Silicon wafer basket conveying, positioning and lifting device

Abstract

The utility model relates to the field of photovoltaic equipment, and discloses a silicon wafer basket conveying, positioning and lifting device which comprises a conveying and positioning mechanism and a lifting module used for driving the whole conveying and positioning mechanism to move up and down. The conveying and positioning mechanism comprises a transmission assembly used for conveying the silicon wafer flower basket, a jacking and positioning assembly used for lifting the height of the silicon wafer flower basket, and a pressing assembly used for fixing the silicon wafer flower basket. The downward pressing assembly is arranged above the conveying assembly and connected with the conveying assembly through the frame main plate, and the jacking positioning assembly is arranged between the conveying assembly and the downward pressing assembly and movably arranged on the conveying assembly through the guiding assembly. The lifting module is arranged on one side of the conveying and positioning mechanism and connected with the frame main plate. According to the utility model, the problems of positioning and shaking generated when the flower basket works on the belt can be solved, the positioning precision of the flower basket is improved, the maintenance cost of equipment can be reduced, and the downtime and the downtime frequency of the equipment are reduced, so that the productivity of the equipment is improved.

Description

Technical Field

[0001] The utility model relates to the field of photovoltaic equipment, in particular to a wafer carrier conveying, positioning, lifting and lowering device. Background Art

[0002] Today, with the rapid development of photovoltaic technology, improving the stability of the entire production line, reducing equipment production costs and maintenance costs have always been an unchanged topic in the entire history of photovoltaic development for photovoltaic cell production lines. During the storage and transmission of wafers, they are usually loaded in carriers. The wafers are carried in the carriers and separated by toothed bars, which facilitates the transfer of the wafers with the carriers. Since the carrier will vibrate during the transmission process, the position of the wafer will shift with the vibration. Therefore, it is necessary to position the carrier once before the wafers enter and exit the carrier.

[0003] Currently, there are mainly two relatively effective solutions on the market: First, use a side cylinder to push the carrier to slide on the belt and lean against the side stop for positioning, and use the top cylinder to press down for clamping. Second, use a side cylinder to push the carrier to slide on the belt and lean against the side stop for positioning, and use a wedge block to lean against the carrier by the top cylinder for positioning and clamping. Although the above solutions can achieve the effect of positioning and anti-vibration, they also bring the following defects: First, using a cylinder to press down and clamp the carrier indirectly presses the conveyor belt, making the service life of the belt far lower than the normal service life. Using a cylinder to push the carrier for positioning laterally or using a wedge block of the pressing cylinder to position the carrier makes the carrier directly slide on the conveyor belt by friction, making the service life of the belt far lower than the normal service life. Second, using a cylinder to press down and clamp the carrier and the conveyor belt, due to the deformation caused by the compression of the belt, a large error occurs in the positioning of the carrier.

[0004] Therefore, the traditional positioning solutions on the market still need to be improved to fundamentally solve the problem of the carrier operating on the belt. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the deficiencies of the prior art and provide a wafer carrier conveying, positioning, lifting and lowering device, which can not only solve the problems of positioning and vibration generated by the carrier operating on the belt, improve the positioning accuracy of the carrier, but also reduce the equipment maintenance cost, reduce the downtime and shutdown frequency of the equipment, thereby improving the production capacity of the equipment, which has great significance for the future development of the industry and has a good application prospect.

[0006] To achieve the above purpose, the utility model adopts the following technical solutions:

[0007] The utility model discloses a wafer carrier conveying and positioning lifting device, which comprises a conveying and positioning mechanism and a lifting module for driving the whole conveying and positioning mechanism to move up and down. The conveying and positioning mechanism comprises a transmission component for conveying the wafer carrier, a jacking and positioning component for lifting the height of the wafer carrier, and a pressing component for fixing the wafer carrier; the pressing component is arranged above the transmission component and connected through a frame main board, the jacking and positioning component is arranged between the transmission component and the pressing component and movably arranged on the transmission component through a guiding component; the lifting module is arranged on one side of the conveying and positioning mechanism and connected with the frame main board.

[0008] Further, the transmission component comprises a conveyor belt, a transmission wheel, a transmission motor and a bottom frame; the transmission wheel and the transmission motor are arranged on the bottom frame, and the transmission wheel is connected with the transmission motor through the conveyor belt.

