Adsorption assembly and grabbing mechanism for chip testing

Abstract

The utility model discloses an adsorption assembly and a grabbing mechanism for chip testing, which are characterized in that the adsorption assembly comprises a vertical plate, a connecting rod and a sucker, the side wall of the vertical plate is provided with a limiting plate, the limiting plate is provided with a through hole, and the middle part of the connecting rod is movably inserted into the through hole; the sucking disc is mounted at the bottom of the connecting rod; a pushing part is further arranged outside the connecting rod, and the pushing part pushes the connecting rod to move downwards along the through hole; a limiting plate is arranged on the vertical plate, a U-shaped plate is further arranged on the vertical plate below the limiting plate, a U-shaped groove is formed in the U-shaped plate, the middle of the connecting rod is movably arranged in the U-shaped groove, two tangent planes are symmetrically arranged on the outer surface of the middle of the connecting rod, and the tangent planes on the two sides make contact with the two side faces of the U-shaped groove respectively. According to the utility model, the material grabbing stability and the testing efficiency are improved.

Description

Technical Field

[0001] The utility model relates to a chip testing device, in particular to an adsorption component and a chip grasping mechanism for chip testing. Background Art

[0002] Chips have become closely related to people's lives and play an important role. Automobiles need chips, mobile phones need chips, electrical appliances need chips. As long as it is a product related to the word "technology", chips are required. Chips are the brain and heart of all electronic products and devices.

[0003] Among them, after the chips are produced, they are not immediately put into use. Because various reasons may cause defective products during the chip production process, all chips need to be tested to check whether their performance is qualified. During chip testing, the chips are placed on the chip testing device for rapid testing.

[0004] In the prior art, one of the more widely used chip testing devices is as follows: the chips are installed in a tray, each chip is in a bin of the tray, and then a suction cup is used to grab the chips from the tray and move them to the detection position for detection. After the detection is completed, the suction cup is placed back into the corresponding bin of the tray. For this structure, the following deficiencies exist:

[0005] 1. The suction cup is generally installed at the bottom of the mounting rod. Through the movement of the chip grasping mechanism, the suction cup is driven to move accordingly. To ensure the stability of the suction cup during the adsorption and grasping of the chip and the testing process, either the top of the mounting rod is directly connected to the cylinder. In this structure, the downward movement accuracy of the mounting rod must be particularly precise. Otherwise, if the mounting rod moves down a little more, the chip will be damaged, or the chip and the testing mechanism at the testing position will be damaged; if a flexible structure is adopted, using a spring structure, in order to prevent the mounting rod from rotating, the mounting rod needs to be set as a non-cylindrical structure, so as to prevent the mounting rod from rotating and ensure that when the chip contacts the detection position after being adsorbed, the chip and the detection position are in precise contact to achieve detection. However, when processing a non-cylindrical mounting rod, its manufacturing difficulty is higher than that of a cylindrical structure, and the processing cost is also higher.

[0006] 2. The chip grasping mechanism either adopts a single suction cup structure or a multi-suction cup structure. In the case of a multi-suction cup structure, it is generally single-row, while the bins on the tray are generally multi-row. In this way, the detection efficiency is relatively low.

[0007] Therefore, how to solve the above technical problems is the direction that those skilled in the art need to work hard on. Summary of the Invention

[0008] The purpose of the present utility model is to provide an adsorption component and a chip testing material grabbing mechanism. By using this structure, the stability of chip grabbing is improved, the testing stability and accuracy are ensured, and the testing efficiency is also improved.

[0009] To achieve the above object, the technical solution adopted by the present utility model is: an adsorption component, including a vertical plate, a connecting rod and a suction cup. A limiting plate is provided on the side wall of the vertical plate, and a through hole is provided on the limiting plate. The middle part of the connecting rod is movably inserted into the through hole.

