Semiconductor metal cleaning equipment

Abstract

The utility model relates to semiconductor metal cleaning equipment, and belongs to the technical field of cleaning equipment.The semiconductor metal cleaning equipment comprises a box body, a conveying mechanism, a plurality of cleaning tanks, an ultrasonic mechanism and an air drying mechanism, the conveying mechanism comprises a driving wheel mechanism, a plurality of tensioning wheel mechanisms and a plurality of guide wheels, and the driving wheel mechanism, the tensioning wheel mechanisms and the guide wheels are arranged between a feeding port and a discharging port; the driving wheel mechanism clamps and drives the semiconductor metal to move in the horizontal direction, the horizontal height of the tensioning wheel mechanism is smaller than that of the guide wheel, the cleaning tank is arranged below the tensioning wheel mechanism, the tensioning wheel mechanism presses part of the semiconductor metal into the detergent, and the ultrasonic mechanism is used for providing high-frequency oscillation ultrasonic waves for the cleaning tank. According to the semiconductor metal cleaning equipment, automatic cleaning of semiconductor metal is achieved, the cleaning efficiency is improved, and the labor intensity of workers is reduced.

Description

Technical Field

[0001] This application relates to the technical field of cleaning equipment, and particularly to a semiconductor metal cleaning equipment. Background Art

[0002] For semiconductor metal substrates, especially precision components such as cast linear metals, linear metals, long strip metals, and thin-edge special-shaped long strip metals, their production processes are prone to situations containing die-casting oil, lubricating oil, or other impurities. If the excess die-casting oil or lubricating oil is not cleaned, the oil on the metal surface will affect the circuit where it is located, such as increasing resistance and reducing circuit current. Therefore, it is necessary to clean the die-casting oil and lubricating oil in a timely manner.

[0003] However, the existing cleaning mainly involves manually cleaning each product separately or cleaning them uniformly after batch production, which not only affects production efficiency but also increases the labor intensity of workers. Summary of the Utility Model

[0004] Based on this, it is necessary to provide a semiconductor metal cleaning equipment to solve the technical problem of low efficiency of manual cleaning of semiconductor metals in the prior art.

[0005] To achieve the above object, this application provides a semiconductor metal cleaning equipment, which includes:

[0006] A box body, forming a cleaning space, with a feed inlet and a discharge outlet respectively arranged at both ends of the cleaning space;

[0007] A conveying mechanism, including a driving wheel mechanism, a plurality of tensioning wheel mechanisms, and a plurality of guide wheels arranged between the feed inlet and the discharge outlet. The driving wheel mechanism clamps and drives the semiconductor metal to move horizontally. The plurality of tensioning wheel mechanisms and the plurality of guide wheels are alternately distributed in sequence. The horizontal height of the tensioning wheel mechanism is lower than that of the guide wheel, so that the part of the semiconductor metal corresponding to the tensioning wheel mechanism bends downward;

[0008] A plurality of cleaning tanks, which are respectively arranged below the plurality of tensioning wheel mechanisms. The cleaning tanks are filled with detergent, and the tensioning wheel mechanisms press part of the semiconductor metal into the detergent;

[0009] An ultrasonic mechanism, arranged at the bottom of the cleaning tank, for providing high-frequency oscillating ultrasonic waves to the cleaning tank; and

[0010] A drying mechanism, arranged between the cleaning tank and the discharge outlet.

[0011] Optionally, the driving wheel mechanism includes:

[0012] An upper driving wheel, rotatably arranged at the discharge outlet;

[0013] A lower driving wheel, rotatably arranged directly below the upper driving wheel, with a semiconductor metal extrusion clamp placed between the upper driving wheel and the lower driving wheel; and

[0014] A rotation driving mechanism for driving the upper driving wheel or the lower driving wheel to rotate.

[0015] Optionally, the height of the upper driving wheel and / or the lower driving wheel is adjustable.

[0016] Optionally, the tensioning wheel mechanism includes:

[0017] An upper tensioning wheel, rotatably arranged at the discharge port; and

[0018] A lower tensioning wheel, rotatably arranged directly below the upper tensioning wheel, with a semiconductor metal extrusion clamp placed between the upper tensioning wheel and the lower tensioning wheel.

