Test tool for measuring resistance of quantum chip and integrated circuit

Abstract

The utility model provides a test tool and an integrated circuit for measuring the resistance of a quantum chip, the package of a to-be-measured sub-chip comprises a first circuit board and a plurality of first connectors, the first circuit board is arranged at the periphery of the to-be-measured sub-chip, the quantum bits of the to-be-measured sub-chip are electrically connected with the first circuit board through leads, and the first connectors are electrically connected with the first circuit board. The plurality of first connectors are electrically connected to the first circuit board, the test tool comprises a second circuit board, the second circuit board comprises a first area and a second area which are adjacently arranged, and the first area is provided with a plurality of first electric contacts; the plurality of second connectors are electrically connected to the first electric contacts of the first area in an array mode, and the plurality of second connectors are electrically connected with the plurality of first connectors respectively; and the plurality of test points are arranged on the second area in an array manner, and the plurality of test points are electrically connected with the central conductors of the plurality of second connectors respectively, so that the resistance of the quantum bit can be measured through an external probe.

Description

Technical Field

[0001] The utility model relates to the technical field of measuring the resistance of a quantum chip, and more specifically, to a test tooling and an integrated circuit for measuring the resistance of a quantum chip. Background Art

[0002] In the packaging of a superconducting quantum chip, the superconducting quantum chip and a printed circuit board are connected by a bonding lead. Both the superconducting quantum chip and the printed circuit board are assembled on a metal base, and the printed circuit board is located around the superconducting quantum chip. Hundreds of radio frequency coaxial connectors are welded on the printed circuit board.

[0003] Currently, when measuring the resistance of qubits in a superconducting quantum chip, one probe at one end of a probe station contacts the central conductor of a radio frequency coaxial connector, and the other probe at the other end of the probe station is grounded. However, the diameter of the central conductor of the radio frequency coaxial connector is only 0.8 mm, and the top of the contact point where one probe contacts the central conductor of the radio frequency coaxial connector is conical, resulting in a very small contact area. This often causes the resistance value not to be displayed when measuring the resistance of the qubits due to poor contact. At the same time, due to poor contact, the number of operations of the probe touching the central conductor will increase. Improper operation may also cause the central conductor to deform, bend or even break. After the central conductor is damaged, the entire radio frequency coaxial connector to which the central conductor belongs needs to be replaced. When removing a certain radio frequency coaxial connector, it is necessary to remove the fixing piece used to fix the position of this group of radio frequency coaxial connectors. Subsequently, an operation of replacing the radio frequency coaxial connector with a damaged central conductor is carried out when the soldering station is in a high-temperature state. At this time, this group of radio frequency coaxial connectors are all in an unfixed state. During replacement, care must be taken not to touch other surrounding radio frequency coaxial connectors, otherwise the displaced radio frequency coaxial connectors need to be removed and re-soldered. At the same time, replacing a certain radio frequency coaxial connector requires at least two more high-temperature treatments. In this way, hundreds of radio frequency coaxial connectors on the printed circuit board will also undergo two more high-temperature treatments. Multiple high-temperature treatments are very likely to cause some of the hundreds of radio frequency coaxial connectors to randomly have functional problems, resulting in a serious impact on the work progress. Summary of the Utility Model

[0004] In view of this, in order to solve at least one of the technical problems in the prior art, an embodiment of the utility model provides a test tooling and an integrated circuit for measuring the resistance of a quantum chip, which can avoid damage to the central conductor of the first connector in the package of the quantum chip to be measured and improve the work efficiency of measuring the resistance of the quantum chip.