[0010] A cavity is provided at the bottom of the connecting rod. An air pipe joint is provided on the outer surface of the middle part of the connecting rod and is communicated with the top of the cavity. The suction cup is installed at the bottom of the connecting rod and is communicated with the cavity.

[0011] A pushing part is further provided outside the connecting rod. The pushing part pushes the connecting rod to move downward along the through hole.

[0012] A U-shaped plate is further provided on the vertical plate below the limiting plate. A U-shaped groove is provided on the U-shaped plate. The middle part of the connecting rod is movably arranged in the U-shaped groove. Two tangent planes are symmetrically provided on the outer surface of the middle part of the connecting rod. The two tangent planes on both sides are respectively in contact with the two side surfaces of the U-shaped groove.

[0013] In the above technical solution, an upper limiting part and a lower limiting part are respectively provided at the top and middle of the connecting rod. The limiting plate is arranged between the upper limiting part and the lower limiting part. The pushing part is a spring. The top of the spring abuts against the bottom surface of the limiting plate, and the bottom of the spring abuts against the lower limiting part. The spring pushes the connecting rod to move downward so that the upper limiting part abuts against the top surface of the limiting plate.

[0014] In the above technical solution, a second limiting plate is further provided on the vertical plate. The second limiting plate is arranged between the U-shaped plate and the limiting plate. A second through hole is provided on the second limiting plate. The second through hole is arranged opposite to the through hole. The middle part of the connecting rod is movably inserted into the second through hole. The lower limiting part is arranged above the second limiting plate.

[0015] The present utility model also provides a chip testing material grabbing mechanism, including two sets of relatively arranged material grabbing components. The two sets of material grabbing components include a first material grabbing component and a second material grabbing component. A plurality of guide rods and at least one separating cylinder are provided on the second material grabbing component. The first material grabbing component is movably connected to the plurality of guide rods. The separating cylinder is configured to drive the first material grabbing component to move along the guide rods so that the first material grabbing component is arranged close to or far away from the second material grabbing component.

[0016] The material grasping assembly includes a mounting plate and the adsorption assembly as described above, and at least two groups of adsorption assemblies are mounted on the mounting plate.

[0017] In the above technical solution, a transverse slide rail is provided on the mounting plate, one side of the vertical plate is slidably connected to the transverse slide rail, and the connecting rod is arranged on the other side of the vertical plate;

[0018] A variable pitch module is further provided on the mounting plate, and the variable pitch module is configured to drive multiple groups of the adsorption assemblies to move along the transverse slide rail and make adjacent adsorption assemblies approach or move away from each other.

[0019] In the above technical solution, the variable pitch module includes a variable pitch cylinder and a variable pitch plate. The variable pitch cylinder is mounted on the mounting plate, the variable pitch plate is arranged beside the mounting plate, the variable pitch cylinder is configured to drive the variable pitch plate to move vertically, and the adsorption assembly is arranged between the variable pitch plate and the transverse slide rail;

[0020] A plurality of variable pitch grooves are horizontally spaced on the variable pitch plate, and the distance between the tops of adjacent variable pitch grooves is less than the distance between the bottoms of adjacent variable pitch grooves;

[0021] A guide wheel is rotatably mounted on the side wall of the vertical plate above the limiting plate, and the guide wheel of each adsorption assembly is inserted into one of the variable pitch grooves.

[0022] In the above technical solution, when the variable pitch plate moves upward, the guide wheel moves at the bottom of the variable pitch groove, and adjacent adsorption assemblies move away from each other; when the variable pitch plate moves downward, the guide wheel moves at the top of the variable pitch groove, and adjacent adsorption assemblies approach each other.

[0023] In the above technical solution, the first material grasping assembly is arranged in front of the second material grasping assembly. A connecting plate is mounted on the side of the mounting plate of the second material grasping assembly. The connecting plate is arranged parallel to the guide rod, and the separating cylinder is mounted on the connecting plate;

[0024] A longitudinal strip-shaped groove is provided at the front end of the connecting plate. A convex part is provided on the side of the mounting plate of the first material grasping assembly. The convex part passes through the longitudinal strip-shaped groove and faces the separating cylinder. The output shaft of the separating cylinder is connected to the convex part.