[0019] Optionally, the height of the upper tensioning wheel and / or the lower tensioning wheel is adjustable.

[0020] Optionally, there are two conveying mechanisms, and the two conveying mechanisms are arranged at intervals perpendicular to the conveying direction of the semiconductor metal.

[0021] Optionally, the ultrasonic mechanism includes:

[0022] An ultrasonic generator, arranged inside the box; and

[0023] An ultrasonic transducer, electrically connected to the ultrasonic generator and arranged on the bottom surface of the cleaning tank.

[0024] Optionally, the semiconductor metal cleaning equipment further includes a plurality of cooling mechanisms corresponding to the plurality of cleaning tanks one by one, and the cooling mechanism includes:

[0025] A cooling pipe network, laid inside the cleaning tank; and

[0026] A chiller, forming a circulation flow path with the cooling pipe network, and the chiller is used to deliver refrigerant to the cooling pipe network.

[0027] Optionally, the semiconductor metal cleaning equipment further includes:

[0028] A liquid replenishing mechanism, connected to the top of the cleaning tank, and the liquid replenishing mechanism is used to deliver pure water into the cleaning tank; and

[0029] A waste liquid collection mechanism, connected to the bottom of the cleaning tank, and the waste liquid collection mechanism is used to collect the waste liquid in the cleaning tank.

[0030] Optionally, the air drying mechanism includes:

[0031] A high-pressure blower, arranged inside the box; and

[0032] The bellows is arranged at the discharge port and communicated with the high-pressure blower, and the bellows is provided with a plurality of air outlets.

[0033] The beneficial effects of the semiconductor metal cleaning equipment provided by this application are as follows: Compared with the prior art, the semiconductor metal cleaning equipment of this application includes a box body, a conveying mechanism, a plurality of cleaning tanks, an ultrasonic mechanism and a drying mechanism. The conveying mechanism includes a driving wheel mechanism, a plurality of tensioning wheel mechanisms and a plurality of guide wheels arranged between the feed port and the discharge port. The driving wheel mechanism clamps and drives the semiconductor metal to move horizontally. The horizontal height of the tensioning wheel mechanism is lower than that of the guide wheel. The cleaning tank is arranged below the plurality of tensioning wheel mechanisms. The tensioning wheel mechanism presses part of the semiconductor metal into the detergent. The ultrasonic mechanism at the bottom of the cleaning tank provides high-frequency oscillating ultrasonic waves to the cleaning tank, realizing the automatic cleaning of the semiconductor metal, improving the cleaning efficiency and reducing the labor intensity of the staff; moreover, the cleaning operation can also be realized during the process of conveying the semiconductor metal, and the subsequent treatment of the semiconductor metal does not need to wait too long, improving the continuity of the entire production process of the semiconductor metal and the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0035] Figure 1 It is a schematic diagram of the internal structure of the semiconductor metal cleaning equipment provided by the embodiment of the present application;

[0036] Figure 2 It is a schematic top view structure diagram of the semiconductor metal cleaning equipment provided by the embodiment of the present application.

[0037] Description of the reference numerals:

[0038] 1. Box body; 110. Feed port; 120. Discharge port;

[0039] 2. Conveying mechanism; 210. Driving wheel mechanism; 211. Upper driving wheel; 212. Lower driving wheel; 220. Tensioning wheel mechanism; 221. Upper tensioning wheel; 222. Lower tensioning wheel; 230. Guide wheel;

[0040] 3. Cleaning tank;

[0041] 4. Ultrasonic mechanism; 410. Ultrasonic generator; 420. Ultrasonic transducer;

[0042] 5. Air-drying mechanism; 510. High-pressure blower; 520. Air box

[0043] 6. Cooling mechanism; 610. Cooling pipe network; 620. Chiller

[0044] 7. Semiconductor metal Detailed implementation manners

[0045] To make the above objects, features, and advantages of the present application more apparent and understandable, the following provides a detailed description of the specific implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0046] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0047] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0048] In the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0049] In this application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply indicates that the horizontal height of the first feature is less than that of the second feature.