[0005] An embodiment of the present utility model provides a test tool for measuring the resistance of a quantum chip. The package of the quantum chip to be measured includes a first circuit board and a plurality of first connectors. The first circuit board is disposed around the quantum chip to be measured. The qubits of the quantum chip to be measured are electrically connected to the first circuit board through leads. The plurality of first connectors are electrically connected to the first circuit board. The test tool includes: a second circuit board, which includes a first area and a second area arranged adjacent to each other. The first area is provided with a plurality of first electrical contacts; a plurality of second connectors, which are arrayedly electrically connected to the first electrical contacts in the first area, and the plurality of second connectors are respectively electrically connected to the plurality of first connectors; and a plurality of test points, which are arrayedly arranged on the second area, and the plurality of test points are respectively electrically connected to the central conductors of the plurality of second connectors, so as to facilitate measuring the resistance of the qubits through external probes.

[0006] According to some embodiments of the present utility model, the first connector and the second connector respectively include any one of the following: a radio frequency coaxial connector, a D-type connector, and a flat cable connector.

[0007] According to some embodiments of the present utility model, the distance between adjacent test points in the horizontal direction and the distance between adjacent test points in the vertical direction among the plurality of test points are equal.

[0008] According to some embodiments of the present utility model, the test tool further includes: a plurality of radio frequency lines, which are respectively electrically connected between the plurality of first connectors and the plurality of second connectors, and the plurality of radio frequency lines are adapted to lead out the signals of the plurality of first connectors to the plurality of second connectors respectively.

[0009] According to some embodiments of the present utility model, the test tool further includes: a first base, which is disposed at the bottom of the second circuit board, and the first base is adapted to be grounded.

[0010] According to some embodiments of the present utility model, a groove is formed at the bottom of the first base. The first base includes: a fixing seat, which is fixed in the groove to limit the position of the test tool during the process of moving the plurality of radio frequency lines.

[0011] According to some embodiments of another aspect of the present utility model, an integrated circuit for measuring the resistance of a quantum chip includes: a packaging device of the quantum chip, which is electrically connected to the quantum chip to be measured; and the test tool for measuring the resistance of the quantum chip, which is electrically connected to the packaging device of the quantum chip.

[0012] According to some embodiments of the present utility model, the packaging device of the above quantum chip includes: a second base, on which the quantum chip to be measured is assembled; a first circuit board, assembled on the second base, and the first circuit board is arranged around the quantum chip to be measured, and a plurality of second electrical contacts are arranged on the first circuit board, so that a plurality of qubits of the quantum chip to be measured are respectively electrically connected to the plurality of second electrical contacts through leads; and a plurality of first connectors, respectively electrically connected to the plurality of second electrical contacts.

[0013] A test tooling and an integrated circuit for measuring the resistance of a quantum chip according to an embodiment of the present utility model. The packaging of the quantum chip to be measured includes a first circuit board and a plurality of first connectors. The first circuit board is arranged around the quantum chip to be measured, and the qubits of the quantum chip to be measured are electrically connected to the first circuit board through leads. The plurality of first connectors are electrically connected to the first circuit board. The test tooling includes a second circuit board, a plurality of second connectors and a plurality of test points. By setting an adjacent first area and a second area on the second circuit board, the first area is provided with a plurality of first electrical contacts, and the plurality of second connectors are arrayedly electrically connected to the first electrical contacts in the first area. The plurality of second connectors are respectively electrically connected to the plurality of first connectors, and the plurality of test points are arrayedly arranged on the second area. The plurality of test points are respectively electrically connected to the central conductors of the plurality of second connectors, so as to facilitate measuring the resistance of the qubits through an external probe. By introducing the test tooling as a medium connected between the packaging of the quantum chip to be measured and the probe station when measuring the resistance of the quantum chip, damage to the central conductors of the first connectors in the packaging of the quantum chip to be measured can be avoided, and the working efficiency of measuring the resistance of the quantum chip is improved. Description of the Drawings

[0014] Through the following description of the embodiments of the present utility model with reference to the drawings, the above and other objects, features and advantages of the present utility model will become clearer. In the drawings:

[0015] Figure 1 is a cross-sectional view of measuring the resistance of a quantum chip in the prior art;

[0016] Figure 2 is a cross-sectional view of a test tooling for measuring the resistance of a quantum chip according to a schematic embodiment of the present utility model;

