Camera electric control assembly, camera and imaging system

Abstract

The utility model provides a camera electric control assembly, camera and imaging system, relate to camera technical field, camera electric control assembly includes substrate, heat conduction support, pinboard and mainboard, be equipped with cooling structure in the substrate, heat conduction support includes mutually connected first heat conduction plate and second heat conduction plate, first heat conduction plate is attached to one side surface of substrate, and second heat conduction plate is attached to the other side surface of substrate. The second heat-conducting plate extends in a direction away from the substrate relative to the first heat-conducting plate; the adapter plate is arranged on one side of the substrate; the mainboard is attached to the second heat conducting plate and electrically connected with the adapter plate. Compared with the prior art, heat of the mainboard is transmitted to the substrate through the heat conduction support and is taken away by the cooling structure in the substrate, good heat dissipation of the mainboard is achieved, meanwhile, the heat conduction support is designed in a bent mode, three-dimensional installation of the adapter plate, the heat conduction support and the mainboard is achieved, occupied space is small, the internal structure is simplified, and cost is reduced. The integration level of the assembly is improved, and miniaturization of the camera is facilitated.

Description

Technical Field

[0001] The utility model relates to the field of imaging technology, and more particularly to a camera electronic control component, a camera and an imaging system. Background Art

[0002] Due to the operation of internal electronic components, a camera will generate heat, which will lead to noise. The appearance of noise will affect the imaging effect of the camera. Therefore, it is necessary to cool and dissipate heat from the camera. At the same time, with the industrial application of cameras in multiple scenarios, the size of cameras is developing towards miniaturization and integration. However, due to the internal electronic control structure of existing cameras, the camera volume is relatively large, which cannot meet the requirements of industrial integration. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a camera electronic control component, a camera and an imaging system, which can adopt a three-dimensional assembly, occupy a small space, simplify the internal structure, improve the integration degree of the component, facilitate the miniaturization of the camera, and at the same time reduce the space required for heat dissipation, and can ensure good heat dissipation for electronic control devices.

[0004] The embodiments of the utility model are implemented as follows:

[0005] In a first aspect, the utility model provides a camera electronic control component, including:

[0006] A substrate, in which a cooling structure is arranged;

[0007] A heat conducting bracket, which includes a first heat conducting plate and a second heat conducting plate connected to each other. The first heat conducting plate is attached to one side surface of the substrate and close to the cooling structure, and the second heat conducting plate extends away from the substrate on the side surface opposite to the substrate;

[0008] An adapter board, which is arranged on the same side of the substrate where the first heat conducting plate is attached;

[0009] A main board, which is arranged on the second heat conducting plate and electrically connected to the adapter board.

[0010] In an optional embodiment, the structure profile formed by the connection of the first heat conducting plate and the second heat conducting plate is L-shaped or T-shaped; and / or

[0011] The first heat conducting plate and the second heat conducting plate are integrally formed; and / or

[0012] The cooling structure includes a water cooling channel, which is distributed in a snake shape in the substrate; and / or

[0013] The adapter board is arranged around the outside of the first heat conducting plate.

[0014] In an alternative embodiment, support columns are provided around the adapter board, and the support columns are connected to the substrate so that the adapter board is spaced apart from the substrate.

[0015] In an alternative embodiment, an avoidance opening is formed in the middle of the adapter board. The avoidance opening corresponds to the first heat conducting plate, and the first heat conducting plate is disposed in the avoidance opening and exposed outside the adapter board through the avoidance opening.

[0016] In a second aspect, the present invention provides a camera, including a main body shell, an imaging unit, and the aforementioned camera electronic control assembly. The main body shell is connected to the substrate and together encloses an electronic control sealed cavity. The heat conducting bracket, the adapter board, and the main board are all disposed in the electronic control sealed cavity, and the imaging unit is disposed on a side of the substrate away from the electronic control sealed cavity.

[0017] In an alternative embodiment, an optical signal connector and an electrical signal connector are provided on an end face of the main body shell away from the substrate. The optical signal connector penetrates through the main body shell, and an end of the optical signal connector extending into the electronic control sealed cavity is electrically connected to the main board. The electrical signal connector penetrates through the main body shell, and an end of the electrical signal connector extending into the electronic control sealed cavity is electrically connected to the main board.

