Bonding wire quality inspection device and bonding wire quality inspection system

Abstract

The utility model relates to the field of production instruments, and discloses a bonding wire quality inspection device and system. The transmission module comprises an assembling part and a connecting part, the assembling part comprises a first assembling front end and a second assembling front end, the first assembling front end and the second assembling front end are arranged in a spaced mode to form an assembling opening and a first guiding notch, and the transmission module is movably connected with the base through the connecting part; the driving module comprises a primary driving assembly connected to the base and a secondary driving assembly connected to the transmission module, and the primary driving assembly drives the secondary driving assembly to move in the first direction based on input first driving current so as to drive the wire picking workpiece to apply force to the target welding wire; and the force applied by the wire picking workpiece to the target welding wire is matched with the current intensity of the first driving current. According to the application, the force applied to the target bonding wire is accurately controlled by driving the secondary driving assembly through the host driving assembly, the welding quality detection result of the target bonding wire is ensured to be reliable, the firmness degree of the bonding wire is intuitively reflected, and the cost is relatively low.

Description

Technical Field

[0001] The present application relates to the field of production equipment, and particularly to a wire bonding quality inspection device and a wire bonding quality inspection system. Background Art

[0002] In the processing and packaging of semiconductor devices, wire bonding has always been the main method for providing electrical connection between two positions within a package. Currently, in the industry, wire bonders or other processing equipment are mainly used for large-scale wire bonding to set up wire loops between two positions that need to be electrically connected to each other within a package.

[0003] However, for the package products produced by a wire bonder, it is necessary to inspect the firmness of the wire bonding to ensure the product quality, especially for the package products produced by the wire bonder through large-scale welding.

[0004] Therefore, providing a wire bonding quality inspection solution with low cost, reliable detection results, and intuitively reflecting the firmness of wire bonding is an urgent problem for those skilled in the art. Summary of the Invention

[0005] The embodiments of the present application provide a wire bonding quality inspection device and a wire bonding quality inspection system, aiming to accurately control the magnitude of the force applied to the target wire bond, ensure reliable detection results of the welding quality of the target wire bond, intuitively reflect the firmness of the wire bond, and reduce the cost of wire bonding quality inspection.

[0006] In a first aspect, the embodiments of the present application provide a wire bonding quality inspection device, including:

[0007] A base for providing installation support;

[0008] A transmission module, the transmission module includes a connection part and an assembly part arranged on a different side from the connection part. The transmission module is movably connected to the base through the connection part. The assembly part at least includes a first assembly front end and a second assembly front end that are connected to the connection part and extend in a direction away from the connection part. The first assembly front end and the second assembly front end are spaced apart to form an assembly opening for connecting and adapting to a wire picking workpiece and a first guiding notch for cooperating with an external guiding workpiece to guide the movement direction of the transmission module;

[0009] A driving module, the driving module includes a primary driving component connected to the base and a secondary driving component connected to the transmission module and adapted to the primary driving component. The primary driving component is at least used to drive the secondary driving component to move in a first direction based on a first driving current input to the primary driving component, so as to drive the wire picking workpiece connected to the assembly part through the secondary driving component and the transmission module to apply a force to the target wire bond welded to the circuit board;

[0010] Wherein, the first direction is the direction in which the target bonding wire is away from the circuit board, and the magnitude of the force exerted by the wire picking workpiece on the target bonding wire matches the current intensity of the first driving current input to the primary driving component.

[0011] In some embodiments, the primary driving component includes a first coil unit and a second coil unit that are spaced apart and connected to the base. The first coil unit and the second coil unit are spaced apart to form a receiving groove. The secondary driving component includes a magnet unit that is connected to the transmission module and adapted to the receiving groove.

[0012] Wherein, the first coil unit and the second coil unit are configured to receive the first driving current and generate a target coil magnetic field under the excitation of the first driving current, so that the magnet unit received in the receiving groove moves in the first direction under the action of the target coil magnetic field, thereby driving the wire picking workpiece to move in the first direction through the transmission module.

[0013] In some embodiments, both the first coil unit and the second coil unit are wound around an axis in a second direction perpendicular to the first direction, and the S pole and the N pole of the magnet unit are arranged in a third direction perpendicular to the first direction and at an angle to the second direction.

[0014] In some embodiments, the base includes a base portion for providing connection support, and a first winding support portion and a second winding support portion that are connected to the base portion and disposed on opposite sides of the connection portion. The first coil unit is wound around the first winding support portion, and the second coil unit is wound around the second winding support portion.

[0015] Wherein, the first winding support portion and the second winding support portion are iron cores or insulating members.

[0016] In some embodiments, at least one of the side of the connection portion close to the first winding support portion and the side close to the second winding support portion forms a limiting groove extending in the first direction, and the connection portion is configured to form a guiding fit with the base through the limiting groove.

[0017] Wherein, the magnet unit is disposed on the connection portion corresponding to the first winding support portion and the second winding support portion, and at least a part of the magnet unit is exposed outside the limiting groove.

[0018] In some embodiments, the primary driving component is further configured to drive the secondary driving component to move in a direction opposite to the first direction based on the input second driving current, and the current direction of the second driving current is opposite to that of the first driving current.

[0019] In some embodiments, the transmission module further includes a guiding portion disposed between the assembling portion and the connection portion. The guiding portion forms at least one second guiding notch extending in the first direction, and the second guiding notch is configured to cooperate with an external guiding workpiece to guide the moving direction of the transmission module.

[0020] In some embodiments, the first guiding notch is formed on a side of the assembly opening close to the connecting portion and is in communication with the assembly opening.

