DPC ceramic plate electroplating hanger

Abstract

The utility model discloses a DPC ceramic plate electroplating hanger which comprises a metal plate and a first dry film layer, the metal plate comprises at least one ceramic plate hanging hole, and the ceramic plate hanging hole can accommodate at least one DPC ceramic plate; the DPC ceramic plate is arranged in the hanging hole, and a gap exists between the edge of the DPC ceramic plate and the inner edge of the hanging hole; the inner edge of the hanging hole comprises a plurality of protruding conductive contacts, and the edge of the DPC ceramic plate is positioned by the conductive contacts. The first dry film layer is adhered to the front surfaces of the metal plate and the DPC ceramic plate, and the first dry film layer comprises a hollow pattern electroplated on the front surface of the DPC ceramic plate corresponding to each DPC ceramic plate. The device is simple in structure, light in weight and convenient to apply to an electroplating assembly line.

Description

[Technical Field]

[0001] The utility model relates to an electroplating fixture, in particular to an electroplating fixture for DPC ceramic plates. [Background Art]

[0002] The ceramic plate VCP refers to a vertical continuous plating (Vertical Continuous Plating) system using a ceramic plate as an electrode, which is widely used in the PCB (printed circuit board) manufacturing industry.

[0003] Before copper plating on the DPC ceramic plate, a metal thin film is plated on the surface of the ceramic substrate by physical sputtering. Usually, metals such as titanium (Ti), chromium (Cr), and nickel (Ni) are used. These metals have good activity and can be used as the seed layer for electroplating. Sputtering coating can form a very thin metal layer, and the thickness is usually between a few nanometers and several thousand nanometers.

[0004] The utility model with the patent number CN202221963344.9 discloses an electroplating fixture for DPC ceramic plates, which relates to the technical field of DPC ceramic plate electroplating and solves the problem that the DPC ceramic plate electroplating fixture is prone to cracking during electroplating, causing damage to the DPC ceramic plate. It includes: a fixture frame and a fixture. The fixture includes an upper spring hook and a lower spring hook. The fixture frame includes a frame and a fixture installation cross bar. The upper spring hook is arranged on the fixture installation cross bar. The lower spring hook is arranged below the upper spring hook and is connected to the fixture installation cross bar. The DPC ceramic plate is arranged between the upper spring hook and the lower spring hook; the to-be-electroplated DPC ceramic plate is fixed elastically by the spring hook, and the fixture cost is low and it can be reused.

[0005] This utility model includes a fixture frame and a fixture, with a complex and heavy structure, which is not convenient to be applied on the electroplating production line and difficult to achieve vertical continuous electroplating; after electroplating, it is not easy to separate the ceramic plate from the upper spring hook and the lower spring hook.

[0006] In addition, the ceramic plates to be copper-plated in rows of this utility model are suspended in the suspension area between two single cross bars of the fixture frame and are supported and conduct electricity by the upper spring hook and the lower spring hook. Since there is a large gap between the upper edge and the lower edge of the ceramic plate and the upper and lower single cross bars, during electroplating of the ceramic plate, due to the curvature effect at the edges, the power lines are more concentrated relative to the middle part of the ceramic plate and may bend to enter the electrolyte, forming an edge effect. The edge effect causes an increase in the current density in the upper edge area and the lower edge area of the ceramic plate, resulting in a thicker electroplated layer in the upper edge area and the lower edge area of the ceramic plate compared to the middle part of the ceramic plate, and a large difference in the copper plating thickness of the ceramic plate. At the same time, the electroplating fixture of this utility model is entirely exposed in the electrolyte. When the ceramic plate is copper-plated, a lot of copper is also plated on the fixture, causing waste of copper ions and increasing the production cost. Moreover, the upper and lower spring hooks are firmly combined with the ceramic plate through copper plating, and it is not easy to separate the finished ceramic plate from the fixture.

[0007] Moreover, the electroplating uniformity of this utility model is poor. Also, due to the long length of the spring hooks, the energy consumption during electroplating is high, the efficiency of filling-hole electroplating is low, the electroplating time is long, which is time-consuming, power-consuming, chemical-agent-consuming, and copper-consuming, and the production efficiency is low while the cost is high. The structure of the spring hooks is not firm enough, and the hanging tool may drop the plates due to reasons such as vibration, pressure difference, or bumping, resulting in product loss and plating tank pollution. The pressure of the spring hooks may also cause the ceramic plates to bend and deform. [Summary of the Invention]

[0008] The technical problem to be solved by this utility model is to provide a ceramic plate electroplating hanging tool with a simple structure and light weight.