[0018] In an alternative embodiment, the imaging unit includes a protective shell and an imaging assembly. The protective shell is disposed on a side of the substrate away from the electronic control sealed cavity and encloses an imaging sealed cavity with the substrate. The imaging assembly is disposed in the imaging sealed cavity and on the substrate.

[0019] In an alternative embodiment, the imaging assembly includes an image sensor, a sensor board, and a heat conducting member. The heat conducting member is disposed on a side of the substrate away from the adapter board. The sensor board is disposed on a side of the heat conducting member away from the substrate. The image sensor is disposed on the sensor board. A flexible circuit board is disposed at an edge of the sensor board, and the flexible circuit board is electrically connected to the adapter board.

[0020] In a third aspect, the present invention provides an imaging system, including a control box, a feedthrough flange, and the camera as described in the foregoing embodiments. The camera is connected to one side of the feedthrough flange, and the control box is connected to the other side of the feedthrough flange.

[0021] In an alternative embodiment, a feedthrough socket and an optical fiber vacuum feedthrough are provided on the feedthrough flange. The feedthrough socket is used for electrically connecting to the electrical signal connector on the main body shell, and the optical fiber vacuum feedthrough is used for electrically connecting to the optical signal connector on the main body shell.

[0022] The beneficial effects of the embodiments of the present utility model are as follows:

[0023] For the camera electronic control assembly provided by the embodiments of the present utility model, a cooling structure is arranged inside the substrate. The first heat conducting plate of the heat conducting bracket is attached to one side surface of the substrate, and the second heat conducting plate extends in a direction away from the substrate. At the same time, the adapter board is arranged on one side of the substrate, and the main board is attached to the second heat conducting plate and electrically connected to the adapter board. Compared with the prior art, the present utility model adopts the mutually connected first heat conducting plate and second heat conducting plate. The first heat conducting plate is attached to the substrate, and the main board is arranged on the second heat conducting plate, which can enable the heat generated by the main board to be transferred to the substrate through the second heat conducting plate and the first heat conducting plate, and taken away by the cooling structure inside the substrate, achieving good heat dissipation for the main board. The design of the mutual connection between the first heat conducting plate and the second heat conducting plate of the heat conducting bracket realizes the three-dimensional installation of the adapter board, the heat conducting bracket, and the main board, occupies a small space, simplifies the internal structure, improves the integration of the assembly, and is beneficial to the miniaturization of the camera. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0025] Figure 1 It is a schematic structural diagram of the camera electronic control assembly provided by the embodiments of the present utility model;

[0026] Figure 2 It is an exploded view of the internal structure of the camera electronic control assembly provided by the embodiments of the present utility model;

[0027] Figure 3 It is a structural sectional view of the camera according to the embodiments of the present utility model;

[0028] Figure 4 It is an overall structure diagram of the camera according to the embodiments of the present utility model;

[0029] Figure 5 It is Figure 3 a schematic diagram of the imaging component of the camera in

[0030] Figure 6 It is a schematic diagram of the imaging system provided by the embodiments of the present utility model;

[0031] Figure 7 It is Figure 6 a schematic structural diagram of the feedthrough flange in

[0032] Figure 8 It isFigure 6 Schematic diagram of the middle control box.

[0033] Icon:

[0034] 100 - Camera electronic control component; 110 - Substrate; 111 - Electrical socket; 112 - Water - cooling channel; 120 - Heat - conducting bracket; 121 - First heat - conducting plate; 122 - Second heat - conducting plate; 130 - Adapter board; 131 - Support column; 132 - Avoidance opening; 140 - Main board; 150 - Main body shell; 151 - Optical signal connector; 152 - Electrical signal connector; 153 - Water - cooling pipeline; 200 - Camera; 210 - Protective shell; 220 - Imaging component; 221 - Image sensor; 222 - Sensor board; 223 - Heat - conducting part; 224 - Semiconductor refrigeration chip; 225 - Pressing plate; 226 - First elastic part; 227 - Connecting part; 228 - Second elastic part; 229 - Connection guiding seat; 300 - Imaging system; 310 - Control box; 311 - Shell; 312 - Power switch; 313 - Fiber - optic interface; 314 - Trigger interface; 315 - Second aviation socket; 316 - Ventilation hole; 320 - Feed - through flange; 321 - Feed - through socket; 322 - Fiber - optic vacuum feed - through; 323 - Water - pipe joint; 324 - Quick connector; 325 - Accommodating shell; 326 - First aviation socket. Specific embodiments