[0017] Figure 3 is a cross-sectional view of measuring the resistance of a quantum chip to be measured by using the test tooling according to a schematic embodiment of the present utility model;

[0018] Figure 4 is a top view of a test tooling for measuring the resistance of a quantum chip according to a schematic embodiment of the present utility model;

[0019] Figure 5 It is a cross-sectional view of a test tool for measuring the resistance of a quantum chip according to another schematic embodiment of the present invention;

[0020] Figure 6 It is a bottom view of the fixing seat fixed in the groove of the first base according to a schematic embodiment of the present invention.

[0021] In the said drawings, the meanings of the reference numerals are specifically as follows:

[0022] 100, printed circuit board;

[0023] 200, metal base;

[0024] 300, radio frequency coaxial connector;

[0025] 1, quantum chip;

[0026] 2, first circuit board;

[0027] 3, second base;

[0028] 4, first connector;

[0029] 5, lead wire;

[0030] 6, second circuit board;

[0031] 61, first area;

[0032] 62, second area;

[0033] 7, second connector;

[0034] 71, center conductor;

[0035] 8, test point;

[0036] 9, probe;

[0037] 10, radio frequency wire;

[0038] 11, first base;

[0039] 12, fixing seat. Detailed implementation manners

[0040] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present invention. In the following detailed description, for the sake of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present invention. However, obviously, one or more embodiments can also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily obscuring the concepts of the present invention.

[0041] The terms used herein are for describing specific embodiments only and are not intended to limit the present utility model. The terms "comprising", "including" and the like used herein indicate the presence of the described features, steps, operations and / or components, but do not preclude the presence or addition of one or more other features, steps, operations or components.

[0042] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification, and should not be interpreted in an idealized or overly rigid manner.

[0043] In the case of using expressions such as "at least one of A, B, and C, etc.", generally, it should be interpreted according to the meaning commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include, but is not limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.). In the case of using expressions such as "at least one of A, B, or C, etc.", generally, it should be interpreted according to the meaning commonly understood by those skilled in the art (for example, "a system having at least one of A, B, or C" should include, but is not limited to, a system having only A, only B, only C, having A and B, having A and C, having B and C, and / or having A, B, and C, etc.).

[0044] Figure 1 is a cross-sectional view of measuring the resistance of a quantum chip in the prior art.

[0045] In the packaging of the quantum chip, the quantum chip 1 and the printed circuit board 100 are connected by means of bonding leads 5. Both the quantum chip 1 and the printed circuit board 100 are assembled on the metal base 200. The printed circuit board 100 is located on the periphery of the quantum chip 1. Hundreds of radio frequency coaxial connectors 300 are all soldered on the printed circuit board 100. Currently, as Figure 1As shown, when measuring the resistance of qubits in the quantum chip 1, one probe 9 at one end of the probe station contacts the central conductor of the RF coaxial connector 300, and the other probe at the other end of the probe station is grounded. The diameter of the central conductor of the RF coaxial connector 300 is only 0.8 mm, and the top of the contact point where the probe 9 at one end contacts the central conductor of the RF coaxial connector 300 is conical, resulting in a very small contact area. This often causes the resistance value not to be displayed due to poor contact when measuring the resistance of the qubit 1. At the same time, due to poor contact, the number of operations of the probe 9 touching the central conductor will increase. Improper operation may also cause the central conductor to deform, bend or even break. After the central conductor is damaged, the entire RF coaxial connector 300 to which the central conductor belongs needs to be replaced. When removing a certain RF coaxial connector 300, it is necessary to remove the fixing parts used to fix the position of this group of RF coaxial connectors. Subsequently, the operation of replacing the RF coaxial connector 300 with a damaged central conductor is carried out when the soldering station is in a high-temperature state. At this time, this group of RF coaxial connectors 300 are all in an unfixed state. Do not touch other surrounding RF coaxial connectors 300 during replacement, otherwise the displaced RF coaxial connectors 300 need to be removed and re-soldered. At the same time, replacing a certain RF coaxial connector 300 requires at least two more high-temperature treatments. In this way, hundreds of RF coaxial connectors 300 on the printed circuit board 100 will also undergo two more high-temperature treatments. Multiple high-temperature treatments are very likely to cause some of the hundreds of RF coaxial connectors 300 to randomly have functional problems, resulting in a serious impact on the work progress. And among the hundreds of RF coaxial connectors 300 soldered on the printed circuit board 100, some of the RF coaxial connectors 300 are arranged horizontally, and some of the RF coaxial connectors 300 are arranged vertically. When measuring the resistance of the qubit 1, the direction of the probe station needs to be adjusted frequently. Since the number of RF coaxial connectors 300 to be measured is large and will continue to increase in the later stage, this measurement method takes a long time.

