Test fixture
The dual-sided testing fixture addresses the inefficiency of separate chip surface testing by aligning and connecting both chip surfaces for simultaneous electrical verification, enhancing testing efficiency and connection integrity.
Patent Information
- Application Number
- CN202421452418.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-24
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-06-24
AI Technical Summary
The prior art cannot meet the demand for simultaneous testing of semiconductor chips on and below, resulting in insufficiency of detection.
A test fixture is designed, including a first test mechanism and a second test mechanism. Through the cooperation of the screw joint and the rotary member, the second signal substrate is moved in a vertical direction, so as to realize simultaneous conduction testing of the upper and lower electrical connection ends of the product to be tested.
It realizes simultaneous conduction detection of test points on both upper and lower sides of the semiconductor chip, improves detection efficiency, avoids damage to the electrical connection, and is easy to operate.
Smart Images

Figure CN223107975U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor chip detection. More specifically, it relates to a test fixture. Background Art
[0002] A semiconductor chip is a basic component used in integrated circuits, also known as an integrated circuit chip or a chip. It is a thin slice made of semiconductor materials (such as silicon), on which multiple electronic devices (such as transistors, capacitors, and resistors) and circuit connection lines are integrated. The main function of a semiconductor chip is to connect electronic devices and circuits together to realize various functions of electronic devices. It can store and process information, control the operation of electronic devices, and realize various functions such as calculation, communication, display, and storage.
[0003] In order to determine whether a semiconductor chip is a qualified product and can be used normally, it needs to be powered on for detection. However, in the prior art, usually single-sided crimping conduction tests are carried out separately. For semiconductor chips that require double-sided tests, the prior art cannot meet the requirement of simultaneously testing the upper and lower surfaces of the chip. Summary of the Utility Model
[0004] In view of the above problems, the utility model provides a test fixture that can meet the requirement of simultaneously conducting conduction tests on the upper and lower test points of a chip through one-time crimping without damaging the electrical connectors.
[0005] To achieve the above object, the utility model adopts the following technical solutions:
[0006] The utility model provides a test fixture, including:
[0007] A first test mechanism for carrying and fixing the product to be tested; and
[0008] A second test mechanism for corresponding cooperation with the first test mechanism;
[0009] The first test mechanism includes a first signal substrate, and a first electrical connector and a second electrical connector arranged on the first signal substrate; the first electrical connector is used for contacting and conducting with the first electrical connection end of the product to be tested;
[0010] The second test mechanism includes a second signal substrate that can move in the vertical direction, a third electrical connector arranged on the second signal substrate, and a driving component for driving the movement of the second signal substrate;
[0011] The driving assembly includes a screw connection and a rotating member fixedly connected to the screw connection; the screw connection is configured to push the second signal substrate downward by rotating the rotating member so that the third electrical connector is crimped and connected to the second electrical connection end of the product to be tested and the second signal substrate is crimped and connected to the second electrical connector.
[0012] Preferably, the first testing mechanism further comprises a base and a carrying plate fixed on the base for carrying the product to be tested;
[0013] The first electrical connector and the second electrical connector are both arranged on the base and penetrate the base in the vertical direction; the end of the first electrical connector facing away from the product to be tested is in a normally connected state with the first signal substrate, and the end facing the product to be tested is used to contact and connect with the first electrical connection end of the product to be tested; the end of the second electrical connector facing the first signal substrate is in a normally connected state with the first signal substrate, and the end facing away from the first signal substrate is used to contact and connect with the second signal substrate.
[0014] A preferred solution is that the first signal substrate is fixed below the base, and a fixing plate for fixing the first electrical connector and the second electrical connector to the base is included between the base and the first signal substrate;
[0015] The carrier plate comprises a cavity for accommodating and positioning the product to be tested; an opening for inserting the end of the first electrical connector is formed on the bottom wall of the cavity.
[0016] A preferred solution is that the second test mechanism further comprises a main body for fixing with the first test mechanism, and the second signal substrate can be configured on the main body in an up-and-down floating manner; the end of the third electrical connector facing away from the product to be tested is in a normally connected state with the second signal substrate, and the end facing the product to be tested is used for contacting and connecting with the second electrical connection end of the product to be tested;
[0017] The main body includes an installation cavity; a threaded ring is arranged in the installation cavity; the screw connection member is screwed to the main body through the threaded ring; by rotating the rotating member, the screw connection member can push the second signal substrate downward so that the third electrical connector is crimped to the product to be tested on the first testing mechanism.