[0035] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some but not all of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model claimed, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0037] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0038] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation to the present utility model. In addition, terms such as "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0039] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0040] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0041] Please refer to Figure 1 and Figure 2 , the embodiment of the present utility model provides a camera electronic control assembly 100, which adopts a three-dimensional assembly, occupies a small space, simplifies the internal structure, improves the integration degree of the assembly, and is beneficial to the miniaturization of the camera 200.

[0042] The camera electronic control assembly 100 provided by the embodiment of the present utility model includes a substrate 110, a heat conduction bracket 120, an adapter board 130 and a main board 140. An electrical socket 111 is provided on the substrate 110, and a cooling structure is provided inside the substrate 110. The heat conduction bracket 120 includes a first heat conduction plate 121 and a second heat conduction plate 122 which are connected to each other. The first heat conduction plate 121 is attached to one side surface of the substrate 110 and close to the cooling structure, and the second heat conduction plate 122 extends by bending in a direction away from the one side surface of the substrate 110 relative to the substrate 110; the adapter board 130 is arranged on the same side of the substrate 110 where the first heat conduction plate 121 is attached, and is arranged around the first heat conduction plate 121 and the second heat conduction plate 122, and the adapter board 130 is electrically connected to the electrical socket 111; the main board 140 is attached to the second heat conduction plate 122 and is electrically connected to the adapter board 130.

[0043] It should be noted that the camera electronic control component 100 here is applicable to the vacuum refrigeration camera 200. The electrical socket 111 on the substrate 110 is a glass electrical signal connector and is electrically connected to the imaging component 220 on the other side of the substrate 110 to achieve signal transmission and control. In this embodiment, the first heat conduction plate 121 and the second heat conduction plate 122 are arranged in a bent shape. The first heat conduction plate 121 is attached to the substrate 110, and the main board 140 is arranged on the second heat conduction plate 122, which can make the heat generated by the main board 140 be transferred to the substrate 110 through the second heat conduction plate 122 and the first heat conduction plate 121, and be taken away by the cooling structure in the substrate 110, realizing good heat dissipation of the main board 140. The adapter board 130 is arranged around the first heat conduction plate 121, and the heat conduction bracket 120 adopts a bent design, realizing a three-dimensional installation of the adapter board 130, the heat conduction bracket 120 and the main board 140, occupying a small space, simplifying the internal structure, improving the integration of the components, and being beneficial to the miniaturization of the camera 200.

[0044] In some embodiments, the structural section formed by the connection of the first heat conduction plate 121 and the second heat conduction plate 122 is L-shaped. Specifically, the first heat conduction plate 121 is attached to the surface of the substrate 110, and the second heat conduction plate 122 is located at the edge of the first heat conduction plate 121 and bends and extends in a direction perpendicular to the substrate 110. The main board 140 is attached to the second heat conduction plate 122 and can maintain a vertical posture to realize plugging into the adapter board 130.

[0045] In some embodiments, the structural section formed by the connection of the first heat conduction plate 121 and the second heat conduction plate 122 is T-shaped. Specifically, the first heat conduction plate 121 is attached to the surface of the substrate 110, and the second heat conduction plate 122 is located in the middle of the first heat conduction plate 121 and bends and extends in a direction perpendicular to the substrate 110. The main board 140 is attached to the second heat conduction plate 122 and can maintain a vertical posture to realize plugging into the adapter board 130.

