Quantitative dipping device for scaling powder

Abstract

The utility model provides a quantitative dipping device for scaling powder, and relates to the technical field of welding equipment. The quantitative dipping device for the soldering flux comprises a soldering flux groove, a quantitative taking block and a lifting mechanism. The soldering flux groove is used for containing soldering flux, and the bottom of the soldering flux groove is connected with a liquid feeding pipeline. The quantitative material taking block is arranged above the soldering flux groove; a V-shaped groove is formed in the upper surface of the quantitative material taking block, and the upper surface of the side wall of the V-shaped groove is a working surface; the working face has a preset width and is used for bearing quantitative scaling powder. The lifting mechanism is used for driving the quantitative material taking block to do lifting motion relative to the scaling powder groove, so that the scaling powder contained in the scaling powder groove wets the working face, and a layer of scaling powder liquid film is formed on the working face. The total amount of the soldering flux dipped by the part pins can be controlled, the part pins are prevented from dipping too much or too little soldering flux, the welding quality is improved, and the soldering flux is prevented from polluting a part body.

Description

Technical Field

[0001] The utility model relates to the technical field of welding equipment, in particular to a flux quantitative dipping device. Background Art

[0002] In the welding process of electronic components with pins, it is necessary to dip the pins into a sufficient amount of flux before soldering to improve the welding quality. In the prior art, generally, the pins of electronic components are dipped into a container filled with flux by hand or a robotic arm. The flux dipping method in the prior art is difficult to control the depth of the pins entering the flux, resulting in uneven flux dipping. Moreover, when the pins of electronic components are small, dipping too much flux is likely to contaminate the main body part of the electronic components. Content of the Utility Model

[0003] The utility model aims to provide a flux quantitative dipping device to solve the problems of uneven flux dipping and easy contamination of the main body part of electronic components by too much dipped flux in the prior art.

[0004] To achieve the above object, the technical solution provided by the utility model is as follows:

[0005] A flux quantitative dipping device includes: a flux tank, a quantitative material taking block, and a lifting mechanism.

[0006] The flux tank is used to hold flux and is connected with a liquid supply pipeline at the bottom.

[0007] The quantitative material taking block is arranged above the flux tank; a V-shaped groove is formed on the upper surface of the quantitative material taking block, and the upper surfaces of the side walls of the V-shaped groove are working surfaces; the working surfaces have a preset width for carrying a quantitative amount of flux.

[0008] The lifting mechanism is used to drive the quantitative material taking block to move up and down relative to the flux tank, so that the flux held in the flux tank wets the working surfaces and forms a layer of flux liquid film on the working surfaces.

[0009] Further, the quantitative material taking block is strip-shaped, the V-shaped groove has two side walls, the upper surfaces of both side walls are working surfaces, and there is a preset distance between the two working surfaces.

[0010] Further, a plurality of reflux holes are arranged at the bottom of the V-shaped groove.

[0011] Further, the quantitative material taking block includes upper and lower two-layer plates, balls are arranged at the central position between the upper and lower two-layer plates, the two ends of the upper and lower two-layer plates are fixed by bolts, the V-shaped groove and the reflux holes are both arranged on the upper layer plate of the quantitative material taking block, and the bolts are used to adjust the levelness of the working surfaces.

[0012] Further, the lifting mechanism includes a fixed column and a lifting cylinder. The top of the fixed column is connected to the bottom of the quantitative material taking block to fix the height of the quantitative material taking block; the lifting cylinder is arranged below the flux tank and is used to drive the flux tank to move up and down.

[0013] Further, the fixed column is strip-shaped and passes through the flux tank to be connected to the lower plate body of the quantitative material taking block; the connection part between the fixed column and the flux tank is sealed by a sealing ring.

[0014] Further, a pair of ear plates extend from both sides of the bottom of the flux tank. The ear plates are fixedly installed on a bottom plate through fasteners, and the moving end of the lifting cylinder is connected to the bottom plate.

[0015] Further, a cover plate is installed on the flux tank. A strip-shaped opening is formed on the cover plate, and the strip-shaped opening is used to accommodate the quantitative material taking block to pass through.