[0009] To solve the above technical problem, the technical solution adopted by this utility model is a DPC ceramic plate electroplating hanging tool, which includes a metal plate and a first dry film layer. The metal plate includes at least one suspension hole for the ceramic plate, and the suspension hole for the ceramic plate can accommodate at least one DPC ceramic plate; the DPC ceramic plate is arranged in the suspension hole, and there is a gap between the edge of the DPC ceramic plate and the inner edge of the suspension hole; the inner edge of the suspension hole includes a plurality of protruding conductive contacts, and the edge of the DPC ceramic plate is positioned by the conductive contacts; the first dry film layer is pasted on the front sides of the metal plate and the DPC ceramic plate, and corresponding to each DPC ceramic plate, the first dry film layer includes a hollowed-out pattern for electroplating the front side of the DPC ceramic plate.

[0010] The above-mentioned DPC ceramic plate electroplating hanging tool includes a second dry film layer, and the second dry film layer is pasted on the back sides of the metal plate and the DPC ceramic plate.

[0011] The above-mentioned DPC ceramic plate electroplating hanging tool, corresponding to each DPC ceramic plate, the second dry film layer includes a hollowed-out pattern for electroplating the back side of the DPC ceramic plate.

[0012] The above-mentioned DPC ceramic plate electroplating hanging tool includes a plurality of the suspension holes, and the plurality of suspension holes are separately arranged in a matrix of M rows and N columns. M and N are positive integers respectively; the shape of the suspension hole is circular or polygonal, and the periphery of the suspension hole includes a plurality of elastic contacts, and the end of the elastic contact that contacts the edge of the DPC ceramic plate is the conductive contact.

[0013] The above-mentioned DPC ceramic plate electroplating hanging tool, the periphery of the hollowed-out pattern for electroplating the front side is close to the edge of the corresponding DPC ceramic plate, and the first dry film layer includes an annular hollowed-out groove around the suspension hole for reducing the edge effect of electroplating the DPC ceramic plate.

[0014] The above-mentioned DPC ceramic plate electroplating fixture, the first dry film layer includes first through holes having the same number as the elastic contacts, and the first through holes are located at the contact portions between the conductive contacts corresponding to the elastic contacts and the DPC ceramic plate; at the contact portions between the conductive contacts and the DPC ceramic plate, the DPC ceramic plate includes a cutting area or a pre-cutting area, and the cutting lines of the cutting area or the pre-cutting lines of the pre-cutting area are outside the edges of the first through holes.

[0015] The above-mentioned DPC ceramic plate electroplating fixture, the periphery of the hollowed-out pattern plated on the back is close to the edge of the DPC ceramic plate, and the second dry film layer includes an annular hollowed-out groove for reducing the edge effect of the DPC ceramic plate electroplating around the suspension holes.

[0016] The above-mentioned DPC ceramic plate electroplating fixture, the second dry film layer includes second through holes having the same number as the elastic contacts, and the second through holes are located at the contact portions between the conductive contacts corresponding to the elastic contacts and the DPC ceramic plate; at the contact portions between the conductive contacts and the DPC ceramic plate, the DPC ceramic plate includes a cutting area or a pre-cutting area, and the cutting lines of the cutting area or the pre-cutting lines of the pre-cutting area are outside the edges of the second through holes.

[0017] The above-mentioned DPC ceramic plate electroplating fixture, the elastic contact includes an L-shaped elastic arm.

[0018] The above-mentioned DPC ceramic plate electroplating fixture, the shapes of the suspension holes and the DPC ceramic plates are both rectangular; a plurality of the above-mentioned DPC ceramic plates are arranged horizontally in the suspension holes, corresponding to each DPC ceramic plate, the upper edge of the suspension hole includes a plurality of the above-mentioned elastic contacts, and the lower edge of the suspension hole includes a plurality of the above-mentioned elastic contacts or rigid contacts; alternatively, a plurality of the above-mentioned DPC ceramic plates are arranged vertically in the suspension holes, corresponding to each DPC ceramic plate, one side edge of the suspension hole includes a plurality of the above-mentioned elastic contacts, and the other side edge of the suspension hole includes a plurality of the above-mentioned elastic contacts or rigid contacts.