[0046] It should be noted that the structural cross-section formed by the connection of the first heat conduction plate 121 and the second heat conduction plate 122 here is L-shaped, which means that the first heat conduction plate 121 and the second heat conduction plate 122 form a roughly L-shaped structure. For example, the first heat conduction plate 121 and the second heat conduction plate 122 can be perpendicular to each other. And when the structural cross-section formed by the connection of the first heat conduction plate 121 and the second heat conduction plate 122 here is T-shaped, it means that the first heat conduction plate 121 and the second heat conduction plate 122 form a roughly T-shaped structure. The first heat conduction plate 121 can be bonded to the surface of the substrate 110 through thermal grease, and the main board 140 can also be bonded to the second heat conduction plate 122 through thermal grease. When bonding between the main board 140 and the second heat conduction plate 122, the position can be adjusted according to the insertion position of the main board 140. Preferably, during actual installation, the adapter board 130 can be fixed first, then the main board 140 is bonded to the second heat conduction plate 122, and the first heat conduction plate 121 is bonded and fixed to the substrate 110. During this process, the position of the main board 140 is adjusted so that the main board 140 can be smoothly inserted into the socket on the adapter board 130.

[0047] In some embodiments, the first heat conduction plate 121 and the second heat conduction plate 122 are integrally bent and formed, and a copper plate structure can be adopted, with high heat conduction efficiency. Of course, in other preferred embodiments, the first heat conduction plate 121 and the second heat conduction plate 122 can also be separately manufactured and fixed together by welding or bonding with thermal glue, which can also achieve good heat conduction effects.

[0048] In some embodiments, the cooling structure includes a water cooling channel 112, and the water cooling channel 112 is distributed in a serpentine shape in the substrate 110, so as to evenly dissipate heat from the substrate 110.

[0049] In some embodiments, support columns 131 are provided around the adapter board 130, and the support columns 131 are connected to the substrate 110 to space the adapter board 130 from the substrate 110. Specifically, the adapter board 130 can be rectangular, and support columns 131 are provided around the adapter board 130. The support columns 131 are fixedly connected to the substrate 110, so that the adapter board 130 is spaced from the substrate 110, avoiding electrical interference of the substrate 110 on the adapter board 130. At the same time, a socket is provided on the adapter board 130, and pins are provided on the main board 140. The pins are inserted into the socket, which can ensure good electrical contact between the main board 140 and the adapter board 130.

[0050] In some embodiments, an avoidance opening 132 is formed in the middle of the adapter board 130. The avoidance opening 132 corresponds to the first heat conducting plate 121, and the first heat conducting plate 121 is exposed outside the adapter board 130 through the avoidance opening 132. Specifically, the avoidance opening 132 is rectangular, so that the adapter board 130 is arranged in a ring shape on the substrate 110 and encloses to form the avoidance opening 132. During installation, the first heat conducting plate 121 can be inserted into the substrate 110 from the avoidance opening 132 and attached to the surface of the substrate 110. At the same time, the second heat conducting plate 122 can extend out of the avoidance opening 132, and the size of the avoidance opening 132 is larger than that of the first heat conducting plate 121, so that the first heat conducting plate 121 can be exposed outside the adapter board 130.

[0051] It should be noted that here, the first heat conducting plate 121 and the avoidance opening 132 are concentrically arranged, and the fact that the first heat conducting plate 121 is exposed outside the adapter board 130 through the avoidance opening 132 means that the projection of the first heat conducting plate 121 on the substrate 110 is spaced from the projection of the adapter board 130 on the substrate 110, and the first heat conducting plate 121 is exactly within the opening range of the avoidance opening 132, which is convenient for the first heat conducting plate 121 to be mounted.

[0052] See Figures 3 to 5 As shown in, an embodiment of the present invention further provides a camera 200, including a main body shell, an imaging unit, and the aforementioned camera electronic control assembly. The camera electronic control assembly 100 includes a substrate 110, a heat conducting bracket 120, an adapter board 130, and a main board 140. An electrical socket 111 is provided on the substrate 110. The heat conducting bracket 120 includes a first heat conducting plate 121 and a second heat conducting plate 122 which are integrally arranged. The first heat conducting plate 121 is attached to one side surface of the substrate 110, and the second heat conducting plate 122 is bent and extended in a direction away from the substrate 110 relative to the first heat conducting plate 121. The adapter board 130 is arranged on one side of the substrate 110 and is arranged in a ring around the first heat conducting plate 121 and the second heat conducting plate 122, and the adapter board 130 is electrically connected to the electrical socket 111. The main board 140 is attached to the second heat conducting plate 122 and is electrically connected to the adapter board 130. The main body shell 150 is connected to the substrate 110 and together encloses an electronic control sealing cavity. The heat conducting bracket 120, the adapter board 130, and the main board 140 are all arranged in the electronic control sealing cavity, and the imaging unit is arranged on the side of the substrate 110 away from the electronic control sealing cavity. Specifically, the main body shell 150 can be hermetically installed on one side of the substrate 110 through a metal wire. The metal wire can be an indium wire or a silver wire, and the electronic control sealing cavity can accommodate the heat conducting bracket 120, the adapter board 130, and the main board 140, so as to protect the electronic control cavity through the main body shell 150 and provide a sealed accommodation space.

