Novel heat conduction material testing device

The novel thermal material testing device addresses the lack of comprehensive thermal conductivity evaluation by using adjustable components and sensors to analyze thermal performance under varying compressions, improving design and reliability.

CN223107694UActive Publication Date: 2025-07-15SHENZHEN THIN CONDUCTOR TECH CO LTD
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Patent Information

Application Number
CN202421601755.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-08
Publication Date
2025-07-15
Estimated Expiration
2034-07-08

AI Technical Summary

Technical Problem

The existing thermal conductivity material testing devices lack comprehensive inspection of the horizontal and vertical thermal conductivity of thermal conductivity of thermal conductivity of different materials under different compression ratios, resulting in insufficient inspection and difficulty in assisting with post-production design solutions and product reliability verification.

Method used

A new thermal conductivity material testing device was designed, including an electric adjustment frame, an upper heat equalization plate, a lower heat equalization plate, a temperature sensor and a CNC operating panel. By adjusting the height and pressure sensor of the upper heat equalization plate, the thermal conductivity changes of the thermal conductivity of the thermal conductivity of the thermal conductivity are measured, and the temperature sensor and a CNC operating panel are combined for accurate data analysis.

Benefits of technology

The comprehensive testing of thermally conductive materials of different materials under different compression ratios is achieved, which improves the accuracy and reliability of test data, and the accuracy of auxiliary material selection and design solutions.

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Abstract

The utility model discloses a novel heat conduction material testing device which comprises an operation table, two electric adjusting frames are arranged on the surface of the operation table, a lower vapor chamber is arranged between the two electric adjusting frames, and a heat source generator is arranged at the bottom of the lower vapor chamber. An upper vapor chamber used in cooperation with the lower vapor chamber is slidably arranged between the two electric adjusting frames, a detected object used for detection is arranged between the upper vapor chamber and the lower vapor chamber, the electric adjusting frames, the upper vapor chamber, the lower vapor chamber and the detected object are arranged, the height of the upper vapor chamber is adjusted through the electric adjusting frames, and the detection accuracy is improved. The upper vapor chamber moves up and down to apply different degrees of extrusion and other forces to an object, so as to control the deformation quantity of the measured object, facilitate the horizontal heat conduction and vertical heat conduction capabilities of different heat conduction materials under different compression ratios, and facilitate the analysis of the change trend of the heat conduction capability of the heat conduction materials along with the change of pressure. And the test range is more comprehensive.
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Description

Technical Field

[0001] The utility model relates to the technical field related to the thermal management industry, and specifically relates to a new type of thermal conductive material testing device. Background Technique

[0002] Thermal management refers to controlling the transfer and distribution of heat through various technical means to improve energy utilization efficiency, reduce energy consumption and protect the environment. It has a wide range of applications in fields such as architecture, industrial production, and transportation. Thermal conductive materials are a new type of industrial material. These materials have been designed in recent years according to the heat conduction requirements of equipment, with excellent performance and reliability. They are suitable for various environments and requirements and have proper countermeasures for possible heat conduction problems, providing strong assistance for the high integration, ultra-small and ultra-thin of equipment. This thermal conductive product has been increasingly applied to many products, improving the reliability of the products. A thermal conductive material testing device, a thermal conductive material parameter testing device is a support device for detecting the functions of thermal conductive materials. After the thermal conductive materials are processed and manufactured, it is necessary to randomly select a part of them for thermal conduction testing to check whether their thermal conductivity is qualified.

[0003] The existing thermal conductive material testing devices lack the ability to measure the horizontal and vertical thermal conductivity of thermal conductive materials of different materials, such as thermal conductive foam, thermal conductive silica gel sheet, etc. under different compression ratios. Their functions are too single, the detection is not comprehensive enough, and it is not convenient for the later-stage qualitative design scheme and product reliability verification. Content of the Utility Model

[0004] To solve the defects existing in the prior art, the utility model provides a new type of thermal conductive material testing device.

