Glue-pouring packaging type SMT (Surface Mount Technology) inductor

Abstract

The utility model discloses a glue-pouring packaging type SMT inductor, which relates to the technical field of SMT inductors and comprises a shell, a cavity with an opening at the lower end is arranged in the shell, and a magnetic core and a winding wound on the magnetic core are arranged in the cavity. A pin is arranged outside the shell, and the winding is provided with an outgoing line connected with the pin; the cavity is filled with packaging glue. A fixing groove is formed in the position, corresponding to the pin, of the shell, the fixing groove is provided with an opening communicated with the cavity, the pin is inserted into the fixing groove, the pin is inserted into the formed fixing groove, and packaging glue enters the fixing groove and wraps the inserted pin part in the process of pouring the packaging glue into the cavity, so that after the packaging glue is solidified, the packaging glue can be fixed in the fixing groove. The positions of the pins are fixed through the packaging glue, operation is easy, control over the pins does not need to be kept all the time, therefore, the assembling efficiency of the SMT inductor is improved, and compared with an existing fixed connection mode, it is not needed to worry about melting and deformation of local materials of the shell due to high temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of SMT inductors, in particular to a potting encapsulated SMT inductor. Background Art

[0002] SMT is a surface mount technology, and SMT inductors are common electronic components used in various electronic devices. They are designed to be directly mounted on the surface of a printed circuit board (PCB) instead of through-hole mounting, which helps reduce volume and improve production efficiency.

[0003] When traditional SMT inductors are produced and assembled, generally, a magnetic core wound with windings is placed into a housing, then the leads of the windings are connected to the pins of the housing, and finally, a bottom plate is installed to provide support for the magnetic core and windings to complete the assembly of the SMT inductor. There are problems such as difficult assembly and hard-to-improve efficiency, and it cannot well adapt to automated production. At the same time, there are also problems of insufficient structural strength and easy loosening of the internal magnetic core and windings. To solve this problem, potting technology has emerged. After placing the magnetic core and windings into the housing and connecting the leads to the housing pins, potting encapsulation is carried out into the housing, enabling the production process of SMT inductors to be more automated and ensuring structural strength at the same time.

[0004] However, the connection between the existing SMT inductor housing and the housing pins is generally completed by welding. It is necessary to first place the pins in the designated positions and then perform welding treatment on the connection points. During the welding process, it is necessary to control the position and direction of the pins, resulting in difficult operation. Moreover, there is also a problem that the housing material is deformed due to the influence of high temperature during the welding process. For example, if the housing is made of insulating plastic, high temperature easily causes local melting of the housing.

[0005] In view of this, it is necessary to propose a new technical solution to solve the above problems. Content of the Utility Model

[0006] The utility model aims to provide a technical solution that can solve the difficult connection operation of pins to overcome the above situations.

[0007] To achieve the above purpose, the utility model provides the following technical solution: A potting encapsulated SMT inductor, including a housing, a cavity with a lower opening is arranged inside the housing, a magnetic core and windings wound around the magnetic core are arranged in the cavity;

[0008] Pins are arranged outside the housing, and the windings are provided with leads connected to the pins;

[0009] The cavity is filled with potting glue;

[0010] A fixing groove is provided at a position corresponding to the housing and the pin, the fixing groove has an opening connected to the cavity, and the pin is inserted into the fixing groove.

[0011] As a further solution of the utility model: the lower end surface of the housing is provided with a stop groove which forms a step structure with the fixing groove, and the pin is provided with a stop block outside;

[0012] Wherein, the retaining block and the retaining groove are both arranged in polygonal structures.

[0013] As a further solution of the utility model: a plurality of through holes are provided on the portion of the pin extending into the interior of the fixing groove.

[0014] As a further solution of the utility model: the pin is in an "L"-shaped structure, and the bottom surface of the pin is a parallel surface.

[0015] As a further solution of the utility model: the lead wire is fixed to the pin by welding.

[0016] As a further solution of the utility model: the packaging glue is made of epoxy resin.

[0017] As a further solution of the utility model: the shell is made of insulating plastic material.