[0019] The DPC ceramic plate electroplating fixture of the present utility model has a simple structure and is light in weight, which is convenient for application on the electroplating production line. [Description of the Drawings]

[0020] The present utility model will be further described in detail below in conjunction with the drawings and specific embodiments.

[0021] Figure 1 It is the front view of the metal plate of the DPC ceramic plate electroplating fixture in Embodiment 1 of the present utility model.

[0022] Figure 2 It is the side view of the metal plate of the DPC ceramic plate electroplating fixture in Embodiment 1 of the present utility model.

[0023] Figure 3It is the front view after the square DPC ceramic plate is installed on the metal plate in Embodiment 1 of the present utility model.

[0024] Figure 4 It is the front view of the DPC ceramic plate electroplating fixture in Embodiment 1 of the present utility model.

[0025] Figure 5 It is the side view of the DPC ceramic plate electroplating fixture in Embodiment 1 of the present utility model.

[0026] Figure 6 It is Figure 3 The partial enlarged view of part Ⅰ in

[0027] Figure 7 It is Figure 4 The partial enlarged view of part Ⅱ in

[0028] Figure 8 It is Figure 7 The A-A cross-sectional view in

[0029] Figure 9 It is the front view of the DPC ceramic plate electroplating fixture in Embodiment 2 of the present utility model.

[0030] Figure 10 It is the front view after the square DPC ceramic plate is installed on the metal plate in Embodiment 3 of the present utility model.

[0031] Figure 11 It is the front view after the circular DPC ceramic plate is installed on the metal plate in Embodiment 4 of the present utility model.

[0032] Figure 12 It is the front view after the regular pentagon DPC ceramic plate is installed on the metal plate in Embodiment 5 of the present utility model.

[0033] Figure 13 It is the front view after the regular hexagon DPC ceramic plate is installed on the metal plate in Embodiment 6 of the present utility model. [Detailed implementation manners]

[0034] The DPC ceramic plate electroplating fixture in Embodiment 1 of the present utility model is as Figures 1 to 8 shown, and includes a stainless steel plate 10, a first dry film layer 20 and a second dry film layer 30. The stainless steel plate 10 includes three suspension holes 11 for ceramic plates (the number of columns N of the suspension hole 11 matrix M×N = 1, and the number of rows M = 3). The shape of the suspension hole 11 is rectangular, and each suspension hole 11 can accommodate two square DPC ceramic plates 40. Two DPC ceramic plates 40 are arranged side by side horizontally in the suspension hole 11. There is a gap Δ between the edge of the DPC ceramic plate 40 and the adjacent inner edge of the suspension hole 11, and there is a gap δ between the two side-by-side DPC ceramic plates 40.

[0035] As Figure 1 andFigure 2 As shown, there are a total of 8 elastic contacts 12 along the inner edge of the suspension hole 11, and each elastic contact 12 has an L-shaped elastic arm 121. The end of the cantilever of the L-shaped elastic arm is a conductive contact 122 protruding into the hole.

[0036] The edge of the DPC ceramic plate 40 is positioned by the conductive contact 122 and electrically connected to the stainless steel plate 10. Corresponding to each DPC ceramic plate 40, there are two elastic contacts 12A along the upper edge of the suspension hole 11, and two elastic contacts 12B along the lower edge of the suspension hole 11 (the elastic contacts 12B on the lower edge can be replaced by rigid contacts protruding upward).

[0037] The first dry film layer 20 and the second dry film layer 30 clamp the DPC ceramic plate 40 in the suspension hole 11 of the stainless steel plate 10.

[0038] The first dry film layer 20 is pasted on the front of the stainless steel plate 10 and the front of the DPC ceramic plate 40. Corresponding to each DPC ceramic plate 40, the first dry film layer 20 is lithographed with a hollowed-out pattern 23 for electroplating on the front of the DPC ceramic plate 40. In Embodiment 1 of the present invention, the DPC ceramic plate 40 is entirely copper-plated, and the hollowed-out pattern 23 for electroplating on the front of the DPC ceramic plate 40 is square.