[0005] To solve the above technical problems, the utility model provides the following technical solutions:

[0006] A new type of thermal conductive material testing device of the utility model includes an operating table. Two electric adjusting frames are arranged on the surface of the operating table. A lower heat sink plate is arranged between the two electric adjusting frames, and a heat source generator is arranged at the bottom of the lower heat sink plate. An upper heat sink plate that cooperates with the lower heat sink plate is slidably arranged between the two electric adjusting frames, and a test object to be detected is arranged between the upper heat sink plate and the lower heat sink plate.

[0007] Among them, the heat source generator is detachably connected to the bottom of the lower heat sink plate.

[0008] Among them, temperature sensors are arranged on the upper heat sink plate, the lower heat sink plate and the bottom of the test object.

[0009] Among them, a pressure sensor is arranged on the operating table at a position directly opposite to the lower heat sink plate.

[0010] Among them, a numerical control operation panel is provided on the operation table, and the numerical control operation panel is divided into three control working areas: power supply, pressure, and temperature.

[0011] Among them, a scale for cooperating with the upper heat sink plate is provided on the surface of the electric adjusting frame.

[0012] The beneficial effects of the present utility model are as follows:

[0013] 1. For this new type of thermal conductivity material testing device, by setting an electric adjusting frame, an upper heat sink plate, a lower heat sink plate, and the object to be measured, the height of the upper heat sink plate is adjusted through the electric adjusting frame, so that the upper heat sink plate moves up and down to apply different degrees of extrusion and other forces to the object, used to control the deformation amount of the object to be measured, which is convenient for testing the horizontal and vertical thermal conductivity capabilities of thermal conductivity materials of different materials, such as thermal conductive foam, thermal conductive silicone sheet, etc. under different compression ratios, helps to analyze the change trend of the thermal conductivity of the thermal conductivity material with the change of pressure, makes the test range more comprehensive, can accurately test the change trend of the thermal conductivity with the change of pressure, and thus effectively assist in the scheme design and material selection.

[0014] 2. For this new type of thermal conductivity material testing device, by setting a temperature sensor, the temperature sensor is equipped with a thermocouple contact probe for more accurate measurement, making the test data more accurate, and can simultaneously test the thermal conductivity capabilities in the horizontal and vertical directions, and comprehensively analyze the thermal performance of the object to be measured.

[0015] 3. For this new type of thermal conductivity material testing device, by setting a numerical control operation panel, through the numerical control operation panel, the set parameters and test curves can be intuitively displayed, which is convenient for the operator to analyze and record the data, with program control, higher precision, and more accurate data. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings are used to provide a further understanding of the present utility model, and constitute a part of the specification. Together with the embodiments of the present utility model, they are used to explain the present utility model, and do not constitute a limitation to the present utility model. In the drawings:

[0017] Figure 1 is a schematic structural diagram of a new type of thermal conductivity material testing device of the present utility model;

[0018] Figure 2 is a schematic structural diagram of another angle of a new type of thermal conductivity material testing device of the present utility model;

[0019] Figure 3 is a new type of thermal conductivity material testing device of the present utility model Figure 1 The enlarged structural diagram of part A;

[0020] Figure 4 is a new type of thermal conductivity material testing device of the present utility modelFigure 2 Schematic diagram of the enlarged structure at position B.

[0021] In the figure: 1, operating table; 2, numerical control operation panel; 3, electric adjusting frame; 4, pressure sensor; 5, upper heat sink plate; 6, object to be measured; 7, lower heat sink plate; 8, heat source generator. Specific implementation mode

[0022] The following is a description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0023] Embodiment: As Figure 1 , Figure 2 , Figure 3 and Figure 4 shown, a new type of thermal conductivity material testing device of the present invention includes an operating table 1. Two electric adjusting frames 3 are provided on the surface of the operating table 1. A lower heat sink plate 7 is provided between the two electric adjusting frames 3. A heat source generator 8 is provided at the bottom of the lower heat sink plate 7. An upper heat sink plate 5 that cooperates with the lower heat sink plate 7 is slidably provided between the two electric adjusting frames 3. An object 6 to be detected is provided between the upper heat sink plate 5 and the lower heat sink plate 7. By setting the electric adjusting frame 3, the upper heat sink plate 5, the lower heat sink plate 7 and the object 6 to be detected, the height of the upper heat sink plate 5 is adjusted by the electric adjusting frame 3, so that the upper heat sink plate 5 moves up and down to apply different degrees of extrusion and other forces to the object, which is used to control the deformation amount of the object 6 to be detected, and is convenient for testing the horizontal and vertical thermal conductivity of different thermal conductivity materials, such as thermal conductive foam, thermal conductive silicone sheet, etc. under different compression ratios, which helps to analyze the change trend of the thermal conductivity of the thermal conductivity material with the change of pressure, and makes the test range more comprehensive.

