MEMS sensor module
By separating the MEMS sensor assembly into two cavitys in the MEMS sensor module and using the gold finger layer for thermal isolation, the problem of thermal influence of ASIC chip is solved, and the performance stability of the MEMS sensor is improved.
Patent Information
- Application Number
- CN202422453729.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-10-09
AI Technical Summary
In existing MEMS sensor modules, the heat generated when the ASIC chip works will affect the temperature-sensitive MEMS sensor components, resulting in reduced performance.
A MEMS sensor module is designed to separate the MEMS sensor assembly into two cavitys and surround each cavity through a gold finger layer, increasing the spatial distance between the ASIC chips, and using notches and through holes to isolate heat to reduce heat propagation.
It effectively avoids the impact of heat generated during operation of the ASIC chip on another MEMS sensor component, improving overall performance stability.
Smart Images
Figure CN223118148U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of sensors, in particular to a MEMS sensor module.
Background Art
[0002] The MEMS sensor modules in the related art will internally install multiple MEMS sensor components to achieve at least one sensor function. For example, pressure sensors, microphone sensors, gas sensors, etc.
[0003] The MEMS sensor component includes a MEMS chip and an ASIC chip. However, when the ASIC chip of some MEMS sensor components works, it will generate a large amount of heat, and these heats will be transmitted through the circuit board or the thermal movement of the air in the module, thus affecting those MEMS sensor components that are sensitive to temperature, resulting in the performance reduction of these MEMS sensor components and their inability to work properly.
[0004] Therefore, it is necessary to provide a new MEMS sensor module to solve the above technical problems.
Content of the Utility Model
[0005] The purpose of the utility model is to overcome the above technical problems and provide a MEMS sensor module, which can avoid the large amount of heat generated when the ASIC chip of one MEMS sensor component works from affecting another MEMS sensor component.
[0006] To achieve the above object, the present utility model provides a MEMS sensor module, which includes side walls enclosing a cavity, a first circuit board disposed at the top of the side walls, and a second circuit board disposed at the bottom of the side walls. The MEMS sensor module further includes a partition wall disposed in the cavity and connected to the side walls. The partition wall divides the cavity into a first cavity and a second cavity. A first MEMS sensor component is disposed in the first cavity, and a second MEMS sensor component is disposed in the second cavity. A first gold finger layer is provided between the side walls and the partition wall and the first circuit board. The first gold finger layer surrounds the first cavity and the second cavity respectively. A second gold finger layer is provided between the side walls and the partition wall and the second circuit board. The second gold finger layer surrounds the first cavity and the second cavity respectively. The first gold finger layer at the partition wall and / or the second gold finger layer at the partition wall are provided with notches communicating the first cavity and the second cavity. The first MEMS sensor component includes a first ASIC chip fixed to the second circuit board and a first MEMS chip stacked and fixed to the first ASIC chip. A first bonding wire is connected between the first MEMS chip and the second circuit board. The second MEMS sensor component includes a second ASIC chip fixed to the first circuit board and a second MEMS chip fixed to the second circuit board. The side walls are provided with conductors connecting the first circuit board and the second circuit board. A second bonding wire is connected between the second MEMS chip and the second circuit board.
[0007] Preferably, the total area of the notches is less than 6400μm 2 .
[0008] Preferably, the first bonding wire is disposed at other positions outside the position between the first MEMS chip and the partition wall, and the second bonding wire is disposed at other positions outside the position between the second MEMS chip and the partition wall.
[0009] Preferably, the partition wall is provided with through holes communicating the first cavity and the second cavity, and the total area of the through holes is less than 6400μm 2 .
[0010] Preferably, the inner surface of the side walls enclosing the cavity is a metallized surface.
[0011] Preferably, both the first circuit board and the second circuit board are embedded with capacitors and resistors for eliminating high-frequency signal interference.
[0012] Preferably, the second circuit board is provided with a through hole corresponding to the position of the second MEMS chip, and the through hole communicates the second MEMS chip and the outside.
[0013] In the MEMS sensor module of the present utility model, the first gold finger layer surrounds the first cavity and the second cavity respectively, and the second gold finger layer surrounds the first cavity and the second cavity respectively, thereby dividing the areas of the first cavity and the second cavity. In addition, the first ASIC chip is fixed to the second circuit board, and the second ASIC chip is fixed to the first circuit board, thereby increasing the spatial distance between the first ASIC chip and the second ASIC chip. Such an arrangement can avoid the large heat generated when the ASIC chip of one MEMS sensor component affects the other MEMS sensor component.
Description of the Drawings
[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art of the present utility model, without creative efforts, other drawings can also be obtained based on these drawings, where:
[0015] Figure 1 is a perspective view of the MEMS sensor module of the present utility model;
[0016] Figure 2 is an exploded perspective view of the MEMS sensor module of the present utility model;
[0017] Figure 3 is an exploded perspective view of the MEMS sensor module of the present utility model from another perspective;
[0018] Figure 4 is a cross-sectional view of the MEMS sensor module of the present utility model.
