Intelligent liquid level monitoring terminal

Abstract

The utility model relates to the technical field of liquid level detection, in particular to an intelligent liquid level monitoring terminal which comprises an ultrasonic sensor, an NB-IOT communication module, a BLE Bluetooth module, a data storage module and an MCU master control module, and the MCU master control module is electrically connected with the ultrasonic sensor, the NB-IOT communication module, the BLE Bluetooth module and the data storage module. The ultrasonic sensor sends collected liquid level data to the MCU main control module, and the MCU main control module stores the liquid level data in the data storage module after receiving the liquid level data; the MCU main control module is connected with the BLE Bluetooth module to realize parameter setting of the MCU main control module; the MCU master control module controls the NB-IOT communication module to establish communication connection with the platform server, so that a user can know the liquid level state and process data of the water tank in real time, and automatic operation of equipment is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid level detection, in particular to an intelligent liquid level monitoring terminal. Background Art

[0002] With the improvement of people's health awareness, water quality safety has become the primary concern; in the water supply system, the liquid level measurement of the water tank is essential. The existing liquid level measurement solutions mainly rely on float liquid level sensors, embedded ultrasonic liquid level sensors, and radar liquid level sensors. These all need to be installed inside the water tank or in contact with water, which brings the risk of secondary pollution to the water source and is not convenient for installation and maintenance; the embedded ultrasonic liquid level sensor and radar liquid level sensor have higher costs and do not have a complete data remote transmission solution. Content of the Utility Model

[0003] The technical problem to be solved by the utility model is to provide an intelligent liquid level monitoring terminal that can remotely and real-time obtain the water level in the water tank.

[0004] To solve the above technical problem, the technical solution adopted by the utility model is as follows:

[0005] An intelligent liquid level monitoring terminal includes an ultrasonic sensor, an NB-IOT communication module, a BLE Bluetooth module, a data storage module, and an MCU main control module. The MCU main control module is electrically connected to the ultrasonic sensor, the NB-IOT communication module, the BLE Bluetooth module, and the data storage module respectively. The ultrasonic sensor is arranged on the outer surface of the bottom of the water tank to be detected.

[0006] Further, the NB-IOT communication module includes a communication module, a power supply filtering and protection unit, and a SIM card external connection unit. The communication module is electrically connected to the power supply filtering and protection unit and the SIM card external connection unit respectively.

[0007] Further, the communication module includes a chip U1A. The eleventh pin, twelfth pin, thirteenth pin, and fourteenth pin of the chip U1A are all electrically connected to the SIM card external connection unit. The forty-second pin and forty-third pin of the chip U1A are both electrically connected to the power supply filtering and protection unit.

[0008] Further, the SIM card external unit includes a resistor R3, a resistor R5, a capacitor C10, a capacitor C11, a capacitor C6, a resistor R2, a resistor R6, a resistor R4, a capacitor C9, a SIM card mounting connector J3, and a chip U2. The first pin of the SIM card mounting connector J3 is electrically connected to one end of the capacitor C6, the sixth pin of the chip U2, and the communication module respectively. The second pin of the SIM card mounting connector J3 is electrically connected to one end of the resistor R3, the first pin of the chip U2, and one end of the capacitor C11 respectively. The third pin of the SIM card mounting connector J3 is electrically connected to one end of the resistor R5, one end of the capacitor C10, and the third pin of the chip U2 respectively. The fifth pin of the SIM card mounting connector J3 is grounded. The sixth pin of the SIM card mounting connector J3 is electrically connected to one end of the resistor R2. The other end of the resistor R2 is electrically connected to the communication module and one end of the resistor R4 respectively. The seventh pin of the SIM card mounting connector J3 is electrically connected to the fourth pin of the chip U2, one end of the capacitor C9, and one end of the resistor R6 respectively. The other end of the resistor R6 is electrically connected to the other end of the resistor R4 and the communication module respectively. The second pin of the chip U2, the other end of the capacitor C9, the other end of the capacitor C6, the other end of the capacitor C10, and the other end of the capacitor C11 are all grounded.

[0009] Further, the power supply filtering and protection unit includes an ESD protection device DT1, a magnetic bead FB2, an electrolytic capacitor E1, and a capacitor C3. One end of the ESD protection device DT1 is electrically connected to one end of the magnetic bead FB2. The other end of the magnetic bead FB2 is electrically connected to one end of the electrolytic capacitor E1, one end of the capacitor C3, and the communication module respectively. The other end of the ESD protection device DT1 is electrically connected to the other end of the electrolytic capacitor E1 and the other end of the capacitor C3 respectively, and the other end of the ESD protection device DT1, the other end of the electrolytic capacitor E1, and the other end of the capacitor C3 are all grounded.