[0024] Among them, the heat source generator 8 is detachably connected to the bottom of the lower heat sink plate 7. By setting the detachable heat source generator 8, the heat source generator 8 that simulates the heat generating device is a detachable single module, which can be used to meet the thermal analysis tests of different thermal conductivity materials.

[0025] Among them, temperature sensors are provided on the upper heat sink plate 5, the lower heat sink plate 7 and the bottom of the object 6 to be detected. By setting the temperature sensors, the equipped temperature sensors measure more accurately through the thermocouple contact probe, making the test data more accurate.

[0026] Among them, a pressure sensor 4 is provided on the operating table 1 at a position directly opposite to the lower heat sink plate 7. By setting the pressure sensor 4, the pressure parameters can be accurately set, further improving the test accuracy.

[0027] Among them, a numerical control operation panel 2 is provided on the operation table 1, and the numerical control operation panel 2 is divided into three control working areas: power supply, pressure, and temperature. By setting the numerical control operation panel 2, the set parameters and test curves can be intuitively displayed, facilitating the operator to analyze and record the data.

[0028] Among them, a scale that is used in cooperation with the upper heat sink 5 is provided on the surface of the electric adjusting frame 3. By setting the scale, it is convenient for the operator to determine the movement height by using the scale, ensuring the accuracy of its height movement.

[0029] During operation, the object to be measured 6 is placed on the lower heat sink 7, and then the height of the upper heat sink 5 is adjusted by the electric adjusting frame 3. The upper heating plate moves up and down to apply different pressures to the object to be measured 6, thereby controlling the deformation amount of the object to be measured 6. The pressure value corresponding to the deformation amount is determined by reading the pressure value displayed on the numerical control operation panel 2, the power of the heat source generator 8 is determined by reading the power value of the power supply, and the temperature of the heat source generator 8, the temperature at the bottom of the object to be measured 6, and the temperature at the top of the object to be measured 6 are determined by reading the temperature value, realizing the detection work.

[0030] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A novel thermal conductivity material testing device, characterized in that, It includes an operation table (1). There are two electric adjusting frames (3) on the surface of the operation table (1). A lower heat sink plate (7) is arranged between the two electric adjusting frames (3). And a heat source generator (8) is arranged at the bottom of the lower heat sink plate (7). An upper heat sink plate (5) which is used in cooperation with the lower heat sink plate (7) is slidably arranged between the two electric adjusting frames (3). A measured object (6) for detection is arranged between the upper heat sink plate (5) and the lower heat sink plate (7).

2. The novel thermal conductivity material testing device according to claim 1, wherein The heat source generator (8) is detachably connected to the bottom of the lower heat sink plate (7).

3. A novel thermal conductivity material testing device according to claim 1, characterized in that, Temperature sensors are arranged on both the upper heat sink plate (5) and the lower heat sink plate (7) and at the bottom of the measured object (6).

4. A novel thermal conductivity material testing device according to claim 1, characterized in that, A pressure sensor (4) is arranged on the operation table (1) at a position directly opposite to the lower heat sink plate (7).

5. A novel thermal conductivity material testing device according to claim 1, characterized in that, A numerical control operation panel (2) is arranged on the operation table (1), and the numerical control operation panel (2) is divided into three control working areas: power supply, pressure and temperature.

6. A novel thermal conductivity material testing device according to claim 1, characterized in that A scale which is used in cooperation with the upper heat sink plate (5) is arranged on the surface of the electric adjusting frame (3).