Solid state disk radiator for M.2 interface
The SSD cooler for M.2 interface addresses the inefficiencies of traditional materials by integrating a heat pipe and fin structure with a foldable support, enhancing thermal conductivity and structural integrity, thus ensuring effective heat dissipation and interface protection.
Patent Information
- Application Number
- CN202421699625.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-18
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-07-18
AI Technical Summary
The existing M.2 interface solid-state drive has a large radiator and poor heat dissipation effect. It cannot effectively protect the M.2 interface and is easily damaged.
A radiator including a shell, a heat conductor, a metal bracket and a heat sink fin are designed. The heat sink fin absorbs heat through the heat conductor, and the metal bracket provides support. The heat sink fins exchange heat with the air and are fixed by snaps to ensure air circulation.
It realizes efficient heat dissipation and protects the M.2 interface. It has a simple structure and avoids interface damage caused by excessive weight.
Smart Images
Figure CN223108541U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of computer equipment, in particular to a solid-state drive radiator for an M.2 interface. Background Art
[0002] Computer hardware is updated rapidly, bringing us more efficient work efficiency. Hard disks have developed from traditional mechanical hard disks to the current popular solid-state drives. Over time, solid-state drives have continuously broken through the performance bottleneck. The interface has developed from the SATA3.0 interface to the M.2 interface, and the volume of the hard disk is getting smaller and smaller. The PCI-E protocol has also developed to the current mainstream PCI-E 5.0 and will develop to PCI-E 7.0 within the next three years. However, the transmission rate has increased exponentially, and the heat generation has also become larger. The high temperature of the chip will directly affect the transmission rate and reliability, and even burn out the chip.
[0003] At present, for the heat dissipation method of M.2 SSDs on the market, most of them use radiators made of pure aluminum or pure copper materials attached to the surface of M.2 SSDs, so that the heat of the M.2 SSD hard disk is transferred to the radiator and then dissipated through the radiator. However, this traditional radiator has the following problems: the heat dissipation effect of the profile radiator is poor, the weight is large, and the M.2 interface is very fragile and cannot withstand the excessive weight of the radiator. Summary of the Invention
[0004] In order to overcome the disadvantages and deficiencies existing in the prior art, the purpose of the utility model is to provide a solid-state drive radiator for an M.2 interface, which has a simple structure and good heat dissipation effect.
[0005] The utility model is realized through the following technical solutions:
[0006] A solid-state drive radiator for an M.2 interface includes a housing with an open bottom end, a heat conducting sheet, a metal bracket, and heat dissipation fins sequentially attached from bottom to top. A plurality of diversion holes are opened on the side surface of the housing. The heat conducting sheet, the metal bracket, and the heat dissipation fins are all arranged inside the housing. The lower end surface of the heat conducting sheet is used to fit the SSD; a plurality of first buckles are protrudingly arranged on both sides of the opening of the housing, and the first buckles are used for clamping with the SSD.
[0007] Wherein, support pieces are respectively bent upward at both ends of the metal bracket, and both ends inside the housing respectively abut against the support pieces.
[0008] Wherein, the support piece is provided with a clamping hole, and a second buckle for clamping with the clamping hole is arranged inside the radiator.
[0009] Wherein, the first buckles on both sides are symmetrically arranged with respect to the housing.
[0010] Among them, a plurality of diversion holes are arranged in one-to-one correspondence with the gaps of the heat dissipation fins.
[0011] Among them, the heat dissipation fins are of a folded strip structure.
[0012] Advantages of the present utility model:
[0013] A solid-state drive radiator for an M.2 interface of the present utility model absorbs the heat of the SSD through a heat conduction sheet. While the metal bracket can conduct heat, it can also support the overall structure of the radiator; the heat dissipation fins can exchange heat with the outside air, thereby completing the heat dissipation of the SSD; the outer shell can protect the heat conduction sheet, the metal bracket and the heat dissipation fins, and at the same time, diversion holes are opened to ensure the effective circulation of air. Compared with traditional profile radiators, the structure of the present utility model is simple and has a good heat dissipation effect, effectively protecting the normal use of the M.2 interface. Description of the drawings
[0014] The present utility model is further described with the aid of the drawings, but the embodiments in the drawings do not constitute any limitation to the present utility model. For those of ordinary skill in the art, other drawings can also be obtained according to the following drawings without creative work.
[0015] Figure 1 It is an exploded view of the present utility model.
[0016] Figure 2 It is a cross-sectional view of the present utility model.
[0017] Reference numerals
[0018] Outer shell - 100, heat conduction sheet - 101, heat dissipation fins - 102, diversion holes - 103, first buckle - 104, support sheet - 105, card holes - 106, second buckle - 107, metal bracket - 108, SSD - 109. Specific embodiments
[0019] In order to make the above-mentioned objects, features and advantages of the present utility model more obvious and understandable, the specific embodiments of the present utility model will be described in detail below with reference to the drawings. Many specific details are set forth in the following description in order to fully understand the present utility model. However, the present utility model can be implemented in many other ways different from those described herein. Those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.