[0021] In some embodiments, at least one of the first assembly front end and the second assembly front end forms an assembly hole for connecting and adapting to the thread picking workpiece;

[0022] And / or, the first assembly front end and the second assembly front end are used to cooperatively clamp the thread picking workpiece through the assembly opening.

[0023] In a second aspect, an embodiment of the present application further provides a wire bonding quality inspection system, including:

[0024] A wire bonding quality inspection device as provided in any embodiment of the present application;

[0025] An acquisition device;

[0026] A receiving platform for receiving and fixing a circuit board to be quality inspected, and a target wire bond is welded on the circuit board;

[0027] A controller, electrically connected to the wire bonding quality inspection device and the acquisition device, for:

[0028] When the circuit board is fixed on the receiving platform, controlling the wire bonding quality inspection device to drive the thread picking workpiece to apply a force to the target wire bond based on a first drive current input to the wire bonding quality inspection device;

[0029] Controlling the acquisition device to obtain the connection state of the target wire bond, and the connection state at least includes a first state and a second state. The first state indicates that the connection between the target wire bond and the circuit board is detached, and the second state indicates that the connection between the target wire bond and the circuit board is not detached;

[0030] Determining the force applied by the thread picking workpiece to the target wire bond according to the current intensity of the first drive current, and outputting wire bonding quality inspection information corresponding to the target wire bond based on the force applied and the connection state.

[0031] In summary, the embodiments of the present application provide a wire bonding quality inspection device and a wire bonding quality inspection system. The wire bonding quality inspection device includes: a base for providing installation support; a transmission module, the transmission module includes a connection part and an assembly part arranged on a different side from the connection part. The transmission module is movably connected to the base through the connection part. The assembly part at least includes a first assembly front end and a second assembly front end connected to the connection part and extending in a direction away from the connection part. The first assembly front end and the second assembly front end are spaced apart to form an assembly opening for connecting and adapting to a wire picking workpiece and a first guiding notch for cooperating with an external guiding workpiece to guide the movement direction of the transmission module; a driving module, the driving module includes a primary driving component connected to the base and a secondary driving component connected to the transmission module and adapted to the primary driving component. The primary driving component is at least used to drive the secondary driving component to move in a first direction based on a first driving current input to the primary driving component, so as to drive the wire picking workpiece connected to the assembly part through the secondary driving component and the transmission module to apply a force to a target wire bonded to a circuit board; wherein, the first direction is the direction in which the target wire is away from the circuit board, and the magnitude of the force applied by the wire picking workpiece to the target wire matches the current intensity of the first driving current input to the primary driving component. The wire bonding quality inspection device and the wire bonding quality inspection system provided by the embodiments of the present application convert the current intensity of the first driving current into the force applied by the wire picking workpiece to the target wire by driving the secondary driving component by the primary driving component in the driving module, can accurately control the magnitude of the force applied to the target wire, ensure the reliability of the welding quality inspection result of the target wire, and intuitively reflect the firmness of the wire bonding. Moreover, compared with the machine vision solution, the cost of implementing wire bonding quality inspection in this solution is lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0033] Figure 1 It is a module structure diagram of an implementation manner of a wire bonding quality inspection device provided by an embodiment of the present application;

[0034] Figure 2 It is a structural schematic diagram of an implementation manner of a wire bonding quality inspection device provided by an embodiment of the present application;

[0035] Figure 3 It is a structural schematic diagram of a base and a primary driving component in a wire bonding quality inspection device provided by an embodiment of the present application;

[0036] Figure 4Schematic diagram of the transmission module and the secondary drive component in the wire bonding quality inspection device provided by an embodiment of the present application;

[0037] Figure 5 Scene schematic diagram of wire bonding quality inspection performed by the wire bonding quality inspection device provided by an embodiment of the present application;

[0038] Figure 6 Arrangement schematic diagram of the first coil unit, the second coil unit and the magnet unit in the wire bonding quality inspection device provided by an embodiment of the present application;

[0039] Figure 7 Module structure diagram of an implementation manner of the wire bonding quality inspection system provided by an embodiment of the present application;

[0040] Reference numerals:

[0041] 100, wire bonding quality inspection device; 10, base; 11, first winding support; 12, second winding support; 13, base part; 20, transmission module; 21, connection part; 211, limit groove; 22, assembly part; 221, first assembly front end; 222, second assembly front end; 223, assembly opening; 224, assembly hole; 225, first guide groove opening; 23, guide part; 231, second guide groove opening; 30, drive module; 31, primary drive component; 311, first coil unit; 312, second coil unit; 313, accommodation groove; 32, secondary drive component; 321, magnet unit; 200, acquisition device; 300, accommodation platform; 400, controller; 500, wire bonding quality inspection system; 600, wire picking workpiece; 700, circuit board; 800, target wire bond; D1, first direction; D2, second direction; D3, third direction. Detailed implementation manners

[0042] The technical solutions of the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Based on the embodiments of the present application, other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application. The flowcharts shown in the accompanying drawings are only illustrative examples, and do not necessarily include all the contents and operations / steps, nor do they necessarily need to be executed in the described order. For example, some operations / steps can also be decomposed, combined or partially merged, so the actual execution order may be changed according to the actual situation.