Detailed Embodiments
[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art of the present utility model without creative efforts belong to the scope of protection of the present utility model.
[0020] Please refer to Figures 1-4As shown in the figure, the present utility model provides a MEMS sensor module 100. The MEMS sensor module 100 includes a side wall 1 surrounding a cavity 10, a first circuit board 2 disposed at the top of the side wall 1, a second circuit board 3 disposed at the bottom of the side wall 1, a partition wall 4 disposed in the cavity 10 and connected to the side wall 1, and a first MEMS sensor component 5 and a second MEMS sensor component 6 disposed in the cavity 10. The first MEMS sensor component 5 and the second MEMS sensor component 6 can implement at least one sensor function among a pressure sensor, a microphone sensor, a gas sensor, etc.
[0021] The partition wall 4 divides the cavity 10 into a first cavity 11 and a second cavity 12. The first MEMS sensor component 5 is disposed in the first cavity 11, and the second MEMS sensor component 6 is disposed in the second cavity 12. A first gold finger layer 7 is provided between the side wall 1 and the partition wall 4 and the first circuit board 2. The first gold finger layer 7 surrounds the first cavity 11 and the second cavity 12 respectively. A second gold finger layer 8 is provided between the side wall 1 and the partition wall 4 and the second circuit board 3. The second gold finger layer 8 surrounds the first cavity 11 and the second cavity 12 respectively. The first gold finger layer 7 and the second gold finger layer 8 divide the regions of the first cavity 11 and the second cavity 12, and the first MEMS sensor component 5 and the second MEMS sensor component 6 respectively have their own regions.
[0022] As an option, the first gold finger layer 7 may include a first part 71 of the first gold finger layer disposed on the side wall 1 and the partition wall 4, and a second part 72 of the first gold finger layer disposed on the first circuit board 2. The projections of the first part 71 of the first gold finger layer and the second part 72 of the first gold finger layer coincide, and the first part 71 of the first gold finger layer and the second part 72 of the first gold finger layer are combined to form the first gold finger layer 7. Of course, the first gold finger layer 7 can also be formed in other feasible ways, and is not limited to the combination of two parts.
[0023] Similarly, the second gold finger layer 8 may include a first part 81 of the second gold finger layer disposed on the side wall 1 and the partition wall 4, and a second part 82 of the second gold finger layer disposed on the second circuit board 3. The projections of the first part 81 of the second gold finger layer and the second part 82 of the second gold finger layer coincide, and the first part 81 of the second gold finger layer and the second part 82 of the second gold finger layer are combined to form the second gold finger layer 8. Of course, the second gold finger layer 8 can also be formed in other feasible ways, and is not limited to the combination of two parts.
[0024] In this embodiment, the first gold finger layer 7 at the partition wall 4 is provided with a notch 70 that communicates the first cavity 11 and the second cavity 12. The notch 70 can meet the air permeability requirement of the MEMS sensor module 100, reduce the air hole requirements of the side wall 1, the first circuit board 2, and the second circuit board 3 of the MEMS sensor module 100, facilitate the design of the backend application, and save the cost of the backend application. It can be understood that the notch 70 can be provided in the first part 71 and / or the second part 72 of the first gold finger layer.
[0025] Of course, in other embodiments, it can also be selected that the second gold finger layer 8 at the partition wall 4 is provided with the notch 70 that communicates the first cavity 11 and the second cavity 12. Similarly, the notch 70 can be provided in the first part 81 and / or the second part 82 of the second gold finger layer; in other embodiments, it can also be selected that both the first gold finger layer 7 and the second gold finger layer 8 at the partition wall 4 are provided with the notch 70 that communicates the first cavity 11 and the second cavity 12. In different embodiments of the notch 70, the total area of the notch 70 is preferably less than 6400 μm 2 。
[0026] Furthermore, the partition wall 4 can be selected to be provided with a through hole that communicates the first cavity 11 and the second cavity 12, and the total area of the through hole is also preferably less than 6400 μm 2 。
[0027] The first MEMS sensor component 5 includes a first ASIC chip 51 fixed to the second circuit board 3 and a first MEMS chip 52 stacked and fixed on the first ASIC chip 51. A first bonding wire 53 is connected between the first MEMS chip 52 and the second circuit board 3. The first ASIC chip 51 is preferably mounted on the second circuit board 3 by surface mount technology and realizes electrical conduction with the second circuit board 3.