[0025] Due to the application of the above technical solution, the present utility model has the following advantages compared with the prior art:

[0026] 1. In the present utility model, the suction cup is installed at the bottom of the connecting rod. The connecting rod is guided in its movement through the through hole on the limiting plate and is pushed downward by the pushing portion. Then, by means of the cut surfaces on both sides of the connecting rod and the setting of the U-shaped plate, the circumferential rotation of the connecting rod is restricted. Thus, it can be ensured that when the connecting rod moves vertically, there will be no circumferential rotation, guaranteeing the stability of chip grasping and detection. At the same time, the connecting rod can directly adopt a columnar structure, and a cut surface can be quickly machined on both of its sides. The U-shaped plate is used to cooperate with the cut surface to achieve circumferential limit. Meanwhile, compared with the connecting rod with a polygonal structure, the connecting rod with a columnar structure moves more smoothly. And by setting a spring, it is a flexible connection, ensuring the stability of the material grasping and testing processes;

[0027] 2. In the present utility model, two sets of material grasping components are provided. A row of suction cups is arranged on each set of material grasping components, and a separating cylinder is used to adjust the distance between the two sets of material grasping components. With the design of double-row suction cups, the chip testing efficiency is improved;

[0028] 3. In the present utility model, the separating cylinder is used to adjust the longitudinal distance between the two rows of suction cups, and a variable distance module is used to adjust the transverse distance between adjacent suction cups. In this way, it can address the problem that the distance between the chips on the tray and the distance between adjacent test positions are inconsistent, thereby ensuring the stability and accuracy of chip grasping and chip testing, and also ensuring the testing efficiency. Description of the Drawings

[0029] Figure 1 is a schematic structural view of the adsorption component in Embodiment 1 of the present utility model;

[0030] Figure 2 is a schematic structural view of the material grasping mechanism for chip testing in Embodiment 1 of the present utility model;

[0031] Figure 3 is a schematic structural view of the second material grasping component in Embodiment 1 of the present utility model;

[0032] Figure 4 is Figure 3 the three-dimensional structural view of.

[0033] Among them: 1. Adsorption component; 11. Vertical plate; 12. Connecting rod; 13. Suction cup; 14. Limiting plate; 15. Air pipe joint; 16. Pushing portion; 17. U-shaped plate; 18. Cut surface; 100. Upper limiting portion; 101. Lower limiting portion; 102. Second limiting plate;

[0034] 21. First material grasping component; 22. Second material grasping component; 23. Guide rod; 24. Separating cylinder; 25. Connecting plate; 26. Longitudinal strip-shaped groove; 27. Convex portion;

[0035] 31. Mounting plate; 32. Horizontal slide rail; 33. Variable pitch cylinder; 34. Variable pitch plate; 35. Variable pitch groove; 36. Guide wheel. Detailed implementation manners

[0036] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments:

[0037] Embodiment 1: Refer to Figure 1 As shown, an adsorption assembly includes a vertical plate 11, a connecting rod 12 and a suction cup 13. A limiting plate 14 is provided on the side wall of the vertical plate 11. A through hole is provided on the limiting plate 14. The middle part of the connecting rod 12 is movably inserted into the through hole.

[0038] A cavity is provided at the bottom of the connecting rod 12. An air pipe joint 15 is provided on the outer surface of the middle part of the connecting rod 12 and communicates with the top of the cavity. The suction cup 13 is installed at the bottom of the connecting rod 12 and communicates with the cavity.

[0039] A pushing part 16 is further provided outside the connecting rod 12. The pushing part 16 pushes the connecting rod 12 to move downward along the through hole.