[0043] Please refer to Figures 1 to 5 , Figure 1 which is a module structure diagram of an implementation manner of the wire bonding quality inspection device 100 provided by an embodiment of the present application, Figure 2 which is a structure schematic diagram of an implementation manner of the wire bonding quality inspection device 100 provided by an embodiment of the present application,Figure 3 The structural schematic diagram of the base 10 and the primary drive assembly 31 in the wire bonding quality inspection device 100 provided by an embodiment of the present application. Figure 4 The structural schematic diagram of the transmission module 20 and the secondary drive assembly 32 in the wire bonding quality inspection device 100 provided by an embodiment of the present application. Figure 5 The scene schematic diagram of the wire bonding quality inspection device 100 provided by an embodiment of the present application for wire bonding quality inspection.

[0044] As Figures 1 to 5 shown, an embodiment of the present application provides a wire bonding quality inspection device 100, which includes: a base 10, a transmission module 20, and a drive module 30. The drive module 30 can be used to assemble a wire picking workpiece 600 to apply a pulling force in a direction away from the circuit board 700 to the target wire bond 800 welded on the circuit board 700, so as to determine whether the wire bond is firm according to whether the connection between the target wire bond 800 and the circuit board 700 is detached, thereby detecting the welding quality of the target wire bond 800.

[0045] The following specifically describes the structure and function of each part in the wire bonding quality inspection device 100.

[0046] Specifically, the base 10 is used to provide installation support. It can form a fixed connection with an external object to provide a fixed base point for the entire wire bonding quality inspection device 100. Or, the base 10 can be directly placed at a preset position, and the base 10 provides mechanical support for the transmission module 20 and the drive module 30.

[0047] Specifically, the transmission module 20 includes a connection part 21 and an assembly part 22 provided on a different side from the connection part 21. The transmission module 20 forms a movable connection with the base 10 through the connection part 21, and the assembly part 22 is configured to be connected and adapted to the wire picking workpiece 600. It should be noted that the connection part 21 and the assembly part 22 are on different sides of the transmission module 20. When the transmission module 20 moves relative to the base 10 through the connection part 21, the wire picking workpiece 600 connected and adapted to the assembly part 22 moves synchronously with the transmission module 20, so as to apply a pulling force in a direction away from the circuit board 700 to the target wire bond 800 welded on the circuit board 700.

[0048] More specifically, the assembly part 22 at least includes a first assembly front end 221 and a second assembly front end 222 connected to the connection part 21 and extending in a direction away from the connection part 21. The first assembly front end 221 and the second assembly front end 222 are spaced apart to form an assembly opening 223 for connecting and adapting to the wire picking workpiece 600 and a first guide slot 225 for cooperating with an external guiding workpiece to guide the moving direction of the transmission module 20.

[0049] Specifically, the driving module 30 includes a primary driving component 31 connected to the base 10 and a secondary driving component 32 connected to the transmission module 20 and adapted to the primary driving component 31. The primary driving component 31 is at least used to drive the secondary driving component 32 to move in the first direction D1 based on the first driving current input to the primary driving component 31, so as to drive the wire picking workpiece 600 connected to the assembling part 22 to apply a force to the target welding wire 800 welded to the circuit board 700 through the secondary driving component 32 and the transmission module 20, wherein the first direction D1 is the direction in which the target welding wire 800 is away from the circuit board 700.

[0050] For example, the primary driving component 31 is a linear motor coil, and the secondary driving component 32 is a linear motor magnet. The linear motor coil and the linear motor magnet form a linear motor (also known as a linear motor) to drive the transmission module 20 to drive the wire picking workpiece 600 connected and adapted to the assembling part 22 to move. It should be understood that the linear motor can provide a high acceleration and has a fast response time, so as to meet the requirements of quickly and accurately moving the wire picking workpiece 600 and precisely controlling the magnitude of the force applied to the target welding wire 800 in the scenario of detecting the welding quality of the target welding wire 800.

[0051] Specifically, under the condition that the wire picking workpiece 600 is connected and adapted to the assembling part 22, when the first driving current is input to the primary driving component 31, the primary driving component 31 generates a target coil magnetic field due to the excitation of the first driving current, and the secondary driving component 32 moves in the first direction D1 under the electromagnetic force exerted on the secondary driving component 32 itself by the target coil magnetic field, so as to drive the wire picking workpiece 600 connected to the assembling part 22 to move in the first direction D1 through the transmission module 20, thereby driving the wire picking workpiece 600 to apply a force to the target welding wire 800 welded to the circuit board 700.

[0052] It should be noted that the first direction D1 is specifically any direction away from the circuit board 700, such as the direction perpendicular to the circuit board 700. Moreover, the magnitude of the electromagnetic force received by the secondary driving component 32 matches the current intensity of the first driving current input to the primary driving component 31, and due to the transmission effect of the transmission module 20, the magnitude of the force applied by the wire picking workpiece 600 to the target welding wire 800 matches the current intensity of the first driving current input to the primary driving component 31.

[0053] Further, based on the magnitude of the force exerted by the thread lifting workpiece 600 on the target bonding wire 800 being matched with the current intensity of the first driving current input to the primary driving component 31, the current intensity of the first driving current can be set to adjust the magnitude of the force exerted by the thread lifting workpiece 600 on the target bonding wire 800. For example, it can be calibrated that when the first driving current is the first current value, the magnitude of the force exerted by the thread lifting workpiece 600 on the target bonding wire 800 is the first force value, and when the second driving current is the second current value, the magnitude of the force exerted by the thread lifting workpiece 600 on the target bonding wire 800 is the second force value. Exemplarily, when the first driving current is 1A, the magnitude of the force exerted by the thread lifting workpiece 600 on the target bonding wire 800 is 1N.

