Bonding jig for die bonding of chip

Abstract

The utility model discloses a bonding jig for die bonding of a chip, and relates to the technical field of bonding jigs, and the bonding jig comprises a bonding frame and a supporting mechanism. The bonding frame is provided with a machining plate arranged in a supported mode, and a machining hole penetrating through the machining plate is formed in the machining plate. The elevating mechanism comprises a mounting plate and a lifting device, the mounting plate is connected with the lifting device, the mounting plate and the lifting device are both arranged below the processing plate, the mounting plate is used for placing the chip carrier and can be lifted under the action of the lifting device, and the chip carrier is clamped between the mounting plate and the processing plate. The processing plate is arranged above the heightening mechanism, a chip carrier is firstly placed on the mounting plate and is pushed by the lifting device to move upwards through the mounting plate, the chip carrier is clamped between the mounting plate and the processing plate, a processing hole is formed in the processing plate, and processing equipment penetrates through the processing plate to process the clamped chip carrier through the processing hole. And the chip carrier can be quickly fixed and unfixed through the supporting mechanism, so that the processing efficiency of the chip is improved.

Description

Technical Field

[0001] The present application relates to the technical field of bonding fixtures, and in particular to a bonding fixture for chip die bonding. Background Art

[0002] In the semiconductor manufacturing process, chip bonding is a key step that requires the chip to be accurately fixed to a predetermined position. Existing bonding fixtures have problems such as insufficient stability and uneven clamping force during use, which can easily lead to chip bonding position deviation and affect product quality. Therefore, how to improve the stability and clamping accuracy of bonding fixtures is a technical problem that needs to be solved urgently in this field.

[0003] Utility model patent announcement number CN218017998U discloses an IC chip testing fixture, including a fixture seat and a chip placement frame, a chip testing mechanism is installed in the fixture seat, the chip placement frame is arranged on the top surface of the fixture seat, a clamping assembly is arranged above the chip placement frame, a negative pressure assembly connected to the clamping assembly is arranged on the fixture seat, the negative pressure assembly includes a sleeve, an elastic air cushion, a connecting hose and a negative pressure suction cup, the sleeve is a rectangular body with a hollow top surface, the sleeve is fixedly connected to the front side of the fixture seat, the elastic air cushion is fixedly connected to the bottom inner wall of the sleeve, the connecting hose is connected and communicated with the top surface of the elastic air cushion, the negative pressure suction cup is connected and communicated with one end of the connecting hose away from the elastic air cushion, through the setting of the negative pressure assembly, when the IC chip test is completed and the clamping assembly is opened, the IC chip is automatically adsorbed on the clamping plate by the negative pressure effect, and the IC chip is taken out of the chip placement frame as the clamping plate rises. Fixing the chip placement frame by adsorption will result in complicated operations when placing and taking out the chip placement frame. The replacement of the chip placement frame takes a long time, resulting in low processing efficiency. Summary of the invention

[0004] The purpose of the present application is to provide a bonding fixture for chip die bonding in order to solve the problem of low processing efficiency caused by low replacement efficiency of chip processing carriers on processing fixtures.

[0005] The present application provides a chip bonding fixture that adopts the following technical solution:

[0006] A chip bonding fixture includes:

[0007] The bonding frame has a processing plate that is supported and arranged high, and the processing plate is provided with a processing hole that penetrates the processing plate;

[0008] The supporting mechanism includes a mounting plate and a lifting device. The mounting plate is connected to the lifting device. Both are arranged below the processing plate. The mounting plate is used to place the chip carrier and can be lifted by the lifting device to clamp the chip carrier between the mounting plate and the processing plate.

[0009] By adopting the above technical solution, the processing plate is arranged above the lifting mechanism. The chip carrier is first placed on the mounting plate. The mounting plate moves upward under the push of the lifting device, clamping the chip carrier between the mounting plate and the processing plate. There are processing holes on the processing plate, and the processing holes allow the processing equipment to pass through the processing plate to process the clamped chip carrier. The lifting mechanism can quickly fix and release the chip carrier, thereby improving the processing efficiency of the chip.