[0009] Further, the jacking and positioning component comprises a jacking cylinder, a lifting plate, a carrier positioning pin, a guiding component and a limiting plate; the jacking cylinder is fixed on the bottom frame, and the moving end is connected with the lifting plate; the carrier positioning pin is arranged on the upper end face of the lifting plate and matched with the positioning hole at the bottom of the wafer carrier, and the limiting plate is arranged on one side of the lifting plate; the guiding component is respectively connected with the bottom frame and the lifting plate.

[0010] Further, the guiding component comprises a jacking slider and a jacking slide rail which are cooperatively connected; the jacking slider is connected with the bottom frame, and the jacking slide rail is connected with the lifting plate.

[0011] Further, the pressing component comprises a top plate, a guiding shaft, a compression spring and a pressing plate; the top plate is connected with one end of the frame main board, and the other end of the frame main board is connected with the bottom frame; one end of the guiding shaft is fixed on the pressing plate, and the other end is movably arranged on the top plate, and the compression spring is arranged on the guiding shaft and located between the top plate and the pressing plate.

[0012] Further, a plurality of support rods are vertically arranged between the pressing component and the transmission component.

[0013] Further, the lifting module comprises a lifting bracket, a lifting cylinder, a lifting slider and a lifting slide rail; the lifting cylinder and the lifting slide rail are fixed on the lifting bracket, the lifting slider is matched with the lifting slide rail, the lifting slider is fixed on the frame main board, and the moving end of the lifting cylinder is connected with the frame main board.

[0014] The beneficial effects of the utility model are as follows:

[0015] The utility model transports the wafer carrier to the lifting and positioning assembly through the transmission assembly. After positioning, it is lifted, and the pressing assembly presses down the wafer carrier to ensure that the position of the carrier does not change during the blanking process. It not only has high positioning accuracy, but also does not cause any damage to the transmission belt, increases the service life of the transmission belt, reduces the shutdown frequency and equipment maintenance cost. After the pressing mechanism presses down, a spring is used for pressing, which does not make hard contact with the carrier, reduces the risk of carrier deformation, and increases the service life of the carrier. Brief Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0017] Figure 1 is the structural schematic diagram of this embodiment.

[0018] Figure 2 is the structural schematic diagram of the conveying and positioning mechanism.

[0019] Figure 3 is the structural schematic diagram of the conveying and positioning mechanism after hiding the fixing plate of the transmission assembly.

[0020] Figure 4 is the structural schematic diagram of another angle of the conveying and positioning mechanism.

[0021] Figure 5 is the structural schematic diagram of the conveying and positioning lifting device with the wafer carrier placed on it.

[0022] Figure 6 is the structural schematic diagram of the wafer carrier.

[0023] Main Component Symbol Explanation:

[0024] 1. Lifting module, 11. Lifting bracket, 12. Lifting cylinder;

[0025] 2. Transmission assembly, 21. Conveyor belt, 22. Conveyor wheel, 23. Conveyor motor, 24. Bottom frame;

[0026] 3. Lifting and positioning assembly, 31. Lifting cylinder, 32. Lifting plate, 33. Carrier positioning pin, 34. Guide assembly, 35. Limit plate;

[0027] 4. Pressing assembly, 41. Top plate, 42. Guide shaft, 43. Compression spring, 44. Pressing plate;

[0028] 5. Frame main board;

[0029] 6. Silicon wafer carrier. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the specification. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] In the present invention, unless otherwise stated, directional words such as "up, down, left, right" are generally understood in combination with the directions shown in the drawings and actual applications.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0034] The endpoints and any values of the ranges disclosed in this article are not limited to the precise ranges or values, and these ranges or values should be understood to include values close to these ranges or values. For numerical ranges, the endpoint values of each range, the endpoint values of each range and the individual point values, and the individual point values can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed in this article. Among them, the terms "optional" and "optional" all mean that they can be included or not (or can be included or not).

[0035] like Figure 1As shown in the figure, the utility model discloses a silicon wafer carrier conveying and positioning lifting device, which includes a conveying and positioning mechanism and a lifting module 1 for driving the overall up and down movement of the conveying and positioning mechanism.

[0036] As Figure 2 shown, the conveying and positioning mechanism includes a transmission component 2 for conveying the silicon wafer carrier, a jacking and positioning component 3 for lifting the height of the silicon wafer carrier, and a pressing component 4 for fixing the silicon wafer carrier. The pressing component 4 is arranged above the transmission component 2 and is connected through a frame main board 5. The jacking and positioning component 3 is arranged between the transmission component 2 and the pressing component 4 and is movably arranged on the transmission component 2 through a guiding component 34. The lifting module 1 is arranged on one side of the conveying and positioning mechanism and is connected to the frame main board 5.

