Clamp for wafer test and semiconductor test equipment

Abstract

The utility model provides a clamp for wafer testing and semiconductor testing equipment, and relates to the technical field of wafer testing. According to the utility model, any buckle assembly comprises a connecting rod penetrating through the test plate assembly and a pressing plate connected with one end of the connecting rod, the pressing plate is arranged at one side, far away from the first sealing cover, of the test plate assembly, and the connecting rod is connected with the first sealing cover, so that the first sealing cover is connected with the test plate assembly to form a test cavity for placing a wafer to be tested; the connecting rods are arranged to rotate along with the pressing plates when the corresponding pressing plates are pressed by force, so that the first sealing cover is separated from the test plate assembly. According to the technical scheme, the connection mode of connecting the test plate assembly and the first sealing cover through screws in the prior art is canceled, rapid separation and rapid connection of the test plate assembly and the first sealing cover can be achieved through downward pressing and resetting of the pressing plate, the structure is simple, operation is convenient, and cost is low. And compared with a connection mode that the test plate assembly and the first sealing cover are tightened by screws, the service life is long.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer testing, in particular to a fixture for wafer testing and a semiconductor testing device. Background Art

[0002] In the prior art, when performing performance testing on a wafer to be tested, it is necessary to connect the various components of the test fixture for the wafer to be tested by means of screw connection, so that the wafer to be tested is in a sealed test space, and then perform performance testing on the wafer to be tested. When testing each wafer to be tested, it is necessary to tighten and disassemble the screws once, which has a great impact on the service life of the screws. Generally, the screw threads will be damaged after using the screws for half a month, which will reduce the service life of the screws and increase the testing cost. Summary of the Utility Model

[0003] An object of the utility model is to provide a fixture for wafer testing, so as to solve the technical problem of increased testing cost caused by the short service life of screws in the prior art.

[0004] A further object of the utility model is to improve the performance testing efficiency of the wafer to be tested.

[0005] Another object of the utility model is to provide a semiconductor testing device having the above fixture.

[0006] In particular, the utility model provides a fixture for wafer testing, including:

[0007] A test board assembly;

[0008] A first sealing cover;

[0009] At least one buckle assembly, connected to the test board assembly, any one of the buckle assemblies includes a connecting rod penetrating through the test board assembly and a pressing plate connected to one end of the connecting rod, the pressing plate is arranged on a side of the test board assembly away from the first sealing cover; the connecting rod is connected to the first sealing cover, so that the first sealing cover and the test board assembly are connected to form a test cavity for placing the wafer to be tested, and the connecting rod is arranged to rotate following the rotation when the corresponding pressing plate is pressed by force, so that the first sealing cover and the test board assembly are separated.

[0010] Optionally, the first sealing cover has at least one matching part, the connecting rod has a clamping part clamped with the matching part, and the connecting rod is arranged so that when the pressing plate is pressed by force and rotates following the pressing plate, the clamping part is separated from the matching part, so that the first sealing cover and the test board assembly are separated.

[0011] Optionally, any one of the pressing plates includes an extension portion extending toward the center of the test board assembly. When a downward pressing force is applied to the extension portion, the pressing plate tilts to drive the link to rotate.

[0012] Optionally, the buckle assembly further includes:

[0013] An elastic member, sleeved on the link and located between the pressing plate and the test board assembly. The elastic member is configured to be compressed when the corresponding pressing plate is pressed and to return to its original state when the pressing plate is not stressed to reset the pressing plate.

[0014] Optionally, the first sealing cover is provided with at least one inwardly recessed groove arranged along its thickness direction. Any one of the grooves corresponds to one of the buckle assemblies, and a protruding mating portion is provided at the inner wall of any one of the grooves. The link passes through the corresponding groove so that the clamping portion is clamped with the corresponding mating portion.

[0015] Optionally, the clamping portion is hook-shaped and has a first contact surface facing the first sealing cover. The mating portion has a second contact surface facing in the opposite direction to the first contact surface, so as to achieve clamping between the clamping portion and the mating portion through the cooperation of the first contact surface and the second contact surface.

[0016] Optionally, the second contact surface is formed by sloping upward from the edge of the mating portion toward the center position of the first sealing cover, and the first contact surface is arranged parallel to the second contact surface.

[0017] Optionally, the buckle assembly further includes:

[0018] A mounting member, mounted on the side of the test board assembly away from the first sealing cover;

[0019] A rotating shaft, at least part of which is movably inserted into the mounting member;

[0020] The link penetrates through the mounting member, and part of the rotating shaft is inserted into the link.

