Resistance attenuator

Abstract

The utility model discloses a resistance attenuator, particularly relates to the field of resistance attenuators, and is technically characterized in that the resistance attenuator comprises an insulating substrate, a first conductor module, a second conductor module, a first resistance plate, a second resistance plate, a third resistance plate, a first grounding module and a second grounding module; the first conductor module, the second conductor module and the first resistance plate are all arranged on the top surface of the insulating substrate, the first conductor module and the second conductor module are respectively arranged on two opposite sides of the first resistance plate, and each of the first conductor module and the second conductor module comprises a first conductor plate, a second conductor plate and a third conductor plate; the cross section of the first conductor plate is L-shaped, the first conductor plate is provided with a first inner side wall and a second inner side wall, one side of the second conductor plate is in contact with the first inner side wall of the first conductor plate, and the side, away from the first inner side wall, of the second conductor plate is in contact with one side of the third conductor plate; and a hollow gap is formed among the first conductor plate, the second conductor plate and the third conductor plate.

Description

Technical Field

[0001] The utility model relates to the field of resistor attenuators, and particularly relates to a resistor attenuator. Background Art

[0002] A resistor attenuator is an attenuator made according to the principle of resistor voltage division, and its core component is a resistor. By adjusting the resistance value of the resistor, the attenuation of the signal amplitude can be achieved. The resistor attenuator is based on Ohm's law and the principle of voltage distribution; when an input signal passes through the resistor attenuator, a voltage drop will occur on the resistor. According to Ohm's law, the voltage drop on the resistor is proportional to the current passing through the resistor and also proportional to the resistance value of the resistor. Therefore, by adjusting the resistance value of the resistor, the voltage drop of the signal on the resistor can be controlled, thereby achieving the attenuation of the signal amplitude.

[0003] In the existing resistor attenuators, there are problems such as unstable attenuation degree, insufficient power, and low frequency characteristics due to signal noise interference between various conductors inside the resistor attenuator; therefore, the present invention aims to provide a resistor attenuator to solve the above-mentioned related problems. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is that in the existing resistor attenuators, there are problems such as unstable attenuation degree, insufficient power, and low frequency due to signal noise interference between conductors in the resistor attenuator. The purpose is to provide a resistor attenuator. By using the hollow gap formed between the first conductor plate, the second conductor plate, and the third conductor plate, the signal interference between the conductor plates can be reduced, which helps to keep the attenuation degree of the resistor attenuator stable, and enables the overall resistor attenuator to have higher frequency characteristics and ensure reliable power; by using the second conductor plate to adjust the width and length of the hollow gap, it is convenient to adjust according to resistor attenuators with different attenuation degrees to meet the use of resistor attenuators with different attenuation degrees; by adjusting the resistance value of the first resistor plate, the attenuation degree of the resistor attenuator can be adjusted within the range of 1 - 20 dB.

[0005] The utility model is realized by the following technical solutions:

[0006] A resistor attenuator, the resistor attenuator comprising an insulating substrate, a first conductor module, a second conductor module, a first resistor plate, a second resistor plate, a third resistor plate, a first grounding module and a second grounding module; the first conductor module, the second conductor module and the first resistor plate are all arranged on the top surface of the insulating substrate, the first grounding module and the second grounding module are respectively arranged on both sides of the insulating substrate, and the first grounding module is connected to the first conductor module through the second resistor plate, and the second grounding module is connected to the second conductor module through the third resistor plate; the first conductor module and the second conductor module are respectively arranged on opposite sides of the first resistor plate, and the first conductor module and the second conductor module both comprise a first conductor plate, a second conductor plate and a third conductor plate; the cross-section of the first conductor plate is L-shaped, the first conductor plate has a first inner side wall and a second inner side wall, one side of the second conductor plate is in contact with the first inner side wall of the first conductor plate, and the side of the second conductor plate away from the first inner side wall is in contact with one side of the third conductor plate; a hollow gap is formed between the first conductor plate, the second conductor plate and the third conductor plate.

[0007] Further, the width of the hollow gap is consistent with the width of the second conductor plate, and the length of the hollow gap is consistent with the distance between the second conductor plate and the second inner side wall.

[0008] Further, the width range of the second conductor plate is 0.4 - 0.7 mm, and the distance between the second conductor plate and the second inner side wall is 0 - 1.1 mm.