[0037] In this embodiment, the silicon wafer carrier 6 is conveyed to the jacking and positioning component 3 by the transmission component 2. After positioning, it is lifted, and the pressing component 4 presses the silicon wafer carrier 6 to ensure that the position of the carrier does not change during the blanking process. It not only has high positioning accuracy, but also does not cause any damage to the transmission belt, increases the service life of the transmission belt, and reduces the downtime frequency and equipment maintenance cost.

[0038] In order to increase the stability of the conveying and positioning mechanism and better fix the silicon wafer carrier, several support rods are vertically arranged between the pressing component 4 and the transmission component 2 to prevent the silicon wafer carrier 6 from tilting and running out of position.

[0039] Specifically:

[0040] As Figure 2 、 Figure 4 shown, the transmission component 2 includes a conveyor belt 21, conveyor wheels 22, a conveyor motor 23, and a bottom frame 24. The conveyor wheels 22 and the conveyor motor 23 are arranged on the bottom frame 24, and the conveyor wheels 22 are connected to the conveyor motor 23 through the conveyor belt 21.

[0041] As Figure 2 、 Figure 3 、 Figure 4 shown, the jacking and positioning component 3 includes a jacking cylinder 31, a lifting plate 32, a carrier positioning pin 33, a guiding component 34, and a limiting plate 35. Referring to Figure 4 , the jacking cylinder 31 is fixed on the bottom frame 24, and the moving end is connected to the lifting plate 32 for driving the lifting plate 32 to move up and down relative to the bottom frame 24. The carrier positioning pin 33 is arranged on the upper end surface of the lifting plate 32 and is matched with the positioning hole at the bottom of the silicon wafer carrier 6. The limiting plate 35 is arranged on one side of the lifting plate 32 for limiting and positioning the end position of the silicon wafer carrier 6. Referring to Figure 3 shown, the guiding component 34 is respectively connected to the bottom frame 24 and the lifting plate 32.

[0042] Among them, the guiding component 34 includes a jacking slider and a jacking slide rail that are connected and cooperate with each other; the jacking slider is connected to the bottom frame 24, and the jacking slide rail is connected to the lifting plate 32.

[0043] As Figure 2 , Figure 4 shown, the pressing component 4 includes a top plate 41, a guiding shaft 42, a compression spring 43, and a pressing plate 44. The top plate 41 is connected to one end of the main frame board 5, and the other end of the main frame board 5 is connected to the bottom frame 24. One end of the guiding shaft 42 is fixed on the pressing plate 44, and the other end is movably arranged on the top plate 41. The compression spring 43 is arranged on the guiding shaft 42 and is located between the top plate 41 and the pressing plate 44. Using a spring for pressing will not cause hard contact with the flower basket, reducing the risk of deformation of the flower basket and increasing the service life of the flower basket.

[0044] As Figure 1 shown, the lifting module 1 includes a lifting bracket 11, a lifting cylinder 12, a lifting slider, and a lifting slide rail; the lifting cylinder 12 and the lifting slide rail are fixed on the lifting bracket 11. The lifting slider cooperates with the lifting slide rail, and the lifting slider is fixed on the main frame board 5. The moving end of the lifting cylinder 12 is connected to the main frame board 5.

[0045] Workflow:

[0046] As Figures 1 to 6 shown, the lifting module 1 raises the conveying and positioning mechanism to the docking height. The conveying motor 23 drives the conveying wheel 22 and drives the conveying belt 21 to move, transporting the silicon wafer flower basket 6 to the limiting plate 35 on the lifting plate 32. The jacking cylinder 31 drives the lifting plate 32 to rise. The flower basket positioning pin 33 is inserted into the positioning hole of the silicon wafer flower basket 6, and the lifting plate 32 lifts the silicon wafer flower basket 6 to the required height. As the height of the flower basket increases, it drives the pressing plate 44 to rise, and the compression spring 43 contracts to tightly press the silicon wafer flower basket 6, and the docking mechanism starts to unload the silicon wafers.