[0039] The second dry film layer 30 is pasted on the back of the stainless steel plate 10 and the back of the DPC ceramic plate 40. If electroplating is not required on the back of the DPC ceramic plate 40, the second dry film layer 30 does not need to be lithographed with a hollowed-out pattern for electroplating on the back of the DPC ceramic plate 40. If electroplating is also required on the back of the DPC ceramic plate 40 at the same time, corresponding to each DPC ceramic plate 40, the second dry film layer 30 also needs to be lithographed with a hollowed-out pattern 33 for electroplating on the back of the DPC ceramic plate 40.

[0040] The height of the first dry film layer 20 and the height of the second dry film layer 30 are both less than the height of the stainless steel plate 10. The top 13A and the bottom 13B of the stainless steel plate 10 are exposed outside the first dry film layer 20 and the second dry film layer 30, and the exposed top 13A and bottom 13B are respectively used for clamping, suspending, and conducting electricity by a fixture on the electroplating production line. During the electroplating process, the DPC ceramic plate electroplating hanger can be taken out of the electrolytic cell, inverted vertically by 180°, and then inserted into the electrolytic cell to continue electroplating. In this way, it is beneficial to improve the uniformity of the copper plating thickness of each DPC ceramic plate 40 up and down.

[0041] The gap Δ left between the inner edge adjacent to the suspension hole 11 of the edge of the DPC ceramic plate 40 and the gap δ left between two juxtaposed DPC ceramic plates 40 are covered by the first dry film layer 20 on the front and the second dry film layer 30 on the back.

[0042] The peripheries of the front - electroplated hollow pattern 23 and the back - electroplated hollow pattern 31 are close to the edges of the corresponding DPC ceramic plates 40. The first dry - film layer 20 lithographs a ring - shaped hollow groove 21, which can be an open - loop or closed - loop, around the periphery of the suspension hole 11. The second dry - film layer 30 lithographs a ring - shaped hollow groove 31, which can be an open - loop or closed - loop, around the periphery of the suspension hole 11. The ring - shaped hollow grooves 21 and 31 can disperse the power lines at the edges of the DPC ceramic plates 40, reducing the edge effect during the electroplating of the DPC ceramic plates 40.

[0043] As Figure 3 shown, the first dry - film layer 20 and / or the second dry - film layer 30 includes through - holes 22 having the same number as the elastic contacts 12 (the through - holes of the second dry - film layer 30 are not shown in the figure). The through - holes 22 are located at the contact positions between the conductive contacts 122 of the corresponding elastic contacts 12 and the edges of the DPC ceramic plates 40. At the contact positions between the conductive contacts 122 and the DPC ceramic plates 40, the DPC ceramic plates 40 have a pre - cutting area 42, and the pre - cutting lines 43 of the pre - cutting area 42 are arranged outside the edges of the through - holes 22.

[0044] The function of the through - holes 22 is to electroplate copper at the contact positions between the conductive contacts 122 and the edges of the DPC ceramic plates 40 during the electroplating of the DPC ceramic plates 40, so as to improve the conduction effect between the conductive contacts 122 and the edges of the DPC ceramic plates 40. After the electroplating of the DPC ceramic plates 40 is completed, the conductive contacts 122 and the edges of the DPC ceramic plates 40 are firmly connected together. The pre - cutting line part is the stress - concentration part of the DPC ceramic plates 40. The DPC ceramic plates 40 can be easily separated from the stainless - steel plates 10 through the pre - cutting lines 43. If the pre - cutting lines 43 are not pre - fabricated on the DPC ceramic plates 40, the DPC ceramic plates 40 can be laser - cut at the cutting areas located outside the edges of the through - holes 22 after the electroplating of the DPC ceramic plates 40 is completed, so as to smoothly separate the DPC ceramic plates 40 from the stainless - steel plates 10.

