Waterproof glue pouring shell structure
The waterproof sealing structure addresses sealant overflow issues by categorizing risk areas and using internal sealants and isolated compartments to maintain aesthetics and quality in multi-shell structures.
Patent Information
- Application Number
- CN202422347428.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-25
AI Technical Summary
Sealant is prone to overflow in the existing glue filling structure, resulting in a decrease in the aesthetics and texture of the product.
The multi-shell structure is divided into a low-overflow risk area and a high-overflow risk area. Apply the first sealant at the joints and set up an isolation bin at the device hole to fill the second sealant to avoid overflow of the sealant.
Improve the aesthetics and texture of the overall structure while keeping the waterproof performance unaffected.
Smart Images
Figure CN223110337U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of housing waterproofing, and particularly to a waterproof potting housing structure. Background Art
[0002] When a multi-housing structure has a waterproofing requirement, the sealing performance, safety, and reliability are improved by potting glue inside the multi-housing structure. The existing potting structure first assembles part of the housing, then potties glue inside this part of the housing, and then assembles the remaining housing, and applies sealant to the gap between the later-assembled housing and the previously-assembled part of the housing for sealing. This potting structure will cause sealant to overflow between adjacent housings, and between electronic devices / wires and the housing, reducing the overall aesthetics and resulting in a decrease in the product texture and competitiveness. Utility Model Content
[0003] Based on this, it is necessary to provide a waterproof potting housing structure to overcome the defects of easy sealant overflow and unsightly potting in the existing potting structure.
[0004] A waterproof potting housing structure includes a base, an upper housing and a lower housing detachably connected to the upper part of the base. A device hole is provided at the end connection of the lower housing and the upper housing. A first sealant is provided inside the lower housing around its connection with the base. An isolation chamber is provided at the end of the lower housing where the device hole is located, and the isolation chamber is filled with a second sealant.
[0005] As a preference of the waterproof potting housing structure in this utility model, a sealing ring is provided in the device hole between the lower housing and the upper housing.
[0006] As a preference of the waterproof potting housing structure in this utility model, the lower housing is of a frame structure.
[0007] As a preference of the waterproof potting housing structure in this utility model, the isolation chamber includes an isolation wall provided inside the end of the lower housing where the device hole is located. Both sides of the isolation wall are fixedly connected to the end of the lower housing where the device hole is not located. A bottom plate is provided at the bottom between the end of the lower housing where the device hole is located and the isolation wall. The end of the bottom plate is fixedly connected to the end of the lower housing where the device hole is located, the isolation wall, or the end of the lower housing where the device hole is not located.
[0008] As a preference of the waterproof potting housing structure in this utility model, a communication groove is provided at the position of the isolation wall corresponding to the device hole of the lower housing.
[0009] As a preference of the waterproof potting housing structure in this utility model, both the first sealant and the second sealant are silicone rubber-based glues.
[0010] Advantages of this utility model:
[0011] The utility model divides the multi - shell structure into a low glue overflow risk area and a high glue overflow risk area according to the size of the potential glue overflow risk. For the low glue overflow risk area, such as the joint between adjacent shells, the first sealant is applied from the inside; for the high glue overflow risk area, such as the device hole, an isolation chamber is arranged, and the second sealant is filled in the isolation chamber during the shell assembly process. By different arrangements for the low and high glue overflow areas, the effect of preventing the potting glue from overflowing is achieved, and the aesthetics and texture of the overall structure are improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following - described drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0013] Figure 1 It is a partial - structure exploded view of the shell structure in the embodiment of the present application;
[0014] Figure 2 It is a top view of the lower shell in the embodiment of the present application;
[0015] Figure 3 It is a top view of the upper shell in the embodiment of the present application;
[0016] DESCRIPTION OF THE REFERENCE NUMERALS:
[0017] 1. Base;
[0018] 2. Lower shell;
[0019] 3. Upper shell;
[0020] 4. Device hole;
[0021] 5. Isolation chamber; 51. Isolation wall; 52. Bottom plate; 53. Connecting groove;
[0022] 6. Sealing ring. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] In order to make the above - mentioned objects, features, and advantages of the present application more obvious and understandable, the following will give a detailed description of the specific embodiments of the present application with reference to the drawings. Many specific details are set forth in the following description to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein. Those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0024] In the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present application.
[0025] In addition, the terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.
[0026] In the present application, unless otherwise clearly specified and limited, the terms "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.
[0027] In the present application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0028] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only implementation.