[0009] Further, the first resistor plate is arranged in the middle of the top surface of the insulating substrate, two first conductor plates are respectively in contact with opposite sides of the first resistor plate, the first grounding module and the second grounding module are respectively arranged on opposite sides of the insulating substrate, one side of the second resistor plate is connected to one side of the first conductor plate in the first conductor module, and the side of the second resistor plate away from the first conductor module is connected to the first grounding module, one side of the third resistor plate is connected to one side of the first conductor plate in the second conductor module, and the side of the third resistor plate away from the second conductor module is connected to the second grounding module.

[0010] Further, the first conductor module and the second conductor module are centrosymmetrically arranged with the center of the top surface of the first resistor plate as the symmetry point.

[0011] Further, the resistance value adjustment range of the first resistor plate is 5.8 - 247.4 Ω; the resistance value ranges of the second resistor plate and the third resistor plate are both 61.1 - 869.8 Ω.

[0012] Further, the second resistor plate and the third resistor plate can be horizontally moved.

[0013] Further, both the first grounding module and the second grounding module include a first grounding plate and a second grounding plate. The first grounding plate is disposed on the side wall of the insulating substrate, the second grounding plate is disposed at the top edge of the insulating substrate, and the first grounding plate is connected to the second grounding plate. A third grounding plate is provided at the bottom of the insulating substrate, and the third grounding plate is connected to the two first grounding plates.

[0014] Further, the insulating substrate is made of alumina ceramic.

[0015] Further, the first grounding plate, the second grounding plate, and the third grounding plate are all made of silver plates.

[0016] Compared with the prior art, the present utility model has the following advantages and beneficial effects:

[0017] In the present utility model, by using the hollow gap formed between the first conductor plate, the second conductor plate, and the third conductor plate, signal interference between the conductor plates can be reduced, which helps to keep the attenuation degree of the resistor attenuator stable, and enables the overall resistor attenuator to have higher frequency characteristics, ensuring reliable power; by using the second conductor plate to adjust the width and length of the hollow gap, it is convenient to adjust according to resistor attenuators with different attenuation degrees to meet the use requirements of resistor attenuators with different attenuation degrees; by adjusting the resistance value of the first resistor plate, the attenuation degree of the resistor attenuator can be adjusted within the range of 1 - 20 dB. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings. In the drawings:

[0019] Figure 1 is a schematic structural diagram of a resistor attenuator in this embodiment;

[0020] Figure 2 is a rear view structural diagram of a resistor attenuator in this embodiment;

[0021] Figure 3 is an exploded view of a resistor attenuator in this embodiment;

[0022] Figure 4 is a top view of a resistor attenuator in this embodiment.

[0023] Marks in the drawings and corresponding component names:

[0024] 1. Insulating substrate; 2. First conductor module; 3. Second conductor module; 4. First resistor plate; 5. Second resistor plate; 6. Third resistor plate; 7. First grounding module; 8. Second grounding module; 9. Hollow gap; 10. First conductor plate; 20. Second conductor plate; 30. Third conductor plate; 40. First grounding plate; 50. Second grounding plate; 60. Third grounding plate. Detailed implementation manners

[0025] The following describes exemplary embodiments of the present disclosure with reference to the accompanying drawings. Various details of the embodiments of the present disclosure are included to assist understanding, and they should be considered merely exemplary. Therefore, those of ordinary skill in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope of the present disclosure. Similarly, for clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0026] In the present disclosure, unless otherwise specified, the terms "first", "second", etc. are used to describe various elements and are not intended to limit the positional relationship, temporal relationship, or importance relationship of these elements. Such terms are only used to distinguish one element from another. In some examples, the first element and the second element may refer to the same instance of the element, and in certain cases, based on the context description, they may also refer to different instances.

[0027] The terms used in the description of various examples in the present disclosure are only for the purpose of describing specific examples and are not intended to be restrictive. Unless the context clearly indicates otherwise, if the number of elements is not specifically limited, the element may be one or more. In addition, the term "and / or" used in the present disclosure covers any one of the listed items and all possible combinations.