[0040] A U-shaped plate 17 is further provided on the vertical plate 11 below the limiting plate 14. A U-shaped groove is provided on the U-shaped plate 17. The middle part of the connecting rod 12 is movably arranged in the U-shaped groove. Two cut surfaces 18 are symmetrically provided on the outer surface of the middle part of the connecting rod 12. The two cut surfaces 18 on both sides are respectively in contact with the two side surfaces of the U-shaped groove.

[0041] In this embodiment, during actual use, the suction cup is used to adsorb the chip, adsorb the chip from the tray, and then press it on the test position of the test circuit board. Therefore, after the chip is adsorbed and moved to the test position, the chip cannot rotate to ensure the stability and accuracy during the chip testing process. Therefore, in this embodiment, when the vertical plate moves, it will synchronously drive other components on it to move together. The through hole is provided to guide the up and down movement of the connecting rod, and the pushing part is provided to make the connecting rod always move downward. In this way, after the vertical plate moves downward and the suction cup contacts the chip (or after grasping the chip and contacting the test position), when the vertical plate continues to move downward, the pushing part can be compressed, so that the suction cup and the product are in flexible contact (the chip is pressed on the test position by the flexible thrust of the pushing part), ensuring the stability of material grasping (also ensuring the stability of the contact between the chip and the test position and the effect during the testing process). At the same time, the connecting rod directly adopts a columnar structure. In this way, the connecting rod is more convenient to manufacture and the cost is lower. To prevent the connecting rod from rotating circumferentially, a U-shaped plate is set, and cut surfaces are provided on both sides of the connecting rod. The cut surfaces contact the side walls of the U-shaped groove of the U-shaped plate, so that the connecting rod cannot rotate, and its circumferential rotation is restricted by the cut surfaces and the U-shaped plate. Thus, when the chip is grasped and moved to the test position for testing, the chip stably contacts the test position of the test circuit board, ensuring the test accuracy and stability. At the same time, after the chip testing is completed and it is placed back into the tray, the angle of the chip will not change, ensuring that the chip is stably placed back into the tray.

[0042] At the same time, a cavity is directly formed by opening a hole at the bottom of the connecting rod, and a hole is opened on the side wall of the connecting rod to communicate with the cavity. Then, an air pipe joint is installed at the opening on the side wall of the connecting rod, and the air pipe joint is connected to an air pipe. The negative pressure source gives negative pressure to the cavity through the air pipe, so that the suction cup can be evacuated to adsorb and grasp the chip by negative pressure. In this way, the length of the cavity can be set according to requirements, and it is not necessary for the entire connecting rod to adopt a hollow structure, shortening the path of negative pressure vacuum, making the negative pressure adsorption response speed fast, improving the chip grasping efficiency, and moreover, only a part of the lower part of the connecting rod is a hollow structure, with better strength and not easy to deform.

[0043] See Figure 1 As shown, an upper limit part 100 and a lower limit part 101 are respectively provided at the top and middle of the connecting rod 12. The limit plate 14 is arranged between the upper limit part 100 and the lower limit part 101. The pushing part 16 is a spring. The top of the spring abuts against the bottom surface of the limit plate 14, and the bottom of the spring abuts against the lower limit part 101. The spring pushes the connecting rod 12 to move downward, so that the upper limit part 100 abuts against the top surface of the limit plate 14.

[0044] In this embodiment, in order to limit the up-and-down movement of the connecting rod so that it can only move a partial distance along the axial direction of the connecting rod, upper and lower limit portions are provided. The distance between the upper limit portion and the lower limit portion is greater than the thickness of the limit plate. The pushing portion is a spring, and the spring pushes the connecting rod downward so that the upper limit portion abuts against the top surface of the limit plate. When adsorbing the chip, the vertical plate moves downward. The suction cup first abuts against the top surface of the chip, and then the vertical plate continues to move downward, which will drive the limit plate to move downward, thereby compressing the spring. The downward pressure is applied to the connecting rod through the thrust of the spring. First, the suction cup is flattened to press out some of the gas inside it, and then the air pipe (negative pressure source) sucks air through the air pipe joint to generate negative pressure, so that the suction cup sucks the chip. When the vertical plate moves upward, the vertical plate will first move upward. After the spring returns, when the vertical plate continues to move upward, it will drive the connecting rod, the suction cup and the chip to move upward at the same time. After moving above the test position of the test circuit board, the vertical plate drives it to move downward. When the chip abuts against the test position, the vertical plate continues to move downward, so that the limit plate moves downward synchronously and compresses the spring, thereby tightly pressing the chip against the test position through the thrust of the spring, so as to ensure the stability during the chip test. In this way, the contact between the chip and the test position is a flexible contact, preventing rigid collision damage to the chip and the test circuit board.

