Packaging structure of semiconductor memory chip
The semiconductor storage chip packaging structure addresses heat dissipation and pin protection issues by integrating heat spreaders, heat pipes, and air channels, ensuring stable operation and reducing pin damage.
Patent Information
- Application Number
- CN202422345047.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-25
AI Technical Summary
The existing semiconductor memory chip package structure has a single thermal dissipation structure and lacks pin protection, which leads to unstable chip operation and easy pin damage.
The combination design of buffer plate, substrate, outer shell layer, inner shell layer, heat homogenization plate, heat conduction pipe, heat dissipation fins, thermal gel and other components is adopted, combining the principles of heat conduction, heat convection and heat radiation to increase the heat exchange area and facilitate pin replacement.
It improves the heat dissipation efficiency of the package structure, reduces the chip temperature, ensures the stable operation of the chip, and facilitates pin replacement, reducing the chip scrap rate.
Smart Images
Figure CN223108887U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of packaging structures, in particular to a packaging structure for a semiconductor memory chip. Background Art
[0002] The packaging of semiconductor chips isolates the chips from the external environment to ensure the stable operation of the chips. In actual chip use, the packaging needs to consider practical use problems such as chip heat dissipation, shock absorption, and maintenance;
[0003] The existing packaging structure of semiconductor memory chips is relatively single, especially the heat dissipation structure is relatively single, and various heat dissipation means are not well combined, resulting in unstable chip operation. At the same time, there is a lack of protection for chip pins, and the pins are prone to falling off and damage during long-term use or transportation.
[0004] Therefore, aiming at the problems of the existing single heat dissipation structure and lack of pin protection structure, a packaging structure for a semiconductor memory chip can be designed to facilitate the protection or replacement of chip pins, and add heat dissipation components to achieve good control of the chip temperature during long-term operation and improve the stability of chip operation. Summary of the Utility Model
[0005] In order to overcome the problems of the existing packaging structure with a single heat dissipation structure, poor combination of various heat dissipation means, and lack of pin protection structure.
[0006] The technical solution of the utility model is: a packaging structure for a semiconductor memory chip, including a housing layer, characterized in that: it further includes a buffer plate, the upper end of the buffer plate is fixedly connected with a substrate, the upper end of the substrate is fixedly installed with a housing layer, the upper end of the housing layer is fixedly installed with a cover plate, the upper end of the cover plate is provided with an inner housing layer inside the housing layer, the upper end of the inner housing layer is fixedly installed with a heat sink plate, the upper end of the heat sink plate is provided with a heat conduction pipe, support columns are fixedly installed on the side edges of the lower end of the heat sink plate, a storage chip is fixedly installed on the upper end of the substrate inside the support columns, inner pins are fixedly connected to the left and right sides of the storage chip, the other ends of the inner pins are fixedly installed with wiring terminals, and the other ends of the wiring terminals are fixedly installed with outer pins.
[0007] Preferably, heat dissipation holes are evenly distributed on the surface of the housing layer, and natural convection of air is utilized through the heat dissipation holes on the surface to improve the heat exchange amount.
[0008] As a preference, heat dissipation fins are fixedly connected to the surface of the inner housing layer, and the heat dissipation fins are evenly distributed. The heat exchange surface area is increased by adding heat dissipation fins to improve the heat radiation heat exchange amount of the structure.
[0009] Preferably, a heat-conducting gel is filled below the inner shell layer and located under the heat pipe. With the heat-conducting gel having a high thermal conductivity as the filling, the heat generated by the chip is quickly transferred to the heat pipe, avoiding heat accumulation at the chip.
[0010] Preferably, the heat pipes are distributed at equal intervals. The front and rear ends of the heat pipes are adhesively connected to the outer shell layer. The heat of the chip is shared by the heat pipe, and then the heat is taken away from the inner shell layer by the heat pipes arranged at equal intervals, avoiding heat accumulation at the heat pipe.
[0011] Preferably, the left end of the inner lead is detachably connected to the terminal block by bolt 1. An end point 1 is fixedly installed at the left end of the inner lead. The right end of the outer lead is detachably connected to the terminal block by bolt 2. When the lead falls off or is damaged, the outer lead can be conveniently replaced.
[0012] Preferably, an end point 2 is fixedly installed at the right end of the outer lead. The end point 1 and the end point 2 are adapted to each other. Through the adapted end point 1 and end point 2, good contact of the leads during chip operation is ensured.