[0045] In this embodiment, the pre - cutting area 42 or the cutting area is not absolutely necessary because the conductive contacts 122 and the DPC ceramic plates 40 can be easily separated by limiting the thickness of the copper plating between the conductive contacts 122 and the DPC ceramic plates 40. For example, during the electroplating process, when the thickness of the electroplating between the conductive contacts 122 and the DPC ceramic plates 40 reaches the set value, and the resistance at the contact positions between the conductive contacts and the DPC ceramic plates drops to the set value, which can meet the requirement of the electroplating current intensity, the DPC ceramic - plate electroplating fixture is taken out of the electroplating bath. After blocking all the through - holes of the first dry - film layer 20 and / or the second dry - film layer 30, the DPC ceramic - plate electroplating fixture is vertically inverted 180°, and then re - inserted into the electrolytic bath for continued electroplating. The subsequent electroplating will not increase the thickness of the copper plating between the conductive contacts 122 and the DPC ceramic plates 40. After the electroplating is completed, the contact positions between the DPC ceramic plates and the conductive contacts can be easily separated because the copper - plating layer is very thin.

[0046] The structure of the electroplating fixture for the DPC ceramic plate in Embodiment 2 of the present utility model is as follows Figure 9 shown. The difference between Embodiment 2 and Embodiment 1 is only that the hollowed-out pattern 23 electroplated on the front surface of the DPC ceramic plate 40 includes a circuit pattern.

[0047] The structure of the electroplating fixture for the DPC ceramic plate in Embodiment 3 of the present utility model is as follows Figure 10 shown. The difference from Embodiment 1 is that the stainless steel plate 10 includes suspension holes 11 for two ceramic plates (the number of columns N of the matrix M×N of the suspension holes 11 is 2, and the number of rows M is 1). The shape of the suspension holes 11 is a rectangle with the long axis arranged vertically. Each suspension hole 11 can accommodate three square DPC ceramic plates 40. The three DPC ceramic plates 40 are arranged separately in the suspension holes 11 along the vertical direction. There is a gap Δ between the edge of the DPC ceramic plate 40 and the inner edge adjacent to the suspension hole 11, and there is a gap δ between two adjacent DPC ceramic plates 40 arranged vertically. There are 6 elastic contacts 12 on each of the two side edges of the suspension hole 11, and each elastic contact 12 has an L-shaped elastic arm 121. The end of the cantilever end of the L-shaped elastic arm is a conductive contact 122 protruding into the hole. Among them, the elastic contacts 12 on one side edge of the suspension hole can be replaced by rigid contacts.

[0048] The structure of the electroplating fixture for the DPC ceramic plate in Embodiment 4 of the present utility model is as follows Figure 11 shown. The difference from Embodiment 1 is that the stainless steel plate 10 includes 6 suspension holes 11 for ceramic plates. The 6 suspension holes 11 are arranged separately on the stainless steel plate 10 in a matrix of three rows (M = 3) and two columns (N = 2). The shape of the suspension holes 11 is circular. There are 4 L-shaped elastic contacts 12 on the inner edge around each suspension hole 11. Similarly, each elastic contact 12 has an L-shaped elastic arm 121. The end of the cantilever end of the L-shaped elastic arm is a conductive contact 122 protruding inward.

[0049] The structure of the electroplating fixture for the DPC ceramic plate in Embodiment 5 of the present utility model is as follows Figure 12 shown. The difference from Embodiment 4 is that the shape of the suspension hole 11 is a regular pentagon, and there is an L-shaped elastic contact 12 on the inner edge of each straight side of the suspension hole 11. The structure of the electroplating fixture for the DPC ceramic plate in Embodiment 6 of the present utility model is as follows Figure 13 shown. The difference from Embodiment 4 is that the shape of the suspension hole 11 is a regular hexagon, and there is an L-shaped elastic contact 12 on the inner edge of each straight side of the suspension hole 11.

[0050] The electroplating fixtures for the DPC ceramic plate in the above embodiments of the present utility model have the following beneficial effects

[0051] 1) The structure is simple and the weight is light, which is convenient for circulation, loading and unloading on the electroplating production line

[0052] 2) The surface of the stainless-steel plate is covered by a dry film layer, with less consumption of copper ions and low production costs;

[0053] 3) The annular hollow groove can disperse the power lines at the edge of the DPC ceramic plate, reduce the edge effect during the electroplating of the DPC ceramic plate, and the copper thickness of the copper plating on the DPC ceramic plate is uniform.

[0054] 4) The elastic contact has a large current-carrying area and small resistance. During the electroplating process, the resistance can be further reduced, the electroplating energy consumption is low, the filling-hole electroplating efficiency is high, the electroplating time is short, the production efficiency is high, and the cost can be reduced; the ceramic plate is clamped in the suspension hole by the elastic contact and two dry films, and the ceramic plate is firmly clamped and will not fall off due to reasons such as jig vibration, pressure difference, or collision, resulting in product loss and plating bath pollution.