[0010] Further, the ultrasonic sensor is electrically connected to the MCU main control module through an R485 communication interface module.

[0011] Further, the R485 communication interface module includes a bead FB1, a capacitor C29, a resistor R41, a MOS transistor Q6, a resistor R42, a resistor R31, a resistor R46, a capacitor C30, and an interface chip U9. One end of the first pin of the interface chip U9 is electrically connected to one end of the resistor R31 and the MCU main control module. One end of the second pin of the interface chip U9 is electrically connected to the third pin of the interface chip U9, the MCU main control module, and one end of the resistor R46. The other end of the resistor R46 is grounded. The fourth pin of the interface chip U9 is electrically connected to the MCU main control module. The fifth pin of the interface chip U9 is grounded. The sixth and seventh pins of the interface chip U9 are both electrically connected to the ultrasonic sensor. One end of the eighth pin of the interface chip U9 is electrically connected to one end of the capacitor C30 and the drain of the MOS transistor Q6. The other end of the capacitor C30 is grounded. The gate of the MOS transistor Q6 is electrically connected to one end of the resistor R42 and one end of the resistor R41. The other end of the resistor R42 is electrically connected to the MCU main control module. The source of the MOS transistor Q6 is electrically connected to the other end of the resistor R41, one end of the capacitor C29, and one end of the bead FB1. The other end of the capacitor C29 is grounded. The other end of the bead FB1 is connected to the 3V power supply.

[0012] Further, the R485 communication interface module further includes a resistor R50, a resistor R51, a voltage regulator diode U13, a fuse F1, and a fuse F2. The first end of the voltage regulator diode U13 is electrically connected to one end of the resistor R50, the seventh pin of the interface chip U9, and one end of the fuse F1. The other end of the fuse F1 is electrically connected to the ultrasonic sensor. The other end of the resistor R50 is grounded. The second end of the voltage regulator diode U13 is electrically connected to one end of the resistor R51, the sixth pin of the interface chip U9, and one end of the fuse F2. The other end of the fuse F2 is electrically connected to the ultrasonic sensor. The third end of the voltage regulator diode U13 is grounded.

[0013] Further, the BLE Bluetooth module includes a resistor R33, a resistor R34, a resistor R35, a capacitor C20, a capacitor C21, a triode Q5, and a chip U8. The eighth pin, ninth pin, seventeenth pin, eighteenth pin, twenty-second pin, twenty-third pin, and twenty-fourth pin of the chip U8 are all electrically connected to the MCU main control module. The tenth pin of the chip U8 is electrically connected to the collector of the triode Q5 and one end of the resistor R33 respectively. The twelfth pin of the chip U8 is electrically connected to the other end of the resistor R33 and one end of the capacitor C21 respectively. The base of the triode Q5 is electrically connected to one end of the resistor R34 and one end of the resistor R35 respectively. The other end of the resistor R34 is electrically connected to the MCU main control module. The other end of the resistor R35 is electrically connected to the emitter of the triode Q5 and one end of the capacitor C20 respectively. The other end of the capacitor C20, the other end of the capacitor C21, the second pin of the chip U8, and the twenty-sixth pin of the chip U8 are all grounded.

[0014] The beneficial effects of the present utility model are as follows:

[0015] By setting an ultrasonic sensor, an NB-IOT communication module, a BLE Bluetooth module, a data storage module, and an MCU main control module, the MCU main control module sends commands to the ultrasonic sensor in real time. The ultrasonic sensor sends the collected liquid level data to the MCU main control module. After receiving the liquid level data, the MCU main control module stores the liquid level data in the data storage module; the MCU main control module establishes a connection with the BLE Bluetooth module and controls the BLE Bluetooth module to establish a connection with the user's mobile phone, thereby realizing parameter setting for the MCU main control module; according to the communication frequency set by the user with the platform, when the communication time arrives, the MCU main control module will turn on the NB-IOT communication module and control it to establish a communication connection with the platform server, and upload relevant data and device status, so that the user can understand the liquid level status and process data of the water tank in real time; the platform can also send instructions to the MCU main control module through the NB-IOT communication module, and the MCU main control module can receive the corresponding instructions and perform corresponding operations, thereby realizing the automatic operation of the device. Description of the Drawings

[0016] Figure 1 It is a module connection block diagram of the intelligent liquid level monitoring terminal of the present utility model;