[0046] In order to solve the problem of damage to the central conductor of the first connector within the package of the quantum chip to be measured during the process of measuring the resistance of the quantum chip, according to the concept of one aspect of the present invention, the package of the quantum chip to be measured includes a first circuit board and a plurality of first connectors. The first circuit board is arranged around the quantum chip to be measured, and the qubits of the quantum chip to be measured are electrically connected to the first circuit board through leads. The plurality of first connectors are electrically connected to the first circuit board. The test tooling includes a second circuit board, a plurality of second connectors, and a plurality of test points. By providing adjacent first and second regions on the second circuit board, the first region is provided with a plurality of first electrical contacts, the plurality of second connectors are arrayed and electrically connected to the first electrical contacts in the first region, the plurality of second connectors are respectively electrically connected to the plurality of first connectors, and the plurality of test points are arrayed on the second region, and the plurality of test points are respectively electrically connected to the central conductors of the plurality of second connectors, so as to facilitate measuring the resistance of the qubits through an external probe. By introducing the test tooling as a medium connected between the package of the quantum chip to be measured and the probe station when measuring the resistance of the quantum chip, damage to the central conductor of the first connector within the package of the quantum chip to be measured can be avoided, and the working efficiency of measuring the resistance of the quantum chip is improved.

[0047] In order to make the objectives, technical solutions, and advantages of the present invention clearer and more understandable, the following further elaborates on the present invention in detail with reference to specific embodiments and the accompanying drawings.

[0048] Figure 2 is a cross-sectional view of a test tooling for measuring the resistance of a quantum chip 1 according to a schematic embodiment of the present invention, Figure 3 is a cross-sectional view of using the test tooling to measure the resistance of a quantum chip 1 to be measured according to a schematic embodiment of the present invention.

[0049] According to an embodiment of the present invention, as Figure 2 and Figure 3As shown, a test tooling for measuring the resistance of a quantum chip 1 is provided. The package of the quantum chip to be measured includes a first circuit board 2 and a plurality of first connectors 4. The first circuit board 2 is disposed around the quantum chip 1 to be measured. The qubits of the quantum chip 1 to be measured are electrically connected to the first circuit board 2 through leads 5. A plurality of first connectors 4 are electrically connected to the first circuit board 2. The test tooling includes a second circuit board 6, a plurality of second connectors 7, and a plurality of test points 8. The second circuit board 6 includes a first region 61 and a second region 62 disposed adjacent to each other. The first region 61 is provided with a plurality of first electrical contacts. A plurality of second connectors 7 are arrayed and electrically connected to the first electrical contacts of the first region 61. The plurality of second connectors 7 are respectively electrically connected to the plurality of first connectors 4. A plurality of test points 8 are arrayed on the second region 62. The plurality of test points 8 are respectively electrically connected to the center conductors 71 of the plurality of second connectors 7, so as to facilitate measuring the resistance of the qubits through an external probe 9.

[0050] According to an embodiment of the present invention, the first circuit board 2 and the second circuit board 6 may be printed circuit boards.

[0051] According to an embodiment of the present invention, the number of the second connectors 7 is the same as the number of the first connectors 4.