[0054] After the thread lifting workpiece 600 exerts a force on the target bonding wire 800 welded to the circuit board 700, based on the connection state of the target bonding wire 800 and the first driving current, the wire bonding quality inspection result of the target bonding wire 800 can be determined. Among them, the connection state of the target bonding wire 800 at least includes a first state and a second state. The first state indicates that the connection between the target bonding wire 800 and the circuit board 700 is detached, and the second state indicates that the connection between the target bonding wire 800 and the circuit board 700 is not detached.

[0055] It is easy to know that after the thread lifting workpiece 600 exerts a force on the target bonding wire 800 welded to the circuit board 700, if the target bonding wire 800 is in the first state, the wire bonding quality inspection result can be obtained: at the current force magnitude of the thread lifting workpiece 600, the connection between the target bonding wire 800 and the circuit board 700 is poor; if the target bonding wire 800 is in the second state, the wire bonding quality inspection result can be obtained: at the current force magnitude of the thread lifting workpiece 600, the connection between the target bonding wire 800 and the circuit board 700 is good.

[0056] Furthermore, the energization time of the first driving current is adjustable to adjust the time for the primary driving component 31 to form the target coil magnetic field and the time for the secondary driving component 32 to move in the target coil magnetic field, thereby restricting the time and amplitude of the thread lifting workpiece 600 moving in the first direction D1, and avoiding the thread lifting workpiece 600 exerting excessive force on the target bonding wire 800 resulting in the detachment of the target bonding wire 800 from the circuit board 700 (different from the poor connection between the target bonding wire 800 and the circuit board 700 in the first state).

[0057] It should also be noted that in the scenario where the wire bonding quality inspection device 100 inspects the target wire bond 800, it is necessary to align the wire picking workpiece 600 adapted to the wire bonding quality inspection device 100 with the target wire bond 800 on the circuit board 700. Specifically, at least one of the circuit board 700 and the wire bonding quality inspection device 100 is translated to perform the following steps: first, align the positions of the wire picking workpiece 600 and the target wire bond 800 with each other, then insert the wire picking workpiece 600 into the position between the circuit board 700 and the target wire bond 800, and then enable the first drive current to input the main drive component 31 to drive the wire picking workpiece 600 to apply a force to the target wire bond 800 welded to the circuit board 700.

[0058] For example, the wire picking workpiece 600 is a needle-shaped workpiece, so that the needle tip of the needle-shaped workpiece can be accurately inserted into the position between the circuit board 700 and the target wire bond 800.

[0059] The wire bonding quality inspection device 100 and the wire bonding quality inspection system 500 provided by the embodiments of the present application use the drive of the main drive component in the drive module 30 to the secondary drive component 32 to convert the current intensity of the first drive current into the force applied by the wire picking workpiece 600 to the target wire bond 800, which can accurately control the magnitude of the force applied to the target wire bond 800, and accurately apply a force to the target wire bond 800 under the guiding action of the first guiding slot 225, so as to ensure the reliability of the welding quality inspection result of the target wire bond 800.

[0060] Moreover, compared with some existing methods for detecting the welding quality of the target wire bond 800 on the circuit board 700 using machine vision, this solution does not require a processor for image processing, which can effectively reduce costs, and directly applies a force to the wire bond, and the firmness of the wire arc welding can be intuitively reflected during the force application process.

[0061] As Figures 1 to 5 shown, in some embodiments, the main drive component 31 includes a first coil unit 311 and a second coil unit 312 that are spaced apart and connected to the base 10. The first coil unit 311 and the second coil unit 312 form an accommodation groove 313 at intervals. The secondary drive component 32 includes a magnet unit 321 that is connected to the transmission module 20 and adapted to the accommodation groove 313;

[0062] Among them, the first coil unit 311 and the second coil unit 312 are used to receive the first drive current and generate a target coil magnetic field under the excitation of the first drive current, so that the magnet unit 321 accommodated in the accommodation groove 313 moves in the first direction D1 under the action of the target coil magnetic field, thereby driving the wire picking workpiece 600 to move in the first direction D1 through the transmission module 20.

[0063] Specifically, the first coil unit 311 and the second coil unit 312 are independent of each other. When the first driving current is input into the primary driving assembly 31, the first driving current flows to both the first coil unit 311 and the second coil unit 312 simultaneously. The first coil unit 311 generates a first sub-magnetic field under the excitation of the first driving current, and the second coil unit 312 generates a second sub-magnetic field under the excitation of the second driving current. The first sub-magnetic field and the second sub-magnetic field form a target coil magnetic field, and the target coil magnetic field generates an electromagnetic force towards the magnet unit 321, causing the magnet unit 321 to move in the first direction D1 under the action of the electromagnetic force, thereby driving the thread-taking workpiece 600 to move in the first direction D1 through the transmission module 20. Among them, the target coil magnetic field is located between the first coil unit 311 and the second coil unit 312.

[0064] It should be understood that during the movement of the magnet unit 321 in the first direction D1, at least part of the magnet unit 321 remains in the accommodation groove 313 between the first coil unit 311 and the second coil unit 312, so as to limit the movement amplitude of the magnet unit 321, the transmission module 20 and even the thread-taking workpiece 600 in the first direction D1.

[0065] Furthermore, the first coil unit 311 and the second coil unit 312 are separated on opposite sides of the magnet unit 321, and the inductances of the first coil unit 311 and the second coil unit 312 are the same (for example, the number of turns of the first coil unit 311 and the second coil unit 312 is the same). The first sub-magnetic field and the second sub-magnetic field can form a uniformly distributed magnetic field to ensure the smooth movement of the magnet unit 321, the transmission module 20 and even the thread-taking workpiece 600 in the first direction D1.