[0017] Figure 2 It is a circuit schematic diagram of the NB-IOT communication module of the intelligent liquid level monitoring terminal of the present utility model;

[0018] Figure 3 It is a circuit schematic diagram of the R485 communication interface module of the intelligent liquid level monitoring terminal of the present utility model;

[0019] Figure 4 The circuit schematic diagram of the BLE Bluetooth module of the intelligent liquid level monitoring terminal of the present utility model;

[0020] Label description:

[0021] 1. Ultrasonic sensor; 2. NB-IOT communication module; 3. BLE Bluetooth module; 4. Data storage module; 5. MCU main control module; 6. R485 communication interface module. Specific implementation mode

[0022] To describe in detail the technical content, achieved purpose and effect of the present utility model, the following is described in conjunction with the implementation mode and accompanied by the drawings.

[0023] Please refer to Figure 1 , the technical solution adopted by the present utility model is:

[0024] An intelligent liquid level monitoring terminal, including an ultrasonic sensor, an NB-IOT communication module, a BLE Bluetooth module, a data storage module and an MCU main control module. The MCU main control module is electrically connected to the ultrasonic sensor, the NB-IOT communication module, the BLE Bluetooth module and the data storage module respectively. The ultrasonic sensor is arranged on the outer surface of the bottom of the water tank to be detected.

[0025] From the above description, it can be seen that the beneficial effect of the present utility model is:

[0026] By setting an ultrasonic sensor, an NB-IOT communication module, a BLE Bluetooth module, a data storage module and an MCU main control module, the MCU main control module sends commands to the ultrasonic sensor in real time. The ultrasonic sensor sends the collected liquid level data to the MCU main control module. After receiving the liquid level data, the MCU main control module saves the liquid level data in the data storage module; the MCU main control module establishes a connection with the BLE Bluetooth module and controls the BLE Bluetooth module to establish a connection with the user's mobile phone, so as to realize the parameter setting of the MCU main control module; according to the communication frequency set by the user and the platform, when the communication time arrives, the MCU main control module will turn on the NB-IOT communication module and control it to establish a communication connection with the platform server, and upload relevant data and device status, so that the user can understand the liquid level status and process data of the water tank in real time; the platform can also send instructions to the MCU main control module through the NB-IOT communication module, and the MCU main control module can receive the corresponding instructions and perform corresponding operations, so as to realize the automatic operation of the device.

[0027] Further, the NB-IOT communication module includes a communication module, a power supply filtering and protection unit and a SIM card external connection unit. The communication module is electrically connected to the power supply filtering and protection unit and the SIM card external connection unit respectively.

[0028] Further, the communication module includes a chip U1A. The eleventh, twelfth, thirteenth, and fourteenth pins of the chip U1A are all electrically connected to the SIM card external unit, and the forty-second and forty-third pins of the chip U1A are both electrically connected to the power supply filtering and protection unit.

[0029] Further, the SIM card external unit includes a resistor R3, a resistor R5, a capacitor C10, a capacitor C11, a capacitor C6, a resistor R2, a resistor R6, a resistor R4, a capacitor C9, a SIM card mounting connector J3, and a chip U2. The first pin of the SIM card mounting connector J3 is electrically connected to one end of the capacitor C6, the sixth pin of the chip U2, and the communication module respectively. The second pin of the SIM card mounting connector J3 is electrically connected to one end of the resistor R3, the first pin of the chip U2, and one end of the capacitor C11 respectively. The third pin of the SIM card mounting connector J3 is electrically connected to one end of the resistor R5, one end of the capacitor C10, and the third pin of the chip U2 respectively. The fifth pin of the SIM card mounting connector J3 is grounded. The sixth pin of the SIM card mounting connector J3 is electrically connected to one end of the resistor R2. The other end of the resistor R2 is electrically connected to the communication module and one end of the resistor R4 respectively. The seventh pin of the SIM card mounting connector J3 is electrically connected to the fourth pin of the chip U2, one end of the capacitor C9, and one end of the resistor R6 respectively. The other end of the resistor R6 is electrically connected to the other end of the resistor R4 and the communication module respectively. The second pin of the chip U2, the other end of the capacitor C9, the other end of the capacitor C6, the other end of the capacitor C10, and the other end of the capacitor C11 are all grounded.

