cause product scrapping due to improper handling. Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art solutions, the utility model provides a silica gel fitting hardware bracket, which can effectively solve the problem of sealing glue defects caused by structural limitations that cannot achieve in-mold overmolding proposed in the background art.

[0004] The technical solution adopted by the utility model to solve its technical problems is: a silica gel fitting hardware bracket, including a frame body and a card slot formed by the frame body. A placement groove with an inwardly concave side is provided at one corner of the card slot. An "L"-shaped buffer block that completely fits the concave part of the side of the placement groove is installed in the placement groove. A columnar groove is provided at the inner corner of the buffer block, and an adhesive layer is provided on the surface of the buffer block in contact with the placement groove.

[0005] Further, a chamfering part is provided at the upper edge of the buffer block facing the inside, and the width of the chamfering part is 0.03 mm to 0.08 mm.

[0006] Further, the buffer block is a soft silica gel block.

[0007] Further, an anti-slip coating is provided on the inner side of the buffer block.

[0008] Further, the length of the long side of the buffer block is twice that of the short side, and the diameter of the groove is half of the length of the short side.

[0009] Compared with the prior art, the beneficial effects of the present utility model are as follows: The "L"-shaped buffer block fits with the recess on the side of the placement groove, reducing the direct contact between the card holder and the hardware bracket, and protecting the surface of the device from frictional damage. The adhesive layer design ensures that the buffer block is firmly adhered to the placement groove, preventing glue from overflowing, and overcoming the sealing glue defects of the traditional in-mold insert molding process, improving the stability and durability of the bracket. In addition, the adhesive layer simplifies the installation process of the buffer block, allowing users to easily paste it, and the buffer block can be replaced or adjusted according to needs, extending the service life of the bracket and achieving convenient and efficient maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is the overall three-dimensional structure diagram of the present utility model;

[0011] Figure 2 is Figure 1 the enlarged view of structure A in

[0012] Figure 3 is the three-dimensional structure diagram of the buffer block of the present utility model;

[0013] Figure 4 is another perspective of the three-dimensional structure diagram of the buffer block of the present utility model.

[0014] Reference numerals in the drawings:

[0015] 1 - frame body, 2 - card slot, 3 - buffer block, 4 - groove, 5 - chamfered portion, 6 - adhesive layer, 7 - placement groove. SPECIFIC EMBODIMENTS

[0016] The following describes the embodiments of the present disclosure in detail with reference to the accompanying drawings.

[0017] The following illustrates the embodiments of the present disclosure through specific examples. Those skilled in the art can easily understand other advantages and effects of the present disclosure from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present disclosure without creative efforts fall within the scope of protection of the present disclosure. Embodiment

[0018] As Figures 1-4As shown in the figure, the utility model provides a silica gel fitting hardware bracket, which includes a bracket body 1 and a card slot 2 formed by the bracket body 1. A placement groove 7 with an inwardly concave side is provided at one corner of the card slot 2. An "L"-shaped buffer block 3 that completely fits the concave part on the side of the placement groove 7 is installed in the placement groove 7. A columnar groove 4 is provided at the inner corner of the buffer block 3. A bonding layer 6 is provided on the surface of the buffer block 3 that contacts the placement groove 7.

[0019] The bracket body 1 and the card slot 2 formed thereby provide stable support and fixation for the card holder, ensuring that the device does not slip or shake during use.

[0020] The design of the "L"-shaped buffer block 3 completely fits the concave part on the side of the placement groove 7, and can also effectively reduce the direct contact between the card holder and the hardware bracket, thereby avoiding damage to the device surface due to friction.

[0021] The design of the bonding layer 6 enables the buffer block 3 to be firmly attached to the placement groove 7 without glue overflow.

[0022] The traditional in-mold insert molding process cannot achieve a perfect sealing effect due to structural limitations. The buffer block 3 with bonding treatment can overcome this defect, ensure the sealing between the buffer block 3 and the placement groove 7, and further improve the stability and durability of the bracket.