[0016] Further, a clamping mechanism is included. The clamping mechanism is arranged above the quantitative material taking block and is used to clamp the parts to be welded, so that the pins of the parts are vertically in contact with the working surface and dip the flux liquid film on the working surface.

[0017] Further, an elastic pressing mechanism is also installed on the clamping mechanism. The elastic pressing mechanism is used to press the parts towards the working surface when the pins of the parts are in contact with the working surface.

[0018] Compared with the prior art, the beneficial effects of the present utility model are as follows: The present utility model utilizes the characteristic that the flux has a certain viscosity and will accumulate on the surface of a horizontal object, and designs a quantitative material taking block with a V-shaped groove. The upper surface of the side wall of the V-shaped groove is the working surface in contact with the pins of the parts. The present utility model can quantitatively accumulate the flux on the working surface by controlling the preset width, thereby being able to control the total amount of flux dipped by the pins of the parts, prevent the pins of the parts from dipping too much or too little flux, improve the welding quality, and prevent the flux from contaminating the part body. Description of the Drawings

[0019] Figure 1 is a schematic structural diagram of Embodiment 1 of the present utility model;

[0020] Figure 2 is a schematic structural diagram of the quantitative material taking block in Embodiment 1 of the present utility model;

[0021] Figure 3 is a partial cross-sectional schematic diagram of Embodiment 1 of the present utility model;

[0022] Figure 4 is an installation schematic diagram of the cover plate in Embodiment 1 of the present utility model;

[0023] Figure 5 is a front view of Embodiment 2 of the present utility model.

[0024] Among them, 1: flux tank; 2: quantitative material taking block; 3: lifting mechanism; 4: liquid supply pipeline; 5: sealing ring; 6: clamping mechanism; 7: elastic pressing mechanism; 8: part; 9: liquid level sensor; 11: ear plate; 12: bottom plate; 13: cover plate; 21: V-shaped groove; 22: working surface; 23: reflux hole; 24: ball; 25: upper plate body; 26: lower plate body; 31: fixed column; 32: lifting cylinder; 71: mounting plate; 72: pressing rod; 73: spring; 74: cylinder; 75: frame. Specific embodiments

[0025] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0026] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0027] It should be noted that all the directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative position relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly. The described connection can be a direct connection or an indirect connection.

[0028] In addition, the descriptions such as "first" and "second" in the present invention are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention. Embodiment 1

[0029] An embodiment of the present invention provides a flux quantitative dipping device, as Figure 1 shown, which is a schematic structural diagram of the flux quantitative dipping device in this embodiment. The flux quantitative dipping device provided in this embodiment includes a flux tank 1, a quantitative material taking block 2, and a lifting mechanism 3.

[0030] Among them, the soldering flux tank 1 is used to contain the soldering flux, the quantitative material taking block 2 is used to quantitatively take the soldering flux from the soldering flux tank 1, and the part 8 dips the soldering flux on the quantitative material taking block 2. The quantitative material taking block 2 can be immersed in the soldering flux tank 1, and the lifting mechanism 3 is used to drive the relative movement of the soldering flux tank 1 and the quantitative material taking block 2, so that the quantitative material taking block 2 enters the soldering flux tank 1 to complete the quantitative material taking.

[0031] The soldering flux tank 1 is used to contain the soldering flux and is connected with a liquid supply pipeline 4 at the bottom.

[0032] Among them, the soldering flux tank 1 is preferably strip-shaped, and a liquid level sensor 9 is arranged on the side surface, which can monitor the height of the soldering flux in the soldering flux tank 1 to prevent the soldering flux from overflowing due to too much or the quantitative material taking block 2 from being unable to complete the material taking due to too little soldering flux. The liquid supply pipeline 4 is connected with a hydraulic pump, and the hydraulic pump is placed in a container containing the soldering flux. The hydraulic pump can be electrically connected with the liquid level sensor 9, so that the liquid level height in the soldering flux tank 1 is maintained within a certain range.

[0033] As Figure 2 shown, it is a schematic structural diagram of the quantitative material taking block. The quantitative material taking block 2 is arranged above the soldering flux tank 1; a V-shaped groove 21 is formed on the upper surface of the quantitative material taking block 2, and the upper surface of the side wall of the V-shaped groove 21 is the working surface 22; the working surface 22 has a preset width and is used to carry a quantitative amount of soldering flux.

