MEMS sensor module
By using the design of using a partition wall and glue to wrap the ASIC chip in the MEMS sensor module, the problem of the heat of the ASIC chip affecting other MEMS sensors is solved, ensuring the normal working performance of the module.
Patent Information
- Application Number
- CN202422437384.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-10-09
AI Technical Summary
In the existing MEMS sensor module, the heat generated when the ASIC chip is working is spread through the circuit board or air, affecting the performance of the temperature-sensitive MEMS sensor components, causing it to fail to work properly.
The partition wall is used to separate the MEMS sensor module into two cavitys, and the ASIC chip with high heat is wrapped with glue, surround each cavity through a gold finger layer, reduce heat propagation, and set up breathable notches to meet the breathable needs.
It effectively avoids the impact of heat during ASIC chip on other MEMS sensor components during operation, ensuring the normal working performance of the module.
Smart Images
Figure CN223118147U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of sensors, in particular to a MEMS sensor module.
Background Art
[0002] The MEMS sensor modules in the related art will internally integrate multiple MEMS sensor components to achieve at least one sensor function. For example, pressure sensors, microphone sensors, gas sensors, etc.
[0003] The MEMS sensor component includes a MEMS chip and an ASIC chip. However, when the ASIC chip of some MEMS sensor components works, it will generate a large amount of heat, and these heats will be transmitted through the circuit board or the thermal movement of the air in the module, thus affecting those MEMS sensor components that are sensitive to temperature, resulting in the performance degradation of these MEMS sensor components and their inability to work properly.
[0004] Therefore, it is necessary to provide a new MEMS sensor module to solve the above technical problems.
Summary of the Utility Model
[0005] The purpose of the utility model is to overcome the above technical problems and provide a MEMS sensor module, which can avoid the large amount of heat generated when the ASIC chip of one MEMS sensor component works from affecting another MEMS sensor component.
[0006] To achieve the above purpose, the utility model provides a MEMS sensor module, which includes side walls surrounding a cavity, a first circuit board arranged on the top of the side walls, and a second circuit board arranged on the bottom of the side walls. The MEMS sensor module further includes a partition wall arranged in the cavity and connected to the side walls. The partition wall divides the cavity into a first cavity and a second cavity. A first MEMS sensor component wrapped by glue is arranged in the first cavity, and a second MEMS sensor component is arranged in the second cavity. A first gold finger layer is arranged between the side walls and the partition wall and the first circuit board. The first gold finger layer surrounds the first cavity and the second cavity respectively. A second gold finger layer is arranged between the side walls and the partition wall and the second circuit board. The second gold finger layer surrounds the first cavity and the second cavity respectively. A notch communicating the first cavity and the second cavity is arranged on the first gold finger layer at the partition wall.
[0007] Preferably, the first MEMS sensor component includes a first ASIC chip fixed to the second circuit board, a first MEMS chip stacked and fixed to the first ASIC chip, a first bonding wire connecting the first ASIC chip and the first MEMS chip, and a second bonding wire connecting the first ASIC chip and the second circuit board. The second MEMS sensor component includes a second ASIC chip fixed to the second circuit board, a second MEMS chip fixed to the second circuit board, a third bonding wire connecting the second ASIC chip and the second MEMS chip, and a fourth bonding wire connecting the second ASIC chip and the second circuit board. The first ASIC chip, the first MEMS chip, the first bonding wire, and the second bonding wire are completely wrapped by the glue.
[0008] Preferably, the total area of the notch is less than 6400 μm 2 .
[0009] Preferably, the inner surface of the side wall enclosing the cavity is a metallized surface.
[0010] Preferably, the first gold finger layer includes a first part of the first gold finger layer disposed on the side wall and the partition wall, and a second part of the first gold finger layer disposed on the first circuit board. The first part of the first gold finger layer and the second part of the first gold finger layer are combined to form the first gold finger layer. The notch is disposed on the first part of the first gold finger layer.
[0011] Preferably, both the first circuit board and the second circuit board are embedded with capacitors and resistors for eliminating high-frequency signal interference.
[0012] Preferably, the second circuit board is provided with a through hole corresponding to the position of the second MEMS chip, and the through hole communicates the second MEMS chip with the outside.
[0013] In the MEMS sensor module of the present invention, the first gold finger layer surrounds the first cavity and the second cavity respectively, and the second gold finger layer surrounds the first cavity and the second cavity respectively, thereby dividing the regions of the first cavity and the second cavity. In addition, the MEMS sensor component including the ASIC chip that generates a large amount of heat during operation is wrapped with glue, thereby reducing the heat flow disturbance caused by the large amount of heat generated by the ASIC chip during operation. Such a setting can prevent the large amount of heat generated by the ASIC chip of one MEMS sensor component from affecting another MEMS sensor component during operation.