[0023] The bonding layer 6 makes the installation of the buffer block 3 more convenient and efficient. The user only needs to paste the buffer block 3 into the placement groove 7 without complex assembly or adjustment process.

[0024] The buffer block 3 with bonding treatment can be replaced or adjusted according to actual needs. For example, when the buffer block 3 is worn or aged due to long-term use, the user can easily remove it and replace it with a new buffer block 3, thereby extending the service life of the bracket.

[0025] See Figure 2 and Figure 3 , a chamfered portion 5 is provided at the upper inner edge of the buffer block 3, and the width of the chamfered portion 5 is 0.03 mm to 0.08 mm. The design of the chamfered portion 5 makes the edge of the buffer block 3 smoother and rounder, thereby improving the visual effect and aesthetics of the entire bracket. When the buffer block 3 contacts the card holder, the chamfered portion 5 can reduce the sharpness of the edge, thereby reducing the risk of friction and scratching on the card holder, extending its service life and reducing maintenance costs. By optimizing the edge shape, stress can be dispersed and the risk of cracking or damage caused by stress concentration can be reduced.

[0026] Among them, the buffer block 3 is a soft silica gel block. The soft silica gel block has good elasticity and softness. When the card holder is placed on the bracket, it can effectively absorb and disperse the impact force, reducing the risk of damage to the card holder due to vibration or collision. Moreover, by filling the gap between the card holder and the card slot with the deformable soft silica gel block, the connection between the card holder and the card slot 2 is made more stable.

[0027] Among them, an anti-slip coating is provided on the inner side of the buffer block 3. The anti-slip coating increases the friction force and prevents the card holder placed on the bracket from slipping.

[0028] See Figure 2 and Figure 3 , the length of the long side of the buffer block 3 is twice that of the short side, and the diameter of the groove 4 is half of the length of the short side.

[0029] When the buffer block 3 is subjected to an external force, the stress usually concentrates in the corner area. By providing the groove 4, these concentrated stresses can be dispersed over a larger area, thereby reducing the stress value per unit area.

[0030] The diameter of the groove 4 is half of the length of the short side, which can ensure that the stress is evenly dispersed around the groove 4, avoiding excessive stress concentration in a small area.

[0031] The presence of the groove 4 changes the stress transmission path. The stress that originally acted directly on the edge of the buffer block 3 now needs to be transmitted through the edge of the groove 4, which increases the stress transmission path and dispersion area.

[0032] By optimizing the shape and size of the groove 4, the stress transmission direction can be further guided to make it more evenly distributed on the buffer block 3.

[0033] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "middle", "length", "upper", "lower", "front", "rear", "vertical", "horizontal", "inner", "outer", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0034] In the present invention, unless otherwise clearly specified and limited, the first feature being "on" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. The meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise clearly specifically limited.

[0035] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or communication with each other; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0036] The above is only to illustrate the implementation manners of the present utility model and is not intended to limit the present utility model. For those skilled in the art, any modifications, equivalent replacements, improvements, etc. made without creative efforts within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A silicone bonded metal bracket, comprising a frame body and a card slot formed by the frame body, characterized in that, A placement groove with an inwardly recessed side is provided at one corner of the card slot. An "L"-shaped buffer block that fits exactly with the recessed part on the side of the placement groove is installed in the placement groove. A columnar groove is provided at the inner corner of the buffer block, and an adhesive layer is provided on the surface of the buffer block that contacts the placement groove.

2. A silicone bonded hardware bracket according to claim 1, wherein: A chamfered portion is provided at the upper edge of the buffer block facing the inside, and the width of the chamfered portion is from 0.03 mm to 0.08 mm.

3. A silicone bonded to a metal bracket according to claim 1, characterized in that: The buffer block is a soft silicone block.

4. A silicone bonded hardware bracket according to claim 1, characterized in that: An anti-slip coating is provided on the inner side of the buffer block.

5. A silicone bonded metal bracket according to any one of claims 1-4, characterized in that: The length of the long side of the buffer block is twice that of the short side, and the diameter of the groove is half of the length of the short side.

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