[0021] Optionally, the test board assembly includes a second sealing cover, and both the second sealing cover and the first sealing cover are circular;

[0022] The number of the buckle assemblies is multiple, and the multiple buckle assemblies are arranged at intervals along the circumference of the second sealing cover and are connected to the second sealing cover.

[0023] Optionally, the pressing plates of all the buckle assemblies are configured to be simultaneously pressed, so that all the links are separated from the first sealing cover simultaneously.

[0024] In particular, the present utility model further provides a semiconductor testing device, including the above-mentioned fixture.

[0025] According to the solution of the present utility model, any snap component includes a connecting rod passing through the test board assembly and a pressing plate connected to one end of the connecting rod. The pressing plate is disposed on the side of the test board assembly away from the first sealing cover. The connecting rod is connected to the first sealing cover, so that the first sealing cover and the test board assembly are connected to form a test cavity for placing the wafer to be tested. The connecting rod is arranged to rotate following the pressing when the corresponding pressing plate is stressed, so that the first sealing cover and the test board assembly are separated. The above technical solution cancels the connection method of connecting the test board assembly and the first sealing cover by screws in the prior art. By pressing down and resetting the pressing plate, the quick separation and quick connection of the test board assembly and the first sealing cover can be realized. The structure is relatively simple and the operation is convenient. Compared with the connection method of screwing the test board assembly and the first sealing cover with screws, the service life is longer.

[0026] Further, in the present utility model, the pressing plates of all the snap components are arranged to be simultaneously stressed, so that all the connecting rods are separated from the first sealing cover, and thus the first sealing cover and the test board assembly are separated. It is not necessary to press the pressing plates in sequence, which can improve the disassembly and connection efficiency of the test board assembly and the first sealing cover, and thus improve the wafer performance testing efficiency.

[0027] Based on the following detailed description of the specific embodiments of the present utility model in conjunction with the drawings, those skilled in the art will more clearly understand the above and other objects, advantages and features of the present utility model. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Hereinafter, some specific embodiments of the present utility model will be described in detail with reference to the drawings in an exemplary and non-limiting manner. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0029] Figure 1 is a schematic structural diagram of a fixture for wafer testing from an angle according to an embodiment of the present utility model;

[0030] Figure 2 is a schematic structural diagram of a fixture for wafer testing from another angle according to an embodiment of the present utility model;

[0031] Figure 3 is a schematic connection diagram of a snap component with a first sealing cover and a second sealing cover according to an embodiment of the present utility model;

[0032] Figure 4 is a schematic cross-sectional view of a snap component in a locked state according to an embodiment of the present utility model;

[0033] Figure 5 It is a schematic cross-sectional view of a buckle assembly in an unlocked state according to an embodiment of the present utility model;

[0034] Figure 6 It is a schematic structural diagram of a buckle assembly according to an embodiment of the present utility model.

[0035] Reference numerals:

[0036] 100 - jig, 10 - test board assembly, 20 - buckle assembly, 30 - first sealing cover, 40 - heat sink, 11 - probe card, 12 - second sealing cover, 13 - probe board, 21 - pressing plate, 22 - elastic member, 23 - mounting member, 24 - connecting rod, 25 - rotating shaft, 26 - screw, 31 - groove, 32 - mating portion, 111 - decorative panel, 112 - outer frame weight reduction plate, 113 - PCB board, 211 - extension portion, 241 - clamping portion, 242 - first contact surface, 321 - second contact surface. Detailed implementation manners

[0037] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present utility model, and should not be construed as a limitation to the present utility model.

[0038] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0039] The terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features, that is, include one or more of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. When a certain feature "includes or contains" a certain or certain features it covers, unless otherwise specifically described, this indicates that other features are not excluded and other features may be further included.

[0040] Unless otherwise clearly defined and limited, terms such as "connection" and "installation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. Those of ordinary skill in the art should be able to understand the specific meanings of the above terms in this utility model according to specific circumstances.

[0041] Unless otherwise limited, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as those commonly understood by those of ordinary skill in the technical field to which this application belongs.