Description of the Drawings
[0014] To more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art of the present utility model, without creative efforts, other drawings can also be obtained based on these drawings, where:
[0015] Figure 1 is a perspective view of the MEMS sensor module of the present utility model;
[0016] Figure 2 is an exploded perspective view of the MEMS sensor module of the present utility model;
[0017] Figure 3 is an exploded perspective view of the MEMS sensor module of the present utility model from another perspective;
[0018] Figure 4 is a cross-sectional view of the MEMS sensor module of the present utility model.
Specific Embodiments
[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art of the present utility model without creative efforts belong to the scope of protection of the present utility model.
[0020] Please refer to Figures 1-4 As shown, the MEMS sensor module 100 provided by the present utility model includes a side wall 1 surrounding a cavity 10, a first circuit board 2 disposed at the top of the side wall 1, a second circuit board 3 disposed at the bottom of the side wall 1, a partition wall 4 disposed in the cavity 10 and connected to the side wall 1, and a first MEMS sensor component 5 and a second MEMS sensor component 7 disposed in the cavity 10. The first MEMS sensor component 5 and the second MEMS sensor component 7 can implement at least one sensor function among a pressure sensor, a microphone sensor, a gas sensor, etc.
[0021] The partition wall 4 divides the cavity 10 into a first cavity 11 and a second cavity 12.
[0022] The first cavity 11 is provided with the first MEMS sensor component 5, and the first MEMS sensor component 5 is wrapped by glue 6, and the glue 6 can be selected as jelly glue.
[0023] The second MEMS sensor assembly 7 is disposed in the second cavity 12.
[0024] A first gold finger layer 8 is provided between the side wall 1, the partition wall 4 and the first circuit board 2. The first gold finger layer 8 surrounds the first cavity 11 and the second cavity 12 respectively. A second gold finger layer 9 is provided between the side wall 1, the partition wall 4 and the second circuit board 3. The second gold finger layer 9 surrounds the first cavity 11 and the second cavity 12 respectively. The first gold finger layer 8 and the second gold finger layer 9 divide the regions of the first cavity 11 and the second cavity 12, and the first MEMS sensor assembly 5 and the second MEMS sensor assembly 7 respectively have their own regions.
[0025] The first MEMS sensor assembly 5 includes a first ASIC chip 51 fixed to the second circuit board 3, a first MEMS chip 52 stacked and fixed on the first ASIC chip 51, a first bonding wire 53 connecting the first ASIC chip 51 and the first MEMS chip 52, and a second bonding wire 54 connecting the first ASIC chip 51 and the second circuit board 3. The first ASIC chip 51, the first MEMS chip 52, the first bonding wire 53 and the second bonding wire 54 are completely wrapped by the glue 6.
[0026] The second MEMS sensor assembly 7 includes a second ASIC chip 71 fixed to the second circuit board 3, a second MEMS chip 72 fixed to the second circuit board 3, a third bonding wire 73 connecting the second ASIC chip 71 and the second MEMS chip 72, and a fourth bonding wire 74 connecting the second ASIC chip 71 and the second circuit board 3.
[0027] As an option, the first gold finger layer 8 may include a first part 81 of the first gold finger layer disposed on the side wall 1 and the partition wall 4, and a second part 82 of the first gold finger layer disposed on the first circuit board 2. The projections of the first part 81 of the first gold finger layer and the second part 82 of the first gold finger layer coincide, and the first part 81 of the first gold finger layer and the second part 82 of the first gold finger layer are combined to form the first gold finger layer 8. Of course, the first gold finger layer 8 may also be formed in other feasible ways, and is not limited to the combination of two parts.
[0028] Similarly, the second gold finger layer 9 may include a first part 91 of the second gold finger layer disposed on the sidewall 1 and the partition wall 4, and a second part 92 of the second gold finger layer disposed on the second circuit board 3. The projections of the first part 91 of the second gold finger layer and the second part 92 of the second gold finger layer coincide, and the first part 91 of the second gold finger layer and the second part 92 of the second gold finger layer are combined to form the second gold finger layer 9. Of course, the second gold finger layer 9 may also be formed in other feasible ways, and is not limited to the combination of two parts.