[0010] Optionally, the bonding fixture further includes a mounting bottom plate. The bonding frame further includes a support rod. One side of the support rod is connected to the processing plate, and the other side is connected to the mounting bottom plate. The lifting mechanism further includes a lifting bottom plate. The lifting bottom plate is arranged on the mounting bottom plate and is connected to the support rod. The lifting device is arranged on the lifting bottom plate.

[0011] By adopting the above technical solution, the support rod is used to support the processing plate, providing space for the lifting mechanism. The mounting bottom plate can connect the bonding frame and the lifting mechanism at the bottom. The lifting bottom plate at the bottom of the lifting mechanism can improve the connectivity between the lifting mechanism and the bonding frame, thus making the overall structure more stable.

[0012] Optionally, a mounting groove is provided on one side of the mounting plate close to the processing plate, and a mounting opening communicating with the mounting groove is provided on the side of the mounting plate.

[0013] By adopting the above technical solution, the mounting groove is used to fix the chip carrier in the mounting plate. When the mounting plate moves up and down, the stability of the chip carrier can be maintained. The mounting opening allows the chip carrier to enter the mounting plate, enabling the chip carrier to be quickly installed and separated.

[0014] Optionally, the mounting opening is in an open shape that expands outward.

[0015] By adopting the above technical solution, the open mounting opening that expands outward allows the chip carrier to enter the mounting groove more conveniently. Even if the entry position is offset, it can accurately enter the mounting groove through the adjustment of the mounting opening.

[0016] Optionally, it further includes a limiting rod. The limiting rod passes through the mounting plate and is connected to the processing plate, and is used to keep the horizontal relative position of the processing plate and the mounting plate unchanged.

[0017] By adopting the above technical solution, the limiting rod is used to keep the mounting plate unchanged in the horizontal position relative to the processing plate when moving up and down under the drive of the lifting device, thereby ensuring that the chip carrier is in a stable position when being clamped by the mounting plate and the processing plate.

[0018] Optionally, a first groove is provided at the edge of the mounting plate close to the mounting opening, and a second groove is provided on the processing plate. The second groove corresponds to the first groove for clamping the chip carrier to be put in or taken out.

[0019] By adopting the above technical solution, after the chip carrier is placed in the installation groove, the first groove and the second groove can form a clamping space on the upper and lower sides of the edge of the chip carrier, so that after the chip carrier is pushed into the installation groove, the chip carrier can be clamped through the space formed by the first groove and the second groove and taken out from the installation groove.

[0020] Optionally, the processing plate is further provided with a detection hole corresponding to the non-processing area of the chip carrier for detecting the position of the chip carrier.

[0021] By adopting the above technical solution, the detection hole corresponds to the non-processed part on the chip carrier and is used to detect whether the position of the processing carrier is accurate, avoiding the offset of the chip carrier in the installation groove, which is beneficial to ensuring the accuracy of the bonding process.

[0022] Optionally, the installation groove is provided with installation holes.

[0023] By adopting the above technical solution, after the chip carrier is placed in the installation groove, the installation holes can form a snap connection with the structure on the back of the chip carrier, so that the chip carrier can be maintained fixed relative to the installation plate, improving the stability of detection.