[0045] See Figure 1 As shown, a second limit plate 102 is further provided on the vertical plate 11. The second limit plate 102 is arranged between the U-shaped plate 17 and the limit plate 14. A second through hole is provided on the second limit plate 102, and the second through hole is arranged opposite to the through hole. The middle part of the connecting rod 12 is movably inserted into the second through hole, and the lower limit portion 101 is arranged between the second limit plate 102 and the limit plate 14.

[0046] The setting of the second limit plate and the second through hole further guides the connecting rod, ensuring that the connecting rod stably moves along the axial directions of the through hole and the second through hole during the vertical movement of the vertical plate, preventing the chip from shifting in position and ensuring the detection accuracy and detection stability.

[0047] See Figures 2-4 As shown, the present invention further provides a chip testing material grabbing mechanism, including two sets of relatively arranged material grabbing components. The two sets of material grabbing components include a first material grabbing component 21 and a second material grabbing component 22. A plurality of guide rods 23 and at least one separating cylinder 24 are provided on the second material grabbing component 22. The first material grabbing component 21 is movably connected to the plurality of guide rods 23, and the separating cylinder 24 is configured to drive the first material grabbing component 21 to move along the guide rods 23 so that the first material grabbing component 21 is arranged close to or away from the second material grabbing component 22;

[0048] The material grabbing assembly includes a mounting plate 31 and the adsorption assembly 1 as described above. At least two groups of the adsorption assemblies 1 are mounted on the mounting plate 31, and the bottom plane of the suction cup 13 is arranged below the bottom plane of the mounting plate 31.

[0049] In this embodiment, the material grabbing mechanism adopts two groups of relatively arranged material grabbing assemblies. At least two groups of suction cup assemblies are arranged on each group of material grabbing assemblies, that is, at least two suction cups (more suction cups can also be arranged) are arranged on each group of material grabbing assemblies. In this way, the material grabbing mechanism can simultaneously adsorb a larger number of chips for chip grabbing and testing, thereby improving the testing efficiency of the chips. Among them, when grabbing and testing the chips, the chips are pre-placed in the tray. Multiple rows of placement slots are arranged on the tray, and each row of placement slots has multiple placement slots. And a driving mechanism and a test circuit board are arranged on the testing device. The driving mechanism is used to drive the material grabbing mechanism to move in three-axis directions, that is, to move in the X, Y, and Z axes directions (horizontally, longitudinally, and vertically). Multiple test positions are arranged on the test circuit board, and the test positions are used for testing the chips. Among them, two rows of test positions are arranged on the test circuit board, and the distance between the two rows of test positions is greater than the distance between the two rows of placement slots on the tray (the distance between adjacent rows of placement slots on the tray is relatively close, so that a larger number of chips can be placed on the same tray. The distance between the two rows of test positions is greater than the distance between the two rows of placement slots, mainly to prevent the adjacent rows of test positions from being too close and affecting the test accuracy). Therefore, a separation cylinder is provided to drive the two groups of material grabbing assemblies to approach or move away from each other. When the suction cup needs to grab the chips in the tray or put the chips into the tray, the output shaft of the separation cylinder retracts, driving the first material grabbing assembly to approach the second material grabbing assembly, so that the two rows of chips approach each other. When the output shaft of the separation cylinder is completely retracted, the distance between the two rows of suction cups is equal to the distance between the two rows of placement slots on the tray, so that the suction cups of the two groups of material grabbing assemblies can respectively grab the two rows of chips. When the adsorbed chips need to be placed on the test positions for testing, the output shaft of the separation cylinder extends, pushing the first material grabbing assembly away from the second material grabbing assembly, so that the distance between the two rows of suction cups matches the distance between the two rows of test positions. In this way, when the material grabbing assembly moves down, each chip can abut against the corresponding test position, and the test circuit board can test multiple chips simultaneously, with high test efficiency.