[0020] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.
[0021] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0022] Currently, for the heat dissipation method of M.2 SSDs on the market, most of them use radiators made of pure aluminum or pure copper materials attached to the surface of the M.2 SSD, so that the heat of the M.2 SSD hard disk is transmitted to the radiator and then dissipated through the radiator. However, this traditional radiator has the following problems: the heat dissipation effect of the profile radiator is poor, the weight is large, and the M.2 interface is very fragile and cannot withstand the excessive weight of the radiator.
[0023] To solve the above problems, this embodiment discloses a solid-state drive radiator for M.2 interfaces, and its structure is as Figure 1 and Figure 2 shown. The radiator includes a housing 100 with an open lower end, a heat conduction sheet 101, a metal bracket 108, and heat dissipation fins 102 that are sequentially attached from bottom to top. A plurality of diversion holes 103 are provided on the side surface of the housing 100. The heat conduction sheet 101, the metal bracket 108, and the heat dissipation fins 102 are all arranged inside the housing 100. The lower end surface of the heat conduction sheet 101 is used to attach to the SSD 109;
[0024] On both sides of the opening of the housing 100, a number of first buckles 104 are also protrudingly provided. The first buckles 104 are used to be snap-connected with the SSD 109. Preferably, the first buckles 104 on both sides are symmetrically arranged with respect to the housing 100, which can ensure the stable installation of the housing 100 and the SSD 109.
[0025] Specifically, a solid-state drive (SSD) radiator for an M.2 interface in this embodiment absorbs the heat of the SSD 109 through the heat-conducting sheet 101. The metal bracket 108 can conduct heat and also support the overall structure of the radiator. The heat-dissipating fins 102 can exchange heat with the outside air to complete the heat dissipation of the SSD 109. The outer shell 100 can protect the heat-conducting sheet 101, the metal bracket 108, and the heat-dissipating fins 102, and at the same time, diversion holes 103 are provided to ensure the effective flow of air. Compared with traditional profile radiators, the radiator in this embodiment has a simple structure and good heat dissipation effect, effectively protecting the normal use of the M.2 interface.
[0026] Furthermore, support pieces 105 are bent upward at both ends of the metal bracket 108. The two ends inside the outer shell 100 are respectively in contact with the support pieces 105. The contact between the support pieces 105 and the outer shell 100 can improve the stability of the radiator during installation. In addition, the support pieces 105 are provided with card holes 106, and a second buckle 107 for engaging with the card holes 106 is arranged inside the radiator. Through the engagement of the card holes 106 and the second buckle 107, the stable installation of the outer shell 100 and the bracket is realized.
[0027] Referring to Figure 1 , in this embodiment, the heat-dissipating fins 102 are of a folded strip structure. This structure of the heat-dissipating fins 102 can effectively improve the heat exchange efficiency with air. At the same time, a plurality of diversion holes 103 on the outer shell 100 are arranged in one-to-one correspondence with the gaps of the heat-dissipating fins 102, so that the outside air directly contacts the heat-dissipating fins 102 for heat exchange after entering the outer shell 100 through the diversion holes 103, improving the heat dissipation efficiency.
[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the protection scope of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the essence and scope of the technical solutions of the present invention.
Claims
1. A solid-state drive radiator for an M.2 interface, characterized in that, It includes a housing with an open lower end, a heat-conducting sheet, a metal bracket, and heat-dissipating fins that are sequentially and conformally arranged from bottom to top. A plurality of diversion holes are formed on the side surface of the housing. The heat-conducting sheet, the metal bracket, and the heat-dissipating fins are all arranged inside the housing. The lower end surface of the heat-conducting sheet is used to conformally contact the SSD. A number of first buckles are also protrudingly arranged on both sides of the opening of the housing. The first buckles are used for snap connection with the SSD.
2. The solid-state drive cooler for M.2 interface according to claim 1, characterized in that, Supporting pieces are respectively upwardly bent at both ends of the metal bracket. Both ends of the inner side of the housing respectively abut against the supporting pieces.
3. The solid-state drive radiator for M.2 interface according to claim 2, characterized in that, A clamping hole is formed in the supporting piece. A second buckle for snap connection with the clamping hole is arranged on the inner side of the radiator.
4. The solid-state drive radiator for M.2 interface according to claim 3, characterized in that, The first buckles on both sides are symmetrically arranged with respect to the housing.
5. The solid-state drive radiator for M.2 interface according to claim 1, wherein The plurality of diversion holes are arranged in one-to-one correspondence with the gaps of the heat-dissipating fins.
6. The solid-state drive radiator for an M.2 interface according to claim 1, wherein The heat-dissipating fins are of a folded strip structure.