[0034] Among them, the quantitative material taking block 2 is preferably strip-shaped. After the V-shaped groove 21 is formed on the upper surface of the quantitative material taking block 2, the parts on both sides of the quantitative material taking block 2 that are higher than the bottom of the V-shaped groove 21 are the side walls of the V-shaped groove 21, and the upper surface of the side wall is a narrow rectangle, and the width of this rectangle can be designed according to requirements. The soldering flux generally has relatively high viscosity and can form a liquid film on the solid surface. When the solid surface carrying the liquid film is a horizontal plane, the mass of the liquid film can tend to be stable. Therefore, the quantitative material taking block 2 can carry a layer of soldering flux liquid film away from the soldering flux tank 1. After the excess soldering flux on the surface of the quantitative material taking block 2 drains into the soldering flux tank 1 along the V-shaped groove 21 under the action of gravity, the mass of the soldering flux remaining on the working surface 22 tends to be stable, so that the pins of the part 8 can dip a quantitative amount of soldering flux. In this embodiment, the mass of the soldering flux remaining on the working surface 22 can be controlled by presetting the width of the working surface 22. And the working surface 22 of this embodiment is strip-shaped and can contact the pins of multiple parts 8 at the same time, improving the working efficiency of dipping the soldering flux.

[0035] The lifting mechanism 3 is used to drive the quantitative material taking block 2 to move up and down relative to the soldering flux tank 1, so that the soldering flux contained in the soldering flux tank 1 wets the working surface 22 and forms a layer of soldering flux liquid film on the working surface 22.

[0036] Among them, during use, the lifting mechanism 3 controls the quantitative material-taking block 2 and the flux tank 1 to approach each other, so that the quantitative material-taking block 2 is immersed in the flux tank 1 and is in full contact with the flux. Subsequently, the lifting mechanism 3 controls the quantitative material-taking block 2 and the flux tank 1 to move away from each other, so that the quantitative material-taking block 2 is separated from the flux tank 1. The flux carried on the surface of the quantitative material-taking block 2 falls into the flux tank 1 under the action of gravity until it reaches a stable state. At this time, the mass of the flux liquid film on the working surface 22 is basically quantitative. Finally, the pins of the component 8 come into contact with the flux liquid film on the working surface 22, and then a quantitative amount of flux can be dipped, completing the process of dipping flux. The lifting mechanism 3 can be any mechanism that can control the relative movement of the quantitative material-taking block 2 and the flux tank 1. Preferably, the quantitative material-taking block 2 is arranged directly above the flux tank 1, and the process of the quantitative material-taking block 2 dipping flux can be completed only by relative up and down movement. The lifting mechanism 3 can drive one or both of the quantitative material-taking block 2 and the flux tank 1 to move.

[0037] In this embodiment, taking advantage of the property that the flux has a certain viscosity and will accumulate on the surface of a horizontal object, a quantitative material-taking block 2 with a V-shaped groove 21 is designed. The upper surface of the side wall of the V-shaped groove 21 is the working surface 22 that contacts the pins of the component 8. In this embodiment, the width can be preset to quantitatively accumulate flux on the working surface 22, thereby quantitatively controlling the total amount of flux dipped by the pins of the component 8, preventing the pins of the component 8 from dipping too much or too little flux, improving the welding quality, and preventing the flux from contaminating the body of the component 8.

[0038] In this embodiment, the quantitative material-taking block 2 is strip-shaped; the V-shaped groove 21 has two side walls, and the upper surfaces of both side walls are the working surfaces 22, and there is a preset distance between the two working surfaces 22.

[0039] Among them, setting two working surfaces 22 can complete the process of dipping flux for more components 8 at one time, or complete the process of dipping flux for multiple pins on one component 8. When both sides of the component 8 have pins and it needs to be flipped, when using the clamping mechanism 6 to flip the component 8, the displacement of the component 8 is generally fixed. If the displacement is exactly equal to the distance between the two working surfaces 22, the process of dipping flux for the pins on the opposite sides of the component 8 can be completed more quickly. The distance between the working surfaces 22, that is, the width of the V-shaped groove 21, can be set as required.