Claims

1. A plating fixture for DPC ceramic plates, characterized in that, It includes a metal plate and a first dry film layer. The metal plate includes at least one suspension hole for a ceramic plate, and the suspension hole of the ceramic plate can accommodate at least one DPC ceramic plate; the DPC ceramic plate is arranged in the suspension hole, and there is a gap between the edge of the DPC ceramic plate and the inner edge of the suspension hole; the inner edge of the suspension hole includes a plurality of protruding conductive contacts, and the edge of the DPC ceramic plate is positioned by the conductive contacts; the first dry film layer is pasted on the front of the metal plate and the DPC ceramic plate. Corresponding to each DPC ceramic plate, the first dry film layer includes a hollowed-out pattern electroplated on the front of the DPC ceramic plate.

2. The DPC ceramic plate electroplating fixture according to claim 1, wherein It includes a second dry film layer, and the second dry film layer is pasted on the back of the metal plate and the DPC ceramic plate.

3. The DPC ceramic plate electroplating fixture according to claim 2, characterized in that, Corresponding to each DPC ceramic plate, the second dry film layer includes a hollowed-out pattern electroplated on the back of the DPC ceramic plate.

4. The DPC ceramic plate electroplating hanger according to claim 2 or 3, characterized in that, It includes a plurality of the suspension holes, and the plurality of suspension holes are arranged separately in a matrix of M rows and N columns, where M and N are positive integers respectively; the shape of the suspension hole is circular or polygonal, and the periphery of the suspension hole includes a plurality of elastic contacts, and the end of the elastic contact that contacts the edge of the DPC ceramic plate is the conductive contact.

5. The DPC ceramic plate electroplating fixture according to claim 4, characterized in that, The periphery of the hollowed-out pattern electroplated on the front is close to the edge of the corresponding DPC ceramic plate, and the first dry film layer includes an annular hollowed-out groove around the suspension hole for reducing the electroplating edge effect of the DPC ceramic plate.

6. The DPC ceramic plate electroplating fixture according to claim 5, wherein, The first dry film layer includes a first through hole with the same number as the elastic contacts, and the first through hole is located at the contact part between the conductive contact of the corresponding elastic contact and the DPC ceramic plate; at the contact part between the conductive contact and the DPC ceramic plate, the DPC ceramic plate includes a cutting area or a pre-cutting area, and the cutting line of the cutting area or the pre-cutting line of the pre-cutting area is outside the edge of the first through hole.

7. The DPC ceramic plate electroplating fixture according to claim 4, characterized in that, The periphery of the hollowed-out pattern electroplated on the back is close to the edge of the DPC ceramic plate, and the second dry film layer includes an annular hollowed-out groove around the suspension hole for reducing the electroplating edge effect of the DPC ceramic plate.

8. The DPC ceramic plate electroplating fixture according to claim 7, characterized in that, The second dry film layer includes a second through hole with the same number as the elastic contacts, and the second through hole is located at the contact part between the conductive contact of the corresponding elastic contact and the DPC ceramic plate; at the contact part between the conductive contact and the DPC ceramic plate, the DPC ceramic plate includes a cutting area or a pre-cutting area, and the cutting line of the cutting area or the pre-cutting line of the pre-cutting area is outside the edge of the second through hole.

9. The DPC ceramic plate electroplating fixture according to claim 4, characterized in that, The elastic contact includes an L-shaped elastic arm.

10. The DPC ceramic plate electroplating fixture according to claim 4, wherein The shapes of the suspension hole and the DPC ceramic plate are both rectangular; a plurality of the DPC ceramic plates are arranged horizontally in the suspension hole. Corresponding to each DPC ceramic plate, the upper edge of the suspension hole includes a plurality of the elastic contacts, and the lower edge of the suspension hole includes a plurality of the elastic contacts or rigid contacts; or, a plurality of the DPC ceramic plates are arranged vertically in the suspension hole. Corresponding to each DPC ceramic plate, one side edge of the suspension hole includes a plurality of the elastic contacts, and the other side edge of the suspension hole includes a plurality of the elastic contacts or rigid contacts.

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