[0030] Further, the power supply filtering and protection unit includes an ESD protection device DT1, a magnetic bead FB2, an electrolytic capacitor E1, and a capacitor C3. One end of the ESD protection device DT1 is electrically connected to one end of the magnetic bead FB2. The other end of the magnetic bead FB2 is electrically connected to one end of the electrolytic capacitor E1, one end of the capacitor C3, and the communication module respectively. The other end of the ESD protection device DT1 is electrically connected to the other end of the electrolytic capacitor E1 and the other end of the capacitor C3 respectively, and the other end of the ESD protection device DT1, the other end of the electrolytic capacitor E1, and the other end of the capacitor C3 are all grounded.

[0031] Further, the ultrasonic sensor is electrically connected to the MCU main control module through the R485 communication interface module.

[0032] Further, the R485 communication interface module includes a bead FB1, a capacitor C29, a resistor R41, a MOS transistor Q6, a resistor R42, a resistor R31, a resistor R46, a capacitor C30, and an interface chip U9. The first pin of the interface chip U9 is electrically connected to one end of the resistor R31 and the MCU main control module respectively. The second pin of the interface chip U9 is electrically connected to the third pin of the interface chip U9, the MCU main control module, and one end of the resistor R46 respectively. The other end of the resistor R46 is grounded. The fourth pin of the interface chip U9 is electrically connected to the MCU main control module. The fifth pin of the interface chip U9 is grounded. The sixth pin and the seventh pin of the interface chip U9 are both electrically connected to the ultrasonic sensor. The eighth pin of the interface chip U9 is electrically connected to one end of the capacitor C30 and the drain of the MOS transistor Q6 respectively. The other end of the capacitor C30 is grounded. The gate of the MOS transistor Q6 is electrically connected to one end of the resistor R42 and one end of the resistor R41 respectively. The other end of the resistor R42 is electrically connected to the MCU main control module. The source of the MOS transistor Q6 is electrically connected to the other end of the resistor R41, one end of the capacitor C29, and one end of the bead FB1 respectively. The other end of the capacitor C29 is grounded. The other end of the bead FB1 is connected to the 3V power supply.

[0033] Further, the R485 communication interface module further includes a resistor R50, a resistor R51, a voltage stabilizing diode U13, a fuse F1, and a fuse F2. The first end of the voltage stabilizing diode U13 is electrically connected to one end of the resistor R50, the seventh pin of the interface chip U9, and one end of the fuse F1 respectively. The other end of the fuse F1 is electrically connected to the ultrasonic sensor. The other end of the resistor R50 is grounded. The second end of the voltage stabilizing diode U13 is electrically connected to one end of the resistor R51, the sixth pin of the interface chip U9, and one end of the fuse F2 respectively. The other end of the fuse F2 is electrically connected to the ultrasonic sensor. The third end of the voltage stabilizing diode U13 is grounded.

[0034] Further, the BLE Bluetooth module includes a resistor R33, a resistor R34, a resistor R35, a capacitor C20, a capacitor C21, a triode Q5, and a chip U8. The eighth pin, ninth pin, seventeenth pin, eighteenth pin, twenty-second pin, twenty-third pin, and twenty-fourth pin of the chip U8 are all electrically connected to the MCU main control module. The tenth pin of the chip U8 is electrically connected to the collector of the triode Q5 and one end of the resistor R33 respectively. The twelfth pin of the chip U8 is electrically connected to the other end of the resistor R33 and one end of the capacitor C21 respectively. The base of the triode Q5 is electrically connected to one end of the resistor R34 and one end of the resistor R35 respectively. The other end of the resistor R34 is electrically connected to the MCU main control module. The other end of the resistor R35 is electrically connected to the emitter of the triode Q5 and one end of the capacitor C20 respectively. The other end of the capacitor C20, the other end of the capacitor C21, the second pin of the chip U8, and the twenty-sixth pin of the chip U8 are all grounded.

[0035] Please refer to Figures 1 to 4 As shown in the figure, Embodiment 1 of the present utility model is as follows:

[0036] Please refer to Figure 1 A kind of intelligent liquid level monitoring terminal, including an ultrasonic sensor 1, an NB-IOT communication module 2, a BLE Bluetooth module 3, a data storage module 4, and an MCU main control module 5. The MCU main control module 5 is electrically connected to the ultrasonic sensor 1, the NB-IOT communication module 2, the BLE Bluetooth module 3, and the data storage module 4 respectively. The ultrasonic sensor 1 is arranged on the outer surface of the bottom of the water tank to be detected.