[0050] See Figures 2-4 As shown, a transverse slide rail 32 is provided on the mounting plate 31. One side of the vertical plate 11 is slidably connected to the transverse slide rail 32, and the connecting rod 12 is arranged on the other side of the vertical plate 11;

[0051] A variable pitch module is further provided on the mounting plate 31. The variable pitch module is configured to drive multiple groups of the adsorption assemblies 1 to move along the transverse slide rail 32 and make the adjacent adsorption assemblies 1 approach or move away from each other simultaneously.

[0052] Furthermore, to ensure that adjacent test positions in each row of test positions do not interfere with each other, the distance between adjacent test positions in the same row is also larger (for two rows of test positions, it is the vertical spacing, and the vertical spacing between the two rows of test positions is greater than the vertical spacing between the two placement slots. The distance between adjacent test positions in the same row is the horizontal spacing, and the horizontal spacing between adjacent test positions is greater than the horizontal spacing between adjacent placement slots). Or rather, multiple test circuit boards are provided on the device, and one test position is provided on each test circuit board, which can further ensure the accuracy and stability of each chip test. At the same time, if there is a problem with a certain test position, the corresponding test circuit board can be directly replaced or repaired. Therefore, in this embodiment, a horizontal slide rail is provided, and the vertical plate of the adsorption assembly is slidably connected to the horizontal slide rail. The setting of the variable distance module can drive adjacent adsorption assemblies to approach or move away from each other. When adjacent adsorption assemblies approach each other, the horizontal spacing between adjacent suction cups is small, which is convenient for adsorbing the chips in the tray or for placing the chips into the tray. When the horizontal spacing between adjacent suction cups is large, it is convenient to place the adsorbed chips on the test position for chip testing.

[0053] Among them, when the chip is grabbed or placed into the tray, the output shaft of the separation cylinder retracts, the two rows of suction cups approach each other, and the vertical spacing shrinks, so that the distance between the two rows of suction cups is equal to the distance between the two discharge slots. At the same time, the variable distance module drives adjacent suction cups to approach each other, and the horizontal spacing shrinks, so that the distance between adjacent suction cups and adjacent discharge slots is equal. In this way, the two rows of suction cups can be aligned with the two discharge slots, and the chips in the two discharge slots can be adsorbed at the same time or the two rows of chips can be placed into the two discharge slots at the same time.

[0054] See Figures 2-4 As shown, the variable distance module includes a variable distance cylinder 33 and a variable distance plate 34. The variable distance cylinder 33 is installed on the mounting plate 31, the variable distance plate 34 is arranged beside the mounting plate 31, the variable distance cylinder 33 is configured to drive the variable distance plate 34 to move vertically, and the output shaft of the variable distance cylinder 33 is connected to the variable distance plate 34. Thus, by the extension and retraction of the output shaft of the variable distance cylinder 33, the variable distance plate 34 is driven to move vertically. The adsorption assembly 1 is arranged between the variable distance plate 34 and the horizontal slide rail 32;

[0055] A plurality of variable distance slots 35 are horizontally spaced on the variable distance plate 34. The distance between the tops of adjacent variable distance slots 35 is less than the distance between the bottoms of adjacent variable distance slots 35; the distance between the tops of adjacent two variable distance slots is a, and the distance between the bottoms of adjacent two variable distance slots is b, and the value of a is less than the value of b. Among them, the variable distance plate is a conventional structure.