[0018] Compared with the prior art, the beneficial effects of this technical solution are:

[0019] 1. Insert the pin into the fixed groove, which has an opening connected to the cavity. Therefore, when the encapsulation glue is used to fill the cavity, the pin is inserted into the fixed groove through the opening and wrapped. After the encapsulation glue is cured, the position of the pin is fixed by the encapsulation glue. The operation is simple and there is no need to keep the pin under control all the time, thereby improving the assembly efficiency of the SMT inductor. Compared with the existing fixed connection method, there is no need to worry about the local material of the shell melting and deformation due to high temperature.

[0020] 2. When the pin is inserted into the fixing slot, the retaining block is correspondingly embedded in the retaining slot. Since both the retaining block and the retaining slot are polygonal structures, the pin can be prevented from rotating, thereby preventing the direction of the pin from being offset;

[0021] 3. The encapsulation glue enters the fixing groove to wrap the pin. Due to the existence of the through hole, after the encapsulation glue is cured, a column passing through the through hole is formed, thereby improving the firmness of the pin and preventing the pin from falling off from the fixing groove.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] Figure 1 is a schematic structural diagram of the present invention;

[0025] Figure 2 is a schematic structural diagram of another perspective of the present invention;

[0026] Figure 3 is a schematic cross-sectional structural diagram of the present invention;

[0027] Figure 4 is a schematic structural diagram of the outer shell of the present invention;

[0028] The corresponding reference numerals in the drawings are described as follows:

[0029] 1. Outer shell; 2. Cavity; 3. Magnetic core; 4. Winding; 5. Pin; 6. Encapsulation glue; 7. Fixed groove; 8. Positioning groove; 9. Positioning block; 10. Through hole; 11. Lead wire. Specific embodiments

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0031] Please refer to Figures 1-4 , a potting and encapsulation type SMT inductor, including an outer shell 1, a cavity 2 with an open lower end is arranged inside the outer shell 1, a magnetic core 3 and a winding 4 wound around the magnetic core 3 are arranged in the cavity 2;

[0032] Pins 5 are arranged outside the outer shell 1, the winding 4 is provided with lead wires 11 connected to the pins 5, the pins 5 are made of metal and have conductivity;

[0033] The cavity 2 is filled with encapsulation glue 6;

[0034] Preferably, first, the magnetic core 3 and the winding 4 are placed into the cavity 2. Then, the lead wire 11 of the winding 4 is connected to the pin 5 outside the housing 1. When the inductor is mounted on the surface of the PCB board, the pin 5 is soldered to the preset position. The winding 4 realizes electrical connection with the PCB board through the pin 5. After the connection of the lead wire 11 is completed, the housing 1 is inverted, that is, the opening of the cavity 2 faces upward. Finally, the cavity 2 is potted with the encapsulation adhesive 6. After the encapsulation adhesive 6 is cured, it forms protection and fixation for the magnetic core 3 and the winding 4, simplifies the assembly steps, adapts to automated production, and significantly improves the production capacity.

[0035] A fixing groove 7 is provided at the corresponding position of the housing 1 and the pin 5. The fixing groove 7 has an opening communicating with the cavity 2, and the pin 5 is inserted into the fixing groove 7.

[0036] Specifically, in the present utility model, the pin 5 is inserted into the provided fixing groove 7, and the fixing groove 7 has an opening communicating with the cavity 2. Therefore, during the process of potting the cavity 2 with the encapsulation adhesive 6, when the height of the encapsulation adhesive 6 reaches the position of the fixing groove 7, it will enter the fixing groove 7 through the opening and wrap the inserted pin 5. After the encapsulation adhesive 6 is cured, the position of the pin 5 is fixed by the encapsulation adhesive 6. The operation is simple and there is no need to continuously control the pin 5, thereby improving the assembly efficiency of the SMT inductor. Compared with the existing fixed connection method, there is no need to worry about the local material of the housing 1 melting and deforming due to high temperature.

[0037] Preferably, a positioning groove 8 forming a stepped structure with the fixing groove 7 is provided on the lower end surface of the housing 1. A positioning block 9 is provided outside the pin 5, and the area of the positioning block 9 is larger than that of the fixing groove 7 and less than or equal to that of the positioning groove 8.

[0038] Wherein, both the positioning block 9 and the positioning groove 8 are arranged in a polygonal structure.

[0039] Specifically, when the pin 5 is inserted into the fixing groove 7, the corresponding positioning block 9 is embedded into the positioning groove 8. Since both the positioning block 9 and the positioning groove 8 are in a polygonal structure, the rotation of the pin 5 can be prevented, and further, the orientation deviation of the pin 5 can be avoided.