[0052] According to an embodiment of the present invention, the first connectors 4 and the second connectors 7 mainly include center conductors and metal housings. The center conductors and metal housings of each first connector 4 are welded to the first circuit board 2. The metal housings of the first connectors 4, the first circuit board 2, and the quantum chip 1 to be measured are in a common ground state. The center conductors of the plurality of first connectors 4 are respectively electrically connected to a plurality of second electrical contacts (the second electrical contacts will be described in detail below) on the first circuit board 2. The plurality of second electrical contacts on the first circuit board 2 are respectively electrically connected to the plurality of qubits of the quantum chip 1 to be measured through leads 5.

[0053] According to an embodiment of the present invention, the plurality of second connectors 7 are respectively electrically connected to the plurality of first connectors 4, and the plurality of test points 8 are respectively electrically connected to the center conductors 71 of the plurality of second connectors 7, that is, each test point 8 corresponds to each qubit of the quantum chip 1 to be measured. One end probe of the probe station contacts the test point, and the other end probe of the probe station is grounded to measure the resistance of each qubit.

[0054] According to an embodiment of the present invention, the package of the quantum chip to be measured includes a first circuit board 2 and a plurality of first connectors 4. The first circuit board 2 is disposed around the quantum chip 1 to be measured. The qubits of the quantum chip 1 to be measured are electrically connected to the first circuit board 2 through leads 5. A plurality of first connectors 4 are electrically connected to the first circuit board 2. The test tooling includes a second circuit board 6, a plurality of second connectors 7, and a plurality of test points 8. By providing an adjacent first region 61 and a second region 62 on the second circuit board 6, the first region 61 is provided with a plurality of first electrical contacts. A plurality of second connectors 7 are array - electrically connected to the first electrical contacts of the first region 61. The plurality of second connectors 7 are respectively electrically connected to the plurality of first connectors 4. The plurality of test points 8 are array - arranged on the second region 62. The plurality of test points 8 are respectively electrically connected to the center conductors 71 of the plurality of second connectors 7, so as to facilitate measuring the resistance of the qubits through an external probe 9. By introducing the test tooling as a medium connected between the package of the quantum chip 1 to be measured and the probe station when measuring the resistance of the quantum chip, damage to the center conductors of the first connectors 4 in the package of the quantum chip to be measured can be avoided, and the working efficiency of measuring the resistance of the quantum chip 1 is improved.

[0055] According to an embodiment of the present invention, the first connector 4 and the second connector 7 each include any one of the following: a radio - frequency coaxial connector, a D - type connector, and a flat - cable connector.

[0056] Figure 4 is a top view of a test tooling for measuring the resistance of a quantum chip 1 according to a schematic embodiment of the present invention.

[0057] According to an embodiment of the present invention, as Figure 4 shown, the distance between adjacent test points 8 in the lateral direction among the plurality of test points 8 and the distance between adjacent test points 8 in the longitudinal direction are equal.

[0058] According to an embodiment of the present invention, the plurality of test points 8 are regularly arranged, so that two probes of the probe station can be set with a fixed distance, and at the same time, the distances of the two probes moving in the lateral direction and in the longitudinal direction when moving together can be set. During the process of measuring the resistance of the quantum chip 1, the measurement can be completed without frequently adjusting the distance between the probes 9, reducing the time for measuring the resistance of the quantum chip 1.

[0059] According to an embodiment of the present invention, the test tooling further includes a plurality of radio - frequency lines 10. The plurality of radio - frequency lines 10 are respectively electrically connected between the plurality of first connectors 4 and the plurality of second connectors 7. The plurality of radio - frequency lines 10 are adapted to lead out the signals of the plurality of first connectors 4 to the plurality of second connectors 7 respectively.

