Circuit board capable of improving welding success rate

Abstract

A circuit board capable of improving the welding success rate comprises a circuit board a and a circuit board b, a welding groove is formed in the edge of one side of the circuit board a, the inner wall face, the upper side edge and the lower side edge of the welding groove are all coated with soldering paste, and a welding piece is fixedly arranged on the circuit board b and used for being welded and positioned with the welding groove. According to the circuit board structure, the soldering paste is coated on the three surfaces of the soldering groove of the circuit board a, so that pseudo soldering is not easy to occur when the soldering groove is welded with the soldering lug on the circuit board b, and the soldering success rate is improved.

Description

Technical Field

[0001] The utility model relates to a circuit board with improved welding success rate. Background Art

[0002] Printed circuit boards, also known as circuit boards, are made of polyimide or polyester film as a substrate. They are highly reliable and extremely flexible printed circuit boards with high wiring density, light weight, thin thickness, and good bendability. During the production process of printed circuit boards, solder paste is applied to the welding points to connect other components. In the existing circuit board structure, solder paste is mostly applied on one side of the welding surface at the welding point, which is prone to cold solder joints during subsequent welding. Utility Model Content

[0003] In view of the shortcomings existing in the above problems, the utility model provides a circuit board with improved welding success rate.

[0004] To achieve the above-mentioned purpose, the utility model provides a circuit board with improved welding success rate, comprising circuit board a and circuit board b. A welding groove is provided at one edge of the circuit board a, and the inner wall surface, upper edge and lower edge of the welding groove are coated with solder paste. A welding piece is fixed on the circuit board b for welding and positioning with the welding groove.

[0005] As a further improvement of the present invention, the welding groove is in an arc-shaped structure.

[0006] As a further improvement of the present invention, the width of the solder paste is greater than the width of the welding position, and the width of the solder paste matches the width of the welding sheet.

[0007] The beneficial effects of the utility model are:

[0008] The circuit board structure adopts the method of coating solder paste on three sides of the welding groove position of the circuit board a, so that the welding groove is not prone to cold welding when welding with the welding piece on the circuit board b, thereby improving the welding success rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a schematic diagram of the structure of a circuit board for improving the welding success rate of the utility model;

[0010] Figure 2 for Figure 1 AA section view.

[0011] In the figure: 1. Circuit board a; 11. Soldering groove; 12. Solder paste; 2. Circuit board b; 21. Soldering piece. DETAILED DESCRIPTION

[0012] like Figure 1-2As shown in the figure, a circuit board for improving the welding success rate according to the present utility model includes a circuit board a plate 1 and a circuit board b plate 2. A welding groove 11 is provided at one side edge of the circuit board a plate 1. The welding groove 11 has an arc-shaped structure. The inner wall surface, the upper side edge, and the lower side edge of the welding groove 11 are all coated with solder paste 12. A solder pad 21 is fixedly provided on the circuit board b plate 2 for welding and positioning with the welding groove 11. The width of the solder paste 12 is greater than the width of the welding position 11, and the width of the solder paste 12 matches the width of the solder pad 21.

[0013] By adopting the method of coating solder paste on three sides at the position of the welding groove of the circuit board a plate, the circuit board structure is not prone to false soldering when the welding groove is welded with the solder pad on the circuit board b plate, thus improving the welding success rate.

[0014] During specific use, for the convenience of understanding the present utility model, it is described in conjunction with the attached drawings;

[0015] During welding, the circuit board a plate and the circuit board b plate are stacked. The position of the welding groove corresponds to the solder pad. A high-temperature soldering iron is close to the welding groove. The solder paste coated on the welding groove melts. In addition to the solder paste on the lower side surface of the welding groove bonding with the solder pad, the melted solder paste on the inner wall surface and the upper side surface of the welding groove will also slide towards the solder pad, ensuring the stable connection between the welding groove and the solder pad and preventing false soldering, thereby improving the welding success rate.

[0016] The above is only the preferred embodiment of the present utility model and is not used to limit the present utility model. For those skilled in the art, the present utility model can have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A circuit board for improving the welding success rate, characterized in that: It includes a circuit board a (1) and a circuit board b (2). A soldering groove (11) is provided at one side edge of the circuit board a (1). Solder paste (12) is coated on the inner wall surface, the upper side edge and the lower side edge of the soldering groove (11). A solder tab (21) is fixedly provided on the circuit board b (2) for welding and positioning with the soldering groove (11).

2. The circuit board for improving the welding success rate according to claim 1, wherein: The soldering groove (11) is in an arc-shaped structure.

3. A circuit board for improving the welding success rate according to claim 1, characterized in that: The width of the solder paste (12) is greater than the width of the soldering position (11), and the width of the solder paste (12) matches the width of the solder tab (21).

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