[0040] Preferably, a plurality of through holes 10 are provided on the part of the pin 5 extending into the fixing groove 7.

[0041] Specifically, since the through holes 10 exist when the encapsulation adhesive 6 enters the fixing groove 7 to wrap the pin 5, after the encapsulation adhesive 6 is cured, a column body passing through the through holes 10 is formed, thereby improving the firmness of the pin 5 and being able to prevent the pin 5 from falling off the fixing groove 7.

[0042] Preferably, the pin 5 has an "L" - shaped structure, and the bottom surface of the pin 5 is a parallel plane. The "L" - shaped structure divides the pin into a vertical plane perpendicular to the PCB board and a parallel plane parallel to the PCB board. The lead - out wire is connected to the vertical plane of the pin 5. When the inductor is mounted, the parallel plane of the pin 5 is welded to the preset point.

[0043] Specifically, by setting the bottom surface of the pin 5 as the parallel plane of the "L" - shaped structure, when the SMT inductor is placed at the preset position on the PCB board, the parallel plane of the pin 5 can provide high stability, thus effectively avoiding the phenomenon that the position of the SMT inductor shifts during the reflow soldering process, resulting in poor power connection.

[0044] Preferably, the lead - out wire 11 is welded and fixed to the pin 5.

[0045] Specifically, after the magnetic core 3 and the winding 4 are placed into the housing 1 and the lead - out wire 11 is led out and connected to the pin 5, the potting and curing of the encapsulation glue 6 will fix the lead - out wire 11, which can avoid the retraction of the lead - out wire 11;

[0046] When the lead - out wire 11 is connected to the pin 5, the lead - out wire 11 can be wound around the pin 5 for one week first, and then the lead - out wire 11 and the pin 5 are welded, which can improve the connection firmness between the lead - out wire 11 and the pin 5 and ensure that the current can pass through the winding 4.

[0047] Preferably, the encapsulation glue 6 is made of epoxy resin.

[0048] Specifically, epoxy resin has excellent insulation, temperature resistance, adhesiveness and thermal stability. After the epoxy resin is fixed, it can provide physical protection for the magnetic core 3 and the winding 4, prevent mechanical shock, and at the same time help with heat dissipation and reduce the influence of thermal stress.

[0049] Preferably, the housing 1 is made of insulating plastic material.

[0050] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above - mentioned exemplary embodiments, and without departing from the spirit or basic characteristics of the present utility model, the present utility model can be implemented in other specific forms. Therefore, in any aspect, the embodiments should be regarded as exemplary and non - restrictive. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A glue-filled encapsulated SMT inductor, characterized in that, It includes a housing (1), inside which there is a cavity (2) with an opening at the lower end. Inside the cavity (2), there is a magnetic core (3) and a winding (4) wound around the magnetic core (3). There are pins (5) arranged outside the housing (1), and the winding (4) is provided with lead wires (11) connected to the pins (5). The cavity (2) is filled with encapsulating glue (6). At a position corresponding to the pins (5) on the housing (1), there are fixing grooves (7) which have openings communicating with the cavity (2), and the pins (5) are inserted into the fixing grooves (7).

2. The potted encapsulation type SMT inductor according to claim 1, characterized in that, On the lower end face of the housing (1), there is a positioning groove (8) forming a stepped structure with the fixing groove (7), and there is a positioning block (9) arranged outside the pins (5). Among them, both the positioning block (9) and the positioning groove (8) are arranged in a polygonal structure.

3. The potted encapsulation type SMT inductor according to claim 2, wherein Several through holes (10) are provided on the part of the pins (5) extending into the fixing grooves (7).

4. The potted encapsulation type SMT inductor according to claim 1, wherein, The pins (5) are in an "L" - shaped structure, and the bottom surface of the pins (5) is a parallel plane.

5. The potted encapsulation type SMT inductor according to claim 1, wherein The lead wires (11) are fixed to the pins (5) by welding.

6. The potted encapsulation type SMT inductor according to claim 3, wherein, The encapsulating glue (6) is made of epoxy resin as the manufacturing material.

7. The potted encapsulation type SMT inductor according to claim 1, wherein, The housing (1) is made of insulating plastic material.

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