[0060] According to an embodiment of the present utility model, both ends of a predetermined number of radio frequency lines 10 are designed as fixed modules. The predetermined number can be 12 or 24, so as to connect the radio frequency lines 10 between the package of the quantum chip to be measured and the test fixture. Taking the predetermined number of radio frequency lines 10 as a group, only need to connect the fixed module at one end of the predetermined number of radio frequency lines 10 to a predetermined number of first connectors 4, and connect the fixed module at the other end to a predetermined number of second connectors 7, then the connection of multiple radio frequency lines 10 between multiple first connectors 4 and multiple second connectors 7 can be completed.

[0061] In a schematic embodiment, multiple second connectors 7 can be divided into groups of 24 as a module. Each group of modules can be arranged in the form of 12 in a row and two rows in a group. The distance between modules in the horizontal direction is the same as the distance between modules in the vertical direction, showing a regular arrangement.

[0062] According to an embodiment of the present utility model, the test fixture further includes a first base 11. The first base 11 is disposed at the bottom of the second circuit board 6, and the first base 11 is suitable for grounding.

[0063] According to an embodiment of the present utility model, the material of the first base 11 can be selected as metal.

[0064] Figure 5 is a cross-sectional view of a test fixture for measuring the resistance of the quantum chip 1 according to another schematic embodiment of the present utility model. Figure 6 is a bottom view of the fixing seat 12 fixed in the groove of the first base 11 according to a schematic embodiment of the present utility model.

[0065] According to an embodiment of the present utility model, as Figure 5 and Figure 6 shown, a groove is opened at the bottom of the first base 11. The first base 11 includes a fixing seat 12, and the fixing seat 12 is fixed in the groove to limit the position of the test fixture during the movement of multiple radio frequency lines 10.

[0066] According to an embodiment of the present utility model, the volume of the groove is larger than the volume of the fixing seat 12, so that the fixing seat 12 can be completely embedded in the groove of the first base 11, preventing the problem that the test fixture is unstable on the probe table due to the external force when connecting multiple radio frequency lines 10.

[0067] According to another aspect of the embodiment of the present utility model, as Figure 3As shown, an integrated circuit for measuring the resistance of a quantum chip 1 is provided. The integrated circuit includes a packaging device for the quantum chip and a test tooling for measuring the resistance of the quantum chip. The packaging device of the quantum chip is electrically connected to the quantum chip 1 to be measured. The test tooling for measuring the resistance of the quantum chip is electrically connected to the packaging device of the quantum chip.

[0068] According to an embodiment of the present invention, as Figure 3 shown, the packaging device of the quantum chip includes a second base 3, a first circuit board 2, and a plurality of first connectors 4. The quantum chip 1 to be measured is assembled on the second base 3. The first circuit board 2 is assembled on the second base 3, and the first circuit board 2 is disposed around the quantum chip 1 to be measured. A plurality of second electrical contacts are provided on the first circuit board 2 so that a plurality of qubits of the quantum chip 1 to be measured are respectively electrically connected to the plurality of second electrical contacts through leads 5. The plurality of first connectors 4 are respectively electrically connected to the plurality of second electrical contacts.

[0069] According to an embodiment of the present invention, the material of the second base 3 can be selected as metal.

[0070] According to an embodiment of the present invention, the lead 5 can be selected as a metal wire, such as an aluminum wire or a gold wire with a diameter of 25 μm. The lead 5 can also be selected as a metal strip, such as an aluminum strip or a gold strip with a cross-section of 3 μm × 0.5 μm.

[0071] It should also be noted that the directional terms mentioned in the embodiments, such as "up", "down", "front", "rear", "left", "right", etc., are only references to the directions in the drawings and are not used to limit the protection scope of the present invention. Throughout the drawings, the same elements are represented by the same or similar reference numerals. When it may cause confusion in the understanding of the present invention, conventional structures or configurations will be omitted, and the shapes and sizes of the components in the drawings do not reflect the true sizes and proportions, but only illustrate the content of the embodiments of the present invention.