[0028] Embodiment

[0029] See Figures 1-4As shown in the figure, a resistor attenuator is shown. The resistor attenuator includes an insulating substrate 1, a first conductor module 2, a second conductor module 3, a first resistor plate 4, a second resistor plate 5, a third resistor plate 6, a first grounding module 7 and a second grounding module 8. The insulating substrate 1 is made of alumina ceramic, and the first grounding plate 40, the second grounding plate 50 and the third grounding plate 60 are all made of silver plates. The first conductor module 2, the second conductor module 3 and the first resistor plate 4 are all arranged on the top surface of the insulating substrate 1. The first grounding module 7 and the second grounding module 8 are respectively arranged on opposite sides of the insulating substrate 1, and the first grounding module 7 is connected to the first conductor module 2 through the second resistor plate 5, and the second grounding module 8 is connected to the second conductor module 3 through the third resistor plate 6. The first conductor module 2 and the second conductor module 3 are respectively fixedly connected to opposite sides of the first resistor plate 4. The first conductor module 2 and the second conductor module 3 are centrosymmetrically arranged with the center of the top surface of the first resistor plate 4 as the symmetric point. The first conductor module 2 and the second conductor module 3 both include a first conductor plate 10, a second conductor plate 20 and a third conductor plate 30. The cross-section of the first conductor plate 10 is L-shaped. The first conductor plate 10 has a first inner wall and a second inner wall. One side of the second conductor plate 20 is in contact with the first inner wall of the first conductor plate 10, and the side of the second conductor plate 20 away from the first inner wall is in contact with one side of the third conductor plate 30. A hollow gap 9 is formed between the first conductor plate 10, the second conductor plate 20 and the third conductor plate 30. The width of the hollow gap 9 is the same as the width of the second conductor plate 20, and the length of the hollow gap 9 is the same as the distance between the second conductor plate 20 and the second inner wall. The width range of the second conductor plate 20 is 0.4 - 0.7 mm, and the distance between the second conductor plate 20 and the second inner wall is 0 - 1.1 mm.

[0030] Specifically, by using the hollow gap 9 formed between the first conductor plate 10, the second conductor plate 20 and the third conductor plate 30, the signal interference between the conductor plates can be reduced, which helps to keep the attenuation degree of the resistor attenuator stable, and enables the overall resistor attenuator to have higher frequency characteristics and ensure the reliability of power. By adjusting the width and length of the hollow gap 9 with the second conductor plate 20, it is convenient to adjust according to resistor attenuators with different attenuation degrees to meet the use of resistor attenuators with different attenuation degrees. By adjusting the resistance value of the first resistor plate 4, the attenuation degree of the resistor attenuator can be adjusted within the range of 1 - 20 dB.

[0031] Further, the first resistor plate 4 is disposed in the middle of the top surface of the insulating substrate 1. Two first conductor plates 10 are respectively in contact with two opposite sides of the first resistor plate 4. The first grounding module 7 and the second grounding module 8 are respectively fixedly installed on two opposite sides of the insulating substrate 1. One side of the second resistor plate 5 is connected to one side of the first conductor plate 10 in the first conductor module 2, and the side of the second resistor plate 5 away from the first conductor module 2 is connected to the first grounding module 7. One side of the third resistor plate 6 is connected to one side of the first conductor plate 10 in the second conductor module 3, and the side of the third resistor plate 6 away from the second conductor module 3 is connected to the second grounding module 8.

[0032] Specifically, in this embodiment, through the second resistor plate 5 and the third resistor plate 6, it is convenient for the first grounding module 7 and the second grounding module 8 to be respectively connected to the first conductor module 2 and the second conductor module 3, so that the first conductor module 2 and the second conductor module 3 are grounded, avoiding damage to the resistor attenuator caused by overheating.

[0033] Further, the resistance value adjustment range of the first resistor plate 4 is 5.8 - 247.4 Ω; the resistance value ranges of the second resistor plate 5 and the third resistor plate 6 are both 61.1 - 869.8 Ω.

[0034] Specifically, in this embodiment, by adjusting the resistance paste of the first resistor plate 4, the resistance value of the first resistor plate 4 is changed to adjust the attenuation degree of the resistor attenuator.

[0035] Further, the second resistor plate 5 and the third resistor plate 6 can be horizontally moved.

[0036] Specifically, in this embodiment, by horizontally moving the second resistor plate 5 and the third resistor plate 6, the contact connection between the second resistor plate 5 and the third resistor plate 6 and the first grounding module 7 and the second contact module is changed, facilitating further increasing the stability of the attenuation degree of the resistor attenuator.

[0037] Further, both the first grounding module 7 and the second grounding module 8 include a first grounding plate 40 and a second grounding plate 50. The first grounding plate 40 is fixedly installed on the side wall of the insulating substrate 1, the second grounding plate 50 is fixedly installed on the edge of the top surface of the insulating substrate 1, and the first grounding plate 40 is connected to the second grounding plate 50. A third grounding plate 60 is fixedly installed at the bottom of the insulating substrate 1, and the third grounding plate 60 is connected to the two first grounding plates 40.