[0042] Figure 1 It is a schematic structural diagram of a fixture 100 for wafer testing according to an embodiment of the present utility model from one angle. Figure 2 It is a schematic structural diagram of a fixture 100 for wafer testing according to an embodiment of the present utility model from another angle. Figure 3 It is a schematic connection diagram of a buckle assembly 20, a first sealing cover 30, and a second sealing cover 12 according to an embodiment of the present utility model. Figure 4 It is a schematic cross-sectional view of the buckle assembly 20 in a locked state according to an embodiment of the present utility model. Figure 5 It is a schematic cross-sectional view of the buckle assembly 20 in an unlocked state according to an embodiment of the present utility model. Figure 6 It is a schematic structural diagram of a buckle assembly 20 according to an embodiment of the present utility model. As Figures 1 to 6 shown, in a specific embodiment, the fixture 100 for wafer testing includes a first sealing cover 30, at least one buckle assembly 20, and a test board assembly 10. At least one buckle assembly 20 is connected to the test board assembly 10. Any buckle assembly 20 includes a connecting rod 24 penetrating through the test board assembly 10 and a pressing plate 21 connected to one end of the connecting rod 24. The pressing plate 21 is disposed on the side of the test board assembly 10 away from the first sealing cover 30. The connecting rod 24 is connected to the first sealing cover 30, so that the first sealing cover 30 and the test board assembly 10 are connected to form a test cavity for placing the wafer to be tested. The connecting rod 24 is arranged to rotate following the pressing of the corresponding pressing plate 21, so that the first sealing cover 30 and the test board assembly 10 are separated. Here, the pressing plate 21 can be pressed down under the drive of a driving device such as a motor or a cylinder. The top of the connecting rod 24 is connected to the pressing plate 21 by a screw 26.

[0043] This embodiment cancels the connection method of connecting the test board assembly 10 and the first sealing cover 30 by screws in the prior art. The separation and connection of the test board assembly 10 and the first sealing cover 30 can be achieved by pressing down and resetting the pressing plate 21. The structure is relatively simple and easy to implement. Compared with the connection method of using screws to tighten, the service life is longer.

[0044] In this embodiment, the test board assembly 10 has test probes. When the first sealing cover 30 is connected to the test board assembly 10, the test probes are located in the test cavity and contact the wafer under test to test the wafer under test.

[0045] In some embodiments, the first sealing cover 30 has at least one mating portion 32, and the connecting rod 24 has a clamping portion 241 that is clamped with the mating portion 32. The connecting rod 24 is arranged such that when the pressing plate 21 is pressed down under force and rotates following the pressing plate 21, the clamping portion 241 is separated from the mating portion 32, so that the first sealing cover 30 is separated from the test board assembly 10.

[0046] In some embodiments, any pressing plate 21 includes an extension portion 211 extending toward the center direction of the test board assembly 10. When the extension portion 211 is subjected to a downward pressing force, the pressing plate 21 tilts to drive the connecting rod 24 to rotate.

[0047] Furthermore, the buckle assembly 20 further includes an elastic member 22. The elastic member 22 is sleeved on the connecting rod 24 and is located between the pressing plate 21 and the test board assembly 10. The elastic member 22 is configured to be compressed when the corresponding pressing plate 21 is pressed down under force and to return to its original state when the pressing plate 21 is not under force to reset the pressing plate 21. Here, the elastic member 22 can be selected as a spring, and the elastic force of the spring can be selected according to specific design requirements. The downward pressing force of the pressing plate 21 needs to be greater than the elastic force of the spring.

[0048] In some embodiments, the first sealing cover 30 is provided with at least one inwardly recessed groove 31 arranged along its thickness direction. Any groove 31 corresponds to a buckle assembly 20, and a protruding mating portion 32 is provided at the inner wall of any groove 31. The connecting rod 24 passes through the corresponding groove 31 so that the clamping portion 241 is clamped with the corresponding mating portion 32. Here, the groove 31 is provided at the edge of the first sealing cover 30, and the mating portion 32 protrudes from the inner wall of the groove 31 toward the outside of the first sealing cover 30. In other embodiments, the position of the groove 31 can also be designed according to specific design requirements.

[0049] In some embodiments, the clamping portion 241 is hook-shaped and has a first contact surface 242 facing the first sealing cover 30. The mating portion 32 has a second contact surface 321 opposite to the first contact surface 242, so as to achieve clamping between the clamping portion 241 and the mating portion 32 through the cooperation of the first contact surface 242 and the second contact surface 321. Here, the second contact surface 321 is located at the bottom of the mating portion 32. Both the first contact surface 242 and the second contact surface 321 are inclined surfaces. When the pressing plate 21 is in a horizontal state, that is, when no downward force is applied, the clamping portion 241 hooks the mating portion 32, and at this time, the first contact surface 242 and the second contact surface 321 are clamped, so that the test board assembly 10 and the first sealing cover 30 are in a locked state. Refer to Figure 4 . When the pressing plate 21 is in a downward inclined state, that is, when a downward force is applied, during the downward movement of the pressing plate 21, the connecting rod 24 is driven to rotate, so that the clamping portion 241 moves toward the outside of the first sealing cover 30, thereby disengaging from the mating portion 32. At this time, the first contact surface 242 and the second contact surface 321 are separated, so that the test board assembly 10 and the first sealing cover 30 are in an unlocked state. Refer to Figure 5 .