[0018] A preferred solution is that the second testing mechanism further comprises a limiting member fixedly coupled to the main body, the rotating member comprises an arc-shaped limiting groove formed on the bottom surface of the rotating member; and the limiting member is arranged on the arc-shaped limiting groove.
[0019] Preferably, the second signal substrate includes a backplane, a PCB board, a first assembly board, and a second assembly board arranged in sequence; the backplane is used to abut against the screwing member; the third electrical connector penetrates through the first assembly board and the second assembly board and is connected and conducted to the PCB board through the first assembly board and the second assembly board; mating test points corresponding to the second electrical connector are formed on the PCB board.
[0020] Preferably, the screwing member is correspondingly mated with the backplane; the backplane is connected to the main body through a shoulder screw; a spring is sleeved on the shoulder screw; one end of the spring abuts against the backplane, and the other end abuts against the head of the shoulder screw.
[0021] Preferably, in the horizontal plane, all the third electrical connectors form an intermediate area on the second assembly board, and the mating test points on the PCB board are located on two opposite sides of the intermediate area.
[0022] Preferably, the test fixture further includes a clamping assembly; the clamping assembly includes a clamping member hinged to the main body and a clamping groove formed on the first test mechanism; the clamping member includes a clamping hook portion for clamping and mating with the clamping groove.
[0023] Preferably, the test fixture further includes a guiding hole provided on the first test mechanism and a guiding post provided on the second test mechanism; the first test mechanism and the second test mechanism are assembled in alignment by inserting the guiding post into the guiding hole.
[0024] The beneficial effects of the present utility model are as follows:
[0025] With the cooperation of the first test mechanism and the second test mechanism, the present utility model fixes the product to be tested between the two, and uses the first electrical connector to electrically connect and conduct the first electrical connection end of the first signal substrate and the product to be tested. Then, by rotating the rotating member to drive the screwing member to push the second signal substrate to move vertically downward, the third electrical connector is pressed and conducted with the second electrical connection end of the product to be tested, and the second signal substrate is pressed and conducted with the second electrical connector to realize the electrical connection and conduction of the second electrical connection end of the first signal substrate and the product to be tested. Thus, the electrical connection and conduction detection of multiple test points on the product to be tested are realized at one time, meeting the requirement of simultaneously conducting a conduction test on the test points on the upper and lower surfaces of the chip through one-time press connection and conduction, saving the detection time, greatly improving the detection efficiency, and being convenient to operate without damaging the electrical connectors. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] The following further elaborates in detail the specific embodiments of the present utility model with reference to the accompanying drawings.
[0027] Figure 1 It is an assembly schematic diagram of the first test mechanism of the present utility model.
[0028] Figure 2It is a top view of the first testing mechanism of the present utility model.
[0029] Figure 3 It is an assembly schematic diagram of the second testing mechanism of the present utility model.
[0030] Figure 4 It is a front view of the second testing mechanism of the present utility model.
[0031] Figure 5 It is a bottom view of the second testing mechanism of the present utility model.
[0032] Description of the drawings: 11. First signal substrate, 12. First electrical connector, 13. Second electrical connector, 14. Base, 15. Carrier plate, 151. Cavity, 16. Fixed plate, 17. Card slot, 18. Guide hole, 19. First convex structure, 211. Back plate, 212. PCB board, 213. First assembly plate, 214. Second assembly plate, 215. Second convex structure, 216. Intermediate area, 217. Matching test point, 22. Third electrical connector, 23. Screwing part, 24. Rotating part, 241. Connecting screw, 25. Main body, 26. Limiting part, 261. Arc-shaped limiting groove, 271. Shoulder screw, 272. Spring, 273. Rotating shaft, 274. Elastic part, 28. Clamping part, 29. Guide post, 30. Chip. Detailed implementation manners
[0033] Now, various exemplary embodiments of the present utility model will be described in detail with reference to the drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and values set forth in these embodiments do not limit the scope of the present utility model.
[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way serves as a limitation to the present utility model or its application or use.
[0035] Technologies and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies and devices should be regarded as part of the specification.
[0036] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.