[0024] In summary, the present application includes at least one of the following beneficial technical effects:

[0025] 1. The processing plate is arranged above the lifting mechanism. The chip carrier is first placed on the installation plate. The installation plate moves upward under the push of the lifting device, clamping the chip carrier between the installation plate and the processing plate. The processing plate is provided with processing holes through which the processing equipment can pass through the processing plate to process the clamped chip carrier. The lifting mechanism can quickly fix and release the chip carrier, thereby improving the processing efficiency of the chip;

[0026] 2. The limiting rod is used to maintain the relative position of the installation plate unchanged in the horizontal direction relative to the processing plate when the installation plate moves up and down driven by the lifting device, so as to ensure that the chip carrier is in a stable position when it is clamped by the installation plate and the processing plate;

[0027] 3. After the chip carrier is placed in the installation groove, the first groove and the second groove can form a clamping space on the upper and lower sides of the edge of the chip carrier, so that after the chip carrier is pushed into the installation groove, the chip carrier can be clamped through the space formed by the first groove and the second groove and taken out from the installation groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is the overall structural schematic diagram of an embodiment of the present application;

[0029] Figure 2 is the exploded structural schematic diagram of an embodiment of the present application;

[0030] Figure 3 is Figure 2 A partial enlarged schematic view of part A in

[0031] Reference numerals: 1, bonding frame; 11, processing plate; 12, processing hole; 13, support rod; 14, second groove; 15, detection hole; 2, lifting mechanism; 21, mounting plate; 22, lifting device; 23, lifting bottom plate; 24, mounting groove; 25, mounting opening; 26, first groove; 27, mounting hole; 3, mounting bottom plate; 4, limiting rod; 5, chip carrier. Detailed implementation manners

[0032] The present application will be further described in detail below with reference to the accompanying drawings.

[0033] A bonding fixture for chip die bonding, referring to Figure 1 and Figure 2 , includes a bonding frame 1, a lifting mechanism 2 and a mounting bottom plate 3. The bonding frame 1 and the lifting mechanism 2 are both arranged on the mounting bottom plate 3, and the lifting mechanism 2 is arranged inside the bonding frame 1. The bonding frame 1 includes a processing plate 11 and support rods 13. The four corners of the processing plate 11 are respectively connected to the support rods 13, and the other side of the support rods 13 is connected to the mounting bottom plate 3. The processing plate 11 is provided with processing holes 12 penetrating through the processing plate 11 for a processing device to pass through the processing plate 11 to process the clamped chip carrier 5. The processing plate 11 is further provided with detection holes 15 corresponding to the non-processing areas of the chip carrier 5, and the detection holes 15 are used to detect the position of the chip carrier 5 to ensure the accurate position of the chip carrier 5. The lifting mechanism 2 includes a mounting plate 21, a lifting device 22 and a lifting bottom plate 23. The lifting bottom plate 23 is arranged on the mounting bottom plate 3, and the four corners of the lifting bottom plate 23 are respectively connected to the lower sides of the support rods 13, so that the bonding frame 1 and the lifting mechanism 2 are connected to each other, improving the connectivity between the lifting mechanism 2 and the bonding frame 1, and thus making the overall structure more stable. The lifting device 22 is arranged on the lifting bottom plate 23, and the mounting plate 21 is connected to the lifting device 22. All three are arranged below the processing plate 11.

[0034] Referring to Figure 2 and Figure 3The mounting plate 21 is provided with a mounting groove 24 on one side close to the processing plate 11, and a mounting opening 25 connected to the mounting groove 24 is provided on the side of the mounting plate 21, and the mounting groove 24 is provided for the chip carrier 5 to be placed. The mounting groove 24 facilitates the placement and positioning of the chip carrier 5, and the mounting opening 25 allows the chip carrier 5 to be pushed into or taken out of the mounting groove 24. The mounting opening 25 is open and expands outward, so that the chip carrier 5 can be inserted into the mounting groove 24 even if there is a slight position deviation with the mounting opening 25. The mounting groove 24 is provided with mounting holes 27, which can form a card connection with the chip carrier 5 to prevent the chip carrier 5 from shifting during the up and down movement, thereby improving the clamping stability and processing accuracy of the bonding fixture. Under the action of the lifting device 22, the chip carrier 5 is lifted under the support of the mounting plate 21, so that the chip carrier 5 is clamped between the mounting plate 21 and the processing plate 11, and the chip carrier 5 is fixed. By quickly fixing and releasing the chip carrier 5, the chip processing efficiency is improved.