[0037] The data storage module 4 uses an SPI flash with the model number AT45DB161E / 321E as the core chip of the data storage module 4. This chip has a built-in buffer area and can achieve page writing, effectively reducing the resource requirements of the MCU main control module 5. The MCU main control module 5 uses a chip of the Microchip PIC24 series as the main control.

[0038] The NB-IOT communication module 2 includes a communication module, a power supply filtering and protection unit, and a SIM card external connection unit. The communication module is electrically connected to the power supply filtering and protection unit and the SIM card external connection unit respectively.

[0039] Since the intelligent liquid level monitoring terminal is basically deployed around the water tank, and most of the environments of the water supply tanks are in the basement and on the roof, which are also blind areas for many wireless signals, the intelligent liquid level monitoring terminal uses a communication module based on the NB-IOT narrowband technology of the Internet of Things. The technical characteristics of this technology are low power consumption and wide coverage, which can effectively solve the problem of signal blind areas.

[0040] Please refer to Figure 2, the communication module includes a chip U1A. The eleventh, twelfth, thirteenth, and fourteenth pins of the chip U1A are all electrically connected to the SIM card external unit, and the forty-second and forty-third pins of the chip U1A are both electrically connected to the power supply filtering and protection unit.

[0041] Please refer to Figure 2 , the communication module further includes a resistor R1, a capacitor C1, a capacitor C2, a connector J1, a diode D1, a capacitor C7, and a capacitor C8. Among them, the resistor R1, the capacitor C1, the capacitor C2, and the connector J1 form a matching circuit for the antenna.

[0042] Please refer to Figure 2 , the SIM card external unit includes a resistor R3, a resistor R5, a capacitor C10, a capacitor C11, a capacitor C6, a resistor R2, a resistor R6, a resistor R4, a capacitor C9, a SIM card mounting connector J3, and a chip U2. The first pin of the SIM card mounting connector J3 is electrically connected to one end of the capacitor C6, the sixth pin of the chip U2, and the communication module respectively. The second pin of the SIM card mounting connector J3 is electrically connected to one end of the resistor R3, the first pin of the chip U2, and one end of the capacitor C11 respectively. The third pin of the SIM card mounting connector J3 is electrically connected to one end of the resistor R5, one end of the capacitor C10, and the third pin of the chip U2 respectively. The fifth pin of the SIM card mounting connector J3 is grounded. The sixth pin of the SIM card mounting connector J3 is electrically connected to one end of the resistor R2. The other end of the resistor R2 is electrically connected to the communication module and one end of the resistor R4 respectively. The seventh pin of the SIM card mounting connector J3 is electrically connected to the fourth pin of the chip U2, one end of the capacitor C9, and one end of the resistor R6 respectively. The other end of the resistor R6 is electrically connected to the other end of the resistor R4 and the communication module respectively. The second pin of the chip U2, the other end of the capacitor C9, the other end of the capacitor C6, the other end of the capacitor C10, and the other end of the capacitor C11 are all grounded. The chip U2 is an ESD protection device for the SIM card, which can improve the anti-static ability and thus improve the product stability.

[0043] When using the NB-IOT communication method, it is necessary to insert a SIM card to allow access to the operator. The SIM card mounting connector J3 can be used to insert the SIM physical card. The chip U2 is an ESD anti-static chip, which can effectively protect against the static electricity impact during card insertion.

[0044] Please refer to Figure 2, the power filter protection unit includes an ESD protection device DT1, a magnetic bead FB2, an electrolytic capacitor E1, and a capacitor C3. One end of the ESD protection device DT1 is electrically connected to one end of the magnetic bead FB2. The other end of the magnetic bead FB2 is respectively electrically connected to one end of the electrolytic capacitor E1, one end of the capacitor C3, and the communication module. The other end of the ESD protection device DT1 is respectively electrically connected to the other end of the electrolytic capacitor E1 and the other end of the capacitor C3, and the other end of the ESD protection device DT1, the other end of the electrolytic capacitor E1, and the other end of the capacitor C3 are all grounded. The magnetic bead FB2 can effectively suppress the interference of high-frequency signals and RF noise. The ESD protection device DT1 can effectively improve the electrostatic protection ability. The electrolytic capacitor E1 and the capacitor C3 can effectively filter out high-frequency and low-frequency interference.

[0045] The ultrasonic sensor 1 is electrically connected to the MCU main control module 5 through the R485 communication interface module 6.