[0037] It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
[0038] To solve the problem that the existing technology cannot meet the requirement of simultaneously testing the upper and lower surfaces of a chip. The present utility model provides a testing fixture, which is mainly used to electrically conductively connect the electrical connection ends on the upper and lower surfaces of the chip under test with a testing device, so as to test various performance parameters of the chip under test and confirm whether there are any defects in the chip under test. In combination with Figures 1 to 5 As shown, specifically, the testing fixture includes: a first testing mechanism for carrying and fixing the product to be tested and a second testing mechanism for corresponding cooperation with the first testing mechanism; by aligning and pressing down the second testing mechanism with the first testing mechanism, the product to be tested is fixed between the two and the test is conducted. More specifically, the first testing mechanism includes a first signal substrate 11 and a first electrical connector 12 and a second electrical connector 13 arranged on the first signal substrate 11; the first electrical connector 12 is used to contact and conduct with the first electrical connection end of the product to be tested on the first testing mechanism, and the second electrical connector 13 is used to correspond and cooperate with the second signal substrate; the second testing mechanism includes a second signal substrate that can move in the vertical direction, a third electrical connector 22 arranged on the second signal substrate, and a driving component for driving the movement of the second signal substrate. The third electrical connector 22 is used to correspond and cooperate with the second electrical connection end of the product to be tested; the driving component includes a screw member 23 corresponding to the second signal substrate and a rotating member 24 fixedly combined with the screw member 23. The rotating member 24 can be fixed to the screw member 23 through a connecting screw 241; the screw member 23 is configured to push the second signal substrate downward by rotating the rotating member 24, so that the third electrical connector 22 is pressed and conducted with the second electrical connection end of the product to be tested and the second signal substrate is pressed and conducted with the second electrical connector 13. At this time, the first electrical connection end of the product to be tested is electrically conducted with the first signal substrate 11, the second electrical connection end of the product to be tested is electrically conducted with the second signal substrate, and the second signal substrate is also electrically conducted with the first signal substrate 11, thus realizing that the first electrical connection end and the second electrical connection end of the product to be tested are simultaneously conducted with the first signal substrate 11. It should be noted that the first signal substrate 11 is electrically connected to the testing device for transmitting test signals. This testing fixture is applied to the detection of semiconductor chips. It mainly realizes the simultaneous testing of the test points on the upper and lower surfaces of the chip and accurate alignment by designing the corresponding first testing mechanism and second testing mechanism. Specifically, the test points on the upper and lower surfaces of the chip can be simultaneously connected and conducted with the testing device for corresponding tests by manually screwing. In this embodiment, the product to be tested is the chip 30, the first electrical connection end of the product to be tested is the test point formed on the bottom surface of the chip 30, and the second electrical connection end of the product to be tested is the test point formed on the top surface of the chip 30.
[0039] It can be understood that since the second signal substrate moves downward vertically under the drive of the screw member 23 until it is in press contact and conduction with the tops of all the second electrical connectors 13, compared with the method of achieving press contact and conduction by flipping and pressing down, in this application, the situation where the signal substrate contacts the electrical connectors one after another, resulting in overvoltage damage to the electrical connectors that are contacted first, will not occur. In this application, the method of manually screwing and pressing down vertically can well protect the electrical connectors and the signal substrate from being damaged and is convenient to operate.