[0035] Reference Figure 1 and Figure 2 The bonding fixture also includes a limit rod 4, which passes through the mounting plate 21 and is connected to the support base plate 23 and the processing plate 11 at both ends. When the mounting plate 21 moves up and down under the push of the lifting device 22, the mounting plate 21 can move on the limit rod 4 relative to the limit rod 4 to maintain the horizontal relative position of the processing plate 11 and the mounting plate 21 unchanged. The edge of the mounting plate 21 near the mounting opening 25 is provided with a first groove 26, and the processing plate 11 is provided with a second groove 14, which corresponds to the first groove 26, so that when the chip carrier 5 is placed in the mounting groove 24, a part of the chip carrier 5 is exposed for clamping, placing in or taking out, thereby improving the efficiency and convenience of operation.

[0036] The implementation principle of the embodiment of the present application is as follows: the chip carrier 5 is placed on the mounting plate 21, and then the mounting plate 21 is lifted by the lifting device 22, so that the chip carrier 5 is clamped between the mounting plate 21 and the processing plate 11, and the processing equipment can process the parts to be processed on the chip carrier 5 through the processing holes 12 on the processing plate 11. By clamping and fixing the chip carrier 5, the chip carrier 5 is stably clamped, and the chip carrier 5 can be quickly fixed and released, which can improve the chip processing efficiency.

[0037] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A bonding fixture for chip die bonding, characterized in that, Comprising: A bonding frame (1) having a processing plate (11) set at a raised height, and a processing hole (12) penetrating through the processing plate (11) is provided on the processing plate (11); A heightening mechanism (2), including a mounting plate (21) and a lifting device (22), the mounting plate (21) is connected to the lifting device (22), and both are arranged below the processing plate (11). The mounting plate (21) is for placing a chip carrier (5), and can be lifted under the action of the lifting device (22) to clamp the chip carrier (5) between the mounting plate (21) and the processing plate (11).

2. The bonding fixture for die bonding of a chip according to claim 1, characterized in that, It further includes a mounting base plate (3). The bonding frame (1) further includes a support rod (13), one side of the support rod (13) is connected to the processing plate (11), and the other side is connected to the mounting base plate (3). The heightening mechanism (2) further includes a heightening base plate (23), the heightening base plate (23) is arranged on the mounting base plate (3) and is connected to the support rod (13), and the lifting device (22) is arranged on the heightening base plate (23).

3. The bonding fixture for chip die bonding according to claim 1, characterized in that, On one side of the mounting plate (21) close to the processing plate (11), a mounting groove (24) is provided, and a mounting opening (25) communicating with the mounting groove (24) is provided on the side of the mounting plate (21).

4. The bonding fixture for chip die bonding according to claim 3, wherein The mounting opening (25) is in an open shape expanding outward.

5. A bonding fixture for chip die bonding according to claim 1, characterized in that, It further includes a limiting rod (4), the limiting rod (4) passes through the mounting plate (21) and is connected to the processing plate (11) for maintaining the horizontal relative position between the processing plate (11) and the mounting plate (21) unchanged.

6. The bonding fixture for chip die bonding according to claim 3, wherein On the edge of the mounting plate (21) close to the mounting opening (25), a first groove (26) is provided, and a second groove (14) is provided on the processing plate (11). The second groove (14) corresponds to the first groove (26) for clamping and putting in or taking out the chip carrier (5).

7. A bonding fixture for chip die bonding according to claim 1, characterized in that, The processing plate (11) further has a detection hole (15), the detection hole (15) corresponds to the non-processing area of the chip carrier (5) for detecting the position of the chip carrier (5).

8. A bonding fixture for chip die bonding according to claim 3, characterized in that, Mounting holes (27) are provided in the mounting groove (24).

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