[0040] As Figure 2 shown, in this embodiment, a plurality of reflux holes 23 are arranged at the bottom of the V-shaped groove 21.

[0041] Among them, to form a flux liquid film on the working surface 22 of the metering and material-taking block 2, the entire metering and material-taking block 2 needs to be immersed in the flux. When the metering and material-taking block 2 leaves the flux tank 1, the flux in the V-shaped groove 21 needs to be discharged. Setting the reflux holes 23 can improve the discharge speed of the flux in the V-shaped groove 21 and prevent the flux from splashing. The number and size of the reflux holes 23 can be determined according to factors such as the lifting speed of the lifting mechanism 3 and the size of the V-shaped groove 21.

[0042] As Figure 3 shown, it is a partial cross-sectional schematic diagram of this embodiment. In this embodiment, the metering and material-taking block 2 includes upper and lower two-layer plates. A ball 24 is arranged at the central position between the upper and lower two-layer plates. The two ends of the upper and lower two-layer plates are fixed by bolts. The V-shaped groove 21 and the reflux holes 23 are both arranged on the upper layer plate 25 of the metering and material-taking block 2. The bolts are used to adjust the levelness of the working surface 22.

[0043] Among them, when simultaneously dipping multiple parts 8 in the flux, the parts 8 are arranged in sequence along the long side of the working surface 22. Therefore, the working surface 22 needs to have a high levelness to ensure that each part 8 can dip an equal amount of flux and improve the processing quality. In this embodiment, the lower layer plate 26 of the metering and material-taking block 2 is used to fix the metering and material-taking block 2 or connect with the lifting mechanism 3, and the levelness of the upper layer working surface 22 is adjusted, thereby reducing the installation difficulty. Both the upper and lower two-layer plates are provided with grooves for installing the balls 24, which can hold the balls 24 between the two plates, so that there is a gap between the upper and lower two-layer plates. The levelness of the upper layer plate 25 can be adjusted by bolts, and it is also convenient for the flux to drain out of the V-shaped groove 21.

[0044] As Figure 3 shown, in this embodiment, the lifting mechanism 3 includes a fixed column 31 and a lifting cylinder 32. The top of the fixed column 31 is connected to the bottom of the metering and material-taking block 2 to fix the height of the metering and material-taking block 2; the lifting cylinder 32 is arranged below the flux tank 1 and is used to drive the flux tank 1 to move up and down.

[0045] Among them, the fixed column 31 is connected to the bottom of the metering and material-taking block 2, preferably fixedly connected to the lower layer plate 26 of the metering and material-taking block 2. The shape of the fixed column 31 can be designed arbitrarily according to needs, only ensuring that the position of the metering and material-taking block 2 is fixed and does not interfere with the movement of the flux tank 1. Fixing the metering and material-taking block can prevent the working surface 22 from shaking during the movement and improve the stability of the working surface 22. During use, the lifting cylinder 32 pushes the flux tank 1 upward to make the flux submerge the metering and material-taking block 2, so that the flux wets the working surface 22. Subsequently, the lifting cylinder 32 drives the flux tank 1 back to its original position. After the excess flux on the metering and material-taking block 2 is drained, a layer of flux liquid film remains on the working surface 22.

[0046] In this embodiment, the fixed vertical column 31 is strip-shaped and passes through the solder flux tank 1 to be connected to the lower plate body 26 of the quantitative material taking block 2; the connection between the fixed vertical column 31 and the solder flux tank 1 is sealed by a sealing ring 5.

[0047] Among them, the fixed vertical column 31 is strip-shaped and is directly vertically installed below the lower plate body 26 of the quantitative material taking block 2, which can further improve the installation stability of the quantitative material taking block 2. The fixed vertical column 31 is preferably cylindrical to reduce contact with the solder flux tank 1 and prevent solder flux leakage.

[0048] In this embodiment, a pair of ear plates 11 extend from both sides of the bottom of the solder flux tank 1. The ear plates 11 are fixedly installed on a bottom plate 12 through fasteners, and the moving end of the lifting cylinder 32 is connected to the bottom plate 12.