[0040] In a specific embodiment, the first test mechanism further includes a base 14 and a carrier plate 15 fixed on the base 14 for carrying the product to be tested. A groove is formed on the base 14, and the carrier plate 15 is assembled and fixed in the groove. For different types and quantities of chips, adaptation can be achieved by replacing the corresponding carrier plate; the first electrical connector 12 and the second electrical connector 13 are both arranged on the base 14 and both penetrate the base 14 in the vertical direction. Holes for the first electrical connector 12 and the second electrical connector 13 to penetrate are formed on the base 14; one end of the first electrical connector 12 facing away from the product to be tested is in a normally connected state with the first signal substrate 11, and the end facing the product to be tested is used to contact and connect with the first electrical connection end of the product to be tested; one end of the second electrical connector 13 facing the first signal substrate 11 is in a normally connected state with the first signal substrate 11, and the end facing away from the first signal substrate 11 is used to contact and connect with the second signal substrate; more specifically, the bottom ends of the first electrical connector 12 and the second electrical connector 13 are both in a normally connected state with the first signal substrate 11, the top ends of the first electrical connector 12 and the second connector 13 are both to-be-contact ends, the top end of the first electrical connector 12 is used to contact and connect with the test points on the bottom surface of the chip 30, and the top end of the second electrical connector 13 is used to contact and connect with the mating test points 217 on the second signal substrate; similarly, one end of the third electrical connector 22 facing away from the product to be tested is in a normally connected state with the second signal substrate, and the end facing the product to be tested is used to contact and connect with the second electrical connection end of the product to be tested. Specifically, the top end of the third electrical connector 22 is in a normally connected state with the second signal substrate, and the bottom end of the third electrical connector 22 is a to-be-contact end for contacting and connecting with the test points formed on the top surface of the chip 30; it should be noted that the first electrical connector 12, the second electrical connector 13, and the third electrical connector 22 are all double-headed probes. In a specific application scenario, the third electrical connector 22 is used to contact and connect with the chip housing, and the first electrical connector 12 is used to contact and connect with the chip GND for measuring the chip GND pin information. The second electrical connector 13 is used to import the chip housing information measured by the third electrical connector 22 into the first signal substrate 11, and the first signal substrate 11 guides the above two pieces of information to the tester to realize the measurement of the resistance value between the chip housing and the GND pin.
[0041] Further, the first signal substrate 11 is fixed below the base 14. Between the base 14 and the first signal substrate 11, there is a fixing plate 15 for fixing the first electrical connector 12 and the second electrical connector 13 to the base 14. Through the fixing plate 16, the bottom ends of the first electrical connector 12 and the second electrical connector 13 can be stably in contact and conduction with the test points on the first signal substrate 11. The carrier plate 15 includes a cavity 151 for accommodating and positioning the product to be tested. An opening for inserting the top end of the first electrical connector 12 is formed on the bottom wall of the cavity 151. Through this opening, the top end of the first electrical connector 12 can be in contact and conduction with the test points on the bottom surface of the chip 30.
[0042] In addition, a first convex structure 19 is further formed on the top surface of the base 14. The top end of the second electrical connector 13 protrudes from the top surface of the first convex structure 19, which can protect the upper end part of the second electrical connector 13 and prevent damage during contact and cooperation. The base 14 of the above first testing mechanism can be connected to the carrier plate 15, the fixing plate 16, and the first signal substrate 11 through positioning pins and bolts.
[0043] In a specific embodiment, the second testing mechanism further includes a main body 25 for fixing to the first testing mechanism. The second signal substrate is configured on the main body 25 to be floating up and down. The two ends of the third electrical connector 22 are respectively used for being in contact and conduction with the second signal substrate and the second electrical connection end of the product to be tested. The main body 25 includes an installation through cavity. A threaded ring is arranged in the installation through cavity. The screw member 23 is screwed to the main body 25 through the threaded ring. By rotating the rotating member 24, the screw member 23 can push the second signal substrate downward so that the third electrical connector 22 is pressed on the product to be tested on the first testing mechanism while the second signal substrate is in contact with the second electrical connector 13, or the second signal substrate can be lifted upward so that the third electrical connector 22 is separated from the product to be tested while the second signal substrate is no longer in contact with the second electrical connector 13.
[0044] Further, the second testing mechanism further includes a limiting member 26 fixedly combined on the main body 25. The rotating member 24 includes an arc-shaped limiting groove 261 formed on the bottom surface of the rotating member 24. The upper end part of the limiting member 26 is arranged on the arc-shaped limiting groove 261. The rotation angle of the rotating member 24 and the screw member 23 is limited through the cooperation between the end part of the arc-shaped limiting groove 261 and the limiting member 26, ensuring that the electrical connectors and the product to be tested will not be damaged due to excessive rotation of the rotating member 24.