[0050] In some embodiments, the second contact surface 321 extends obliquely upward from the edge of the mating portion 32 toward the center position of the first sealing cover 30, and the first contact surface 242 is arranged in parallel with the second contact surface 321. By setting the first contact surface 242 and the second contact surface 321 in this embodiment, the clamping between the clamping portion 241 and the mating portion 32 can be made more stable, not easily loosened, and the reliability is improved.

[0051] In some embodiments, the buckle assembly 20 further includes a mounting member 23 and a rotating shaft 25. The mounting member 23 is mounted on the side of the test board assembly 10 away from the first sealing cover 30. At least part of the rotating shaft 25 is movably inserted into the mounting member 23. The connecting rod 24 penetrates through the mounting member 23, and part of the rotating shaft 25 is inserted into the connecting rod 24. Here, the elastic member 22 is located between the pressing plate 21 and the mounting member 23. The mounting member 23 is detachably connected to the test board assembly 10 by screws. The mounting member 23 is provided with a vertically penetrating mounting hole, and a rotating shaft 25 extending in the horizontal direction is mounted in the mounting hole, and the connecting rod 24 is inserted on the rotating shaft 25.

[0052] In some embodiments, the test board assembly 10 includes a second sealing cover 12. Both the second sealing cover 12 and the first sealing cover 30 are circular. The number of the buckle assemblies 20 is multiple, and the multiple buckle assemblies 20 are arranged at intervals along the circumference of the second sealing cover 12 and are connected to the second sealing cover 12.

[0053] Further, the test board assembly 10 further includes a probe card 11 and a probe board 13, and the probe board 13 has test probes. In this embodiment, a first sealing cover 30, a probe card 11, and a second sealing cover 12 are arranged in sequence from bottom to top. The first sealing cover 30 is connected to the probe card 11 to form a test cavity for placing the wafer to be tested. The probe board 13 is connected to the probe card 11 and is located in the test cavity, and the test probes of the probe board 13 are in contact with the wafer to be tested. In addition, a heat sink 40 is provided in the test cavity, and the wafer to be tested is located on the heat sink 40. Here, at least one through hole is respectively provided on the second sealing cover 12 and the probe card 11, and the connecting rod 24 sequentially passes through the mounting hole of the mounting member 23, the through hole of the second sealing cover 12, the through hole of the probe card 11, and the groove 31 of the first sealing cover 30. The mounting hole of the mounting member 23, the through hole of the second sealing cover 12, and the through hole of the probe card 11 respectively have redundant spaces for the connecting rod 24 to rotate.

[0054] In some embodiments, the probe card 11 includes a PCB board 113, an outer frame weight reduction board 112, and a decorative panel 111. Specifically, the decorative panel 111 is located on the side of the probe card 11 away from the first sealing cover 30, the PCB board is located on the side of the probe card 11 close to the first sealing cover 30 and is connected to the probe board 13. The outer frame weight reduction board 112 is connected between the decorative panel 111 and the PCB board 113. In addition, the outer frame weight reduction board 112 has a hand-held space to facilitate personnel to pick up the probe card 11.

[0055] In some embodiments, the pressing plates 21 of the plurality of snap components 20 extend toward the center of the second sealing cover 12, see Figure 3 . In other embodiments, the orientation of the pressing plates 21 of the plurality of snap components 20 can also be designed according to specific design requirements. In this embodiment, the driving component device can be arranged above the pressing plate 21 to directly drive the pressing plate 21 to press down.

[0056] In this embodiment, the pressing plates 21 of all the snap components 20 are set to be simultaneously pressed, so that all the connecting rods 24 are separated from the first sealing cover 30 at the same time, so that the first sealing cover 30 can be quickly separated from the test board assembly 10. It is not necessary to press the pressing plates 21 in sequence, which can improve the disassembly and connection efficiency of the test board assembly 10 and the first sealing cover 30, save the loading and unloading time of the fixture 100, and thus improve the performance test efficiency of the wafer to be tested. Here, when all the pressing plates 21 are simultaneously pressed, the engaging members 241 of all the connecting rods 24 are separated from the corresponding mating portions 32.