[0053] In some embodiments, an optical signal connector 151 and an electrical signal connector 152 are provided on the end face of the main body housing 150 away from the substrate 110. The optical signal connector 151 is provided through the main body housing 150, and one end of the optical signal connector 151 extending into the electronic control sealing cavity is connected to the main board 140 through a jumper wire. The electrical signal connector 152 is provided through the main body housing 150, and one end of the electrical signal connector 152 extending into the electronic control sealing cavity is connected to the main board 140 through a cable. Specifically, the optical signal connector 151 is a vacuum fiber feedthrough, and the electrical signal connector 152 is a glass sintered socket. The vacuum fiber feedthrough and the glass sintered socket are installed on the main body housing 150, and both the vacuum fiber feedthrough and the glass sintered socket are sealed with the main body housing 150 by metal wires. One end of the vacuum fiber feedthrough inside the main body housing 150 is connected to the main board 140 through an optical fiber jumper wire for transmitting the image information of the camera 200. One end of the glass sintered socket inside the housing is connected to the main board 140 through a cable to supply power to the main board 140 and communicate trigger signals.

[0054] It should be noted that here the electrical signal connector 152 can also be a ceramic sintered socket, and the optical signal connector can also be a glass sintered plug or a ceramic sintered plug, which can achieve the transmission of optical signals and electrical signals while meeting the sealing requirements.

[0055] In some embodiments, a water cooling pipeline 153 is further provided on the main body housing 150, and a water cooling channel 112 is provided in the substrate 110. One end of the water cooling pipeline 153 extends out of the main body housing 150, and the other end of the water cooling pipeline 153 communicates with the water cooling channel 112. Specifically, the water cooling pipeline 153 is embedded in the main body housing 150, and one end of the water cooling pipeline 153 is joined to the substrate 110 and connected to the water cooling channel 112. The other end extends out of the end face of the main body housing 150 in the direction away from the substrate 110 and is provided with a water cooling joint, which is used to connect with an external pipeline to realize the transportation of cooling water. By designing the water cooling structure, the cooling of the substrate 110 can be realized, and then the heat on the heat conduction support 120 and the main board 140 can be taken away to achieve overall heat dissipation.

[0056] Furthermore, the camera 200 further includes a protective housing 210 and an imaging component 220. The protective housing 210 is provided on the side of the substrate 110 away from the adapter board 130, and an imaging sealing cavity is formed by enclosing with the protective housing 210. The imaging component 220 is provided in the imaging sealing cavity, is provided on the substrate 110, and is electrically connected to the electrical socket 111. Specifically, the protective housing 210 and the main body housing 150 are respectively provided on both sides of the substrate 110, and the protective housing 210 can also be hermetically connected to the substrate 110 by metal wires, thereby forming an imaging sealing cavity to accommodate the imaging component 220 and providing a sealed space.

[0057] The imaging component 220 includes an image sensor 221, a sensor board 222, and a heat conducting member 223. The heat conducting member 223 is disposed on the side of the substrate 110 away from the adapter board 130. The sensor board 222 is disposed on the side of the heat conducting member 223 away from the substrate 110. The image sensor 221 is disposed on the sensor board 222. A flexible printed circuit board is disposed at the edge of the sensor board 222 and is connected to the electrical socket 111. Specifically, a transparent plate is hermetically disposed on the end face of the protective case 210 away from the substrate 110. The transparent plate corresponds to the image sensor 221, so that external light can be introduced into the image sensor 221 to achieve imaging. The image sensor 221 is plugged into the sensor board 222. A heat conducting block is disposed in the middle of the heat conducting member 223, and the heat conducting block is in contact with the image sensor 221 to achieve heat conduction. One end of the flexible printed circuit board is plugged into the sensor board 222, and the other end is plugged into the electrical socket 111 of the substrate 110, realizing signal transmission, so that the flexible printed circuit board can be electrically connected to the adapter board 130. Moreover, the use of the flexible printed circuit board and the sensor board 222 also makes the integration degree of the imaging component 220 higher, saves the occupied space, and simplifies the imaging structure.

