Thyristor assembly fixing structure and solid-state relay

Abstract

The utility model discloses a thyristor assembly fixing structure and a solid state relay, comprising a housing and a thyristor assembly, the housing is provided with an installation groove of the thyristor assembly, and the thyristor assembly is bonded and fixed in the installation groove. According to the utility model, the connection mode of the thyristor assembly and the housing is simple, the cost is low, and the assembly automation of the thyristor assembly is convenient to realize.

Description

Technical Field

[0001] The utility model relates to the technical field of relays, in particular to a fixing structure for a thyristor component and a solid-state relay. Background Art

[0002] A solid-state relay is a contactless switch composed of a microelectronic circuit, discrete electronic devices, power electronic power devices, etc. Among them, a thyristor component (also known as a silicon controlled rectifier chip component) is one of the important components of a solid-state relay. At present, it is generally fixedly connected to the housing structure of the solid-state relay by a fastener or a snap structure. However, this connection method has the following disadvantages: the method using fasteners has a high material cost and is not conducive to realizing automatic assembly; the method using a snap structure has a relatively complex structure, a high mold opening cost, and is also not conducive to realizing automatic assembly. Content of the Utility Model

[0003] Aiming at the technical problems existing in the prior art, the utility model provides a fixing structure for a thyristor component and a solid-state relay, which is beneficial to reducing the production cost and facilitating the automatic assembly of the thyristor component.

[0004] The technical solution adopted by the utility model to solve its technical problems is: a fixing structure for a thyristor component, including a housing and a thyristor component. The housing is provided with an installation groove for the thyristor component, and the thyristor component is adhesively fixed in the installation groove.

[0005] Further, the installation groove is a through groove structure.

[0006] Further, the peripheral groove walls of the installation groove are provided with limiting step surfaces, and the limiting step surfaces face the same side as the back surface of the thyristor component. The four peripheral edges of the front surface of the thyristor component are adhesively bonded to the limiting step surfaces through an adhesive layer; the adhesive layer is a glue layer.

[0007] Further, it further includes a radiator component, and the radiator component is connected to the housing and cooperates with the back side of the thyristor component.

[0008] Further, a heat conduction layer is arranged between the radiator component and the thyristor component, so that the heat generated by the thyristor component is conducted to the radiator component through the heat conduction layer.

[0009] Further, the heat conduction layer is coated on the back surface of the thyristor component.

[0010] Further, the material of the heat conduction layer is heat-conducting silicone grease.

[0011] Further, the radiator component is locked to the housing by a plurality of screws.

[0012] The present utility model further provides a solid state relay, which includes the thyristor component fixing structure as described in the present utility model above.

[0013] Further, the housing is a lower housing, and further includes an upper housing, and the upper housing is connected to the lower housing up and down.

[0014] Compared with the prior art, the present utility model has the following beneficial effects:

[0015] 1. Since the housing is provided with the installation groove for the thyristor component, and the thyristor component is adhesively fixed in the installation groove, the connection mode between the thyristor component and the housing of the present utility model is simple, with low cost, and it is convenient to realize the automation of the assembly of the thyristor component.

[0016] 2. The installation groove is of a through groove structure, which is beneficial to improving the heat dissipation efficiency of the thyristor component. In particular, the thyristor component can be in close contact with the radiator component, so that the heat generated by the thyristor component can be quickly conducted to the radiator component for heat dissipation, and the heat dissipation efficiency is high.

[0017] The following further describes the present utility model in detail with reference to the drawings and embodiments; however, a thyristor component fixing structure and a solid state relay of the present utility model are not limited to the embodiments. Description of the Drawings

[0018] Figure 1 is the bottom view of the lower housing of the present utility model;

[0019] Figure 2 is Figure 1 the A-A sectional view of

[0020] Figure 3 is Figure 1 the B-B sectional view of

[0021] Figure 4 is the top view of the lower housing and the thyristor component of the present utility model in the combined state;

[0022] Figure 5 is Figure 4 the C-C sectional view of

[0023] Figure 6 is Figure 4 the D-D sectional view of

[0024] Figure 7 is the top view of the lower housing, the thyristor component, and the radiator component of the present utility model in the combined state;

[0025] Figure 8 is Figure 7 the E-E sectional view of

[0026] Figure 9 isFigure 7 F-F sectional view;

[0027] In the figure, 1 is the housing, 11 is the installation groove, 111 is the limiting step surface, 2 is the thyristor component, 3 is the radiator component, and 4 is the screw. Specific implementation manner

[0028] Please refer to Figures 1 - 9 As shown, a fixing structure for a thyristor component of the present utility model includes a housing 1 and a thyristor component 2. The housing 1 is provided with an installation groove 11 for the thyristor component 2, and the thyristor component 2 is adhesively fixed to the installation groove 11. The housing 1 is in a long strip shape, the installation groove 11 is roughly located in the middle of the housing 1, and the peripheral contour of the installation groove 11 is square. The shape and size of the peripheral contour of the thyristor component 2 match or are basically matched with the shape and size of the peripheral contour of the installation groove 11.

[0029] As a preferred structure, the above installation groove 11 is a through groove structure, that is, large openings are provided at both the upper and lower ends of the installation groove 11. The large opening at the upper end corresponds to the front of the thyristor component and is used to provide a space for the corresponding devices on the thyristor component 2. The large opening at the lower end corresponds to the back of the thyristor component 2, so that the heat generated by the operation of the thyristor component 2 can be dissipated outward through its back side.