[0047] After the silicon wafers on the silicon wafer flower basket 6 are unloaded, the jacking cylinder 31 drives the lifting plate 32 to descend. The lifting plate 32 places the silicon wafer flower basket 6 on the conveying belt 21. The flower basket positioning pin 33 disengages from the positioning hole of the silicon wafer flower basket 6. The lifting module 1 lowers the conveying and positioning mechanism to the docking height. The conveying motor 23 drives the conveying wheel 22 and drives the conveying belt 21 to transport the silicon wafer flower basket 6 out of the silicon wafer flower basket conveying and positioning machine.

[0048] In the example, there is a single flower basket. The number shown in the figure is only to make the purpose, technical solution, and advantages of the embodiments of the present invention clearer. The described embodiments are partial embodiments of the present invention, not all embodiments. Therefore, it cannot be understood as a limitation on the protection scope of the present invention.

[0049] The utility model can be applied in the photovoltaic industry, including but not limited to process sections such as PVD and PECVD. Any improvement or transformation of the process requirements achieved by using this equipment shall fall within the protection scope of the appended claims of the utility model.

[0050] In summary, the utility model can not only solve the problems of positioning and jitter generated by the flower basket during operation on the belt, improve the positioning accuracy of the flower basket, but also reduce the equipment maintenance cost, reduce the downtime and shutdown frequency of the equipment, thereby improving the production capacity of the equipment, which is of great significance to the future development of the industry and has a good application prospect.

[0051] The preferred embodiments of the utility model have been described in detail above. However, the utility model is not limited thereto. Within the technical concept scope of the utility model, various simple modifications can be made to the technical solutions of the utility model, including any other suitable combination of each technical feature. These simple modifications and combinations should also be regarded as the disclosed content of the utility model and fall within the protection scope of the utility model.

Claims

1. A silicon wafer carrier conveying, positioning, lifting and lowering device, characterized in that: It includes a conveying and positioning mechanism and a lifting module for driving the overall up-and-down movement of the conveying and positioning mechanism. The conveying and positioning mechanism includes a transmission component for conveying a wafer carrier basket, a jacking and positioning component for lifting the height of the wafer carrier basket, and a pressing component for fixing the wafer carrier basket. The pressing component is arranged above the transmission component and is connected through a frame main board. The jacking and positioning component is arranged between the transmission component and the pressing component and is movably arranged on the transmission component through a guiding component. The lifting module is arranged on one side of the conveying and positioning mechanism and is connected to the frame main board.

2. The wafer carrier conveying, positioning, lifting and lowering device according to claim 1, wherein: The transmission component includes a conveyor belt, a conveyor wheel, a conveyor motor, and a bottom frame. The conveyor wheel and the conveyor motor are arranged on the bottom frame, and the conveyor wheel is connected to the conveyor motor through the conveyor belt.

3. The silicon wafer carrier conveying, positioning, lifting and lowering device according to claim 2, wherein: The jacking and positioning component includes a jacking cylinder, a lifting plate, a basket positioning pin, a guiding component, and a limiting plate. The jacking cylinder is fixed on the bottom frame, and the moving end is connected to the lifting plate. The basket positioning pin is arranged on the upper end surface of the lifting plate and is matched with the positioning hole at the bottom of the wafer carrier basket. The limiting plate is arranged on one side of the lifting plate. The guiding component is respectively connected to the bottom frame and the lifting plate.

4. The silicon wafer carrier conveying, positioning, lifting and lowering device according to claim 3, wherein: The guiding component includes a jacking slider and a jacking slide rail that are cooperatively connected. The jacking slider is connected to the bottom frame, and the jacking slide rail is connected to the lifting plate.

5. The wafer boat conveying, positioning, lifting and lowering device according to claim 4, wherein: The pressing component includes a top plate, a guiding shaft, a compression spring, and a pressing plate. The top plate is connected to one end of the frame main board, and the other end of the frame main board is connected to the bottom frame. One end of the guiding shaft is fixed on the pressing plate, and the other end is movably arranged on the top plate. The compression spring is arranged on the guiding shaft and is located between the top plate and the pressing plate.

6. The wafer boat conveying, positioning, lifting and lowering device according to claim 1, wherein: A number of support rods are vertically arranged between the pressing component and the transmission component.

7. The wafer carrier conveying and positioning lifting device according to claim 5, wherein: The lifting module includes a lifting bracket, a lifting cylinder, a lifting slider, and a lifting slide rail. The lifting cylinder and the lifting slide rail are fixed on the lifting bracket. The lifting slider is matched with the lifting slide rail, and the lifting slider is fixed on the frame main board. The moving end of the lifting cylinder is connected to the frame main board.

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