[0058] Further, the imaging component 220 further includes a thermoelectric cooler 224. The thermoelectric cooler 224 is disposed on the substrate 110 and is in contact with and disposed on the side of the heat conducting member 223 away from the image sensor 221 for dissipating heat from the heat conducting member 223. Specifically, the thermoelectric cooler 224 has a cooling surface and a heat dissipation surface. The cooling surface is in contact with the surface of the heat conducting member 223 to cool the heat conducting member 223, so that the heat conducting member 223 can more effectively take away the heat generated by the image sensor 221. The heat dissipation surface is in contact with the surface of the substrate 110. By providing the thermoelectric cooler 224, the heat conduction ability of the heat conducting member 223 can be improved, which is beneficial to improving the heat dissipation effect.

[0059] Further, on the side of the image sensor 221 away from the substrate 110, a pressing plate 225 is further disposed. The pressing plate 225 presses on the image sensor 221 to ensure that the image sensor 221 is in close contact with the heat conducting block. And an imaging window that partially exposes the image sensor 221 is disposed in the middle of the pressing plate 225.

[0060] In some embodiments, a first elastic member 226 is provided between the sensor board 222 and the heat conducting member 223. A connecting member 227 is further provided at the edge of the heat conducting member 223. A second elastic member 228 is provided between the connecting member 227 and the pressing plate 225. The first elastic member 226 is configured to provide an elastic force away from the heat conducting member 223 to the sensor board 222, and the second elastic member 228 is configured to provide an elastic force close to the heat conducting member 223 to the pressing plate 225. By adding the first elastic member 226 and the second elastic member 228, the first elastic member 226 presses the sensor board 222 towards the image sensor 221, so that the image sensor 221 can be tightly inserted into the sensor board 222. At the same time, the second elastic member 228 presses the pressing plate 225 towards the heat conducting block, so that the pressing plate 225 can be pressed on the image sensor 221, and the image sensor 221 can be tightly attached to the surface of the heat conducting block. Therefore, a tight connection between the image sensor 221 and the heat conducting block and between the image sensor 221 and the sensor board 222 can be ensured simultaneously, thereby ensuring good signal transmission and heat conduction.

[0061] In some embodiments, a first avoidance hole for the heat conducting block to pass through is provided in the middle of the sensor board 222, and a second avoidance hole for the connecting member 227 to pass through is provided at the edge of the sensor board 222; the image sensor 221 is inserted into the sensor board 222, and the heat conducting block is attached to the image sensor 221. A connection guiding seat 229 is further provided at the edge of the heat conducting member 223. The first elastic member 226 includes a first spring, and the first spring is sleeved outside the connection guiding seat 229 and pressed between the sensor board 222 and the heat conducting member 223. One end of the connecting member 227 is detachably assembled in the connection guiding seat 229, and the other end passes through the sensor board 222 and the pressing plate 225 in sequence. The second elastic member 228 includes a second spring, and the second spring is sleeved on the part of the connecting member 227 that passes through the pressing plate 225 and pressed between the connecting member 227 and the pressing plate 225.