[0050] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.

[0051] Embodiments of the present application provide a semiconductor metal cleaning device. Please refer to Figure 1 and Figure 2 , the semiconductor metal cleaning device includes a box body 1, a conveying mechanism 2, a plurality of cleaning tanks 3, an ultrasonic mechanism 4 and a drying mechanism 5. The box body 1 forms a cleaning space 110, and a feeding port 120 and a discharging port 130 are respectively arranged at both ends of the cleaning space 110; the conveying mechanism 2 includes a driving wheel mechanism 210, a plurality of tensioning wheel mechanisms 220 and a plurality of guide wheels 230 arranged between the feeding port 120 and the discharging port 130. The driving wheel mechanism 210 clamps and drives the semiconductor metal 7 to move in the horizontal direction. The plurality of tensioning wheel mechanisms 220 and the plurality of guide wheels 230 are alternately distributed in sequence. The horizontal height of the tensioning wheel mechanism 220 is lower than that of the guide wheel 230, so that the part of the semiconductor metal 7 corresponding to the tensioning wheel mechanism 220 bends downward; the plurality of cleaning tanks 3 are correspondingly arranged below the plurality of tensioning wheel mechanisms 220. The cleaning tank 3 contains a detergent, and the tensioning wheel mechanism 220 presses part of the semiconductor metal 7 into the detergent; the ultrasonic mechanism 4 is arranged at the bottom of the cleaning tank 3, and the ultrasonic mechanism 4 is used to provide high-frequency oscillating ultrasonic waves to the cleaning tank 3. The drying mechanism 5 is arranged between the cleaning tank 3 and the discharging port 130.

[0052] Exemplarily, the product type of the semiconductor metal 7 is metal strip edge wrapping.

[0053] Preferably, the detergent is a hydrocarbon solvent. The hydrocarbon solvent can dissolve a variety of organic substances and has many advantages such as being able to completely volatilize without leaving residues, not damaging the environment, being easy to evaporate, and not damaging the ozone layer.

[0054] In an embodiment of the present application, the semiconductor metal cleaning device includes a box body 1, a conveying mechanism 2, a plurality of cleaning tanks 3, an ultrasonic mechanism 4, and a drying mechanism 5. The conveying mechanism 2 includes a driving wheel mechanism 210, a plurality of tensioning wheel mechanisms 220, and a plurality of guiding wheels 230 disposed between the feeding port 120 and the discharging port 130. The driving wheel mechanism 210 clamps and drives the semiconductor metal 7 to move horizontally. The horizontal height of the tensioning wheel mechanism 220 is lower than that of the guiding wheel 230. The cleaning tanks 3 are disposed below the plurality of tensioning wheel mechanisms 220. The tensioning wheel mechanism 220 presses a part of the semiconductor metal 7 into the detergent. The ultrasonic mechanism 4 at the bottom of the cleaning tank 3 provides high-frequency oscillating ultrasonic waves to the cleaning tank 3, realizing the automatic cleaning of the semiconductor metal 7, improving the cleaning efficiency, and reducing the labor intensity of the staff. Moreover, the cleaning operation can also be realized during the transportation of the semiconductor metal 7, and the subsequent processing of the semiconductor metal 7 does not need to wait for too long, improving the continuity of the entire production process of the semiconductor metal 7 and the production efficiency.

[0055] In one embodiment, please refer to Figure 1 , the driving wheel mechanism 210 includes an upper driving wheel 211, a lower driving wheel 212, and a rotation driving mechanism. The upper driving wheel 211 is rotatably disposed at the discharging port 130. The lower driving wheel 212 is rotatably disposed directly below the upper driving wheel 211. The semiconductor metal 7 is squeezed and clamped between the upper driving wheel 211 and the lower driving wheel 212. The rotation driving mechanism is used to drive the upper driving wheel 211 or the lower driving wheel 212 to rotate.

[0056] Exemplarily, the rotation driving mechanism of the present application is in transmission connection with the lower driving wheel 212. The transmission mode between the rotation driving mechanism and the lower driving wheel 212 is gear transmission, belt transmission, or the lower driving wheel 212 is directly mounted on the rotating shaft of the rotation driving mechanism, which is not uniquely limited herein.