[0029] The first gold finger layer 8 at the partition wall 4 is provided with a notch 80 communicating the first cavity 11 and the second cavity 12. Specifically, the notch 80 is disposed on the first part 81 of the first gold finger layer. The notch 80 can meet the air permeability requirement of the MEMS sensor module 100, can reduce the air hole requirements of the sidewall 1, the first circuit board 2 and the second circuit board 3 of the MEMS sensor module 100, is convenient for the design of the backend application, and saves the cost of the backend application. Of course, in other embodiments, the notch 80 may also be disposed on the second part 82 of the first gold finger layer, or may also be disposed on the first part 81 of the first gold finger layer and the second part 82 of the first gold finger layer. The total area of the notch 80 may be selected to be less than 6400 μm 2 。
[0030] In this embodiment, the second circuit board 3 is provided with a through hole 31 corresponding to the position of the second MEMS chip 72, and the through hole 31 communicates the second MEMS chip 72 and the outside. As an option, the through hole 31 may be a sound inlet hole, and the second MEMS chip 72 may be a MEMS microphone chip.
[0031] As an option, the inner surface of the sidewall 1 surrounding the cavity 10 is a metallized surface to meet the radio frequency interference resistance ability of the MEMS sensor module 100.
[0032] As an option, the first circuit board 2 and the second circuit board 3 may be selected to bury capacitors and resistors for eliminating high-frequency signal interference.
[0033] In the MEMS sensor module of the present utility model, the first gold finger layer surrounds the first cavity and the second cavity respectively, and the second gold finger layer surrounds the first cavity and the second cavity respectively, thereby dividing the regions of the first cavity and the second cavity. In addition, the MEMS sensor component including the ASIC chip that generates a large amount of heat during operation is wrapped with glue, thereby reducing the heat flow disturbance caused by the large amount of heat generated by the ASIC chip during operation. Such a setting can prevent the large amount of heat generated by the ASIC chip of one MEMS sensor component from affecting another MEMS sensor component during operation.
[0034] The above are only the embodiments of the present utility model. It should be noted here that for those of ordinary skill in the field of the present utility model, improvements can be made without departing from the creative concept of the present utility model, but these all belong to the protection scope of the present utility model.
Claims
1. A MEMS sensor module, comprising side walls enclosing a cavity, a first circuit board disposed at the top of the side walls, and a second circuit board disposed at the bottom of the side walls, characterized in that, The MEMS sensor module further includes a partition wall disposed in the cavity and connected to the side wall. The partition wall divides the cavity into a first cavity and a second cavity. A first MEMS sensor component wrapped by glue is disposed in the first cavity, and a second MEMS sensor component is disposed in the second cavity. A first gold finger layer is provided between the side wall and the partition wall and the first circuit board. The first gold finger layer surrounds the first cavity and the second cavity respectively. A second gold finger layer is provided between the side wall and the partition wall and the second circuit board. The second gold finger layer surrounds the first cavity and the second cavity respectively. A notch communicating the first cavity and the second cavity is provided in the first gold finger layer at the partition wall.
2. The MEMS sensor module according to claim 1, wherein The first MEMS sensor component includes a first ASIC chip fixed to the second circuit board, a first MEMS chip stacked and fixed on the first ASIC chip, a first bonding wire connecting the first ASIC chip and the first MEMS chip, and a second bonding wire connecting the first ASIC chip and the second circuit board. The second MEMS sensor component includes a second ASIC chip fixed to the second circuit board, a second MEMS chip fixed to the second circuit board, a third bonding wire connecting the second ASIC chip and the second MEMS chip, and a fourth bonding wire connecting the second ASIC chip and the second circuit board. The first ASIC chip, the first MEMS chip, the first bonding wire and the second bonding wire are completely wrapped by the glue.
3. The MEMS sensor module according to claim 1, characterized in that, The total area of the notch is less than 6400 μm 2 .
4. The MEMS sensor module according to claim 1, wherein, The inner surface of the side wall surrounding the cavity is a metallized surface.
5. The MEMS sensor module according to claim 1, characterized in that The first gold finger layer includes a first part of the first gold finger layer disposed on the side wall and the partition wall, and a second part of the first gold finger layer disposed on the first circuit board. The first part of the first gold finger layer and the second part of the first gold finger layer are combined to form the first gold finger layer. The notch is provided in the first part of the first gold finger layer.
6. The MEMS sensor module according to claim 1, wherein, Both the first circuit board and the second circuit board are embedded with capacitors and resistors for eliminating high-frequency signal interference.
7. The MEMS sensor module according to claim 2, wherein An opening is provided in the second circuit board corresponding to the position of the second MEMS chip. The opening communicates the second MEMS chip and the outside.