[0066] Exemplarily, both the first coil unit 311 and the second coil unit 312 are linear motor coils, and the magnet unit 321 is a linear motor magnet, that is, the first coil unit 311, the second coil unit 312 and the magnet unit 321 form a linear motor.

[0067] Please refer to Figure 6 , Figure 6 which is a schematic layout diagram of the first coil unit 311, the second coil unit 312 and the magnet unit 321 in the wire bonding quality inspection device 100 provided by an embodiment of the present application.

[0068] As Figure 6 shown, in some embodiments, both the first coil unit 311 and the second coil unit 312 are wound around an axis in the second direction D2 perpendicular to the first direction D1, and the S pole and the N pole of the magnet unit 321 are arranged along a third direction D3 perpendicular to the first direction D1 and at an angle to the second direction D2.

[0069] Specifically, the second direction D2 forms an angle with the third direction D3, and the plane formed by the second direction D2 and the third direction D3 is perpendicular to the first direction D1. Preferably, the second direction D2 is perpendicular to the third direction D3, that is, the first direction D1, the second direction D2, and the third direction D3 are mutually perpendicular.

[0070] It should be noted that the magnet unit 321 can be a single magnet, and the S pole and N pole of the single magnet are arranged along the third direction D3. The magnet unit 321 can also include two magnets with S poles and N poles respectively, and the S-pole magnet and the N-pole magnet are arranged along the third direction D3.

[0071] It should be understood that the coil windings of the first coil unit 311 and the second coil unit 312 are axially centered on the second direction D2. The arrangement directions of the first coil unit 311 and the second coil unit 312 and the arrangement direction of the S pole and N pole in the magnet unit 321 are designed to ensure that the magnetic field generated when the first drive current is input to the first coil unit 311 and the second coil unit 312 can drive the magnet unit 321 to move in the first direction D1 or in the direction opposite to the first direction D1.

[0072] As Figure 4 shown, in some embodiments, the base 10 includes a base portion 13 for providing connection support and a first winding support portion 11 and a second winding support portion 12 that are connected to the base portion 13 and are disposed on opposite sides of the connection portion 21. The first coil unit 311 is wound around the first winding support portion 11, and the second coil unit 312 is wound around the second winding support portion 12;

[0073] Among them, the first winding support portion 11 and the second winding support portion 12 are iron cores or insulating members.

[0074] Specifically, the base portion 13 is used to provide installation support. It can form a fixed connection with an external object to provide a fixed base point for the entire wire bonding quality inspection device 100. Alternatively, the base portion 13 can be directly placed at a preset position to provide mechanical support by the base portion 13.

[0075] Furthermore, one side of the first winding support portion 11 away from the base portion 13 and one side of the second winding support portion 12 away from the base portion 13 extend towards each other but remain spaced apart, and the accommodation groove 313 is located between the first winding support portion 11 and the second winding support portion 12. That is, the extension directions of one side of the first winding support portion 11 away from the base portion 13 and one side of the second winding support portion 12 away from the base portion 13 are parallel to the second direction D2, and the first coil unit 311 is wound around one side of the first winding support portion 11 away from the base portion 13, and the second coil unit 312 is wound around one side of the second winding support portion 12 away from the base portion 13.

[0076] Thus, the first winding support portion 11 provides axial support for the first coil unit 311, and the second winding support portion 12 provides axial support for the second coil unit 312 to constrain the winding directions of the first coil unit 311 and the second coil unit 312, avoiding deviation in the driving direction of the magnet unit 321 caused by misalignment between the first coil unit 311 and the second coil unit 312.

[0077] Supplementary note, the first winding support portion 11 and the second winding support portion 12 can be insulating parts or iron cores. When the first winding support portion 11 and the second winding support portion 12 are insulators, they can provide axial support for the first coil unit 311 and the second coil unit 312; when the first winding support portion 11 and the second winding support portion 12 are iron cores, they can strengthen the magnetic field intensity generated by the first coil unit 311 and the second coil unit 312 in addition to providing axial support.

[0078] In some embodiments, at least one of the side of the connecting portion 21 close to the first winding support portion 11 and the side close to the second winding support portion 12 forms a limiting groove 211 extending along the first direction D1, and the connecting portion 21 is used to form a guiding fit with the base 10 through the limiting groove 211;

[0079] Wherein, the magnet unit 321 is disposed on the connecting portion 21 corresponding to the first winding support portion 11 and the second winding support portion 12, and at least part of the magnet unit 321 is exposed outside the limiting groove 211.

[0080] It should be understood that the connecting portion 21 forms a guiding fit with the base 10 through the limiting groove 211 to limit the movement of the magnet unit 321 in the first direction D1 or the direction opposite to the first direction D1. Specifically, the magnet unit 321 is disposed on the connecting portion 21 and partially exposed, and the exposed part of the magnet unit 321 faces the first winding support portion 11 and the second winding support portion 12, so that while satisfying the function of the magnetic field formed by the magnet unit 321, it also has a compact mechanical structure and reduces the occupied volume.

[0081] Furthermore, setting at least part of the magnet unit 321 to be exposed outside the limiting groove 211 also facilitates the disassembly and replacement of the magnet unit 321.

[0082] It should be noted that in the scenario where the wire bonding quality inspection device 100 provided in the embodiment of the present application inspects multiple target wire bonds 800, after applying a force to the target wire bonds 800 welded to the circuit board 700 along the first direction D1 by driving the wire picking workpiece 600 through the secondary driving assembly 32 and the transmission module 20, the secondary driving assembly 32, the transmission module 20 and the wire picking workpiece 600 need to be reset.