[0057] In one embodiment, the tensioning wheel mechanism 220 includes an upper tensioning wheel 221 and a lower tensioning wheel 222. The upper tensioning wheel 221 is rotatably disposed at the discharging port 130. The lower tensioning wheel 222 is rotatably disposed directly below the upper tensioning wheel 221. The semiconductor metal 7 is squeezed and clamped between the upper tensioning wheel 221 and the lower tensioning wheel 222.

[0058] Furthermore, the upper tensioning wheel 221 of the tensioning wheel mechanism 220 can also be installed with a rotation driving mechanism to play a certain auxiliary role in the transportation of the semiconductor metal 7.

[0059] In one embodiment, the height of the upper driving wheel 211 and / or the lower driving wheel 212 is adjustable.

[0060] In one embodiment, the height of the upper tensioning wheel 221 and / or the lower tensioning wheel 222 is adjustable.

[0061] In summary, the height of the upper driving wheel 211 and / or the lower driving wheel 212 is adjustable, and the height of the upper tensioning wheel 221 and / or the lower tensioning wheel 222 is adjustable, which can not only achieve the effect of adapting to semiconductor metals 7 of different thicknesses, but also adjust the downward bending degree of the semiconductor metal 7.

[0062] For the convenience of explanation, the upper driving wheel 211, the lower driving wheel 212, the upper tensioning wheel 221 and the lower tensioning wheel 222 are collectively referred to as rollers, and the height of the rollers is adjusted through a vertically arranged adjusting plate.

[0063] In one embodiment, please refer to Figure 2 , two conveying mechanisms 2 are provided, and the two conveying mechanisms 2 are arranged at intervals perpendicular to the conveying direction of the semiconductor metal 7, thereby realizing double-line operation and improving the cleaning efficiency.

[0064] In one embodiment, please refer to Figure 1 , the ultrasonic mechanism 4 includes an ultrasonic generator 410 and an ultrasonic transducer 420. The ultrasonic generator 410 is arranged in the box body 1, and the ultrasonic transducer 420 is electrically connected to the ultrasonic generator 410 and arranged on the bottom surface of the cleaning tank 3.

[0065] Specifically, the ultrasonic generator 410 is a device that generates high-frequency electrical signals and converts them into ultrasonic energy, while the ultrasonic transducer 420 is a device that converts ultrasonic energy into mechanical vibration.

[0066] In one embodiment, please refer to Figure 1 , the semiconductor metal cleaning equipment further includes a plurality of cooling mechanisms 6 corresponding to the plurality of cleaning tanks 3 one by one. The cooling mechanism 6 includes a cooling pipe network 610 and a chiller 620. The cooling pipe network 610 is laid in the cleaning tank 3, and a circulating flow path is formed between the chiller 620 and the cooling pipe network 610. The chiller 620 is used to deliver refrigerant to the cooling pipe network 610. The cooling mechanism 6 can timely cool the detergent in the cleaning tank 3 to ensure the cleaning effect of the detergent.

[0067] In one embodiment, the semiconductor metal cleaning equipment further includes a liquid replenishing mechanism and a waste liquid collecting mechanism. The liquid replenishing mechanism is connected to the top of the cleaning tank 3, and the liquid replenishing mechanism is used to deliver pure water into the cleaning tank 3. The waste liquid collecting mechanism is connected to the bottom of the cleaning tank 3, and the waste liquid collecting mechanism is used to collect the waste liquid in the cleaning tank 3, so as to achieve the effect of timely replacing the waste liquid in the cleaning tank 3 and ensure a better cleaning effect.

[0068] In one embodiment, please refer to Figure 1, the air-drying mechanism 5 includes a high-pressure blower 510 and an air box 520. The high-pressure blower 510 is disposed inside the box body 1, the air box 520 is disposed at the discharge port 130 and communicated with the high-pressure blower 510. The air box 520 is provided with a plurality of air outlets. The high-pressure air generated by the high-pressure blower 510 is blown from the air outlets towards the semiconductor metal 7, so as to achieve the purpose of air-drying the semiconductor metal 7 and avoid the liquid remaining on the semiconductor metal 7 from corroding the semiconductor metal 7.