[0046] Please refer to Figure 3 , the R485 communication interface module 6 includes a magnetic bead FB1, a capacitor C29, a resistor R41, a MOS transistor Q6, a resistor R42, a resistor R31, a resistor R46, a capacitor C30, and an interface chip U9. The first pin of the interface chip U9 is respectively electrically connected to one end of the resistor R31 and the MCU main control module 5. The second pin of the interface chip U9 is respectively electrically connected to the third pin of the interface chip U9, the MCU main control module 5, and one end of the resistor R46. The other end of the resistor R46 is grounded. The fourth pin of the interface chip U9 is electrically connected to the MCU main control module 5. The fifth pin of the interface chip U9 is grounded. The sixth pin and the seventh pin of the interface chip U9 are both electrically connected to the ultrasonic sensor 1. The eighth pin of the interface chip U9 is respectively electrically connected to one end of the capacitor C30 and the drain of the MOS transistor Q6. The other end of the capacitor C30 is grounded. The gate of the MOS transistor Q6 is respectively electrically connected to one end of the resistor R42 and one end of the resistor R41. The other end of the resistor R42 is electrically connected to the MCU main control module 5. The source of the MOS transistor Q6 is respectively electrically connected to the other end of the resistor R41, one end of the capacitor C29, and one end of the magnetic bead FB1. The other end of the capacitor C29 is grounded. The other end of the magnetic bead FB1 is connected to the 3V power supply.

[0047] Please refer to Figure 3, the R485 communication interface module 6 further includes a resistor R50, a resistor R51, a voltage regulator diode U13, a fuse F1, and a fuse F2 (both the fuse F1 and the fuse F2 are self - resetting fuses, which can provide over - current protection for the bus.), the first end of the voltage regulator diode U13 is electrically connected to one end of the resistor R50, the seventh pin of the interface chip U9, and one end of the fuse F1 respectively, the other end of the fuse F1 is electrically connected to the ultrasonic sensor 1, the other end of the resistor R50 is grounded, the second end of the voltage regulator diode U13 is electrically connected to one end of the resistor R51, the sixth pin of the interface chip U9, and one end of the fuse F2 respectively, the other end of the fuse F2 is electrically connected to the ultrasonic sensor 1, and the third end of the voltage regulator diode U13 is grounded.

[0048] It further includes a power supply module, and the power supply module is electrically connected to the ultrasonic sensor 1.

[0049] As a serial bus communication protocol, RS485 has the characteristics of high stability, long transmission distance, fast speed, strong anti - interference ability, and support for multiple nodes, and is widely used in the fields of industrial automation, building automation, and instrumentation; therefore, in this solution, RS485 communication is adopted for the interface with the ultrasonic sensor 11. The outputs RS485A and RS485A of the R485 communication interface module 6 are connected to the A and B interfaces of the ultrasonic sensor 1 respectively. The 12V output of the second power supply module, and the GND pin of the second power supply module are connected to the VCC pin and the GND pin of the ultrasonic sensor 1 to provide power supply for the ultrasonic sensor 11. The input terminals / RX_485 and / TX_485 of the interface chip U9 are connected to the UART serial port of the MCU main control module 55. The bead FB1, the capacitor C29, the resistor R41, the resistor R42, the MOS transistor Q6, and the capacitor C30 constitute the power control circuit of the RS485 communication interface. / V485_POWER is connected to the MCU2 I / O pin. In the normal standby situation, the MCU main control module 5 powers off this circuit to reduce power consumption; when the MCU main control module 5 needs to communicate with the ultrasonic sensor 1, it will turn on the power pin / V485_POWER and the interface enable pin / EN_485 of RS485 to make it enter the working state and enter the communication mode with the ultrasonic sensor 1.

[0050] Please refer to Figure 4, the BLE Bluetooth module 3 includes a resistor R33, a resistor R34, a resistor R35, a capacitor C20, a capacitor C21, a triode Q5, and a chip U8. The eighth pin, ninth pin, seventeenth pin, eighteenth pin, twenty-second pin, twenty-third pin, and twenty-fourth pin of the chip U8 are all electrically connected to the MCU main control module 5. The tenth pin of the chip U8 is electrically connected to the collector of the triode Q5 and one end of the resistor R33 respectively. The twelfth pin of the chip U8 is electrically connected to the other end of the resistor R33 and one end of the capacitor C21 respectively. The base of the triode Q5 is electrically connected to one end of the resistor R34 and one end of the resistor R35 respectively. The other end of the resistor R34 is electrically connected to the MCU main control module 5. The other end of the resistor R35 is electrically connected to the emitter of the triode Q5 and one end of the capacitor C20 respectively. The other end of the capacitor C20, the other end of the capacitor C21, the second pin of the chip U8, and the twenty-sixth pin of the chip U8 are all grounded. The chip U8 is a BLE Bluetooth 5.0 chip module, which is directly connected to the MCU main control module. The MCU main control module establishes communication with it to control the module to establish a connection with the mobile phone APP to achieve communication interaction. Due to considering the ultra-low power standby mode of the whole machine, the triode Q5, the resistor R33, the resistor R34, and the resistor R35 constitute the power control circuit of the BLE Bluetooth module. Only when it is necessary to interact with the APP, the MCU main control module will turn on the power of the BLE Bluetooth module through the / BLE_PW pin and establish communication.