[0062] See Figure 6 and Figure 7, the embodiment of the present utility model further provides an imaging system 300, which includes a control box 310, a feedthrough flange 320, and the aforementioned camera 200. The camera 200 is connected to one side of the feedthrough flange, and the control box 310 is connected to the other side of the feedthrough flange 320. The camera 200 includes a protective shell 210, an imaging component 220, and the aforementioned camera electronic control component 100. The camera electronic control component 100 includes a substrate 110, a heat conduction bracket 120, an adapter board 130, and a main board 140. An electrical socket 111 is provided on the substrate 110. The heat conduction bracket 120 includes a first heat conduction plate 121 and a second heat conduction plate 122 integrally provided. The first heat conduction plate 121 is attached to one side surface of the substrate 110, and the second heat conduction plate 122 is bent and extended away from the substrate 110 relative to the first heat conduction plate 121. The adapter board 130 is disposed on one side of the substrate 110 and surrounds the first heat conduction plate 121 and the second heat conduction plate 122, and the adapter board 130 is electrically connected to the electrical socket 111. The main board 140 is attached to the second heat conduction plate 122 and is electrically connected to the adapter board 130. The protective shell 210 is disposed on the side of the substrate 110 away from the adapter board 130, and together with the protective shell 210, an imaging sealed cavity is formed. The imaging component 220 is disposed in the imaging sealed cavity, is disposed on the substrate 110, and the imaging component 220 is electrically connected to the electrical socket 111. Specifically, the protective shell 210 and the main body shell 150 are respectively disposed on both sides of the substrate 110, and the protective shell 210 can also be hermetically connected to the substrate 110 through a wire, thereby forming an imaging sealed cavity to accommodate the imaging component 220 and providing a sealed space.

[0063] In some embodiments, mounting openings are reserved on the feedthrough flange 320, and the feedthrough socket 321 and the fiber optic vacuum feedthrough 322 can be fixedly installed through the mounting openings. Specifically, the feedthrough socket 321 and the fiber optic vacuum feedthrough 322 are hermetically connected to the feedthrough flange 320 through wires. The feedthrough socket 321 is used for electrical connection in the vacuum chamber and can be electrically connected to the electrical signal connector 152. The fiber optic vacuum feedthrough 322 is used for light signals to pass through the vacuum cavity and can be electrically connected to the optical signal connector 151. At the same time, a metal-sealed water pipe joint 323 is also provided on the feedthrough flange 320. The metal-sealed water pipe joint 323 is installed on the feedthrough flange 320 in a welding form and is used for connecting the water cooling pipeline 153 in the vacuum chamber, that is, connecting to the pipe joint of the water cooling pipeline 153. A quick joint 324 is installed at the position corresponding to the metal-sealed water pipe joint 323 on the other side of the feedthrough flange 320 for connecting the water cooling pipeline 153 outside the vacuum chamber. An accommodating shell 325 is further provided on the outer side of the feedthrough flange 320. A first aviation socket 326 is installed on the accommodating shell 325 for electrical connection outside the vacuum. A cable is used to connect the first aviation socket 326 and the feedthrough socket 321.

[0064] In some embodiments, refer toFigure 8 The control box 310 includes a housing 311. The housing 311 houses a power supply and signal processing circuit for the camera 200, which is used for supplying power to the camera 200 and processing image signals. A power switch 312 is arranged on the panel of the housing 311 to control the power on and off of the camera 200. An optical fiber interface 313 is used to communicate with the camera 200 through an optical fiber. The USB3.0 interface is used to transmit signals such as images of the camera 200 to the host through a USB cable. A trigger interface 314 is used for external trigger signals to be input into the camera 200 and the trigger output of the camera 200. The second aviation socket 315 is used for supplying power to the camera 200 and transmitting signals. Ventilation holes 316 for heat dissipation are reserved on the side of the housing. An AC power socket is arranged on the rear cover plate of the housing to supply power to the control box 310.

[0065] In summary, for the camera electronic control assembly 100, the camera 200 and the imaging system 300 provided by the embodiments of the present invention, the first heat conducting plate 121 of the heat conducting bracket 120 is attached to one side surface of the substrate 110, and the second heat conducting plate 122 is bent and extended away from the substrate 110 relative to the first heat conducting plate 121. At the same time, the adapter plate 130 is arranged on one side of the substrate 110 and surrounds the first heat conducting plate 121 and the second heat conducting plate 122, and the adapter plate 130 is electrically connected to the electrical socket 111 on the substrate 110. The main board 140 is attached to the second heat conducting plate 122 and is electrically connected to the adapter plate 130. Compared with the prior art, the present invention uses the first heat conducting plate 121 and the second heat conducting plate 122 arranged in a bent manner. The first heat conducting plate 121 is attached to the substrate 110, and the main board 140 is arranged on the second heat conducting plate 122, which can make the heat generated by the main board 140 be transferred to the substrate 110 through the second heat conducting plate 122 and the first heat conducting plate 121. The adapter plate 130 surrounds the first heat conducting plate 121, and the heat conducting bracket 120 adopts a bent design, realizing a three-dimensional installation of the adapter plate 130, the heat conducting bracket 120 and the main board 140, occupying a small space, simplifying the internal structure, improving the integration of components, and being beneficial to the miniaturization of the camera 200.