[0013] Advantages of the present utility model:
[0014] 1. For the packaging structure of the semiconductor memory chip, through the combined operation of the heat dissipation fins, heat dissipation holes, heat-conducting gel, and heat pipes, the heat transfer surface area is increased by the heat dissipation fins, and the fluid flow rate of air and other fluids is increased by the heat dissipation holes, thereby improving the heat convection and heat radiation heat transfer amount. The heat is transferred to the heat pipe by the heat-conducting gel with a high thermal conductivity. After the heat pipe shares the heat, the heat is taken away by the heat pipes, reducing the local accumulation of heat, making full use of the principles of heat conduction, heat convection, and heat radiation, improving the heat transfer amount of the packaging structure, and still being able to keep the chip at a lower temperature after long-term operation, ensuring the full utilization of the chip performance during operation, and improving the stability of the packaging structure;
[0015] 2. For the packaging structure of the semiconductor memory chip, the inner and outer leads are fixedly installed in the terminal block by bolts. On the premise of ensuring good contact of the leads, the leads can be conveniently disassembled and replaced, reducing the scrap rate of the chip and improving the utilization rate of the chip in actual use. Description of the Drawings
[0016] Figure 1 Shows a schematic cross-sectional structure diagram of the packaging structure of the semiconductor memory chip of the present utility model;
[0017] Figure 2 Shows a schematic overall structure diagram of the packaging structure of the semiconductor memory chip of the present utility model Figure 1 ;
[0018] Figure 3 Shows a schematic diagram of the positioning rod structure of the packaging structure of the semiconductor memory chip of the present utility modelFigure 2 ;
[0019] Figure 4 Shown is Figure 1 the enlarged structural schematic diagram at position A in
[0020] Explanation of reference numerals: 1, buffer plate; 2, substrate; 3, outer shell layer; 31, heat dissipation holes; 4, cover plate; 5, inner shell layer; 51, heat dissipation fins; 6, heat spreader; 7, heat conduction tube; 8, support column; 9, storage chip; 10, inner lead; 101, end point one; 11, terminal; 111, bolt one; 112, bolt two; 12, outer lead; 121, end point two; 13, thermal conductive gel. Specific implementation mode
[0021] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.
[0022] Please refer to Figures 1-4 , the present utility model provides an embodiment: a packaging structure of a semiconductor storage chip, including an outer shell layer 3, and further including a buffer plate 1. The upper end of the buffer plate 1 is fixedly connected to a substrate 2. The upper end of the substrate 2 is fixedly installed with an outer shell layer 3. Heat dissipation holes 31 are formed on the surface of the outer shell layer 3, and the heat dissipation holes 31 are equally spaced. The upper end of the outer shell layer 3 is fixedly installed with a cover plate 4. An inner shell layer 5 is arranged inside the outer shell layer 3 at the upper end of the cover plate 4. A heat spreader 6 is fixedly installed at the upper end of the inner shell layer 5. A heat conduction tube 7 is arranged at the upper end of the heat spreader 6. Support columns 8 are fixedly installed on the side of the lower end of the heat spreader 6. A storage chip 9 is fixedly installed inside the support columns 8 at the upper end of the substrate 2. Inner leads 10 are fixedly connected to the left and right sides of the storage chip 9. The other end of the inner lead 10 is fixedly installed with a terminal 11. The other end of the terminal 11 is fixedly installed with an outer lead 12. The good contact between the inner lead 10 and the outer lead 12 is ensured through the terminal 11. At the same time, the outer lead 12 is fixed by a bolt one 111, and the inner lead 10 is fixed by a bolt two 112. When the lead falls off or is damaged, the bolt one 111 can be disassembled to conveniently replace the faulty lead.
[0023] Please refer to FIGS. 1 and Figure 3 , in this embodiment, heat dissipation fins 51 are fixedly connected to the surface of the inner shell layer 5, and the heat dissipation fins 51 are equally spaced. A thermal conductive gel 13 is filled below the heat spreader 6 inside the inner shell layer 5. The heat conduction tubes 7 are equally spaced, and the front and rear ends of the heat conduction tubes 7 are in contact with the outer shell layer 3. Through the combined operation of the heat dissipation holes 31, the heat dissipation fins 51, the thermal conductive gel 13, and the heat conduction tubes 7, the principles of heat conduction, heat convection, and heat radiation are fully utilized to increase the heat exchange amount of the structure, reduce the temperature of the storage chip 9, and ensure the stable operation of the storage chip 9.