[0083] Specifically, the secondary drive assembly 32, the transmission module 20, and the thread picking workpiece 600 can be reset by using weight. For example, the wire bonding quality inspection device 100 is arranged as shown in Figure 2 so that after stopping inputting the first drive current to the primary drive assembly 31, the secondary drive assembly 32, the transmission module 20, and the thread picking workpiece 600 move downward under the action of gravity to complete the reset.

[0084] Another way to reset the secondary drive assembly 32, the transmission module 20, and the thread picking workpiece 600 is to input a second drive current with a current direction opposite to that of the first drive current to the primary drive assembly 31:

[0085] In some embodiments, the primary drive assembly 31 is further configured to drive the secondary drive assembly 32 to move in a direction opposite to the first direction D1 based on the input second drive current, and the current direction of the second drive current is opposite to that of the first drive current.

[0086] Specifically, under the condition that the second drive current is input to the primary drive assembly 31, the host drive assembly generates a reset coil magnetic field opposite to the magnetic field of the target coil, and the secondary drive assembly 32 moves in a direction opposite to the first direction D1 under the action of the reset coil magnetic field. Correspondingly, the transmission module 20 and the thread picking workpiece 600 synchronously move in a direction opposite to the first direction D1 to reset the secondary drive assembly 32, the transmission module 20, and the thread picking workpiece 600.

[0087] It should be understood that this setting improves the adaptability of the wire bonding quality inspection device 100 for quality inspection of a large number of target wire bonds 800. Compared with the method of simply using gravity for reset, this solution greatly improves the accuracy and response speed of reset.

[0088] In some embodiments, the transmission module 20 further includes a guiding portion 23 disposed between the assembling portion 22 and the connecting portion 21. The guiding portion 23 forms at least one second guiding notch 231 extending along the first direction D1, and the second guiding notch 231 is configured to cooperate with an external guiding workpiece to guide the moving direction of the transmission module 20.

[0089] Specifically, by cooperating the second guiding notch 231 with the external guiding workpiece, the movement of the secondary drive assembly 32 can be restricted to the first direction D1 or the direction opposite to the first direction D1, avoiding the deviation of the force application direction of the thread picking workpiece 600.

[0090] As Figure 3 shown, the number of the second guiding notches 231 is one.

[0091] In some embodiments, the first guiding notch 225 is formed on a side of the assembling opening 223 close to the connecting portion 21 and is in communication with the assembling opening 223.

[0092] Specifically, the first assembly front end 221 and the second assembly front end 222 are connected to the guiding portion 23 and are arranged to extend in a direction away from the guiding portion 23. The first guiding slot 225 communicates with the assembly opening 223, and the assembly opening 223 is located at one end (opposite front end) of the first assembly front end 221 and the second assembly front end 222 away from the connecting portion 21, and the first guiding slot 225 is located at one end (opposite rear end) of the first assembly front end 221 and the second assembly front end 222 close to the connecting portion 21.

[0093] It should be understood that the assembly opening 223 is arranged at the relatively front end and the first guiding slot 225 is arranged at the relatively rear end, which is beneficial to the arrangement of the thread picking workpiece 600. Moreover, the first guiding slot 225 being adapted to the external guiding workpiece at the relatively rear end is also beneficial to balancing the weight distribution from the connecting portion 21 to the assembly portion 22 when the transmission module 20 moves in the first direction D1, and avoiding the tilting of the transmission module 20.

[0094] Specifically, when the thread picking workpiece 600 is connected and adapted to the transmission module 20, the thread picking workpiece 600 is received in the assembly opening 223 formed between the first assembly front end 221 and the second assembly front end 222. Among them, the connection method between the thread picking workpiece 600 and the assembly opening 223 can be: the first assembly front end 221 and the second assembly front end 222 cooperate to clamp the thread picking workpiece 600, or the thread picking workpiece 600 is connected and adapted to at least one of the first assembly front end 221 and the second assembly front end 222.

[0095] In some embodiments, at least one of the first assembly front end 221 and the second assembly front end 222 forms an assembly hole 224 for connecting and adapting to the thread picking workpiece 600.

[0096] Specifically, the thread picking workpiece 600 can be engaged or bolted with at least one of the first assembly front end 221 and the second assembly front end 222 through the assembly hole 224.

[0097] In some other embodiments, the first assembly front end 221 and the second assembly front end 222 are used to clamp the thread picking workpiece 600 through the assembly opening 223.

[0098] Specifically, the first assembly front end 221 and the second assembly front end 222 cooperate to clamp the thread picking workpiece 600 located in the assembly opening 223. Further, the distance between the first assembly front end 221 and the second assembly front end 222 in the clamping direction is adjustable to realize the clamping and loosening of the thread picking workpiece 600.

[0099] It should be understood that the above two embodiments can be implemented separately or in combination to improve the firmness of the connection between the thread picking workpiece 600 and the assembly portion 22.

[0100] Please refer to Figure 7 , Figure 7 which is a module structure diagram of an implementation manner of a wire bonding quality inspection system 500 provided by an embodiment of the present application.

[0101] As Figure 7 shown, an embodiment of the present application further provides a wire bonding quality inspection system 500, including a wire bonding quality inspection device 100, a collection device 200, a placement platform 300, and a controller 400. Among them, the wire bonding quality inspection device 100 is the wire bonding quality inspection device 100 provided by any embodiment of the present application and is used to be connected and adapted to the wire picking workpiece 600. The placement platform 300 is used to place the circuit board 700 to be quality inspected and fix the circuit board 700. Among them, a target wire bond 800 is welded on the circuit board 700 to be quality inspected, and the collection device 200 is used to perform image collection on the circuit board 700 placed on the placement platform 300.