[0028] The second MEMS sensor component 6 includes a second ASIC chip 61 fixed to the first circuit board 2 and a second MEMS chip 62 fixed to the second circuit board 3. The second ASIC chip 61 is preferably mounted on the first circuit board 2 by surface mount technology and realizes electrical conduction with the first circuit board 2. The side wall 1 is provided with a conductor 9 connecting the first circuit board 2 and the second circuit board 3 to electrically conduct the second ASIC chip 61 to the second circuit board 3. A second bonding wire 63 is connected between the second MEMS chip 62 and the second circuit board 3.
[0029] The first ASIC chip 51 is fixed to the second circuit board 3, and the second ASIC chip 61 is fixed to the first circuit board 2, thereby increasing the spatial distance between the first ASIC chip 51 and the second ASIC chip 61 to reduce the mutual interference therebetween.
[0030] In this embodiment, the second circuit board 3 is provided with a through hole 31 at a position corresponding to the second MEMS chip 62, and the through hole 31 communicates the second MEMS chip 62 with the outside. As an option, the through hole 31 may be a sound inlet hole, and the second MEMS chip 62 may be a MEMS microphone chip.
[0031] The first bonding wire 53 is disposed at a position other than the position between the first MEMS chip 52 and the partition wall 4, and the second bonding wire 63 is disposed at a position other than the position between the second MEMS chip 62 and the partition wall 4, thereby increasing the spatial distance between the first bonding wire 53 and the second bonding wire 63 to reduce the mutual interference therebetween.
[0032] As an option, the inner surface of the side wall 1 surrounding the cavity 10 is a metallized surface to meet the radio frequency interference resistance ability of the MEMS sensor module 100.
[0033] As an option, the first circuit board 2 and the second circuit board 3 may be selected to bury capacitors and resistors for eliminating high-frequency signal interference.
[0034] In the MEMS sensor module of the present invention, the first gold finger layer surrounds the first cavity and the second cavity respectively, and the second gold finger layer surrounds the first cavity and the second cavity respectively, thereby dividing the regions of the first cavity and the second cavity. In addition, the first ASIC chip is fixed to the second circuit board, and the second ASIC chip is fixed to the first circuit board, thereby increasing the spatial distance between the first ASIC chip and the second ASIC chip. Such a setting can avoid the large heat generated when the ASIC chip of one MEMS sensor component works from affecting the other MEMS sensor component.
[0035] The above are only the embodiments of the present invention. It should be noted here that for those of ordinary skill in the field of the present invention, without departing from the creative concept of the present invention, improvements can still be made, but these all belong to the protection scope of the present invention.
Claims
1. A MEMS sensor module, comprising side walls enclosing a cavity, a first circuit board disposed at the top of the side walls, and a second circuit board disposed at the bottom of the side walls, characterized in that, The MEMS sensor module further includes a partition wall disposed in the cavity and connected to the side wall. The partition wall divides the cavity into a first cavity and a second cavity. A first MEMS sensor component is disposed in the first cavity, and a second MEMS sensor component is disposed in the second cavity. A first gold finger layer is provided between the side wall and the partition wall and the first circuit board. The first gold finger layer surrounds the first cavity and the second cavity respectively. A second gold finger layer is provided between the side wall and the partition wall and the second circuit board. The second gold finger layer surrounds the first cavity and the second cavity respectively. The first gold finger layer at the partition wall and / or the second gold finger layer at the partition wall are provided with notches communicating the first cavity and the second cavity. The first MEMS sensor component includes a first ASIC chip fixed to the second circuit board and a first MEMS chip stacked and fixed to the first ASIC chip. A first bonding wire is connected between the first MEMS chip and the second circuit board. The second MEMS sensor component includes a second ASIC chip fixed to the first circuit board and a second MEMS chip fixed to the second circuit board. The side wall is provided with a conductor connecting the first circuit board and the second circuit board. A second bonding wire is connected between the second MEMS chip and the second circuit board.
2. The MEMS sensor module according to claim 1, characterized in that, The total area of the notch is less than 6400 μm 2 .
3. The MEMS sensor module according to claim 1, wherein The first bonding wire is disposed at a position other than the position between the first MEMS chip and the partition wall. The second bonding wire is disposed at a position other than the position between the second MEMS chip and the partition wall.
4. The MEMS sensor module according to claim 1, characterized in that, The partition wall is provided with a through hole communicating the first cavity and the second cavity, and the total area of the through hole is less than 6400 μm 2 .
5. The MEMS sensor module according to claim 1, characterized in that, The inner surface of the side wall surrounding the cavity is a metallized surface.
6. The MEMS sensor module according to claim 1, characterized in that, Both the first circuit board and the second circuit board are embedded with capacitors and resistors for eliminating high-frequency signal interference.
7. The MEMS sensor module according to claim 1, characterized in that, The second circuit board is provided with a through hole corresponding to the position of the second MEMS chip. The through hole communicates the second MEMS chip and the outside.