[0049] Among them, in this embodiment, the installation of the solder flux tank 1 only requires drilling screw holes in the ear plates 11, and the solder flux tank 1 is supported by the bottom plate 12. Only a hole for the upper liquid pipeline 4 to pass through needs to be opened at the bottom of the solder flux tank 1 body, and no hole for installation and positioning needs to be opened, so the possibility of solder flux leakage can be reduced. The upper liquid pipeline 4 and the bottom of the solder flux tank 1 can be connected through a sealing member to improve the sealing performance.

[0050] As Figure 4 shown, it is a schematic installation diagram of the cover plate. In this embodiment, a cover plate 13 is installed on the solder flux tank 1, and a strip-shaped opening is opened on the cover plate 13 for the quantitative material taking block 2 to pass through.

[0051] Among them, the cover plate 13 can block the notch of the solder flux tank 1 to prevent impurities from falling into it and play a protective role. The strip-shaped opening can also scrape the excess solder flux on the side of the quantitative material taking block 2 into the solder flux tank 1, quickly removing the excess solder flux on the quantitative material taking block 2, so that the quality of the solder flux on the working surface 22 quickly enters a balanced state and improves the work efficiency. Embodiment 2

[0052] As Figure 5 shown, it is a front view of this embodiment. The solder flux quantitative dipping device provided in this embodiment further includes a clamping mechanism 6. The clamping mechanism 6 is arranged above the quantitative material taking block 2 and is used to clamp the part 8 to be welded, so that the pins of the part 8 are in vertical contact with the working surface 22 to dip the solder flux liquid film on the working surface 22.

[0053] Among them, Figure 5The clamping mechanism 6 therein only shows the fixture for clamping the part 8, and the rest is omitted. The clamping mechanism 6 can be designed according to the structure of the part 8 to be welded. When the part 8 has pins on multiple surfaces, the clamping mechanism 6 needs to clamp the part 8 and rotate it. Therefore, the clamping mechanism needs to have the functions of moving and flipping the fixture, so that the pins on each surface of the part 8 can be vertically in contact with the solder flux liquid film on the working surface 22 to complete the process of dipping the solder flux. The moving function of the clamping mechanism 6 can be realized by a robotic arm, a three-axis moving mechanism, etc., and the flipping function of the clamping mechanism 6 can be realized by a motor. Preferably, the fixture of the clamping mechanism 6 can clamp multiple parts 8 at the same time, so that the pins of the parts 8 are arranged in a straight line, which is convenient for contacting the strip-shaped working surface 22 and improves the processing efficiency. Figure 5 The fixture of the clamping mechanism 6 therein clamps several parts 8, and makes the pins of the parts 8 vertically downward and perpendicular to the working surface 22. Subsequently, the clamping mechanism 6 drives the part 8 to move vertically downward, so that the pins of the part 8 are in contact with the working surface 22.

[0054] In this embodiment, an elastic pressing mechanism 7 is further installed on the clamping mechanism 6. The elastic pressing mechanism 7 is used to press the part 8 in the direction of the working surface 22 when the pins of the part 8 are in contact with the working surface 22.

[0055] Among them, Figure 5 Only a partial structure of the elastic pressing mechanism 7 therein is shown. The elastic pressing mechanism 7 can be connected to the clamping mechanism 6 and move together, and this part and other structures are omitted. This embodiment can provide a quantitative solder flux liquid film on the working surface 22. Therefore, when the pins of the part 8 cannot be fully in contact with the working surface 22, the pins may not be able to dip enough solder flux. The elastic pressing mechanism 7 presses the part 8 to make the pins of the part 8 fully in contact with the solder flux liquid film on the working surface 22, ensuring that the pins on each part 8 can dip enough solder flux and improving the subsequent welding quality. The elastic pressing mechanism 7 can be any elastic pressing structure. As Figure 5 shown, in this embodiment, the elastic pressing mechanism 7 includes a mounting plate 71. Several pressing rods 72 are installed on the mounting plate 71. Springs 73 are sleeved on the pressing rods 72, and the pressing plate is driven by a cylinder 74 to drive the pressing rods 72 to move up and down, so that the ends of the pressing rods 72 can press the part 8. The cylinder 74 can be installed on a frame 75. The frame 75 can be connected to the clamping mechanism 6 and can be connected to a component with a moving function to realize the overall movement of the clamping mechanism 6. The spring 73 can reduce the impact on the part 8 and make the pressing process smoother. The elastic pressing mechanism 7 can move downward together with the clamping mechanism 6. After the pins of the part 8 are in contact with the working surface 22, the cylinder 74 drives the mounting plate 71 to drive the pressing rods 72 to apply pressure to the part 8, so that several parts 8 can be fully in contact with the working surface 22 and the processing quality is improved.