[0057] In this embodiment, the number of the snap components 20 is 12. In other embodiments, the number of the snap components 20 can also be designed according to specific design requirements, for example, it can be determined according to the diameters of the first sealing cover 30 and the second sealing cover 12.

[0058] This embodiment also provides a semiconductor test device, which includes the fixture 100 of any of the above embodiments. The fixture 100 will not be elaborated here one by one. Exemplarily, the semiconductor test device may be a wafer-level aging test device, but is not limited thereto.

[0059] Compared with the technical solution in which the first sealing cover 30 and the test board assembly 10 are connected by screws, in this embodiment, by providing a plurality of snap components 20, a snap connection method is adopted to achieve the quick connection between the first sealing cover 30 and the test board assembly 10, so as to form a test cavity for testing the wafer to be measured, improving the structural reliability and installation convenience of the fixture 100 and effectively improving the test efficiency. In addition, since this embodiment does not adopt the screw connection method, no debris will fall off, and the wafer to be measured will not be contaminated, improving the test safety.

[0060] So far, those skilled in the art should recognize that although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and determined to cover all these other variations or modifications.

Claims

1. A fixture for wafer testing, characterized in that, Comprising: A test board assembly; A first sealing cover; At least one snap component, connected to the test board assembly. Any one of the snap components includes a connecting rod penetrating through the test board assembly and a pressing plate connected to one end of the connecting rod. The pressing plate is disposed on a side of the test board assembly away from the first sealing cover. The connecting rod is connected to the first sealing cover, such that the first sealing cover and the test board assembly are connected to form a test cavity for placing a wafer under test. The connecting rod is configured to rotate following the corresponding pressing plate when the pressing plate is pressed by force, so that the first sealing cover is separated from the test board assembly.

2. The fixture according to claim 1, wherein The first sealing cover has at least one mating portion, and the connecting rod has a clamping portion that is clamped with the mating portion. The connecting rod is configured such that when the pressing plate is pressed by force and rotates following the pressing plate, the clamping portion is separated from the mating portion, so that the first sealing cover is separated from the test board assembly.

3. The fixture according to claim 1, wherein Any one of the pressing plates includes an extending portion extending towards the center direction of the test board assembly. When the extending portion is subjected to a downward pressing force, the pressing plate tilts to drive the connecting rod to rotate.

4. The fixture according to claim 1, characterized in that, The snap component further includes: An elastic member, sleeved on the connecting rod and located between the pressing plate and the test board assembly. The elastic member is configured to be compressed when the corresponding pressing plate is pressed by force, and to return to its original state when the pressing plate is not subjected to force to reset the pressing plate.

5. The fixture according to claim 2, wherein The first sealing cover is provided with at least one inwardly recessed groove arranged along its thickness direction. Any one of the grooves corresponds to one snap component, and a protruding mating portion is provided at the inner wall of any one of the grooves. The connecting rod passes through the corresponding groove, so that the clamping portion is clamped with the corresponding mating portion.

6. The fixture according to claim 2, wherein The clamping portion is hook-shaped and has a first contact surface facing the first sealing cover. The mating portion has a second contact surface facing the opposite direction of the first contact surface, so as to realize the clamping of the clamping portion and the mating portion through the cooperation of the first contact surface and the second contact surface.

7. The fixture according to claim 6, wherein The second contact surface is formed by upwardly inclined extension from the edge of the mating portion towards the center position of the first sealing cover, and the first contact surface is arranged parallel to the second contact surface.

8. The fixture according to claim 1, characterized in that, The snap component further includes: A mounting member, mounted on a side of the test board assembly away from the first sealing cover; A rotating shaft, at least part of the rotating shaft is movably penetrated in the mounting member; The connecting rod penetrates through the mounting member, and part of the rotating shaft is penetrated in the connecting rod.

9. The fixture according to claim 1, characterized in that, The test board assembly includes a second sealing cover, and both the second sealing cover and the first sealing cover are circular; The number of the snap components is multiple, and the multiple snap components are arranged at intervals along the circumferential direction of the second sealing cover and are connected to the second sealing cover.

10. The fixture according to claim 9, wherein The pressing plates of all the buckle assemblies are arranged to be simultaneously pressed, so that all the connecting rods are separated from the first sealing cover simultaneously.

11. A semiconductor testing device, characterized in that, It includes the clamp as described in any one of claims 1-10.

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