[0051] The ultrasonic sensor 1 is arranged on the outer surface of the bottom of the water tank to be detected. The MCU main control module 5 drives the ultrasonic sensor 1 to emit acoustic wave signals from the ultrasonic probe. After being reflected by the liquid or other solid media, the signals are folded back and received by the same probe. The time difference between the ultrasonic wave emission and reception is measured to achieve the measurement of the liquid level. In this way, the liquid level inside the water tank can be measured outside the water tank, thus avoiding the pollution of the water source. And since the ultrasonic sensor 1 is arranged outside, it is convenient for management and maintenance.

[0052] In summary, an intelligent liquid level monitoring terminal provided by the present utility model includes an ultrasonic sensor, an NB-IOT communication module, a BLE Bluetooth module, a data storage module, and an MCU main control module. The MCU main control module sends commands to the ultrasonic sensor in real time. The ultrasonic sensor sends the collected liquid level data to the MCU main control module. After receiving the liquid level data, the MCU main control module saves the liquid level data in the data storage module. The MCU main control module establishes a connection with the BLE Bluetooth module and controls the BLE Bluetooth module to establish a connection with the user's mobile phone, thereby realizing parameter setting for the MCU main control module. According to the communication frequency set by the user with the platform, when the communication time arrives, the MCU main control module will activate the NB-IOT communication module and control it to establish a communication connection with the platform server, uploading relevant data and device status, so that the user can understand the liquid level status and process data of the water tank in real time. The platform can also send instructions to the MCU main control module through the NB-IOT communication module, and the MCU main control module can receive the corresponding instructions and perform corresponding operations, thereby realizing the automatic operation of the device.

[0053] The above are only embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent transformation made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in the relevant technical fields, shall be included in the patent protection scope of the present utility model by the same token.

Claims

1. An intelligent liquid level monitoring terminal, characterized in that, It includes an ultrasonic sensor, an NB-IOT communication module, a BLE Bluetooth module, a data storage module and an MCU main control module. The MCU main control module is electrically connected to the ultrasonic sensor, the NB-IOT communication module, the BLE Bluetooth module and the data storage module respectively. The ultrasonic sensor is arranged on the outer surface of the bottom of the water tank to be detected.

2. The intelligent liquid level monitoring terminal according to claim 1, wherein The NB-IOT communication module includes a communication module, a power filter protection unit and a SIM card external connection unit. The communication module is electrically connected to the power filter protection unit and the SIM card external connection unit respectively.

3. The intelligent liquid level monitoring terminal according to claim 2, characterized in that The communication module includes a chip U1A. The eleventh pin, twelfth pin, thirteenth pin and fourteenth pin of the chip U1A are all electrically connected to the SIM card external connection unit. The forty-second pin and forty-third pin of the chip U1A are both electrically connected to the power filter protection unit.

4. The intelligent liquid level monitoring terminal according to claim 2, wherein The SIM card external connection unit includes a resistor R3, a resistor R5, a capacitor C10, a capacitor C11, a capacitor C6, a resistor R2, a resistor R6, a resistor R4, a capacitor C9, a SIM card installation connector J3 and a chip U2. The first pin of the SIM card installation connector J3 is electrically connected to one end of the capacitor C6, the sixth pin of the chip U2 and the communication module respectively. The second pin of the SIM card installation connector J3 is electrically connected to one end of the resistor R3, the first pin of the chip U2 and one end of the capacitor C11 respectively. The third pin of the SIM card installation connector J3 is electrically connected to one end of the resistor R5, one end of the capacitor C10 and the third pin of the chip U2 respectively. The fifth pin of the SIM card installation connector J3 is grounded. The sixth pin of the SIM card installation connector J3 is electrically connected to one end of the resistor R2. The other end of the resistor R2 is electrically connected to the communication module and one end of the resistor R4 respectively. The seventh pin of the SIM card installation connector J3 is electrically connected to the fourth pin of the chip U2, one end of the capacitor C9 and one end of the resistor R6 respectively. The other end of the resistor R6 is electrically connected to the other end of the resistor R4 and the communication module respectively. The second pin of the chip U2, the other end of the capacitor C9, the other end of the capacitor C6, the other end of the capacitor C10 and the other end of the capacitor C11 are all grounded.