[0102] The controller 400 is electrically connected to the wire bonding quality inspection device 100 and the collection device 200 and is used to execute the following control steps:

[0103] When the circuit board 700 is fixed on the placement platform 300, control the wire bonding quality inspection device 100 to drive the wire picking workpiece 600 to apply a force to the target wire bond 800 based on the first driving current input to the wire bonding quality inspection device 100;

[0104] Control the collection device 200 to obtain the connection state of the target wire bond 800. The connection state includes at least a first state and a second state. The first state indicates that the connection between the target wire bond 800 and the circuit board 700 is detached, and the second state indicates that the connection between the target wire bond 800 and the circuit board 700 is not detached;

[0105] Determine the force applied by the wire picking workpiece 600 to the target wire bond 800 according to the current intensity of the first driving current, and output the wire bonding quality inspection information corresponding to the target wire bond 800 based on the force applied and the connection state.

[0106] Specifically, when the circuit board 700 is fixed on the placement platform 300 and the wire picking workpiece 600 is in place, the controller 400 controls the wire bonding quality inspection device 100 to drive the wire picking workpiece 600 to apply a force to the target wire bond 800 based on the first driving current input to the wire bonding quality inspection device 100, and then controls the collection device 200 to obtain the connection state of the target wire bond 800. It is easy to know that it can be determined whether the connection between the target wire bond 800 and the circuit board 700 is detached according to the connection state. After that, the controller 400 determines the force applied by the wire picking workpiece 600 to the target wire bond 800 according to the current intensity of the first driving current, and outputs the wire bonding quality inspection information corresponding to the target wire bond 800 based on the force applied and the connection state.

[0107] More specifically, based on the magnitude of the force exerted by the thread picking workpiece 600 on the target bonding wire 800 being matched to the current intensity of the first driving current input to the main driving component 31, a mapping relationship between the magnitude of the force exerted and the current intensity of the first driving current can be established in advance. The controller 400 can determine the magnitude of the force exerted by the thread picking workpiece 600 on the target bonding wire 800 according to this mapping relationship.

[0108] After determining the magnitude of the force exerted by the thread picking workpiece 600 on the target bonding wire 800, the controller 400 can generate wire bonding quality inspection information corresponding to the target bonding wire 800 by synthesizing the magnitude of the force exerted and the connection state.

[0109] Exemplarily, the wire bonding quality inspection information can be recorded in the format of "magnitude of the force exerted, connection state". For example, "2N, second state" or "3N, first state". For the wire bonding quality inspection information obtained by applying forces of multiple different magnitudes to a single target bonding wire 800, the magnitudes of the forces exerted multiple times and the connection states corresponding to the magnitudes of the forces exerted can be comprehensively recorded. For example: "1N, second state; 2N, second state; 3N, first state; 4N, first state", so as to more accurately obtain the critical point of the magnitude of the force exerted at which the connection between the target bonding wire 800 and the circuit board 700 becomes disconnected.

[0110] It should also be noted that for the specific manner of using the wire bonding quality inspection device 100 to drive the thread picking workpiece 600 to exert a force on the target bonding wire 800 based on the first driving current input to the wire bonding quality inspection device 100, reference can be made to the description of the wire bonding quality inspection device 100 in the above embodiments, which will not be elaborated here.

[0111] The acquisition device 200 will be described: The acquisition device 200 is used to perform image acquisition on the circuit board 700 to obtain an image corresponding to the circuit board 700, and the controller 400 performs image processing on the acquired image to determine the connection state of the target bonding wire 800.

[0112] Exemplarily, the acquisition device 200 includes but is not limited to at least one of a sensor, a camera, etc.

[0113] It should be understood that compared with the solution of only using machine vision to perform quality inspection on the target bonding wire 800, the wire bonding quality inspection system 500 provided by the embodiments of the present application can perform quality inspection on the target bonding wire 800 after being exerted with a force by the wire bonding quality inspection device 100, so as to intuitively reflect the magnitude of the force that the target bonding wire 800 can withstand, avoid unreliable connection between the target bonding wire 800 and the circuit board 700, and more accurately judge the reliability of the connection between the target bonding wire 800 and the circuit board 700.

[0114] In summary, the embodiments of the present application provide a wire bonding quality inspection device 100 and a wire bonding quality inspection system 500. The wire bonding quality inspection device 100 includes: a base 10 for providing installation support; a transmission module 20, the transmission module 20 includes a connection part 21 and an assembly part 22 arranged on a different side from the connection part 21. The transmission module 20 is movably connected to the base 10 through the connection part 21, and the assembly part 22 is configured to be connected and adapted to a wire picking workpiece 600; a driving module 30, the driving module 30 includes a primary driving component 31 connected to the base 10 and a secondary driving component 32 connected to the transmission module 20 and adapted to the primary driving component 31. The primary driving component 31 is at least used to drive the secondary driving component 32 to move in a first direction D1 based on a first driving current input to the primary driving component 31, so as to drive the wire picking workpiece 600 connected to the assembly part 22 through the secondary driving component 32 and the transmission module 20 to apply a force to a target wire bond 800 welded to a circuit board 700; wherein, the first direction D1 is the direction in which the target wire bond 800 is away from the circuit board 700, and the magnitude of the force applied by the wire picking workpiece 600 to the target wire bond 800 matches the current intensity of the first driving current input to the primary driving component 31. The wire bonding quality inspection device 100 and the wire bonding quality inspection system 500 provided by the embodiments of the present application use the driving of the primary driving component in the driving module 30 to the secondary driving component 32 to convert the current intensity of the first driving current into the force applied by the wire picking workpiece 600 to the target wire bond 800, which can accurately control the magnitude of the force applied to the target wire bond 800, and accurately apply a force to the target wire bond 800 under the guiding action of the first guiding slot 225, so as to ensure the reliability of the welding quality inspection result of the target wire bond 800 and intuitively reflect the firmness of the wire bond. Moreover, compared with the machine vision solution, the cost of implementing wire bonding quality inspection in this solution is lower.