[0072] Unless otherwise known to the contrary, the numerical parameters in this specification and the appended claims are approximate values and can be changed according to the required characteristics obtained through the content of the present invention. Specifically, all the numbers representing the contents of the components, reaction conditions, etc. used in the specification and the claims should be understood to be modified by the term "about" in all cases. Generally, the meaning expressed is that it includes a change of ±10% in some embodiments, a change of ±5% in some embodiments, a change of ±1% in some embodiments, and a change of ±0.5% in some embodiments for a specific quantity.

[0073] The ordinal terms used in the description and claims, such as "first", "second", "third", etc., are used to modify the corresponding elements. They do not themselves imply any ordinal number for the elements, nor do they represent the order of one element relative to another or the order in the manufacturing method. The use of these ordinal terms is only to clearly distinguish an element with a certain name from another element with the same name.

[0074] In addition, unless specifically described or steps that must occur in sequence, the order of the above steps is not limited to those listed above and can be varied or rearranged according to the required design. And based on considerations of design and reliability, the above embodiments can be used in combination with each other or in combination with other embodiments, that is, the technical features in different embodiments can be freely combined to form more embodiments.

[0075] The specific embodiments described above further elaborate on the purpose, technical solutions, and beneficial effects of the present utility model. It should be understood that the above are only specific embodiments of the present utility model and are not used to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A test tool for measuring the resistance of a quantum chip, the package of the quantum chip to be measured includes a first circuit board and a plurality of first connectors. The first circuit board is arranged around the quantum chip to be measured. The qubits of the quantum chip to be measured are electrically connected to the first circuit board through leads. The plurality of first connectors are electrically connected to the first circuit board, and it is characterized in that, The test fixture includes: A second circuit board, which includes a first area and a second area arranged adjacent to each other, and a plurality of first electrical contacts are provided in the first area; A plurality of second connectors, which are electrically connected to the first electrical contacts in the first area in an array manner, and the plurality of second connectors are respectively electrically connected to the plurality of first connectors; and A plurality of test points, which are arranged in an array on the second area, and the plurality of test points are respectively electrically connected to the center conductors of the plurality of second connectors, so as to facilitate measuring the resistance of the qubit through an external probe.

2. The test tooling according to claim 1, wherein The first connector and the second connector each include any one of the following: a radio frequency coaxial connector, a D-type connector, and a flat cable connector.

3. The test tooling according to claim 1, characterized in that, The spacing between adjacent test points in the lateral direction and the spacing between adjacent test points in the longitudinal direction among the plurality of test points are equal.

4. The test tooling according to claim 1, characterized in that, It further includes: A plurality of radio frequency lines, which are respectively electrically connected between the plurality of first connectors and the plurality of second connectors, and the plurality of radio frequency lines are suitable for leading out the signals of the plurality of first connectors to the plurality of second connectors respectively.

5. The test tooling according to any one of claims 1-4, characterized in that, It further includes: A first base, which is provided at the bottom of the second circuit board, and the first base is suitable for grounding.

6. The test tooling according to claim 5, characterized in that A groove is formed at the bottom of the first base, and the first base includes: A fixing seat, which is fixed in the groove to limit the position of the test fixture during the process of moving the plurality of radio frequency lines.

7. An integrated circuit for measuring the resistance of a quantum chip, characterized in that, It includes: A packaging device for a quantum chip, which is electrically connected to the quantum chip to be measured; A test fixture for measuring the resistance of a quantum chip according to any one of claims 1-6, which is electrically connected to the packaging device of the quantum chip.

8. The integrated circuit according to claim 7, wherein, The packaging device of the quantum chip includes: A second base, on which the quantum chip to be measured is assembled; A first circuit board, which is assembled on the second base, and the first circuit board is arranged around the quantum chip to be measured, and a plurality of second electrical contacts are provided on the first circuit board, so that a plurality of qubits of the quantum chip to be measured are respectively electrically connected to the plurality of second electrical contacts through leads; and A plurality of first connectors, which are respectively electrically connected to the plurality of second electrical contacts.

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