[0045] Regarding the specific structure of the second signal substrate, in one embodiment, the second signal substrate includes a back plate 211, a PCB board 212, a first assembly board 213 and a second assembly board 214 arranged in sequence from top to bottom; the back plate 211 is used to abut against the screw connection 23; the third electrical connector 22 penetrates the first assembly board 213 and the second assembly board 214 and is connected to the PCB board 212 through the first assembly board 213 and the second assembly board 214, and a second protruding structure 215 is formed on the bottom surface of the second assembly board 214, and the bottom end of the third electrical connector 22 is formed by the second protruding structure 215. The protruding bottom surface can protect the lower end of the third electrical connector 22 to avoid damage during contact and mating; the PCB board 212 is formed with a mating test point 217 for correspondingly mating with the second electrical connector 13, and the top end of the second electrical connector 13 can be in contact and conduct with the mating test point 217 on the PCB board 212, and the bottom end can be in contact and conduct with the test point on the first signal substrate 11 to achieve electrical conduction between the first signal substrate 11 and the second signal substrate; the back plate 211, PCB board 212, first assembly plate 213 and second assembly plate 214 can be connected by positioning pins and bolts.
[0046] Furthermore, the screw connector 23 corresponds to the back plate 211, and during the rotation of the screw connector 23, it will abut against the back plate 211; the back plate 211 is connected to the main body 25 through a shoulder screw 271; a spring 272 is sleeved on the shoulder screw 271; one end of the spring 272 abuts against the back plate 211, and the other end abuts against the head of the shoulder screw 271. More specifically, when the screw connector 23 rotates and moves downward on the main body 25 to drive the lower end of the third electrical connector 22 to contact the product to be tested, the spring 272 will be compressed; when the screw connector 23 rotates and moves upward, the elastic restoring force of the spring 272 can drive the PCB board 212 and the third electrical connector 22 to move upward and away from the product to be tested.
[0047] In the above embodiment, referring to Figure 2 and Figure 5 As shown, in the horizontal plane, all the third electrical connectors 22 form a middle area 216 on the second assembly board 214, and the middle area 216 corresponds to the position of the carrier board 15. The matching test points 217 on the PCB board 212 are located on two opposite sides of the middle area 216, and the second electrical connectors 13 are correspondingly arranged on two opposite sides of the carrier board 15. Through the above arrangement, the stability of the contact and conduction between the PCB board 212 and the second electrical connector 13 can be further improved.
[0048] In a specific embodiment, the test fixture further includes a clamping component; the clamping component includes a clamping member 28 hinged to the main body 25 and a clamping groove 17 formed on the base 14; the clamping member 28 includes a clamping hook portion for clamping and cooperating with the clamping groove 17, which can ensure the cooperation stability of the test fixture during operation. After the main body 25 and the base 14 are aligned and inserted, the clamping member 28 can be clamped on the clamping groove 17 through the clamping hook portion to ensure the stability during operation. Further, the two clamping members 28 are respectively arranged on two opposite sides of the main body 25. The middle of the clamping member 28 is a hinge portion, the lower side of the hinge portion is a clamping hook portion, and the upper side is a pressing portion for manually pressing and opening the clamping member 28. The hinge portion is rotatably arranged on the main body 25 through a rotating shaft 273, and an elastic member 274 is connected between the pressing portion and the main body 25, which can provide a rotational resetting force for the pressing portion.
[0049] Further, in order to ensure the accuracy of the alignment and cooperation between the first test mechanism and the second test mechanism, the test fixture further includes a guiding hole 18 provided on the base 14 of the first test mechanism and a guiding post 29 provided on the main body 25 of the second test mechanism; the alignment and assembly of the first test mechanism and the second test mechanism can be realized by inserting the guiding post 29 into the guiding hole 18, ensuring the accuracy of the assembly.
[0050] In summary, the utility model fixes the product to be tested between the first test mechanism and the second test mechanism through the cooperation of the first test mechanism and the second test mechanism, and uses the first electrical connector to electrically connect the first signal substrate and the first electrical connection end of the product to be tested. Then, by rotating the rotating member to drive the screwed member to push the second signal substrate to move vertically downward, the third electrical connector is pressed and conducted with the second electrical connection end of the product to be tested, and the second signal substrate is pressed and conducted with the second electrical connector to realize the electrical connection between the first signal substrate and the second electrical connection end of the product to be tested, so as to realize the electrical conduction detection of multiple test points on the product to be tested at one time, meet the requirement of simultaneously conducting the conduction test on the test points on the upper and lower surfaces of the chip through one-time press connection and conduction, save the detection time, greatly improve the detection efficiency, and is convenient to operate and does not damage the electrical connector.