[0029] Embodiment
[0030] This embodiment provides a waterproof potting housing structure, as Figure 1 shown, including a base 1, a lower housing 2 and an upper housing 3 which are detachably connected to the upper part of the base 1 in sequence from bottom to top. A device hole 4 for an electronic device or a wire to pass through is provided at the connection part of the ends of the lower housing 2 and the upper housing 3. A first sealant (not shown in the figure) is provided inside the lower housing 2 around its connection with the base 1. An isolation chamber 5 is provided at the end of the lower housing 2 where the device hole 4 is located, and a second sealant (not shown in the figure) is filled in the isolation chamber 5.
[0031] In this embodiment, connection holes are provided around the base 1. Nut columns are provided at positions on the inner wall of the lower housing 2 corresponding to the connection holes. Countersunk holes are provided at positions on the upper housing 3 corresponding to the nut columns. A nut passes through the countersunk hole, the nut column and the connection hole from top to bottom to connect the base 1, the lower housing 2 and the upper housing 3 into a whole.
[0032] As Figure 2 shown and Figure 3 , a sealing ring 6 for further enhancing the sealing line is provided in the device hole 4 between the lower housing 2 and the upper housing 3, and the inner wall of the sealing ring 6 abuts against the outer wall of the electronic device or the wire.
[0033] In this embodiment, the lower housing 2 is of a frame structure. After being connected to the base 1, it is used to place electronic devices or wires and fill potting glue.
[0034] In this embodiment, the isolation chamber 5 includes an isolation wall 51 which is provided inside the end of the lower housing 2 where the device hole 4 is located. Both sides of the isolation wall 51 are fixedly connected to the end of the lower housing 2 where the device hole 4 is not provided. A bottom plate 52 is provided at the bottom between the end of the lower housing 2 where the device hole 4 is located and the isolation wall 51. The end of the bottom plate 52 is fixedly connected to the end of the lower housing 2 where the device hole 4 is located, the isolation wall 51 or the end of the lower housing 2 where the device hole 4 is not provided.
[0035] In this embodiment, a communication groove 53 is provided at a position on the isolation wall 51 corresponding to the device hole 4 of the lower housing 2 to facilitate the part of the electronic device or the wire extending into the lower housing 2 to pass through.
[0036] In this embodiment, both the first sealant and the second sealant are silicone rubber adhesives.
[0037] The utility model divides the multi-housing structure into a low glue overflow risk area and a high glue overflow risk area according to the size of the potential glue overflow risk. For the low glue overflow risk area such as the joint between the base 1 and the lower housing 2, after the base 1 and the lower housing 2 are assembled and before the potting sealant is filled, the first sealant is directly applied and filled from the inside of the gap to prevent the potting sealant from overflowing from this position; for the high glue overflow risk area such as the device hole 4, an isolation chamber 5 is arranged. After the first sealant is applied, the second sealant is filled in the isolation chamber 5. The second sealant needs to be applied and filled evenly and fully to prevent the potting sealant from overflowing from the gap between the device hole 4 and the electronic device or wire after filling. By different arrangements of the low glue overflow area and the high glue overflow area, while not affecting the waterproof performance, the effect of preventing the potting sealant from overflowing from the gap of the multi-housing structure is achieved, and the aesthetics and texture of the overall structure are improved.
[0038] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.
[0039] The above-described embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.
Claims
1. A waterproof potting housing structure, comprising a base, wherein a lower housing and an upper housing detachably connected to the base are arranged on the upper part of the base, and a device hole is arranged at the connection part of the ends of the lower housing and the upper housing, and it is characterized in that: A first sealant is provided inside the lower housing around its connection with the base. An isolation chamber is provided at the end of the device hole of the lower housing, and the isolation chamber is filled with a second sealant.
2. The waterproof potting housing structure according to claim 1, wherein A sealing ring is provided in the device hole between the lower housing and the upper housing.
3. The waterproof potting housing structure according to claim 2, wherein, The lower housing is of a frame structure.
4. The waterproof potting housing structure according to claim 1, characterized in that, The isolation chamber includes an isolation wall, which is provided on the inner side of the end of the lower housing where the device hole is provided. Both sides of the isolation wall are fixedly connected to the end of the lower housing where the device hole is not provided. A bottom plate is provided at the bottom between the end of the lower housing where the device hole is provided and the isolation wall, and the end of the bottom plate is fixedly connected to the end of the lower housing where the device hole is provided, the isolation wall or the end of the lower housing where the device hole is not provided.
5. The waterproof potting housing structure according to claim 4, characterized in that, A communication groove is provided at the position corresponding to the device hole of the lower housing on the isolation wall.
6. The waterproof potting housing structure according to claim 1, wherein Both the first sealant and the second sealant are silicone rubber-based glues.