[0115] The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application. The protection scope of the present application shall be subject to the protection scope of the claims.

[0116] It should be understood that the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. Unless otherwise clearly defined and limited, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances. As used in the specification of this application and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an", and "the" are intended to include the plural forms. It should also be understood that the term " / and" used in the specification of this application and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations. In this article, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or system comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or system.

Claims

1. A wire bonding quality inspection device, characterized in that, Comprising: A base for providing installation support; A transmission module, the transmission module includes a connection part and an assembly part arranged on a different side from the connection part. The transmission module is movably connected to the base through the connection part. The assembly part at least includes a first assembly front end and a second assembly front end connected to the connection part and extending in a direction away from the connection part. The first assembly front end and the second assembly front end are spaced apart to form an assembly opening for connecting and adapting to a thread picking workpiece and a first guiding notch for cooperating with an external guiding workpiece to guide the moving direction of the transmission module; A driving module, the driving module includes a primary driving component connected to the base and a secondary driving component connected to the transmission module and adapted to the primary driving component. The primary driving component is at least used to drive the secondary driving component to move in the first direction based on a first driving current input to the primary driving component, so as to drive a thread picking workpiece connected to the assembly part through the secondary driving component and the transmission module to apply a force to a target bonding wire welded to a circuit board; The first direction is the direction in which the target bonding wire is away from the circuit board, and the force applied by the thread picking workpiece to the target bonding wire matches the current intensity of the first driving current input to the primary driving component.

2. The wire bonding quality inspection device according to claim 1, wherein The primary driving component includes a first coil unit and a second coil unit spaced apart and connected to the base. The first coil unit and the second coil unit are spaced apart to form a receiving groove. The secondary driving component includes a magnet unit connected to the transmission module and adapted to the receiving groove; Wherein, the first coil unit and the second coil unit are used to receive the first driving current and generate a target coil magnetic field under the excitation of the first driving current, so that the magnet unit accommodated in the receiving groove moves in the first direction under the action of the target coil magnetic field, thereby driving the thread picking workpiece to move in the first direction through the transmission module.

3. The wire bonding quality inspection device according to claim 2, wherein, Both the first coil unit and the second coil unit are wound around an axis in a second direction perpendicular to the first direction, and the S pole and the N pole of the magnet unit are arranged in a third direction perpendicular to the first direction and forming an angle with the second direction.

4. The wire bonding quality inspection device according to claim 2, characterized in that, The base includes a base part for providing connection support and a first winding support part and a second winding support part connected to the base part and arranged on opposite sides of the connection part. The first coil unit is wound around the first winding support part, and the second coil unit is wound around the second winding support part; Wherein, the first winding support part and the second winding support part are iron cores or insulating parts.

5. The wire bonding quality inspection device according to claim 4, wherein, At least one of the side of the connection part close to the first winding support part and the side close to the second winding support part forms a limiting groove extending in the first direction, and the connection part is used to form a guiding fit with the base through the limiting groove; Wherein, the magnet unit is disposed on the connecting portion corresponding to the first winding support portion and the second winding support portion, and at least a part of the magnet unit is exposed outside the limiting groove.

6. The wire bonding quality inspection device according to claim 1, wherein, The primary drive assembly is further configured to drive the secondary drive assembly to move in a direction opposite to the first direction based on an input second drive current, and the current direction of the second drive current is opposite to that of the first drive current.

7. The wire bonding quality inspection device according to any one of claims 1-6, characterized in that, The transmission module further includes a guiding portion disposed between the assembling portion and the connecting portion. The guiding portion forms at least one second guiding notch extending along the first direction, and the second guiding notch is configured to cooperate with an external guiding workpiece to guide the movement direction of the transmission module.

8. The wire bonding quality inspection device according to any one of claims 1-6, characterized in that, The first guiding notch is formed on a side of the assembling opening close to the connecting portion and is in communication with the assembling opening.

9. The wire bonding quality inspection device according to claim 8, characterized in that, At least one of the first assembling front end and the second assembling front end forms an assembling hole for connecting and adapting to the thread picking workpiece; and / or, the first assembling front end and the second assembling front end are configured to clamp the thread picking workpiece through the assembling opening.

10. A wire bonding quality inspection system, characterized in that, Comprising: The wire bonding quality inspection device according to any one of claims 1-9; A collecting device; A receiving platform for receiving and fixing a circuit board to be quality inspected, and a target wire bond is welded on the circuit board; A controller, electrically connected to the wire bonding quality inspection device and the collecting device, and configured to: When the circuit board is fixed on the receiving platform, control the wire bonding quality inspection device to drive the thread picking workpiece to apply a force to the target wire bond based on a first drive current input to the wire bonding quality inspection device; Control the collecting device to obtain the connection state of the target wire bond, where the connection state at least includes a first state and a second state. The first state indicates that the connection between the target wire bond and the circuit board is detached, and the second state indicates that the connection between the target wire bond and the circuit board is not detached; Determine the magnitude of the force applied by the thread picking workpiece to the target wire bond according to the current intensity of the first drive current, and output wire bonding quality inspection information corresponding to the target wire bond based on the magnitude of the force and the connection state.

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