[0038] Working principle: Connect the circuit input terminal and the circuit output terminal to the third conductor plate 30 on both sides, connect the resistor attenuator to the circuit to conduct, and the circuit signal will be transmitted through the third conductor plate 30, the second conductor plate 20 and the first conductor plate 10 on one side to the first resistor plate 4 for power attenuation, and the attenuated signal will be output after passing through the first conductor plate 10, the second conductor plate 20 and the third conductor plate 30 on the other side.

[0039] The specific implementation manners described above have further elaborated on the purpose, technical solution and beneficial effects of the present utility model. It should be understood that the above are only the specific implementation manners of the present utility model and are not used to limit the protection scope of the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A resistor attenuator, characterized in that, The described resistor attenuator includes an insulating substrate (1), a first conductor module (2), a second conductor module (3), a first resistor plate (4), a second resistor plate (5), a third resistor plate (6), a first grounding module (7) and a second grounding module (8); the first conductor module (2), the second conductor module (3) and the first resistor plate (4) are all arranged on the top surface of the insulating substrate (1), the first grounding module (7) and the second grounding module (8) are respectively arranged on both sides of the insulating substrate (1), and the first grounding module (7) is connected to the first conductor module (2) through the second resistor plate (5), and the second grounding module (8) is connected to the second conductor module (3) through the third resistor plate (6); the first conductor module (2) and the second conductor module (3) are respectively arranged on opposite sides of the first resistor plate (4), and both the first conductor module (2) and the second conductor module (3) include a first conductor plate (10), a second conductor plate (20) and a third conductor plate (30); the cross-section of the first conductor plate (10) is L-shaped, the first conductor plate (10) has a first inner side wall and a second inner side wall, one side of the second conductor plate (20) is in contact with the first inner side wall of the first conductor plate (10), and the side of the second conductor plate (20) away from the first inner side wall is in contact with one side of the third conductor plate (30); a hollow gap (9) is formed between the first conductor plate (10), the second conductor plate (20) and the third conductor plate (30).

2. The resistive attenuator according to claim 1, characterized in that, The width of the hollow gap (9) is consistent with the width of the second conductor plate (20), and the length of the hollow gap (9) is consistent with the distance between the second conductor plate (20) and the second inner side wall.

3. The resistive attenuator according to claim 2, wherein The width range of the second conductor plate (20) is 0.4 - 0.7 mm, and the distance between the second conductor plate (20) and the second inner side wall is 0 - 1.1 mm.

4. A resistor attenuator according to claim 1, characterized in that The first resistor plate (4) is arranged in the middle of the top surface of the insulating substrate (1), two first conductor plates (10) are respectively in contact with opposite sides of the first resistor plate (4), the first grounding module (7) and the second grounding module (8) are respectively arranged on opposite sides of the insulating substrate (1), one side of the second resistor plate (5) is connected to one side of the first conductor plate (10) in the first conductor module (2), and the side of the second resistor plate (5) away from the first conductor module (2) is connected to the first grounding module (7), one side of the third resistor plate (6) is connected to one side of the first conductor plate (10) in the second conductor module (3), and the side of the third resistor plate (6) away from the second conductor module (3) is connected to the second grounding module (8).

5. A resistor attenuator according to claim 1 or 4, characterized in that, The first conductor module (2) and the second conductor module (3) are centrosymmetrically arranged with the center of the top surface of the first resistor plate (4) as the symmetric point.

6. A resistor attenuator according to claim 1 or 4, characterized in that, The resistance value adjustment range of the first resistor plate (4) is 5.8 - 247.4 Ω; the resistance value ranges of the second resistor plate (5) and the third resistor plate (6) are both 61.1 - 869.8 Ω.

7. A resistor attenuator according to claim 1, characterized in that The second resistor plate (5) and the third resistor plate (6) can move horizontally.

8. A resistor attenuator according to claim 1 or 4, characterized in that, Both the first grounding module (7) and the second grounding module (8) include a first grounding plate (40) and a second grounding plate (50). The first grounding plate (40) is disposed on the sidewall of the insulating substrate (1), and the second grounding plate (50) is disposed at the top edge of the insulating substrate (1). The first grounding plate (40) is connected to the second grounding plate (50). A third grounding plate (60) is provided at the bottom of the insulating substrate (1), and the third grounding plate (60) is connected to the two first grounding plates (40).

9. The resistive attenuator according to claim 1, characterized in that, The insulating substrate (1) is made of alumina ceramic.

10. A resistance attenuator according to claim 8, characterized in that, The first grounding plate (40), the second grounding plate (50), and the third grounding plate (60) are all made of silver plates.

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