[0051] Obviously, the above embodiments of the present utility model are only examples for clearly illustrating the present utility model, rather than limiting the implementation manners of the present utility model. For those of ordinary skill in the art, other different forms of changes or variations can be made on the basis of the above description. It is impossible to list all the implementation manners here. Any obvious changes or variations derived from the technical solutions of the present utility model still fall within the protection scope of the present utility model.
Claims
1. A test fixture, characterized in that, include: A first testing mechanism for carrying and fixing the product to be tested; as well as A second testing mechanism for correspondingly cooperating with the first testing mechanism; The first test mechanism comprises a first signal substrate and a first electrical connector and a second electrical connector disposed on the first signal substrate; the first electrical connector is used to contact and conduct with a first electrical connection end of the product to be tested; The second testing mechanism comprises a second signal substrate movable in a vertical direction, a third electrical connection member disposed on the second signal substrate, and a driving assembly for driving the second signal substrate to move; The driving assembly includes a screw connection and a rotating member fixedly connected to the screw connection; the screw connection is configured to push the second signal substrate downward by rotating the rotating member so that the third electrical connector is crimped and connected to the second electrical connection end of the product to be tested and the second signal substrate is crimped and connected to the second electrical connector.
2. The test fixture according to claim 1, wherein The first testing mechanism also includes a base and a carrying plate fixed on the base for carrying the product to be tested; The first electrical connector and the second electrical connector are both arranged on the base and penetrate the base in the vertical direction; the end of the first electrical connector facing away from the product to be tested is in a normally connected state with the first signal substrate, and the end facing the product to be tested is used to contact and connect with the first electrical connection end of the product to be tested; the end of the second electrical connector facing the first signal substrate is in a normally connected state with the first signal substrate, and the end facing away from the first signal substrate is used to contact and connect with the second signal substrate.
3. The test fixture according to claim 2, wherein The first signal substrate is fixed below the base, and a fixing plate for fixing the first electrical connector and the second electrical connector to the base is included between the base and the first signal substrate; The carrier plate comprises a cavity for accommodating and positioning the product to be tested; an opening for inserting the end of the first electrical connector is formed on the bottom wall of the cavity.
4. The test fixture according to claim 1, wherein The second test mechanism also includes a main body for fixing with the first test mechanism, and the second signal substrate can be configured on the main body in an up-and-down floating manner; the end of the third electrical connector facing away from the product to be tested is in a normally connected state with the second signal substrate, and the end facing the product to be tested is used for contacting and connecting with the second electrical connection end of the product to be tested; The main body includes an installation cavity; a threaded ring is arranged in the installation cavity; the screw connection member is screwed to the main body through the threaded ring; by rotating the rotating member, the screw connection member can push the second signal substrate downward so that the third electrical connector is crimped to the product to be tested on the first testing mechanism.
5. The test fixture according to claim 4, wherein, The second testing mechanism further comprises a limiting member fixedly coupled to the main body, the rotating member comprises an arc-shaped limiting groove formed on the bottom surface of the rotating member; the limiting member is arranged on the arc-shaped limiting groove.
6. The test fixture according to claim 4, wherein, The second signal substrate includes a back plate, a PCB board, a first assembly board and a second assembly board arranged in sequence; the back plate is used to abut against the screw connection; the third electrical connector penetrates the first assembly board and the second assembly board and is connected to the PCB board through the first assembly board and the second assembly board; a mating test point is formed on the PCB board for corresponding mating with the second electrical connector.
7. The test fixture according to claim 6, wherein The screw connector is correspondingly matched with the back plate; the back plate is connected to the main body by a shoulder screw; a spring is sleeved on the shoulder screw; one end of the spring abuts against the back plate, and the other end abuts against the head of the shoulder screw.
8. The test fixture according to claim 6, wherein, In the horizontal plane, all the third electrical connectors form an intermediate area on the second assembly plate, and the mating test points on the PCB board are located on two opposite sides of the intermediate area.
9. The test fixture according to claim 4, characterized in that, The test fixture further includes a clamping assembly; the clamping assembly includes a clamping member hinged to the main body and a clamping groove formed on the first test mechanism; the clamping member includes a clamping hook portion for clamping and cooperating with the clamping groove.
10. The test fixture according to claim 1, wherein The test fixture further includes a guide hole provided on the first test mechanism and a guide post provided on the second test mechanism; the first test mechanism and the second test mechanism are assembled in alignment by inserting the guide post into the guide hole.