5. The intelligent liquid level monitoring terminal according to claim 2, characterized in that, The power filter protection unit includes an ESD protection device DT1, a magnetic bead FB2, an electrolytic capacitor E1 and a capacitor C3. One end of the ESD protection device DT1 is electrically connected to one end of the magnetic bead FB2. The other end of the magnetic bead FB2 is electrically connected to one end of the electrolytic capacitor E1, one end of the capacitor C3 and the communication module respectively. The other end of the ESD protection device DT1 is electrically connected to the other end of the electrolytic capacitor E1 and the other end of the capacitor C3 respectively, and the other end of the ESD protection device DT1, the other end of the electrolytic capacitor E1 and the other end of the capacitor C3 are all grounded.

6. The intelligent liquid level monitoring terminal according to claim 1, wherein The ultrasonic sensor is electrically connected to the MCU main control module through an R485 communication interface module.

7. The intelligent liquid level monitoring terminal according to claim 6, wherein The R485 communication interface module includes a bead FB1, a capacitor C29, a resistor R41, a MOS transistor Q6, a resistor R42, a resistor R31, a resistor R46, a capacitor C30, and an interface chip U9. The first pin of the interface chip U9 is electrically connected to one end of the resistor R31 and the MCU main control module respectively. The second pin of the interface chip U9 is electrically connected to the third pin of the interface chip U9, the MCU main control module, and one end of the resistor R46 respectively. The other end of the resistor R46 is grounded. The fourth pin of the interface chip U9 is electrically connected to the MCU main control module. The fifth pin of the interface chip U9 is grounded. The sixth pin and the seventh pin of the interface chip U9 are both electrically connected to the ultrasonic sensor. The eighth pin of the interface chip U9 is electrically connected to one end of the capacitor C30 and the drain of the MOS transistor Q6 respectively. The other end of the capacitor C30 is grounded. The gate of the MOS transistor Q6 is electrically connected to one end of the resistor R42 and one end of the resistor R41 respectively. The other end of the resistor R42 is electrically connected to the MCU main control module. The source of the MOS transistor Q6 is electrically connected to the other end of the resistor R41, one end of the capacitor C29, and one end of the bead FB1 respectively. The other end of the capacitor C29 is grounded. The other end of the bead FB1 is connected to the 3V power supply.

8. The intelligent liquid level monitoring terminal according to claim 6, characterized in that The R485 communication interface module further includes a resistor R50, a resistor R51, a voltage regulator diode U13, a fuse F1, and a fuse F2. The first end of the voltage regulator diode U13 is electrically connected to one end of the resistor R50, the seventh pin of the interface chip U9, and one end of the fuse F1 respectively. The other end of the fuse F1 is electrically connected to the ultrasonic sensor. The other end of the resistor R50 is grounded. The second end of the voltage regulator diode U13 is electrically connected to one end of the resistor R51, the sixth pin of the interface chip U9, and one end of the fuse F2 respectively. The other end of the fuse F2 is electrically connected to the ultrasonic sensor. The third end of the voltage regulator diode U13 is grounded.

9. The intelligent liquid level monitoring terminal according to claim 1, characterized in that The BLE Bluetooth module includes a resistor R33, a resistor R34, a resistor R35, a capacitor C20, a capacitor C21, a triode Q5, and a chip U8. The eighth pin, ninth pin, seventeenth pin, eighteenth pin, twenty-second pin, twenty-third pin, and twenty-fourth pin of the chip U8 are all electrically connected to the MCU main control module. The tenth pin of the chip U8 is electrically connected to the collector of the triode Q5 and one end of the resistor R33 respectively. The twelfth pin of the chip U8 is electrically connected to the other end of the resistor R33 and one end of the capacitor C21 respectively. The base of the triode Q5 is electrically connected to one end of the resistor R34 and one end of the resistor R35 respectively. The other end of the resistor R34 is electrically connected to the MCU main control module. The other end of the resistor R35 is electrically connected to the emitter of the triode Q5 and one end of the capacitor C20 respectively. The other end of the capacitor C20, the other end of the capacitor C21, the second pin of the chip U8, and the twenty-sixth pin of the chip U8 are all grounded.

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