[0066] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A camera electronic control component, characterized in that, Comprising: A substrate (110) with a cooling structure disposed therein; A heat-conducting bracket (120), the heat-conducting bracket (120) comprising a first heat-conducting plate (121) and a second heat-conducting plate (122) connected to each other, the first heat-conducting plate (121) being attached to one side surface of the substrate (110) and close to the cooling structure, and the second heat-conducting plate (122) extending away from the one side surface of the substrate (110); An adapter board (130) disposed on the same side of the substrate (110) where the first heat-conducting plate (121) is attached; A main board (140) disposed on the second heat-conducting plate (122) and electrically connected to the adapter board (130).

2. The camera electronic control component according to claim 1, wherein, The structure formed by the connection of the first heat-conducting plate (121) and the second heat-conducting plate (122) has an L-shaped or T-shaped cross-section; and / or The first heat-conducting plate (121) and the second heat-conducting plate (122) are integrally formed; and / or The cooling structure includes a water-cooling channel (112) which is serpentinely distributed in the substrate (110); and / or The adapter board is disposed around the outside of the first heat-conducting plate (121).

3. The camera electronic control component according to claim 1, characterized in that, Support columns (131) are provided around the adapter board (130), and the support columns (131) are connected to the substrate (110) to space the adapter board (130) from the substrate (110).

4. The camera electronic control component according to claim 1, characterized in that An avoidance opening (132) is formed in the middle of the adapter board (130), the avoidance opening (132) corresponds to the first heat-conducting plate (121), and the first heat-conducting plate (121) is disposed in the avoidance opening (132) and is exposed outside the adapter board (130) through the avoidance opening (132).

5. A camera, characterized in that, Comprising a main body shell (150), an imaging unit, and a camera electronic control assembly according to any one of claims 1-4, the main body shell (150) is connected to the substrate (110) and together encloses an electronic control sealed cavity, the heat-conducting bracket (120), the adapter board (130), and the main board (140) are all disposed in the electronic control sealed cavity, and the imaging unit is disposed on the side of the substrate (110) away from the electronic control sealed cavity.

6. The camera according to claim 5, wherein An optical signal connector (151) and an electrical signal connector (152) are provided on the end face of the main body shell (150) away from the substrate (110), the optical signal connector (151) is disposed through the main body shell (150), and one end of the optical signal connector (151) extending into the electronic control sealed cavity is electrically connected to the main board (140), the electrical signal connector (152) is disposed through the main body shell (150), and one end of the electrical signal connector (152) extending into the electronic control sealed cavity is electrically connected to the main board (140).

7. The camera according to claim 5, wherein The imaging unit includes a protective housing (210) and an imaging component (220). The protective housing (210) is disposed on a side of the substrate (110) away from the electrically controlled sealing cavity, and forms an imaging sealing cavity with the substrate (110). The imaging component (220) is disposed in the imaging sealing cavity and on the substrate (110).

8. The camera according to claim 7, wherein, The imaging component (220) includes an image sensor (221), a sensor board (222), and a heat conducting member (223). The sensor board (222) is disposed on a side of the heat conducting member (223) away from the substrate (110). The image sensor (221) is disposed on the sensor board (222). A flexible printed circuit board is disposed at an edge of the sensor board (222), and the flexible printed circuit board is electrically connected to the adapter board (130).

9. An imaging system, characterized in that, It includes a control box (310), a feedthrough flange (320), and the camera according to any one of claims 5-8. The camera is connected to one side of the feedthrough flange (320), and the control box (310) is connected to the other side of the feedthrough flange (320).

10. The imaging system according to claim 9, wherein The feedthrough flange (320) is provided with a feedthrough socket (321) and an optical fiber vacuum feedthrough (322). The feedthrough socket (321) is used for electrical connection with an electrical signal connector (152) on the main body housing (150), and the optical fiber vacuum feedthrough (322) is used for electrical connection with an optical signal connector (151) on the main body housing (150).

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