[0056] A guide wheel 36 is rotatably mounted on the side wall of the vertical plate 11 above the limit plate 14, and the guide wheel 36 of each adsorption assembly is inserted into one of the variable pitch grooves 35.

[0057] When the variable pitch plate moves upward, the guide wheel moves at the bottom of the variable pitch groove, and adjacent adsorption assemblies move away from each other; when the variable pitch plate moves downward, the guide wheel moves at the top of the variable pitch groove, and adjacent adsorption assemblies move closer to each other.

[0058] Since the vertical position of the vertical plate relative to the mounting plate does not change, the extension and retraction of the output shaft of the variable pitch cylinder drive the variable pitch plate to move up and down, causing the positions of the top and bottom of the variable pitch groove to be adjusted. Therefore, while the position of the variable pitch groove changes (the variable pitch groove is obliquely arranged), it drives the guide wheel to move horizontally, thereby driving the suction cup mounting assembly to move along the horizontal slide rail to adjust the distance between adjacent suction cups. Among them, the diameter of the guide wheel matches the width of the variable pitch groove, and the diameter of the guide wheel is smaller than the length of the variable pitch groove. In this way, when the variable pitch plate moves up and down, it will pull the guide wheel to move horizontally through the variable pitch groove, realizing the mutual approach or separation of adjacent adsorption assemblies.

[0059] See Figure 2 、 4 As shown in the figure, the first material grabbing assembly 21 is arranged on the front side of the second material grabbing assembly 22. A connecting plate 25 is installed on the side of the mounting plate 31 of the second material grabbing assembly 22. The connecting plate 25 is arranged parallel to the guide rod 23, and the separation cylinder 24 is installed on the connecting plate 25;

[0060] A longitudinal strip-shaped groove 26 is provided at the front end of the connecting plate 25. A convex portion 27 is provided on the side of the mounting plate 31 of the first material grabbing assembly 21. The convex portion 27 passes through the longitudinal strip-shaped groove 26 and is arranged opposite to the separation cylinder 24, and the output shaft of the separation cylinder 24 is connected to the convex portion 27.

[0061] In this embodiment, in order to ensure the accuracy of the extension and retraction of the output shaft of the separation cylinder and the accuracy of the position when the first material grabbing assembly and the second material grabbing assembly approach or separate from each other, therefore, by setting a connecting plate, a longitudinal strip-shaped groove is set on the connecting plate. The longitudinal strip-shaped groove is arranged parallel to the output shaft of the separation cylinder, and the output shaft of the separation cylinder is also arranged parallel to the guide rod. Moreover, the convex portion passes through the longitudinal strip-shaped groove and is connected to the output shaft of the separation cylinder. When the output shaft of the separation cylinder extends and the convex portion contacts the front end of the longitudinal strip-shaped groove, the first material grabbing assembly and the second material grabbing assembly are separated in place. When the output shaft of the separation cylinder retracts and the convex portion contacts the rear end of the longitudinal strip-shaped groove, the first material grabbing assembly and the second material grabbing assembly are close to each other in place. In this way, the positions of the first material grabbing assembly and the second material grabbing assembly approaching and separating from each other are accurate and stable.

Claims

1. An adsorption component, characterized in that: It includes a vertical plate, a connecting rod and a suction cup. A limiting plate is provided on the side wall of the vertical plate, and a through hole is provided on the limiting plate. The middle part of the connecting rod is movably inserted into the through hole; A cavity is provided at the bottom of the connecting rod. An air pipe joint is provided on the outer surface of the middle part of the connecting rod and communicates with the top of the cavity. The suction cup is installed at the bottom of the connecting rod and communicates with the cavity; A pushing part is further provided outside the connecting rod. The pushing part pushes the connecting rod to move downward along the through hole; A U-shaped plate is further provided on the vertical plate below the limiting plate. A U-shaped groove is provided on the U-shaped plate. The middle part of the connecting rod is movably arranged in the U-shaped groove. Two cut surfaces are symmetrically provided on the outer surface of the middle part of the connecting rod, and the two cut surfaces on both sides are respectively in contact with the two side surfaces of the U-shaped groove.