[0030] As Figures 1 - 3 shown, in order to facilitate the fixation of the thyristor component 2, the peripheral groove walls of the installation groove 11 are provided with limiting step surfaces 111. The limiting step surfaces 111 face the same side as the back of the thyristor component 2. The four peripheral edges of the front of the thyristor component 2 are adhesively bonded to the limiting step surfaces 111 through an adhesive layer (not shown in the figure), as Figures 4 - 6 shown. Therefore, when assembling the thyristor component 2, the thyristor component 2 is inserted into the installation groove 11 from bottom to top. The adhesive layer is specifically a glue layer, but is not limited thereto. In other embodiments, the adhesive layer is a solid adhesive layer.

[0031] The present utility model further includes a radiator component 3. The radiator component 3 is connected to the housing 1 and is fitted to the back side of the thyristor component 2, so that the heat generated by the operation of the thyristor component 2 can be conducted to the radiator component 3, as Figures 7 - 9 shown. And, as a preferred method, a heat conduction layer (not shown in the figure) is provided between the radiator component 3 and the thyristor component 2, so that the heat generated by the thyristor component 2 can be quickly conducted to the radiator component 3 through the heat conduction layer. The material of the heat conduction layer is preferably thermal grease, but is not limited thereto. The heat conduction layer is coated on the back of the thyristor component 2. Of course, the heat conduction layer can also be coated on the side of the radiator component 3 facing the back of the thyristor component 2. In other embodiments, the back of the thyristor component 2 is in direct contact with the radiator component 3, or there is a certain air gap between the thyristor component 2 and the radiator component 3.

[0032] The above radiator assembly 3 is specifically fastened to the housing 1 by a plurality of screws 4. However, the connection manner between the radiator assembly 3 and the housing 1 is not limited thereto. In other embodiments, the radiator assembly 3 is connected to the housing 1 by means of snap connection or bonding.

[0033] For a fixed structure of a thyristor assembly of the present utility model, during assembly, first apply a circle of glue on the limiting step surface 111 of the installation groove 11 to form a glue layer. Then, place the four peripheral edges of the front surface of the thyristor assembly 2 on the glue layer. After the glue layer is cured, the fixed connection between the thyristor assembly 2 and the housing 1 is realized. Then, apply a heat-conducting layer on the back surface of the thyristor assembly 2 and make the heat-conducting layer substantially flush with the bottom end surface of the housing 1 to ensure that after connecting the radiator assembly 3, the heat-conducting layer can be attached to the corresponding surface of the radiator assembly. Finally, lock the radiator assembly 3 to the bottom end of the housing 1 with two screws 4. At this time, the radiator assembly 3 is attached to the bottom end surface of the housing 1 and the heat-conducting layer.

[0034] For a fixed structure of a thyristor assembly of the present utility model, it adopts the installation groove 11 and the bonding method to realize the fixed connection between the thyristor assembly 2 and the housing 1. The connection method is simple, the cost is low, and it is convenient to realize the automation of the assembly of the thyristor assembly 2. Particularly, the installation groove 11 is a through-groove structure, enabling the thyristor assembly 2 to directly contact the radiator assembly 3, and there is a certain gap between the thyristor assembly 2 and the radiator assembly 3 for filling thermal grease. The heat generated by the thyristor assembly 2 is conducted to the radiator assembly 3 through the thermal grease, which can greatly improve the heat dissipation efficiency of the thyristor assembly 2.

[0035] A solid-state relay of the present utility model includes the fixed structure of the thyristor assembly of the present utility model as described above. Specifically, the above housing 1 is the lower housing of the solid-state relay, and the solid-state relay further includes an upper housing, which is fixedly connected to the lower housing up and down.

[0036] For a fixed structure of a thyristor assembly and a solid-state relay of the present utility model, the parts not involved (such as other components and structures of the solid-state relay, working principles, etc.) are the same as those in the prior art or can be realized by using the prior art.

[0037] The above embodiments are only used to further illustrate a fixed structure of a thyristor assembly 2 and a solid-state relay of the present utility model. However, the present utility model is not limited to the embodiments. Any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present utility model all fall within the protection scope of the technical solution of the present utility model.

Claims

1. A fixing structure for a thyristor component, comprising a housing and a thyristor component, characterized in that: The housing is provided with an installation groove for the thyristor component, and the thyristor component is adhesively fixed in the installation groove; The installation groove is of a through-groove structure; the peripheral groove walls of the installation groove are provided with limiting stepped surfaces, and the limiting stepped surfaces and the back surface of the thyristor component face the same side. The four peripheral edges of the front surface of the thyristor component are adhesively bonded to the limiting stepped surfaces through an adhesive layer.

2. The thyristor component fixing structure according to claim 1, wherein: The adhesive layer is a glue layer.

3. The thyristor component fixing structure according to claim 1 or 2, characterized in that: It further includes a radiator component, which is connected to the housing and cooperates with the back side of the thyristor component.

4. The thyristor component fixing structure according to claim 3, characterized in that: A heat-conducting layer is arranged between the radiator component and the thyristor component, so that the heat generated by the thyristor component is conducted to the radiator component through the heat-conducting layer.

5. The thyristor component fixing structure according to claim 4, characterized in that: The heat-conducting layer is coated on the back surface of the thyristor component.

6. The thyristor component fixing structure according to claim 4 or 5, characterized in that: The material of the heat-conducting layer is heat-conducting silicone grease.

7. The thyristor component fixing structure according to claim 3, characterized in that: The radiator component is fastened to the housing by a plurality of screws.

8. A solid-state relay, characterized in that: It includes a thyristor component fixing structure according to any one of claims 1-7.

9. The solid state relay according to claim 8, wherein: The housing is a lower housing, and it further includes an upper housing, and the upper housing and the lower housing are connected up and down.

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