[0056] The above are only the preferred embodiments of the present utility model, and do not thereby limit the patent scope of the present utility model. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in other related technical fields, shall similarly be included within the patent protection scope of the present utility model.

Claims

1. A flux quantitative dipping device, characterized in that, Comprising: A flux tank (1), a quantitative material taking block (2) and a lifting mechanism (3); The flux tank (1) is used for containing flux and is connected with a liquid supply pipe (4) at the bottom; The quantitative material taking block (2) is arranged above the flux tank (1); a V-shaped groove (21) is formed on the upper surface of the quantitative material taking block (2), and the upper surface of the side wall of the V-shaped groove (21) is a working surface (22); the working surface (22) has a preset width and is used for carrying a quantitative amount of the flux; The lifting mechanism (3) is used for driving the quantitative material taking block (2) to move up and down relative to the flux tank (1), so that the flux contained in the flux tank (1) wets the working surface (22) and forms a layer of flux liquid film on the working surface (22).

2. The flux quantitative dipping device according to claim 1, characterized in that, The quantitative material taking block (2) is strip-shaped, the V-shaped groove (21) has two side walls, and the upper surfaces of the two side walls are both the working surface (22), and a preset distance is provided between the two working surfaces (22).

3. The solder flux quantitative dipping device according to claim 2, characterized in that, A plurality of reflux holes (23) are arranged at the bottom of the V-shaped groove (21).

4. The solder flux quantitative dipping device according to claim 3, characterized in that The quantitative material taking block (2) comprises upper and lower two-layer plates, a ball (24) is arranged at the central position between the upper and lower two-layer plates, the two ends of the upper and lower two-layer plates are fixed by bolts, the V-shaped groove (21) and the reflux holes (23) are both arranged on the upper-layer plate (25) of the quantitative material taking block (2), and the bolts are used for adjusting the levelness of the working surface (22).

5. The solder flux quantitative dipping device according to claim 4, wherein The lifting mechanism (3) comprises a fixed column (31) and a lifting cylinder (32), the top end of the fixed column (31) is connected with the bottom of the quantitative material taking block (2) to fix the height of the quantitative material taking block (2); the lifting cylinder (32) is arranged below the flux tank (1) and is used for driving the flux tank (1) to move up and down.

6. The solder flux quantitative dipping device according to claim 5, wherein The fixed column (31) is strip-shaped, passes through the flux tank (1) and is connected with the lower-layer plate (26) of the quantitative material taking block (2); the connection part of the fixed column (31) and the flux tank (1) is sealed by a sealing ring (5).

7. The solder flux quantitative dipping device according to claim 6, wherein A pair of ear plates (11) extend from both sides of the bottom of the flux tank (1), the ear plates (11) are fixedly installed on a bottom plate (12) through fasteners, and the moving end of the lifting cylinder (32) is connected with the bottom plate (12).

8. The flux quantitative dipping device according to claim 1, wherein A cover plate (13) is installed on the flux tank (1), and a strip-shaped opening is formed in the cover plate (13) for the quantitative material taking block (2) to pass through.

9. The solder flux quantitative dipping device according to claim 1, wherein Also included is a clamping mechanism (6), the clamping mechanism (6) is arranged above the quantitative material taking block (2) and is used for clamping the part (8) to be welded, so that the pins of the part (8) are vertically in contact with the working surface (22) to dip the flux liquid film on the working surface (22).

10. The solder flux quantitative dipping device according to claim 9, characterized in that, An elastic pressing mechanism (7) is further installed on the clamping mechanism (6). The elastic pressing mechanism (7) is used to press the component (8) towards the working surface (22) when the pins of the component (8) come into contact with the working surface (22).

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