2. The adsorption component according to claim 1, wherein: An upper limiting part and a lower limiting part are respectively provided at the top and middle of the connecting rod. The limiting plate is arranged between the upper limiting part and the lower limiting part. The pushing part is a spring. The top of the spring abuts against the bottom surface of the limiting plate, and the bottom of the spring abuts against the lower limiting part. The spring pushes the connecting rod to move downward so that the upper limiting part abuts against the top surface of the limiting plate.

3. The adsorption assembly according to claim 2, wherein: A second limiting plate is further provided on the vertical plate. The second limiting plate is arranged between the U-shaped plate and the limiting plate. A second through hole is provided on the second limiting plate. The second through hole is arranged opposite to the through hole. The middle part of the connecting rod is movably inserted into the second through hole, and the lower limiting part is arranged above the second limiting plate.

4. A material grabbing mechanism for chip testing, characterized in that: It includes two sets of oppositely arranged material grasping assemblies. The two sets of material grasping assemblies include a first material grasping assembly and a second material grasping assembly. A plurality of guide rods and at least one separating cylinder are provided on the second material grasping assembly. The first material grasping assembly is movably connected to the plurality of guide rods. The separating cylinder is configured to drive the first material grasping assembly to move along the guide rods so that the first material grasping assembly is arranged close to or far away from the second material grasping assembly; The material grasping assembly includes a mounting plate and the adsorption assembly according to any one of claims 1-3. At least two sets of adsorption assemblies are mounted on the mounting plate.

5. The pick-up mechanism for chip testing according to claim 4, characterized in that: A transverse slide rail is provided on the mounting plate. One side of the vertical plate is slidably connected to the transverse slide rail, and the connecting rod is arranged on the other side of the vertical plate; A variable pitch module is further provided on the mounting plate. The variable pitch module is configured to drive a plurality of sets of adsorption assemblies to move along the transverse slide rail and make adjacent adsorption assemblies approach or separate from each other.

6. The pick-up mechanism for chip testing according to claim 5, wherein: The variable pitch module includes a variable pitch cylinder and a variable pitch plate. The variable pitch cylinder is installed on the mounting plate. The variable pitch plate is arranged beside the mounting plate. The variable pitch cylinder is configured to drive the variable pitch plate to move vertically. The adsorption assembly is arranged between the variable pitch plate and the transverse slide rail; A plurality of variable pitch grooves are transversely spaced on the variable pitch plate. The distance between the tops of adjacent variable pitch grooves is less than the distance between the bottoms of adjacent variable pitch grooves; A guide wheel is rotatably installed on the side wall of the vertical plate above the limiting plate. The guide wheel of each adsorption assembly is inserted into one variable pitch groove.

7. The pick-up mechanism for chip testing according to claim 6, wherein: When the variable pitch plate moves upward, the guide wheel moves at the bottom of the variable pitch groove, and adjacent adsorption components move away from each other; when the variable pitch plate moves downward, the guide wheel moves at the top of the variable pitch groove, and adjacent adsorption components move closer to each other.

8. The chip testing material grabbing mechanism according to claim 4, wherein: The first material grasping component is arranged on the front side of the second material grasping component. A connecting plate is installed on the side of the mounting plate of the second material grasping component. The connecting plate is arranged parallel to the guide rod, and the separating cylinder is installed on the connecting plate; A longitudinal strip-shaped groove is provided at the front end of the connecting plate. A convex portion is provided on the side of the mounting plate of the first material grasping component. The convex portion passes through the longitudinal strip-shaped groove and is arranged opposite to the separating cylinder. The output shaft of the separating cylinder is connected to the convex portion.

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