[0069] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0070] The above-described embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A semiconductor metal cleaning device, characterized in that, Comprising: A box body, forming a cleaning space, with a feed inlet and a discharge outlet respectively arranged at two ends of the cleaning space; A conveying mechanism, including a driving wheel mechanism, a plurality of tensioning wheel mechanisms and a plurality of guide wheels arranged between the feed inlet and the discharge outlet. The driving wheel mechanism clamps and drives the semiconductor metal to move horizontally. The plurality of tensioning wheel mechanisms and the plurality of guide wheels are alternately distributed in sequence. The horizontal height of the tensioning wheel mechanism is lower than that of the guide wheel, so that the part of the semiconductor metal corresponding to the tensioning wheel mechanism bends downward; A plurality of cleaning tanks, correspondingly arranged below the plurality of tensioning wheel mechanisms one by one. The cleaning tanks are filled with detergent, and the tensioning wheel mechanism presses part of the semiconductor metal into the detergent; An ultrasonic mechanism, arranged at the bottom of the cleaning tank, and the ultrasonic mechanism is used to provide high-frequency oscillating ultrasonic waves to the cleaning tank; And A drying mechanism, arranged between the cleaning tank and the discharge outlet.

2. The semiconductor metal cleaning equipment according to claim 1, wherein The driving wheel mechanism includes: An upper driving wheel, rotatably arranged at the discharge outlet; A lower driving wheel, rotatably arranged directly below the upper driving wheel, and the semiconductor metal is squeezed and clamped between the upper driving wheel and the lower driving wheel; and A rotation driving mechanism, used to drive the upper driving wheel or the lower driving wheel to rotate.

3. The semiconductor metal cleaning equipment according to claim 2, wherein The height of the upper driving wheel and / or the lower driving wheel is adjustable.

4. The semiconductor metal cleaning equipment according to claim 1, wherein, The tensioning wheel mechanism includes: An upper tensioning wheel, rotatably arranged at the discharge outlet; and A lower tensioning wheel, rotatably arranged directly below the upper tensioning wheel, and the semiconductor metal is squeezed and clamped between the upper tensioning wheel and the lower tensioning wheel.

5. The semiconductor metal cleaning equipment according to claim 4, characterized in that, The height of the upper tensioning wheel and / or the lower tensioning wheel is adjustable.

6. The semiconductor metal cleaning equipment according to any one of claims 1-5, characterized in that Two sets of the conveying mechanism are provided, and the two sets of the conveying mechanism are arranged at intervals perpendicular to the conveying direction of the semiconductor metal.

7. The semiconductor metal cleaning equipment according to any one of claims 1-5, characterized in that, The ultrasonic mechanism includes: An ultrasonic generator, arranged inside the box body; and An ultrasonic transducer, electrically connected to the ultrasonic generator and arranged on the bottom surface of the cleaning tank.

8. The semiconductor metal cleaning equipment according to any one of claims 1-5, characterized in that, The semiconductor metal cleaning equipment further includes a plurality of cooling mechanisms corresponding to the plurality of cleaning tanks one by one. The cooling mechanism includes: A cooling pipe network, laid inside the cleaning tank; and A chiller, forming a circulating flow path with the cooling pipe network, and the chiller is used to transport refrigerant to the cooling pipe network.

9. The semiconductor metal cleaning equipment according to any one of claims 1-5, characterized in that, The semiconductor metal cleaning equipment further includes: A liquid replenishing mechanism, connected to the top of the cleaning tank, and the liquid replenishing mechanism is used to transport pure water into the cleaning tank; and A waste liquid collecting mechanism, connected to the bottom of the cleaning tank, and the waste liquid collecting mechanism is used to collect the waste liquid in the cleaning tank.

10. The semiconductor metal cleaning equipment according to any one of claims 1-5, characterized in that, The drying mechanism includes: A high-pressure blower, arranged inside the box body; and An air box, arranged at the discharge outlet and communicated with the high-pressure blower, and the air box is provided with a plurality of air outlets.

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