[0024] Please refer toFigure 1 , Figure 3 and Figure 4 , in this embodiment, the left end of the inner pin 10 is detachably connected to the terminal 11 through the second bolt 112. The left end of the inner pin 10 is fixedly installed with a first end point 101. The right end of the outer pin 12 is detachably connected to the terminal 11 through the first bolt 111. The right end of the outer pin 12 is fixedly installed with a second end point 121. The first end point 101 is adapted to the second end point 121. On the premise of ensuring good contact of the pins through the terminal 11, the pins can be conveniently disassembled and replaced, reducing the scrap rate of the chip and improving the utilization rate of the chip in actual use.
[0025] When working, the memory chip 9 on the substrate 2 starts to work and generates heat. The heat is transferred to the lower end of the heat sink plate 6 through the thermal conductive gel 13. The heat sink plate 6 evenly distributes the heat to the upper surface of the heat sink plate 6. The heat conduction tube 7 on the upper surface of the heat sink plate 6 works to take away part of the heat. At the same time, the heat inside the thermal conductive gel 13 is transferred from the inner shell layer 5 to the heat dissipation fins 51. The heat dissipation fins 51 increase the convective heat transfer area to accelerate heat transfer. The heat dissipation holes 31 are opened on the surface of the outer shell layer 3. The heat dissipation holes 31 increase the flow rate of fluids such as air, reducing the accumulation of heat inside the structure. At the same time, when the outer pin 12 falls off or is damaged, the first bolt 111 can be removed. After the first bolt 111 is removed, the outer pin 12 can be removed from the terminal 11. When a new outer pin 12 is replaced, the first bolt 111 is installed, which can ensure that the outer pin 12 is fixed on the premise that the first end point 101 and the second end point 121 are in good contact inside the terminal 11, improving the utilization rate of the chip.
[0026] Through the above steps, by using the combined work of the heat dissipation fins 51, the heat dissipation holes 31, the thermal conductive gel 13, and the heat conduction tube 7, the principles of heat conduction, heat convection, and heat radiation are fully utilized, improving the heat transfer amount of the packaging structure, keeping the chip at a lower temperature, improving the actual performance of the chip. At the same time, the outer pin 12 and the terminal 11 that can be conveniently disassembled and replaced are provided to solve the problems of the existing packaging structure with a single heat dissipation structure, poor combination of various heat dissipation means, and lack of a pin protection structure.
Claims
1. A packaging structure of a semiconductor memory chip, comprising a housing layer, characterized in that: It further includes a buffer plate, the upper end of the buffer plate is fixedly connected to a substrate, the upper end of the substrate is fixedly installed with a housing layer, the upper end of the housing layer is fixedly installed with a cover plate, an inner housing layer is arranged inside the housing layer at the upper end of the substrate, a heat pipe is fixedly installed at the upper end of the inner housing layer, a heat conduction pipe is arranged at the upper end of the heat pipe, support columns are fixedly installed at the side edges of the lower end of the heat pipe, a storage chip is fixedly installed inside the support columns at the upper end of the substrate, inner pins are fixedly connected to both the left and right sides of the storage chip, a wiring terminal is fixedly installed at the end of the inner pin away from the storage chip, and an outer pin is installed at the end of the wiring terminal away from the inner pin.
2. The packaging structure of a semiconductor memory chip according to claim 1, characterized in that: Heat dissipation holes are evenly formed on the surface of the housing layer, and the heat dissipation holes are distributed at equal intervals.
3. The packaging structure of a semiconductor memory chip according to claim 1, characterized in that: Heat dissipation fins are fixedly connected to the surface of the inner housing layer, and the heat dissipation fins are distributed at equal intervals.
4. The packaging structure of a semiconductor memory chip according to claim 1, wherein: Thermal conductive gel is filled below the heat pipe inside the inner housing layer.
5. The encapsulation structure of a semiconductor memory chip according to claim 1, wherein: The heat conduction pipes are distributed at equal intervals, and the front and rear ends of the heat conduction pipes are in fit connection with the housing layer.
6. The encapsulation structure of a semiconductor memory chip according to claim 1, wherein: The left end of the inner pin is detachably connected to the wiring terminal by bolt two, and an end point one is fixedly installed at the left end of the inner pin. The right end of the outer pin is detachably connected to the wiring terminal by bolt one.
7. The packaging structure of a semiconductor memory chip according to claim 1, characterized in that: An end point two is fixedly installed at the right end of the outer pin, and the end point one is adapted to the end point two.